JP2005268534A5 - - Google Patents

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Publication number
JP2005268534A5
JP2005268534A5 JP2004078782A JP2004078782A JP2005268534A5 JP 2005268534 A5 JP2005268534 A5 JP 2005268534A5 JP 2004078782 A JP2004078782 A JP 2004078782A JP 2004078782 A JP2004078782 A JP 2004078782A JP 2005268534 A5 JP2005268534 A5 JP 2005268534A5
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JP
Japan
Prior art keywords
chip
wiring
main surface
semiconductor device
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004078782A
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English (en)
Japanese (ja)
Other versions
JP2005268534A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004078782A priority Critical patent/JP2005268534A/ja
Priority claimed from JP2004078782A external-priority patent/JP2005268534A/ja
Publication of JP2005268534A publication Critical patent/JP2005268534A/ja
Publication of JP2005268534A5 publication Critical patent/JP2005268534A5/ja
Pending legal-status Critical Current

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JP2004078782A 2004-03-18 2004-03-18 半導体チップおよび積層型半導体装置 Pending JP2005268534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004078782A JP2005268534A (ja) 2004-03-18 2004-03-18 半導体チップおよび積層型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004078782A JP2005268534A (ja) 2004-03-18 2004-03-18 半導体チップおよび積層型半導体装置

Publications (2)

Publication Number Publication Date
JP2005268534A JP2005268534A (ja) 2005-09-29
JP2005268534A5 true JP2005268534A5 (https=) 2007-01-18

Family

ID=35092765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004078782A Pending JP2005268534A (ja) 2004-03-18 2004-03-18 半導体チップおよび積層型半導体装置

Country Status (1)

Country Link
JP (1) JP2005268534A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535110B2 (en) * 2006-06-15 2009-05-19 Marvell World Trade Ltd. Stack die packages
JP5759750B2 (ja) * 2011-02-28 2015-08-05 株式会社メガチップス 半導体装置および半導体集積回路の設計方法

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