JP2005294017A - Socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a socket for an electric component capable of restraining damage to the electric component in a pressing operation of a pressing means, and facilitating extraction of the electric component at the same time. <P>SOLUTION: This socket for an electric component is provided with: a housing part 20 formed on the upper surface of a socket body part for housing an IC package; a floating plate 16 install vertically movably with respect to the housing part 20 and locked to the bottom face of the IC package to support it; helical springs 15 installed on the socket body part for energizing the floating plate 16 upward; and the pressing means 26 for pressing the IC package housed in the housing part 20 from the upper side. The socket is so structured that vertical through-holes 16d are formed at parts of the floating plate 16 corresponding to the helical springs 15 and release members 21 are inserted therein; and the release members 21 are pressed by the pressing means 26 before the IC package is pressed to release the energization of the helical springs 15 to lower the floating plate 16. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrical component socket for inspecting electrical components. More specifically, the present invention relates to an electrical component socket that suppresses damage to an electrical component during the pressing operation so that no load is applied to the electrical component until immediately before the pressing operation by the pressing means is completed. The present invention relates to an electrical component socket that is intended to facilitate the removal of the component.

  For example, as shown in FIG. 10, a conventional socket for electric parts is provided with a base plate 2 provided with contact pins 1 and terminals of the electric parts (hereinafter referred to as IC package 3) provided on the base plate 2. A tab film 4 for electrically connecting the contact pin 1 and the contact film 1, and a middle provided on the tab film 4 so as to be detachable from the base plate 2 and provided with a socket cover 5 so as to be rotatable at one end. It has a member 6 and an alignment plate 7 that is detachably engaged with an opening 6a provided in the intermediate member 6 and has an opening 7a formed at the center, and closes the socket cover 5 by lying down. By pressing the IC package 3 accommodated in the opening 7 a of the alignment plate 7 with the pad 8 provided on the socket cover 5, Has a terminal contact pin 1 of the cage 3 so as to be electrically connected (e.g., see Patent Document 1).

In FIG. 10, reference numeral 9 denotes a reliable electrical connection between the electrode pattern of the tab film 4 (hereinafter referred to as contact electrode 4a) and the terminal of the IC package 3 by elastically supporting the tab film 4 from below. The elastic sheet which consists of silicone rubber etc. provided in order to ensure is shown. Reference numeral 10 denotes a stopper provided so that the terminals of the IC package 3 are not crushed beyond a predetermined level. Further, reference numeral 11 indicates another elastic sheet that is pressed by the intermediate member 6 to maintain a reliable electrical connection between the connection electrode 4 b of the tab film 4 and the contact pin 1. Reference numeral 12 denotes locking means that is locked to the side surface 6b of the intermediate member to maintain the closed state of the socket cover. Each element is assembled into an electrical component socket by fastening a bolt 13 and a nut 14.
JP 2003-272786 A

  However, in such a conventional socket for electrical parts, the IC package 3 is pressed to ensure electrical connection between the solder balls as the terminals of the IC package 3 and the contact electrodes 4a of the tab film 4. Therefore, for example, in a burn-in test performed at a high temperature, the solder ball may be softened and stuck to the contact electrode 4a. In this case, when the IC package 3 is removed from the electrical component socket after the test is completed, it may not be easily removed.

  In order to cope with such a problem, as shown in FIG. 11, instead of the alignment plate 7 described above, a floating that is elastically supported by being urged upward by a string spring 15 and is movable up and down. A plate 16 is disposed above the base plate 2, and a support portion 17 that locks to the bottom surface of the IC package 3 is projected to the inside of the opening portion 16a on the wall portion 16b of the opening portion 16a that accommodates the IC package 3 of the floating plate 16. It is conceivable to have a configuration. With this configuration, when the socket cover 5 is closed, the upper surface of the IC package 3 accommodated in the opening 16a is against the urging force of the chord spring 15 in the direction of arrow A in FIG. The terminal 3 a of the IC package 3 and the contact electrode 4 a of the tab film 4 can be connected by pressing in the middle arrow B direction and pressing down together with the floating plate 16. Further, after the test is completed, the pressing force applied to the IC package 3 by the pad 8 is released along with the opening operation of the socket cover 5, and the floating plate 16 is pushed up by the biasing force (in the direction of arrow A) of the string spring 15. As a result, the support portion 17 provided in the opening 16 a of the floating plate 16 is locked to the bottom surface of the IC package 3, and the terminal 3 a of the IC package 3 attached to the contact electrode 4 a of the tab film 4 is connected to the string spring 15. It can be peeled off by the biasing force.

  However, in such an electrical component socket, it is necessary to increase the urging force of the string spring 15 in order to easily peel off the stuck IC package 3. In this case, when the IC package 3 is accommodated in the opening 16a of the floating plate 16 and the socket cover 5 is closed, the biasing force of the coiled spring 15 in the direction of arrow A acts on the IC package 3 as it is. There is a risk that the bottom surface of the IC package 3 is seriously damaged, and the IC package 3 is broken or damaged.

  Accordingly, the present invention provides an electrical component socket that addresses such problems, suppresses damage to the electrical component during the pressing operation by the pressing means, and at the same time facilitates the removal of the electrical component. Objective.

  In order to achieve the above object, an electrical component socket according to the present invention is formed on an upper surface of a socket main body portion, accommodates an electrical component, and includes an accommodating portion provided with contact means capable of contacting the terminal of the electrical component. A floating plate that is arranged to be movable up and down with respect to the housing part, and that is engaged with and supports the bottom surface of the electrical component, and is provided in the socket body part, and biases the floating plate upward. Urging means and pressing means for pressing from above the electrical component housed in the housing portion so as to press the upper surface thereof to electrically connect the terminal of the electrical component and the contact means. When the pressing means presses the electrical component, the floating part is provided before the pressing means contacts and presses the upper surface of the electrical component. Those having means for lowering the over bets.

  With such a configuration, the floating plate that is urged by the urging means and is arranged so as to be movable up and down with respect to the accommodating portion is locked to and supported by the bottom surface of the electric component, and the pressing means holds the electric component. When pressing, the floating plate is lowered by the means for lowering the floating plate before the pressing means comes into contact with the upper surface of the electrical component and presses it.

  Further, the means for lowering the floating plate is a release member that is inserted into a through-hole penetrating in a vertical direction in a portion corresponding to the biasing means of the floating plate and releases the bias of the biasing means, Before the pressing means comes into contact with and presses on the upper surface of the electrical component, the pressing means presses the biasing means to release the biasing means. Thus, the pressing member presses the release member inserted into the vertical through-hole provided in the floating plate before the electric component is pressed, and the release member biases the floating plate upward. Release the force.

  Further, the pressing means includes a pusher elastically supported by an elastic member on a surface of the socket cover that is rotatably provided at one end of the socket body and facing the accommodating portion, and the pusher A pad that is held and presses the electrical component, and the edge of the pad is pressed against the release member when the socket cover is closed. As a result, the release member is pressed by the edge portion of the pad elastically supported together with the pusher on the surface of the socket cover facing the housing portion in accordance with the closing operation in which the socket cover falls.

  Furthermore, the release member is formed in a block shape that is engaged with the through hole of the floating plate. Thereby, the urging | biasing of the urging means which urges | biases a floating plate with the block-shaped releasing member latched in the through-hole of a floating plate is cancelled | released.

  Alternatively, the release member is a tightly wound portion formed integrally with the upper end portion of the urging means. Thereby, the urging | biasing of the urging | biasing means which urges | biases a floating plate by the closely wound part integrally formed in the upper end part of the urging | biasing means is cancelled | released.

  The pad is formed such that a gap is formed between the edge portion of the pad and the upper end surface of the through hole of the floating plate when the electric component is pressed. Thus, a gap is generated between the edge of the pad and the upper end surface of the through hole of the floating plate in the pressed state of the electrical component.

  The floating plate includes an opening into which the electric component can be inserted corresponding to the housing portion, and a support portion that locks the bottom surface of the electric component is protruded inside the opening portion on the wall portion of the opening. It is a thing. Thus, the support portion provided on the wall portion of the opening portion so as to protrude inside the opening portion is engaged with and supported by the bottom surface of the electric component inserted into the opening portion.

  According to the first aspect of the present invention, the floating plate is supported at the bottom, and the floating plate urged upward by the urging means is lowered before the electric component is pressed. It is possible to prevent the load of the pressing means from being applied to the electric component until the pressing means comes into contact with and presses the upper surface of the electrical component after descending to the point position. Therefore, during the pressing operation by the pressing means, the urging force of the urging means does not act on the electrical component, and damage to the electrical component can be suppressed.

  According to the invention of claim 2, the release member inserted into the vertical through-hole provided in the floating plate by the pressing means for pressing the electrical component is pressed before the electrical component is pressed, and the release member Since the biasing means for biasing the floating plate is released, the mechanism for lowering the floating plate can have a simple structure.

  Further, according to the invention according to claim 3, the release member is provided at the edge of the pad elastically supported together with the pusher on the surface of the socket cover facing the accommodating portion in accordance with the closing operation in which the socket cover falls down. It is possible to easily apply the clamshell type electrical component socket.

  According to the invention of claim 4, the release member is formed in a block shape that is locked to the through hole of the floating plate, so that the release member does not fall out of the through hole. Therefore, handling of the release member is facilitated.

  Furthermore, according to the invention which concerns on Claim 5, manufacture is easy by making the cancellation | release member into the close winding part integrally formed in the upper end part of the biasing means.

  According to the sixth aspect of the present invention, there is provided a gap between the edge of the pad and the upper end surface of the through hole of the floating plate when the electric component is pressed by the pad. It is possible to absorb the variation in thickness of the pad and reliably transmit the pressing force by the pad to the electrical component.

  According to the seventh aspect of the present invention, the electric part inserted into the opening is supported by the bottom of the supporting part provided on the wall of the opening so as to protrude inside the opening. Thus, when the socket cover is opened, the elastic restoring force of the urging means that urges the floating plate upward can be applied to the bottom portion of the electrical component by the support portion. Therefore, even when the terminal portion of the electrical component is stuck to the contact means by a high temperature test or the like, it can be easily peeled off.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing an embodiment of an electrical component socket according to the present invention, and FIG. 2 is a sectional view taken along line XX of FIG. This socket for electrical parts is a clamshell type electrical part socket used for product inspection such as burn-in test of an IC package, and includes a socket body 18, contact means 19, a floating plate 16, and a socket cover 5. And.

  Here, as shown in FIG. 3, the IC package 3 has a BGA (terminal 3a made of a large number of substantially spherical solder balls arranged in a matrix in columns and rows on a bottom surface 3b of a rectangular package body, for example. Ball Grid Array) type.

  As shown in FIG. 2, the socket body 18 is for housing and holding the IC package 3 in the housing portion 20 formed in the center portion, and forming a rectangular groove 2 a corresponding to the housing portion 20. A rectangular base plate 2 having an elastic sheet 9 made of silicone rubber or the like in the groove 2a, and an intermediate member 6 having an opening 6a corresponding to the accommodating portion 20 and having substantially the same outer shape. Prepare and configure.

  Contact means 19 is provided on the base plate 2. The contact means 19 electrically connects the terminal 3a of the IC package 3 accommodated in the accommodating portion 20 and the electric circuit board disposed below the base plate 2, and as shown in FIG. It consists of a pin 1 and a tab film 4.

  Here, the contact pins 1 are formed by, for example, pressing a conductive metal plate material, and a large number of the contact pins 1 are implanted along the four sides of the peripheral portion of the base plate 2 (four rows in FIG. 2). It is formed as a contact portion 1a that protrudes from the upper surface side of the base plate 2 and comes into contact with the connection electrode 4b (see FIG. 10) of the tab film 4, and a lower end portion is formed as a lead portion 1b that protrudes from the lower surface side of the base plate 2, The lead portion 1b is inserted into the through hole of the electric circuit board to be electrically connected.

  The tab film 4 is a quadrilateral flexible printed circuit board in which, for example, a polyimide film is formed with a wiring that fan-outs from the center toward the periphery, and the contact portion 1a of the contact pin 1 is formed on the back surface side of the periphery. A plurality of contact electrodes 4b (refer to FIG. 10) are formed, and a plurality of contact electrodes 4a that contact the terminals 3a of the IC package 3 accommodated in the accommodating portion 20 as shown in FIG. The terminals 3a of the densely arranged IC packages 3 and the contact pins 1 can be electrically connected. The tab film 4 is disposed on an elastic sheet 9 disposed at the center of the base plate 2, and the elastic force of the elastic sheet 9 causes the terminals 3 a of the IC package 3 and the contact electrodes 4 a formed on the tab film 4 to be connected. The electrical connection can be made reliably. Further, the tab film 4 is formed with insertion holes 4c corresponding to the four corners of the accommodating portion 20, and a support portion 17 of the floating plate 16 described later is inserted into the insertion hole 4c as the floating plate 16 descends. It has come to be.

  Further, a stopper 10 is disposed on the upper surface of the tab film 4. The stopper 10 is used for positioning the terminal 3a of the IC package 3 and the contact electrode 4a of the tab film 4 and minimizing deformation of the terminal 3a of the IC package 3 due to a high-temperature burn-in test or the like. For example, a polyimide resin having a heat resistance, an insulating property, and a predetermined hardness is formed in a square shape, and a plurality of introduction holes 10a for introducing the terminals 3a of the IC package 3 are formed in the center portion. The height of the stopper 10 is slightly lower than the height of the terminal 3a of the IC package 3. Even if the solder ball of the terminal 3a is softened and deformed in a high-temperature test, the bottom surface 3b of the IC package 3 remains on the stopper 10 By being in contact with, the deformation is prevented from proceeding more than a predetermined amount.

  Further, as shown in FIG. 1, a floating plate 16 is accommodated in the opening 6 a of the intermediate member 6 above the base plate 2. The floating plate 16 has a function of guiding the IC package 3 to the housing portion 20 and, after completion of the test, peeling off the IC package 3 having the terminals 3a attached to the contact electrodes 4a of the tab film 4. 5, an opening 16 a is formed corresponding to the housing portion 20, and a wall surface 16 b of the opening 16 a is formed in a slope shape (see FIG. 4) to guide the IC package 3 to the housing portion 20. A support portion 17 that protrudes inside the opening portion 16a and engages with the bottom surface 3b of the IC package 3 is formed at, for example, the four corners of the opening portion 16a below the wall surface 16b. The height of the support portion 17 is formed so as to substantially match the value obtained by adding the thickness of the tab film 4 and the height of the stopper 10.

  Further, a conical through hole 16c penetrating in the vertical direction is formed in the lateral center of each side of the opening 16a, and a release member 21 is inserted into the through hole 16c. The release member 21 releases a biasing force of a later-described string-wound spring 15 that is pressed down and pressed by a later-described pad 8 to bias the floating plate 16 upward, and has a truncated cone shape substantially equal to the through hole 16c. And has an upper end projecting from the upper surface of the floating plate 16.

  In addition, a string spring 15 as a biasing means is provided at a portion on the base plate 2 corresponding to the through hole 16c. The string spring 15 elastically supports the floating plate 16, one end is fixed to the base plate 2, and the other end abuts against the bottom surface of the release member 21, and the floating plate 16 is interposed via the release member 21. Has come to be energized.

  As shown in FIG. 1 or 2, the socket cover 5 is rotatably provided at one end of the intermediate member 6 of the socket body 18. The socket cover 5 is pivotally supported on one side end portion of the intermediate member 6 so as to be rotatable by a rotation shaft 22, wound around the rotation shaft 22, and one end portion of the socket cover 5 being an upper surface of the intermediate member 6. And the other end portion of the socket cover 5 is always urged in the standing direction (opening direction) by the string spring 23. On the other end of the socket cover 5, the locking means 12 is pivotally supported by a pivot shaft 24. The locking means 12 is to lock the socket cover 5 to the side surface 6b of the intermediate member 6 when the socket cover 5 is overturned and closed, and to maintain the closed state of the socket cover 5. And is constantly urged toward the inside of the socket cover 5 by a string spring 25 having one end locked to the upper surface of the socket cover 5 and the other end locked to the inner surface of the upper end of the locking means 12. ing. A pressing means 26 is provided in the central portion of the socket cover 5 on the side facing the housing portion 20. When the socket cover 5 is in a closed state, the IC package accommodated in the housing portion 20 by the pressing means 26. By pressing the upper surface of 3, the electrical connection between the terminal 3 a of the IC package 3 and the contact means 19 can be ensured.

  As shown in FIG. 4, the pressing means 26 includes a pusher 27 and a pad 8. The pusher 27 is elastically supported by a coiled spring 29 as an elastic member built in a concave portion 28 formed in the central portion of the surface of the socket cover 5 facing the accommodating portion 20 and is accommodated in the concave portion 28. A long hole 30 that is long in the vertical direction is formed at both end portions, and two shafts 31 supported on the inner surface of the recessed portion 28 are inserted into the long hole 30 so as to be vertically movable. .

  On the other hand, the pad 8 is formed in a substantially inverted trapezoidal shape with a lower surface 8a narrower than the upper surface 8b in FIG. 4, and presses the upper surface of the IC package 3 with the lower surface 8a. Also, the upper surface 8b side is provided with a flange portion 8c that protrudes on both sides. As the socket cover 5 is closed, the flange portion 8c comes into contact with and presses the release member 21, and is floated by the release member 21. The urging means 15 for urging the plate 16 is released. Further, the pad 8 protrudes upward at both end portions of the upper surface 8b to form a protrusion 8d, and a long hole 32 that is long in the vertical direction is formed in the protrusion 8d corresponding to the long hole 30 of the pusher 27. The two shafts 31 provided in the recess 28 are held together with the pusher 27 so as to be movable up and down. The pad 8 is provided on its upper surface with a recess 34 that fits with a hemispherical projection 33 formed at the center of the lower surface of the pusher 27 so as to be swingable with respect to the pusher 27. The upper surface of the package 3 can be made to act uniformly.

  The pad 8 is located between the upper end surface of the through hole 16c of the floating plate 16 and the flange 8c of the pad 8 in a state where the socket cover 5 is closed and the IC package 3 accommodated in the accommodating portion 20 is pressed. It is formed so that a slight gap is generated (see FIG. 8). Thereby, the thickness variation of the IC package 3 can be absorbed and the pressing force of the elastic means 15 can be reliably transmitted to the IC package 3.

Next, the operation of the electrical component socket of the present invention will be described with reference to FIGS.
First, an electrical component socket is disposed on an electrical circuit board (not shown). Next, as shown in FIG. 6, the IC package 3 is dropped in the direction of the arrow C with respect to the opening 16 a of the floating plate 16 in the open state of the socket cover 5. The IC package 3 is guided to the accommodating portion 20 at the center of the opening 16a at the center of the opening 16a by a guide portion in which the wall surface 16b of the opening 16a is formed in a slope shape. At this time, the IC package 3 is supported by supporting the bottom surface 3b of the support portion 17 provided at the four corners below the wall surface 16b of the opening portion 16a so as to protrude inside the opening portion 16a.

  Next, the socket cover 5 is closed in the direction of arrow D in FIG. When the socket cover 5 is closed, first, as shown in FIG. 7, the flange 8c of the pad 8 of the pressing means 26 is inserted into the through hole 16c provided at the center of each side of the opening 16a of the floating plate 16. Abutting on the upper end of the inserted release member 21, the release member 21 is pressed in the direction of arrow E along with the closing operation of the socket cover 5, and the string spring 15 disposed on the lower surface of the release member 21 is pushed down. . As a result, the locking of the release member 21 with respect to the through hole 16c is released, and the biasing of the string spring 15 that biases the floating plate 16 upward is released. Therefore, the floating plate 16 descends by its own weight. At the same time, the IC package 3 supported by the support 17 in the opening 16a of the floating plate 16 is also lowered. At this time, the pad 8 is not yet in contact with the upper surface of the IC package 3.

  Further, the closing operation of the socket cover 5 proceeds, and as shown in FIG. The pressing force F of the pressing means 26 acts on the IC package 3 in contact with the upper surface. As a result, the terminal 3a of the IC package 3 is guided by the stopper 10 and contacts the contact electrode 4a of the tab film 4 to ensure electrical connection.

  In this state, the locking means 12 of the socket cover 5 is locked to the side surface 6b of the intermediate member 6 (see FIG. 2), and the closing operation of the socket cover 5 is completed. And the socket for electrical components which accommodated IC package 3 is used for product inspections, such as a burn-in test, for example.

  Since this burn-in test is performed under a high temperature, the solder ball of the terminal 3 a of the IC package 3 may be softened and stuck to the contact electrode 4 a of the tab film 4. The IC package 3 attached in this way is easily peeled off when the socket cover 5 described below is opened.

Next, the opening operation of the socket cover 5 will be described.
First, when the product inspection of the IC package 3 is completed, the locking of the intermediate member 6 to the side surface 6b by the locking means 12 is released (see FIG. 2). Thereby, the socket cover 5 is rotated about the rotation shaft 22 by the elastic restoring force of the string spring 23 provided at the side end portion thereof, and starts the opening operation in the direction of arrow G in FIG. By this opening operation, the pressing force applied to the IC package 3 by the pressing means 26 is released, and the floating plate 16 is pushed upward by the biasing force f of the string spring 15 as shown in FIG. At the same time, the biasing force f of the string spring 15 acts as an upward peeling force on the bottom surface 3 b of the IC package 3 via the support portion 17 of the floating plate 16. In this case, if the urging force f of the string winding spring 15 is set sufficiently larger than the adhesion force of the IC package 3, the IC package 3 adhered to the contact electrode 4 a of the tab film 4 is It is easily peeled off by the urging force f. This facilitates removal of the IC package 3 from the electrical component socket after product inspection.

  Thus, according to the electrical component socket of the present invention, when closing the socket cover 5, the biasing force of the string spring 15 that elastically supports the floating plate 16 is released before the IC package 3 is pressed. As a result, during the closing operation of the socket cover 5, the urging force f of the string spring 15 does not act on the IC package 3, and damage to the IC package 3 can be suppressed.

  Further, a support portion 17 is formed on the wall portion 16b of the opening portion 16a provided in the floating plate 16 so as to protrude inside the opening portion 16a, and the IC package 3 is supported by the support portion 17 so that the socket When the cover 5 is opened, the urging force f of the string spring 15 that supports the floating plate 16 can be applied to the bottom surface 3 b of the IC package 3. Therefore, it is possible to easily peel off the terminal 3a that has been softened in a high-temperature test such as a burn-in test and adhered to the contact electrode 4a of the tab film 4. Thereby, the IC package 3 can be easily taken out from the socket for electric parts after the test.

  The release member 21 is not limited to the substantially truncated cone shape described above, and may have any shape as long as the release member 21 is formed in a block shape to be engaged with the through hole 16c of the floating plate 16. For example, as shown in FIG. 9, the tightly wound portion 15 a formed integrally with the upper end portion of the string spring 15 is used as the release member 21, and the densely wound portion 15 a is inserted into the through hole 16 c of the floating plate 16. May be. In this case, manufacture becomes easy.

  Further, the means for lowering the floating plate 16 is not limited to the release member 21 that releases the bias of the chord spring 15 that biases the floating plate 16 upward. Any material can be used as long as the plate 16 can be lowered. For example, a plunger or the like may be provided on the surface of the pad 8 on the side facing the flange portion 8c or the housing portion of the socket cover 5, and the floating plate 16 may be directly pushed down by this plunger or the like.

  And the socket for electrical components of this invention is not restricted to a clamshell type, You may apply to an open top type. In this case, the latch member as a pressing means for pressing the IC package 3 is interlocked with the pressing cover disposed on the socket main body 18 so as to be movable up and down, and then floats before contacting and pressing the upper surface of the IC package 3. The plate 16 may be lowered.

It is a top view which shows embodiment of the socket for electrical components by this invention, an upper half shows the open state of a socket cover with respect to XX line, and a lower half shows the closed state of a socket cover. It is the XX sectional view taken on the line of FIG. The IC package applied to the said socket for electrical components is shown, (a) is the front view, (b) is the bottom view. It is a conceptual diagram of the socket cover open state which expands and shows the principal part of FIG. It is a top view which shows the floating plate of the said socket for electrical components. It is explanatory drawing which shows the state which accommodated the electrical component in the said socket for electrical components in the socket cover open state. It is explanatory drawing which shows the closing operation initial state of the socket cover of the said socket for electrical components. It is explanatory drawing which shows the socket cover closing operation completion state of the said socket for electrical components. It is a longitudinal cross-sectional view which shows the other structural example of the cancellation | release member of the said socket for electrical components. It is a disassembled perspective view of the conventional socket for electrical components. It is explanatory drawing which shows an example of the means to peel off the IC package affixed on the tab film.

Explanation of symbols

3 ... Electric parts 3a ... Terminal 5 ... Socket cover 8 ... Pad 15 ... Coil spring (biasing means)
DESCRIPTION OF SYMBOLS 16 ... Floating plate 16a ... Opening part 16b ... Wall part 16c ... Through-hole 17 ... Support part 18 ... Socket main body part 19 ... Contact means 20 ... Accommodating part 21 ... Release member 26 ... Pressing means 27 ... Pusher 29 ... String winding spring (pressing) Element)

Claims (7)

A housing portion formed on the upper surface of the socket body portion, housing electrical components, and provided with contact means capable of contacting the terminals of the electrical components;
A floating plate that is arranged so as to be movable up and down with respect to the housing portion, and that supports and supports the bottom surface of the electrical component;
An urging means provided in the socket main body for urging the floating plate upward;
Press means for pressing from above the electrical component housed in the housing portion so as to press the upper surface thereof to electrically connect the terminal of the electrical component and the contact means;
A socket for electrical parts comprising:
An electrical component socket, comprising: means for lowering the floating plate before the pressing means abuts against and presses the upper surface of the electrical component when the pressing device presses the electrical component.   The means for lowering the floating plate is a release member that is inserted into a through-hole penetrating vertically in a portion corresponding to the biasing means of the floating plate and releases the bias of the biasing means, 2. The socket for an electrical component according to claim 1, wherein the biasing means is released by being pressed by the pressing means before the pressing means comes into contact with and presses on the upper surface of the component.   The pressing means includes a pusher that is elastically supported by an elastic member on a surface of the socket cover that is pivotally provided at one end of the socket body, and that is held by the pusher. And a pad that presses the electrical component, and with the closing operation in which the socket cover falls, the edge of the pad is pressed against the release member. The socket for electrical parts according to 2.   4. The socket for an electrical component according to claim 2, wherein the release member is formed in a block shape to be locked in the through hole of the floating plate.   The electrical component socket according to claim 2 or 3, wherein the release member is a tightly wound portion formed integrally with an upper end portion of the urging means.   The said pad was formed so that a clearance gap might be produced between the said edge part of a pad and the through-hole upper end surface of the said floating plate in the press state of the said electrical component. The socket for electrical components according to item 1.   The floating plate has an opening into which the electric component can be inserted corresponding to the housing portion, and a support portion that locks to the bottom surface of the electric component is protruded inside the opening portion on the wall portion of the opening portion. The socket for electrical parts according to any one of claims 1 to 6.

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