JP2005288664A5 - - Google Patents
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- Publication number
- JP2005288664A5 JP2005288664A5 JP2004111510A JP2004111510A JP2005288664A5 JP 2005288664 A5 JP2005288664 A5 JP 2005288664A5 JP 2004111510 A JP2004111510 A JP 2004111510A JP 2004111510 A JP2004111510 A JP 2004111510A JP 2005288664 A5 JP2005288664 A5 JP 2005288664A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- polished
- cage
- completion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 309
- 239000000758 substrate Substances 0.000 claims description 54
- 238000001514 detection method Methods 0.000 claims description 28
- 239000010410 layer Substances 0.000 claims description 16
- 230000033001 locomotion Effects 0.000 claims description 16
- 230000000630 rising effect Effects 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 30
- 230000001681 protective effect Effects 0.000 description 18
- 239000012530 fluid Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 15
- 239000007788 liquid Substances 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920003225 polyurethane elastomer Polymers 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004111510A JP2005288664A (ja) | 2004-04-05 | 2004-04-05 | 研磨装置及び研磨パッド立上完了検知方法 |
| US11/098,430 US7189139B2 (en) | 2004-04-05 | 2005-04-05 | Polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004111510A JP2005288664A (ja) | 2004-04-05 | 2004-04-05 | 研磨装置及び研磨パッド立上完了検知方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005288664A JP2005288664A (ja) | 2005-10-20 |
| JP2005288664A5 true JP2005288664A5 (enExample) | 2007-05-17 |
Family
ID=35054988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004111510A Pending JP2005288664A (ja) | 2004-04-05 | 2004-04-05 | 研磨装置及び研磨パッド立上完了検知方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7189139B2 (enExample) |
| JP (1) | JP2005288664A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007144564A (ja) * | 2005-11-28 | 2007-06-14 | Ebara Corp | 研磨装置 |
| JP5511600B2 (ja) | 2010-09-09 | 2014-06-04 | 株式会社荏原製作所 | 研磨装置 |
| TWI530360B (zh) * | 2012-09-28 | 2016-04-21 | 荏原製作所股份有限公司 | 研磨裝置 |
| US9227294B2 (en) * | 2013-12-31 | 2016-01-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and method for chemical mechanical polishing |
| CN106604802B (zh) * | 2014-09-02 | 2019-05-31 | 株式会社荏原制作所 | 终点检测方法、研磨装置及研磨方法 |
| JP6233326B2 (ja) | 2015-02-04 | 2017-11-22 | 信越半導体株式会社 | 研磨布立ち上げ方法及び研磨方法 |
| JP6775354B2 (ja) | 2015-10-16 | 2020-10-28 | 株式会社荏原製作所 | 研磨装置、及び、研磨方法 |
| US10744617B2 (en) * | 2015-10-16 | 2020-08-18 | Ebara Corporation | Polishing endpoint detection method |
| US10058974B1 (en) * | 2017-03-31 | 2018-08-28 | Taiwan Semiconductor Manufacturing Co., Ltd | Method for controlling chemical mechanical polishing process |
| JP7215412B2 (ja) * | 2019-12-26 | 2023-01-31 | 株式会社Sumco | 半導体ウェーハ用研磨布の使用開始時期の判定方法及びそれを用いた半導体ウェーハの研磨方法、並びに半導体ウェーハ研磨システム |
| CN113334238A (zh) * | 2021-06-22 | 2021-09-03 | 上海华虹宏力半导体制造有限公司 | 化学机械研磨的控制方法和设备 |
| JP7746217B2 (ja) * | 2022-05-13 | 2025-09-30 | 株式会社荏原製作所 | 処理システムおよびパッド搬送装置 |
| JP2024085517A (ja) * | 2022-12-15 | 2024-06-27 | 株式会社荏原製作所 | 研磨装置 |
| JP2024106670A (ja) | 2023-01-27 | 2024-08-08 | 株式会社Ｓｃｒｅｅｎホールディングス | 研磨具のコンディショニング方法、基板処理方法および基板処理装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
| US5308438A (en) * | 1992-01-30 | 1994-05-03 | International Business Machines Corporation | Endpoint detection apparatus and method for chemical/mechanical polishing |
| US5741171A (en) * | 1996-08-19 | 1998-04-21 | Sagitta Engineering Solutions, Ltd. | Precision polishing system |
| US6352466B1 (en) * | 1998-08-31 | 2002-03-05 | Micron Technology, Inc. | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
| US6739947B1 (en) * | 1998-11-06 | 2004-05-25 | Beaver Creek Concepts Inc | In situ friction detector method and apparatus |
| US6300247B2 (en) * | 1999-03-29 | 2001-10-09 | Applied Materials, Inc. | Preconditioning polishing pads for chemical-mechanical polishing |
| US6623334B1 (en) * | 1999-05-05 | 2003-09-23 | Applied Materials, Inc. | Chemical mechanical polishing with friction-based control |
| US6293845B1 (en) * | 1999-09-04 | 2001-09-25 | Mitsubishi Materials Corporation | System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current |
| US6780086B2 (en) * | 2001-10-12 | 2004-08-24 | Mosel Vitelic, Inc. | Determining an endpoint in a polishing process |
| TW523826B (en) * | 2002-03-15 | 2003-03-11 | Mosel Vitelic Inc | Determination method of CMP processing time |
| DE10324429B4 (de) * | 2003-05-28 | 2010-08-19 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers |
-
2004
- 2004-04-05 JP JP2004111510A patent/JP2005288664A/ja active Pending
-
2005
- 2005-04-05 US US11/098,430 patent/US7189139B2/en not_active Expired - Fee Related
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