JP2005288664A - 研磨装置及び研磨パッド立上完了検知方法 - Google Patents

研磨装置及び研磨パッド立上完了検知方法 Download PDF

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Publication number
JP2005288664A
JP2005288664A JP2004111510A JP2004111510A JP2005288664A JP 2005288664 A JP2005288664 A JP 2005288664A JP 2004111510 A JP2004111510 A JP 2004111510A JP 2004111510 A JP2004111510 A JP 2004111510A JP 2005288664 A JP2005288664 A JP 2005288664A
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Japan
Prior art keywords
polishing
polishing pad
polished
pad
completion
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JP2004111510A
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English (en)
Japanese (ja)
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JP2005288664A5 (enExample
Inventor
Katsutoshi Ono
勝俊 大野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2004111510A priority Critical patent/JP2005288664A/ja
Priority to US11/098,430 priority patent/US7189139B2/en
Publication of JP2005288664A publication Critical patent/JP2005288664A/ja
Publication of JP2005288664A5 publication Critical patent/JP2005288664A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2004111510A 2004-04-05 2004-04-05 研磨装置及び研磨パッド立上完了検知方法 Pending JP2005288664A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004111510A JP2005288664A (ja) 2004-04-05 2004-04-05 研磨装置及び研磨パッド立上完了検知方法
US11/098,430 US7189139B2 (en) 2004-04-05 2005-04-05 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004111510A JP2005288664A (ja) 2004-04-05 2004-04-05 研磨装置及び研磨パッド立上完了検知方法

Publications (2)

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JP2005288664A true JP2005288664A (ja) 2005-10-20
JP2005288664A5 JP2005288664A5 (enExample) 2007-05-17

Family

ID=35054988

Family Applications (1)

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JP2004111510A Pending JP2005288664A (ja) 2004-04-05 2004-04-05 研磨装置及び研磨パッド立上完了検知方法

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US (1) US7189139B2 (enExample)
JP (1) JP2005288664A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012056029A (ja) * 2010-09-09 2012-03-22 Ebara Corp 研磨装置
JP2016143837A (ja) * 2015-02-04 2016-08-08 信越半導体株式会社 研磨布立ち上げ方法及び研磨方法
JP2021106226A (ja) * 2019-12-26 2021-07-26 株式会社Sumco 半導体ウェーハ用研磨布の使用開始時期の判定方法及びそれを用いた半導体ウェーハの研磨方法、並びに半導体ウェーハ研磨システム
CN113334238A (zh) * 2021-06-22 2021-09-03 上海华虹宏力半导体制造有限公司 化学机械研磨的控制方法和设备
WO2024127900A1 (ja) * 2022-12-15 2024-06-20 株式会社荏原製作所 研磨装置
KR20240118679A (ko) 2023-01-27 2024-08-05 가부시키가이샤 스크린 홀딩스 연마구의 컨디셔닝 방법, 기판 처리 방법 및 기판 처리 장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007144564A (ja) * 2005-11-28 2007-06-14 Ebara Corp 研磨装置
TWI530360B (zh) * 2012-09-28 2016-04-21 荏原製作所股份有限公司 研磨裝置
US9227294B2 (en) * 2013-12-31 2016-01-05 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and method for chemical mechanical polishing
CN106604802B (zh) * 2014-09-02 2019-05-31 株式会社荏原制作所 终点检测方法、研磨装置及研磨方法
JP6775354B2 (ja) 2015-10-16 2020-10-28 株式会社荏原製作所 研磨装置、及び、研磨方法
US10744617B2 (en) * 2015-10-16 2020-08-18 Ebara Corporation Polishing endpoint detection method
US10058974B1 (en) * 2017-03-31 2018-08-28 Taiwan Semiconductor Manufacturing Co., Ltd Method for controlling chemical mechanical polishing process
JP7746217B2 (ja) * 2022-05-13 2025-09-30 株式会社荏原製作所 処理システムおよびパッド搬送装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5308438A (en) * 1992-01-30 1994-05-03 International Business Machines Corporation Endpoint detection apparatus and method for chemical/mechanical polishing
US5741171A (en) * 1996-08-19 1998-04-21 Sagitta Engineering Solutions, Ltd. Precision polishing system
US6352466B1 (en) * 1998-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
US6739947B1 (en) * 1998-11-06 2004-05-25 Beaver Creek Concepts Inc In situ friction detector method and apparatus
US6300247B2 (en) * 1999-03-29 2001-10-09 Applied Materials, Inc. Preconditioning polishing pads for chemical-mechanical polishing
US6623334B1 (en) * 1999-05-05 2003-09-23 Applied Materials, Inc. Chemical mechanical polishing with friction-based control
US6293845B1 (en) * 1999-09-04 2001-09-25 Mitsubishi Materials Corporation System and method for end-point detection in a multi-head CMP tool using real-time monitoring of motor current
US6780086B2 (en) * 2001-10-12 2004-08-24 Mosel Vitelic, Inc. Determining an endpoint in a polishing process
TW523826B (en) * 2002-03-15 2003-03-11 Mosel Vitelic Inc Determination method of CMP processing time
DE10324429B4 (de) * 2003-05-28 2010-08-19 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Betreiben eines chemisch-mechanischen Polier Systems mittels eines Sensorsignals eines Polierkissenkonditionierers

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012056029A (ja) * 2010-09-09 2012-03-22 Ebara Corp 研磨装置
KR101462119B1 (ko) 2010-09-09 2014-11-17 가부시키가이샤 에바라 세이사꾸쇼 연마 장치
JP2016143837A (ja) * 2015-02-04 2016-08-08 信越半導体株式会社 研磨布立ち上げ方法及び研磨方法
WO2016125423A1 (ja) * 2015-02-04 2016-08-11 信越半導体株式会社 研磨布立ち上げ方法及び研磨方法
KR20170113554A (ko) * 2015-02-04 2017-10-12 신에쯔 한도타이 가부시키가이샤 연마포 기동방법 및 연마방법
US10307885B2 (en) 2015-02-04 2019-06-04 Shin-Etsu Handotai Co., Ltd. Method for raising polishing pad and polishing method
KR102294368B1 (ko) 2015-02-04 2021-08-26 신에쯔 한도타이 가부시키가이샤 연마포 기동방법 및 연마방법
JP2021106226A (ja) * 2019-12-26 2021-07-26 株式会社Sumco 半導体ウェーハ用研磨布の使用開始時期の判定方法及びそれを用いた半導体ウェーハの研磨方法、並びに半導体ウェーハ研磨システム
JP7215412B2 (ja) 2019-12-26 2023-01-31 株式会社Sumco 半導体ウェーハ用研磨布の使用開始時期の判定方法及びそれを用いた半導体ウェーハの研磨方法、並びに半導体ウェーハ研磨システム
CN113334238A (zh) * 2021-06-22 2021-09-03 上海华虹宏力半导体制造有限公司 化学机械研磨的控制方法和设备
WO2024127900A1 (ja) * 2022-12-15 2024-06-20 株式会社荏原製作所 研磨装置
KR20240118679A (ko) 2023-01-27 2024-08-05 가부시키가이샤 스크린 홀딩스 연마구의 컨디셔닝 방법, 기판 처리 방법 및 기판 처리 장치

Also Published As

Publication number Publication date
US20050221720A1 (en) 2005-10-06
US7189139B2 (en) 2007-03-13

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