JP2005293903A - Module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module with a wide adjustable range of board thickness. <P>SOLUTION: The module 10 is provided with a first circuit board 12, a second circuit board 14, and a flexible board 16 electrically connecting the first circuit board 12 and the second circuit board 14. A connector connecting pad 12i is provided on a first face 12f of the first circuit board 12. A connector connecting pad 14i is provided on a first face 14f of the second circuit board 14. The connector connecting pads 12i, 14i constitute a connector plug which comes in contact with a terminal electrode of an electric connector 100 when the module 10 is insertion-coupled with the electric connector 100. A second face 12g of the first circuit board 12 and a second face 14g of the second circuit board 14 are jointed to each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a module having a connector plug fitted to an electrical connector.

The module has a connector plug that is electrically connected to a terminal electrode of the electrical connector by being fitted to the electrical connector. In general, an electrical connector has a structure in which a terminal electrode is press-fitted into a resin molded product in order to reduce the cost (for example, Patent Document 1).
JP 2000-331732 A

  In many cases, the connector shape of an electrical connector is standardized, for example, when applied to an optical module. Therefore, the thickness of the module fitted to the electrical connector is required to follow the standard of the electrical connector.

  By the way, it is required to apply a high-density mounting substrate that can be miniaturized to the module as the device in which the module is incorporated is miniaturized. As the high-density mounting substrate, for example, a build-up substrate that can form a small-diameter via and can realize a via-on-via, such as an ALIVH substrate (registered trademark), is used. In such a high-density mounting substrate, since the small-diameter via is formed by laser processing or etching, the layer thickness cannot be increased. Also, considering the module reliability and manufacturing cost, there is a limit to increasing the number of module layers. Therefore, it is difficult for the high-density mounting board to increase the thickness of the module in accordance with the electrical connector standard.

  Therefore, an object of the present invention is to provide a module having a wide adjustable range of substrate thickness.

  The module of the present invention includes a first member and a second member. The first member has a first surface on which a first pad for connector connection is provided, and a second surface opposite to the first surface. The second member includes a first surface provided with a second pad for connector connection, and a second surface bonded to the second surface of the first member opposite to the first surface. And have. The module includes a connector plug formed by a first pad and a second pad, with the second surface of the first member and the second surface of the second member facing each other.

  According to the present invention, the thickness of the module can be adjusted by each of the first member and the second member. Therefore, in the module of the present invention, the adjustable range of the substrate thickness is wide.

  In the module of the present invention described above, the first member and the second member can be circuit boards. The module further includes a flexible substrate that electrically connects the first member and the second member.

  Furthermore, in the module of the present invention, the second surface of the first member has a first connection pad, and the second surface of the second member is a first connection pad of the first member. An opposing second connection pad can be provided. When the second surface of the first member and the second surface of the second member are opposed to each other, the first connection pad and the second connection pad are connected.

  The module of the present invention includes a first member and a second member. The first member has a first surface provided with a plurality of bonding pads, and a second surface opposite to the first surface. The second member has a first surface and a second surface electrically connected to the first surface, and the second surface is connected to each of the plurality of bonding pads. The module has a connector plug formed by the first surface of the second member.

  According to the present invention, the thickness of the connector plug of the module can be arbitrarily adjusted by the second member connected to the bonding pad of the first member. Therefore, the module of the present invention has a wide adjustable range of the board thickness in the connector plug.

  As described above, according to the present invention, a module having a wide adjustable range of the substrate thickness is provided. Therefore, according to the present invention, the board thickness of the module can be adjusted according to the shape of the electrical connector to be fitted.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

  (First embodiment)

  FIG. 1 is a perspective view of a module according to the first embodiment of the present invention. FIG. 1 shows both the electrical connector 100 into which the module is fitted. The module 10 includes a first circuit board (first member) 12, a second circuit board (second member) 14, and a flexible board 16.

  FIG. 2 is a view exemplarily showing a cross section of the module 10, and shows a cross section taken along the line II-II of FIG. 1 in a state before the first circuit board 12 and the second circuit board 14 are joined. . The first circuit board 12 and the second circuit board 14 are all-layer build-up boards capable of high-density mounting. The first circuit board 12 is composed of, for example, a layer in which a prepreg 12a, a core 12b, a prepreg 12c, and a cover lay 12d are provided symmetrically, and a flexible substrate 16 made of polyimide is sandwiched between the layers. Similarly, the second circuit board 14 is composed of layers in which the prepreg 14a, the core 14b, the prepreg 14c, and the cover lay 14d are provided symmetrically, and the flexible board 16 is sandwiched between the layers. For example, epoxy resin can be used for the prepreg and coverlay, and FR4 can be used for the core. The thicknesses of the prepregs 12a and 14a, the cores 12b and 14b, the prepregs 12c and 14c, and the cover lays 12d and 14d are, for example, 90 μm, 60 μm, 55 μm, and 37 μm.

  Each layer of the first circuit board 12 and the second circuit board 14 is provided with elements such as copper wiring and vias to form a circuit. The diameter of the via is, for example, 0.15 mm. The circuits formed on the first circuit board 12 and the second circuit board 14 are electrically connected by a flexible board 16.

  FIG. 3A and FIG. 3B are perspective views of the module 10 and show a state before the first circuit board 12 and the second circuit board 14 are joined. FIG. 3A shows a state where the first surface 12f of the first circuit board 12 is viewed from above, and FIG. 3B shows the second surface 12g of the first circuit board 12. Shown from the top.

  The first circuit board 12 has a first surface 12f and a second surface 12g facing the first surface 12f. The first surface 12f is a surface for mounting an electronic component. As shown in FIG. 3A, a plurality of connector connection pads (first pads) 12 i are provided on the first surface 12 f along one edge 12 h of the first circuit board 12. A plurality of connector connection pads (second pads) 14 i are also provided on the first surface 14 f of the second circuit board 14 along the one edge 14 h. The connector connection pads 12i and 14i constitute a connector plug and come into contact with the terminal electrode of the electrical connector 100 when fitted to the electrical connector 100.

  As shown in FIG. 3B, a terminal pad 12k is provided on the second surface 12g of the first circuit board 12 along an edge 12j opposite to the one edge 12h. When the module 10 is used as a part of an optical module, the lead terminals of the optical transmission subassembly and the optical reception subassembly are joined to the terminal pad 12k.

  A first connection pad 12m is provided on the second surface 12g of the first circuit board 12 along one edge 12h. A second connection pad 14m facing the first connection pad 12m is provided on the second surface 14g of the second circuit board 14 along the edge 14h. By joining the first connection pad 12m and the second connection pad 14m, the first circuit board 12 and the second circuit board 14 are joined as shown in FIG. 1, and the module 10 is provided.

  In the module 10 of the present embodiment, the thickness of the module 10 is adjusted by each of the two circuit boards (the first circuit board 12 and the second circuit board 14) electrically connected to each other by the flexible board 16. Is possible. Therefore, the adjustable range of the thickness of the module 10 is widened.

  (Second Embodiment)

  The module according to the second embodiment of the present invention will be described below. 4 and 5 are perspective views of the module 20 according to the second embodiment of the present invention. FIG. 4 shows the module 20 in a state where the first surface 22a of the substrate body 22 is viewed from above, and FIG. 5 shows the module in a state where the second surface 22b of the substrate body 22 is viewed from above. 20 is shown.

  Similarly to the module 10, the module 20 is fitted to the electrical connector 100. The module 20 includes a substrate main body (first member) 22 and a block (second member) 24. The board body 22 is an all-layer buildup board that can be mounted at high density. The board body 22 is a circuit board made of ten prepregs each having a thickness of 80 μm, for example. For the prepreg, for example, an aramid nonwoven fabric substrate can be used. A circuit is formed in the substrate body 22 by providing elements such as copper wiring and vias in each layer.

  The substrate body 22 has a first surface 22a and a second surface 22b opposite to the first surface 22a. A plurality of bonding pads 22 d are provided on the first surface 22 a along one edge 22 c of the substrate body 22. Each of the blocks 24 is mounted on the bonding pad 22d.

  The block 24 has a joint surface (second surface) 24a and a connection surface (first surface) 24b facing the joint surface 24a. The joint surface 24a and the connection surface 24b are electrically connected. For the block 24, for example, a member made of Ni—Au plating on a block made of Cu can be used.

  The bonding surface 24a is bonded to the bonding pad 22d. On the other hand, the connection surface 24 b constitutes a connector plug and is a surface that contacts the terminal electrode of the electrical connector 100 when the module 20 is fitted to the electrical connector 100. FIG. 6 is a perspective view showing an example of the block 24. The connection surface 24 b of the block 24 may include a surface 22 c that provides a recess corresponding to the shape of the terminal electrode of the electrical connector 100. By providing the surface 22 c, the terminal electrode of the electrical connector 100 can easily come into contact with the block 24.

  As shown in FIG. 4, a terminal pad 22g is provided on the first surface 22a along an edge 22f opposite to the one edge 22c. When the module 20 is used as one part of an optical module, the lead terminals of the optical transmission subassembly and the optical reception subassembly are joined to the terminal pad 22g.

  As shown in FIG. 5, the second surface 22b is provided with a plurality of connector connection pads 22e along one edge 22c. The plurality of connector connection pads 22 e constitute a connector plug, and contact the terminal electrode of the electrical connector 100 when the module 20 is fitted to the electrical connector 100.

  According to the module 20 described above, the thickness of the connector plug fitted to the electrical connector 100 can be increased by the block 24. Since the thickness of the block 24 can be arbitrarily changed, according to the module 20, the adjustable range of the board thickness in the connector plug is widened.

  (Third embodiment)

  Hereinafter, a module according to a third embodiment of the present invention will be described. FIG. 7 is an exploded perspective view of a module according to the third embodiment of the present invention. FIG. 8 is a cross-sectional view of the auxiliary substrate applied to the module according to the third embodiment of the present invention, and shows a cross section taken along line VIII-VIII in FIG. The module 30 according to the present embodiment includes a substrate main body (first member) 22 similar to the module 20 and an auxiliary substrate (second member) 26.

  As shown in FIG. 8, the auxiliary substrate 26 uses a PCB such as FR4 as a base, and has a bonding surface (second surface) 26a and a connection surface (first surface) 26b facing the bonding surface 26a. A plurality of bonding pads 26c are provided on the bonding surface 26a. The bonding pads 26c are provided at the same pitch as the bonding pads 22d of the substrate body 22 and are bonded to the bonding pads 22d.

  A plurality of connector connection pads 26d are provided on the connection surface 26b. The connector connection pad 26d is electrically connected to the bonding pad 26c by a metal material such as Cu embedded in the through hole. The connector connection pad 26 d constitutes a connector plug, and contacts the terminal electrode of the electrical connector 100 when the module 30 is fitted to the electrical connector 100.

  According to the module 30 described above, the thickness of the connector plug fitted to the electrical connector 100 can be increased by the auxiliary board 26. Since the thickness of the auxiliary board 26 can be arbitrarily changed, according to the module 30, the adjustable range of the board thickness in the connector plug is widened.

FIG. 1 is a perspective view of a module according to the first embodiment of the present invention. FIG. 2 is a view exemplarily showing a cross section of the module according to the first embodiment of the present invention, and shows a state before the first circuit board and the second circuit board are bonded together. FIG. 3A and FIG. 3B are perspective views of the module according to the first embodiment of the present invention, and show a state before the first circuit board and the second circuit board are bonded together. Show. FIG. 4 is a perspective view of a module according to the second embodiment of the present invention. FIG. 5 is a perspective view of a module according to the second embodiment of the present invention. FIG. 6 is a perspective view showing an example of a block applied to the module according to the second embodiment of the present invention. FIG. 7 is an exploded perspective view of a module according to the third embodiment of the present invention. FIG. 8 is a cross-sectional view of an auxiliary substrate applied to a module according to the third embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Module, 12 ... 1st circuit board, 12f ... 1st surface, 12g ... 2nd surface, 12i ... Connector connection pad, 12k ... Terminal pad, 14 ... 2nd circuit board, 14f ... 1st Surface, 14g ... 2nd surface, 14i ... Connector connection pad.

Claims (4)

A first member having a first surface provided with a first pad for connecting a connector, and a second surface opposite to the first surface;
A second surface having a first surface provided with a second pad for connector connection, and a second surface bonded to the second surface of the first member opposite to the first surface. And members of
With
A connector plug formed by the first pad and the second pad, wherein the second surface of the first member and the second surface of the second member are opposed to each other; Feature module. The first member is a circuit board;
The second member is a circuit board;
The module further includes a flexible substrate that electrically connects the first member and the second member.
The module according to claim 1. The second surface of the first member has a first connection pad;
The second surface of the second member has a second connection pad facing the first connection pad of the first member;
When the second surface of the first member and the second surface of the second member are opposed to each other, the first connection pad and the second connection pad are connected.
The module according to claim 1 or 2. A first member having a first surface provided with a plurality of bonding pads and a second surface opposite to the first surface;
A second member having a first surface and a second surface electrically connected to the first surface, wherein the second surface is connected to each of the plurality of bonding pads;
With
A module comprising a connector plug formed by the first surface of the second member.

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