JP2005260079A5 - - Google Patents

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Publication number
JP2005260079A5
JP2005260079A5 JP2004071294A JP2004071294A JP2005260079A5 JP 2005260079 A5 JP2005260079 A5 JP 2005260079A5 JP 2004071294 A JP2004071294 A JP 2004071294A JP 2004071294 A JP2004071294 A JP 2004071294A JP 2005260079 A5 JP2005260079 A5 JP 2005260079A5
Authority
JP
Japan
Prior art keywords
groove
wiring layer
main surface
via hole
pad electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004071294A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005260079A (ja
JP4282514B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004071294A priority Critical patent/JP4282514B2/ja
Priority claimed from JP2004071294A external-priority patent/JP4282514B2/ja
Publication of JP2005260079A publication Critical patent/JP2005260079A/ja
Publication of JP2005260079A5 publication Critical patent/JP2005260079A5/ja
Application granted granted Critical
Publication of JP4282514B2 publication Critical patent/JP4282514B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004071294A 2004-03-12 2004-03-12 半導体装置の製造方法 Expired - Fee Related JP4282514B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004071294A JP4282514B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004071294A JP4282514B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005260079A JP2005260079A (ja) 2005-09-22
JP2005260079A5 true JP2005260079A5 (enrdf_load_html_response) 2007-04-19
JP4282514B2 JP4282514B2 (ja) 2009-06-24

Family

ID=35085497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004071294A Expired - Fee Related JP4282514B2 (ja) 2004-03-12 2004-03-12 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4282514B2 (enrdf_load_html_response)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101697573B1 (ko) 2010-11-29 2017-01-19 삼성전자 주식회사 반도체 장치, 그 제조 방법, 및 상기 반도체 장치를 포함하는 반도체 패키지
FR2970118B1 (fr) 2010-12-30 2013-12-13 St Microelectronics Crolles 2 Puce de circuits integres et procede de fabrication.
FR2970119B1 (fr) * 2010-12-30 2013-12-13 St Microelectronics Crolles 2 Sas Puce de circuits integres et procede de fabrication.
US9711403B2 (en) 2011-01-17 2017-07-18 Xintec Inc. Method for forming chip package
SE538058C2 (sv) 2012-03-30 2016-02-23 Silex Microsystems Ab Metod att tillhandahålla ett viahål och en routing-struktur
CN116344478B (zh) * 2021-12-24 2025-02-25 长鑫存储技术有限公司 一种半导体结构及半导体结构的制备方法
CN115084082B (zh) * 2022-07-19 2022-11-22 甬矽电子(宁波)股份有限公司 扇出型封装结构和扇出型封装方法

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