JP2005256113A - Vacuum deposition apparatus - Google Patents

Vacuum deposition apparatus Download PDF

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JP2005256113A
JP2005256113A JP2004070993A JP2004070993A JP2005256113A JP 2005256113 A JP2005256113 A JP 2005256113A JP 2004070993 A JP2004070993 A JP 2004070993A JP 2004070993 A JP2004070993 A JP 2004070993A JP 2005256113 A JP2005256113 A JP 2005256113A
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hollow shaft
evaporation source
vacuum chamber
vacuum
evaporation
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JP4563698B2 (en
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Hisato Tanaka
寿人 田中
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Ulvac Inc
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Ulvac Inc
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Priority to PCT/JP2005/003174 priority patent/WO2005087970A1/en
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus having a driving mechanism for an evaporation source, which reduces particles to be formed in a chamber, and copes with the arrangement of a plurality of evaporation sources. <P>SOLUTION: This vacuum deposition apparatus comprises a hollow shaft 5 having one end 5a closed and the other end 5b opened; a transfer mechanism which is placed outside a vacuum chamber, inserts the closed end 5a of the hollow shaft 5 into the inner part 2 of the vacuum chamber, and axially moves the hollow shaft 5; the evaporation source 4 attached on the closed end 5a side of the hollow shaft 5; and a feeding system 7 for supplying an electrical power and cooling water to the evaporation source 4 through the inner part of the hollow shaft 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、真空チャンバ内において蒸発源が移動できる構造の真空蒸着装置に関する。   The present invention relates to a vacuum deposition apparatus having a structure in which an evaporation source can move in a vacuum chamber.

真空蒸着装置は、真空チャンバの内部に被処理基板と蒸発源とを対向配置し、蒸発源からの蒸発物質を基板上に蒸着させ成膜している。従来では、蒸発源を真空チャンバ内に固定して成膜していたが、近年では、基板の大面積化、膜質の均質化等を理由として、蒸発源を基板に対して相対移動させながら成膜する方法も採用されている（例えば下記特許文献１参照）。   In the vacuum deposition apparatus, a substrate to be processed and an evaporation source are disposed opposite to each other in a vacuum chamber, and an evaporation substance from the evaporation source is deposited on the substrate to form a film. Conventionally, the evaporation source is fixed in a vacuum chamber to form a film. However, in recent years, the evaporation source is moved while moving relative to the substrate for reasons such as increasing the area of the substrate and homogenizing the film quality. A film forming method is also employed (for example, see Patent Document 1 below).

真空チャンバ内において蒸発源が移動できる構造の真空蒸着装置は、従来、例えばチェーンやスプロケット等、蒸発源の駆動に必要な機構を真空チャンバ内に配置し、蒸発源に対する電力供給ケーブル及び冷却水循環ホース等の接続は、真空チャンバの隔壁を介してチャンバ内部の蒸発源へ直接行うようにしていた。   Conventionally, a vacuum evaporation apparatus having a structure in which an evaporation source can move in a vacuum chamber has conventionally been provided with a mechanism necessary for driving the evaporation source, such as a chain or a sprocket, in the vacuum chamber, and a power supply cable and a cooling water circulation hose for the evaporation source. These connections were made directly to the evaporation source inside the chamber through the partition of the vacuum chamber.

なお、この出願の発明に関連する先行技術文献を以下に示す。特許文献１には、基板の一端から他方の一端まで移動する蒸発源を複数備え、異種蒸着材料の多層膜を連続して形成する構造の真空蒸着装置が開示されている。また、特許文献２には、電子ビーム蒸着装置の蒸発源を円筒形状に形成し、当該円筒形状の蒸発源を長手方向に移動自在とすると共に、内部に冷却水を循環させる構成が開示されている。   Prior art documents related to the invention of this application are shown below. Patent Document 1 discloses a vacuum vapor deposition apparatus having a structure in which a plurality of evaporation sources moving from one end of a substrate to the other end are formed and a multilayer film of different vapor deposition materials is continuously formed. Further, Patent Document 2 discloses a configuration in which an evaporation source of an electron beam evaporation apparatus is formed in a cylindrical shape, the cylindrical evaporation source is movable in the longitudinal direction, and cooling water is circulated therein. Yes.

特開２００３−２５７６４４号公報JP 2003-257644 A 特開平１０−２５９４７４号公報JP-A-10-259474

しかしながら、真空チャンバ内において蒸発源が移動できる構造の従来の真空蒸着装置は、上述のように、蒸発源を移動させるのに必要な駆動機構が真空チャンバ内に配置されているので、当該駆動機構から生じるパーティクルでチャンバ内が汚染されるという問題がある。また、駆動機構をチャンバ内に配置しているので、チャンバ容積が増大し、複数の蒸発源を配置することも困難となる。   However, in the conventional vacuum evaporation apparatus having a structure in which the evaporation source can move in the vacuum chamber, as described above, the drive mechanism necessary for moving the evaporation source is arranged in the vacuum chamber. There is a problem that the inside of the chamber is contaminated with particles generated from the above. In addition, since the drive mechanism is disposed in the chamber, the chamber volume increases and it is difficult to dispose a plurality of evaporation sources.

更に、蒸発源に接続された電力ケーブルや冷却水導入管等を真空チャンバ内にそのまま入れる構成であったので、蒸発源の移動に伴ってこれらケーブル等を原因とするパーティクルの発生や、耐久性の問題もあった。   Furthermore, since the power cable connected to the evaporation source, the cooling water introduction pipe, and the like are put in the vacuum chamber as they are, the generation of particles caused by these cables and the durability of the evaporation source move. There was also a problem.

本発明は上述の問題に鑑みてなされ、チャンバ内におけるパーティクルの発生を低減でき、蒸発源の複数配置にも対応することができる蒸発源駆動機構を備えた真空蒸着装置を提供することを課題とする。   The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a vacuum evaporation apparatus including an evaporation source driving mechanism that can reduce generation of particles in a chamber and can cope with a plurality of evaporation sources. To do.

以上の課題は、真空チャンバ内に、蒸着材料の蒸発源を備えた真空蒸着装置において、一端が閉塞し他端が開放された中空軸と、この中空軸の一端側を前記真空チャンバの内部に挿通し前記中空軸を軸方向に移動させる移動機構とを有し、前記蒸発源は、前記中空軸の一端側に取り付けられ、前記蒸発源に導入される電力及び冷却水が前記中空軸の内部を介して供給されると共に、前記移動機構は、前記真空チャンバの外部に設けられていることを特徴とする真空蒸着装置、によって解決される。   In the vacuum deposition apparatus provided with the evaporation source of the deposition material in the vacuum chamber, the above problem is that a hollow shaft whose one end is closed and the other end is opened, and one end side of this hollow shaft are placed inside the vacuum chamber. A moving mechanism that moves the hollow shaft in the axial direction, the evaporation source is attached to one end of the hollow shaft, and electric power and cooling water introduced into the evaporation source are inside the hollow shaft. And the moving mechanism is solved by a vacuum deposition apparatus provided outside the vacuum chamber.

本発明では、蒸発源の駆動機構が真空チャンバの外部に配置されているので、当該駆動機構を原因とするパーティクルの発生を回避できると共に、真空チャンバの容積の低減あるいは真空チャンバ内における蒸発源の複数配置にも容易に対応することが可能である。   In the present invention, since the evaporation source drive mechanism is arranged outside the vacuum chamber, generation of particles caused by the drive mechanism can be avoided, and the volume of the vacuum chamber can be reduced or the evaporation source in the vacuum chamber can be prevented. It is possible to easily cope with a plurality of arrangements.

更に、蒸発源に対する必要な電力及び冷却水の供給を、蒸発源を支持する中空軸の内部を介して行うようにしているので、これら電力及び冷却水の各供給系統からのパーティクル発生を抑えて、真空チャンバの汚染を効果的に低減することができる。   Furthermore, since the necessary power and cooling water are supplied to the evaporation source through the inside of the hollow shaft that supports the evaporation source, the generation of particles from each supply system of these electric power and cooling water is suppressed. The contamination of the vacuum chamber can be effectively reduced.

以上述べたように、本発明の真空蒸着装置によれば、蒸発源の駆動機構を真空チャンバの外部に配置すると共に、蒸発源に対する必要な電力及び冷却水の供給を、蒸発源を支持する中空軸の内部を介して行うようにしているので、真空チャンバ内部におけるパーティクル発生要因を低減できると共に、蒸発源の複数配置にも容易に対応することが可能である。   As described above, according to the vacuum vapor deposition apparatus of the present invention, the evaporation source drive mechanism is disposed outside the vacuum chamber, and the necessary power and cooling water supply to the evaporation source are provided in the hollow space that supports the evaporation source. Since it is performed through the inside of the shaft, it is possible to reduce the cause of particle generation inside the vacuum chamber and to easily deal with a plurality of evaporation sources.

以下、本発明の実施の形態について図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の実施の形態における真空蒸着装置の蒸発源駆動機構１の構成を示している。   FIG. 1 shows a configuration of an evaporation source driving mechanism 1 of a vacuum vapor deposition apparatus according to an embodiment of the present invention.

この蒸発源駆動機構１は、成膜室２を区画する真空チャンバの隔壁３を貫通し、成膜室２内で蒸発源４を支持する中空軸５を備えている。この中空軸５は、成膜室２側の一端部５ａが閉塞すると共に、真空チャンバ外方側の他端部５ｂが開放している。蒸発源４は、この中空軸５の一端部５ａ近傍に支持されている。なお、以下、中空軸５の一端部５ａを「閉塞端」、他端部５ｂを「開放端」とそれぞれ表現する。   The evaporation source drive mechanism 1 includes a hollow shaft 5 that passes through a partition 3 of a vacuum chamber that partitions the film formation chamber 2 and supports the evaporation source 4 in the film formation chamber 2. The hollow shaft 5 is closed at one end portion 5a on the film forming chamber 2 side and opened at the other end portion 5b on the outer side of the vacuum chamber. The evaporation source 4 is supported in the vicinity of one end 5 a of the hollow shaft 5. Hereinafter, the one end portion 5a of the hollow shaft 5 is expressed as “closed end”, and the other end portion 5b is expressed as “open end”.

中空軸５は隔壁３の貫通孔３ａに挿通され、この挿通部を介して中空軸５は軸方向へ移動自在とされると共に、この挿通部と中空軸５の開放端５ｂとの間にはベローズ６が設けられている。つまり、本実施の形態では、隔壁３と中空軸５との間の気密をベローズ６によって確保し、このベローズ６によって、中空軸５の挿通部における真空チャンバの内外の連通を遮断するようにしている。なお、中空軸５の内部は、その閉塞端５ａが真空チャンバ内部に位置し、開放端５ｂが真空チャンバ外部に位置しているので、大気圧状態である。   The hollow shaft 5 is inserted into the through hole 3a of the partition wall 3, and the hollow shaft 5 is movable in the axial direction through the insertion portion, and between the insertion portion and the open end 5b of the hollow shaft 5. A bellows 6 is provided. In other words, in the present embodiment, the airtightness between the partition wall 3 and the hollow shaft 5 is ensured by the bellows 6, and the bellows 6 blocks communication between the inside and outside of the vacuum chamber at the insertion portion of the hollow shaft 5. Yes. The inside of the hollow shaft 5 is in an atmospheric pressure state because the closed end 5a is located inside the vacuum chamber and the open end 5b is located outside the vacuum chamber.

蒸発源４は、蒸着材料を蒸発させる抵抗加熱源と、冷却水が循環するジャケット部を有しており、これら抵抗加熱源に供給する電力ケーブル及び冷却水の循環ホース等の供給系統７は、中空軸５の内部を介して、蒸発源４に接続されている。   The evaporation source 4 has a resistance heating source for evaporating the vapor deposition material and a jacket portion through which the cooling water circulates. A supply system 7 such as a power cable and a cooling water circulation hose for supplying the resistance heating source, It is connected to the evaporation source 4 through the inside of the hollow shaft 5.

なお、蒸発源４は上述の抵抗加熱方式に限らず、電子ビーム蒸発源等の他の形式の蒸発源を用いることも可能である。   The evaporation source 4 is not limited to the resistance heating method described above, and other types of evaporation sources such as an electron beam evaporation source can be used.

中空軸５の内部は、真空チャンバの外部（大気側）に開口する開放端５ｂに連通しており、上記電力ケーブル及び冷却水循環ホース等の供給系統７は、この中空軸５の開放端５ｂから挿通されている。上記供給系統７は、中空軸５の開放端５ｂ側上部に取り付けられた支持板８に固定されている可撓性導出管９の内部を介して外部の電力源及び冷却水循環システムに接続されている。   The inside of the hollow shaft 5 communicates with an open end 5b that opens to the outside (atmosphere side) of the vacuum chamber, and the supply system 7 such as the power cable and the cooling water circulation hose is connected to the open end 5b of the hollow shaft 5 from the open end 5b. It is inserted. The supply system 7 is connected to an external power source and a cooling water circulation system through the inside of a flexible outlet tube 9 fixed to a support plate 8 attached to the upper part of the open end 5b of the hollow shaft 5. Yes.

蒸発源４は、成膜室２の内部において、中空軸５の軸方向に延在するガイドレール１０に沿って移動自在とされている。中空軸５の閉塞端５ａ側には、このガイドレール１０上を走行するガイドローラ１１が取り付けられている。   The evaporation source 4 is movable along a guide rail 10 extending in the axial direction of the hollow shaft 5 inside the film forming chamber 2. A guide roller 11 that travels on the guide rail 10 is attached to the closed end 5 a side of the hollow shaft 5.

中空軸５をその軸方向に移動させる駆動源は、真空チャンバの外部に設けられている。   A drive source for moving the hollow shaft 5 in the axial direction is provided outside the vacuum chamber.

真空チャンバの隔壁３には、その外面側の中空軸５の直下方位置に、当該中空軸５の延在方向に沿ってスライドガイド１２を支持するブラケット１３が取り付けられている。中空軸５の開放端５ｂ側には、このスライドガイド１２上を走行するガイドブロック１４が設けられており、ブラケット１３の下面側に取り付けられた駆動部１５の駆動により、図２に示すように、中空軸５をスライドガイド１２に沿って移動自在としている。   A bracket 13 that supports the slide guide 12 along the extending direction of the hollow shaft 5 is attached to the partition wall 3 of the vacuum chamber at a position directly below the hollow shaft 5 on the outer surface side. A guide block 14 that travels on the slide guide 12 is provided on the open end 5b side of the hollow shaft 5, and is driven by a drive unit 15 attached to the lower surface side of the bracket 13 as shown in FIG. The hollow shaft 5 is movable along the slide guide 12.

駆動部１５としては、サーボシリンダや電動サーボモータ、あるいはパルスモータを含むボールネジユニット等の精密送り機構で構成され、中空軸５の移動量及び移動位置が高精度に制御できるようにされている。   The drive unit 15 is constituted by a precision feed mechanism such as a ball screw unit including a servo cylinder, an electric servo motor, or a pulse motor, and the movement amount and movement position of the hollow shaft 5 can be controlled with high accuracy.

なお、これらスライドガイド１２、ブラケット１３、ガイドブロック１４、駆動部１５等により、本発明の「移動機構」が構成される。   The slide guide 12, the bracket 13, the guide block 14, the drive unit 15 and the like constitute the “moving mechanism” of the present invention.

以上のように構成される蒸発源駆動機構１を備えた真空蒸着装置は、成膜室２の内部において、蒸発源４と対向する位置に配置された被処理基板の成膜面に対し、所定の蒸着材料を成膜する。この場合、被処理基板の成膜面には、所定形状の開口パターンが形成されたマスクが重ね合わされていてもよい。   The vacuum vapor deposition apparatus provided with the evaporation source driving mechanism 1 configured as described above is predetermined with respect to the film formation surface of the substrate to be processed disposed at a position facing the evaporation source 4 inside the film formation chamber 2. The vapor deposition material is deposited. In this case, a mask on which an opening pattern having a predetermined shape is formed may be superimposed on the film formation surface of the substrate to be processed.

蒸発源駆動機構１は、図１に示す蒸発源４の待機位置から、駆動部１５を駆動して中空軸５を成膜室２側へ移動させ、蒸発源４を図２に示す終端位置までの間を移動させる過程で被処理基板に対する成膜作用を行う。   The evaporation source drive mechanism 1 drives the drive unit 15 from the standby position of the evaporation source 4 shown in FIG. 1 to move the hollow shaft 5 to the film forming chamber 2 side, and moves the evaporation source 4 to the end position shown in FIG. A film forming action is performed on the substrate to be processed in the process of moving between them.

ここで、蒸発源１が図１に示す待機位置に位置している場合には成膜処理が行えない、即ち、蒸発材料が成膜面に蒸着しない幾何学的位置に被処理基板を配置しておけば、シャッタ等の蒸着阻害機構を設けることなく、待機位置において蒸着材料の蒸発作用を行わせておくことが可能となり、これにより、蒸発源の移動と同時に所期の成膜処理を迅速に実行でき、生産性及び膜質の向上を図ることができる。   Here, when the evaporation source 1 is located at the standby position shown in FIG. 1, the film forming process cannot be performed, that is, the substrate to be processed is arranged at a geometric position where the evaporation material is not deposited on the film forming surface. Therefore, it is possible to allow the evaporation material to evaporate at the standby position without providing an evaporation hindrance mechanism such as a shutter. Therefore, productivity and film quality can be improved.

さて、本実施の形態においては、蒸発源４の駆動機構を真空チャンバの隔壁３の外方位置に配置しているので、当該駆動機構を原因とするダストあるいはパーティクルの発生を回避でき、これにより成膜室２のクリーン度を維持して高品質の成膜処理を行うことができる。   In the present embodiment, since the drive mechanism of the evaporation source 4 is disposed outside the partition wall 3 of the vacuum chamber, generation of dust or particles caused by the drive mechanism can be avoided. A high-quality film formation process can be performed while maintaining the cleanness of the film formation chamber 2.

また、蒸発源駆動機構１が真空チャンバの外部に配置されているので、成膜室２の容積の大型化を回避でき、これにより真空チャンバの小型化を図ることができる。   In addition, since the evaporation source drive mechanism 1 is disposed outside the vacuum chamber, it is possible to avoid an increase in the volume of the film forming chamber 2 and thereby to reduce the size of the vacuum chamber.

また、蒸発源駆動機構１を真空チャンバの外部に配置することによって、成膜室２の内部に複数の蒸発源４を配置することも可能となり、被処理基板に対する多層膜の形成にも十分に対応することができるようになる。   In addition, by disposing the evaporation source driving mechanism 1 outside the vacuum chamber, it is possible to dispose a plurality of evaporation sources 4 inside the film forming chamber 2, which is sufficient for forming a multilayer film on the substrate to be processed. It will be possible to respond.

図３は、成膜室２内への複数の蒸発源４の配置例を示す平面図である。各蒸発源４Ａ，４Ｂは、それぞれ上述と同様な構成を有する蒸発源駆動機構１Ａ，１Ｂによって、成膜室２内を移動自在とされている。各蒸発源４Ａ，４Ｂは、被処理基板の成膜面の同一領域をカバーできるように、同一の移動領域を共有できる形状に構成されている。これら各蒸発源４の移動形態は特に限定されず、同期して移動させたり、交互に移動させることができる。   FIG. 3 is a plan view showing an arrangement example of the plurality of evaporation sources 4 in the film forming chamber 2. The evaporation sources 4A and 4B are movable in the film forming chamber 2 by evaporation source driving mechanisms 1A and 1B having the same configuration as described above. Each of the evaporation sources 4A and 4B is configured in a shape that can share the same moving region so as to cover the same region of the film formation surface of the substrate to be processed. The movement form of each of these evaporation sources 4 is not particularly limited, and can be moved synchronously or alternately.

また、本実施の形態によれば、成膜室２内の蒸発源４に対する必要な電力及び冷却水の供給を、蒸発源４を支持する中空軸５の内部を介して行っているので、真空チャンバの隔壁３に対して電力ケーブルや冷却水循環ホース等のための挿通機構を必要とすることはない。   Further, according to the present embodiment, the necessary power and cooling water are supplied to the evaporation source 4 in the film formation chamber 2 through the inside of the hollow shaft 5 that supports the evaporation source 4, so that the vacuum An insertion mechanism for a power cable, a cooling water circulation hose or the like is not required for the partition wall 3 of the chamber.

また、蒸発源４に対する必要な電力及び冷却水の供給系統７を中空軸５の内部に挿入配置しているので、蒸発源４の移動に伴うこれら供給系統７を安定に保持でき、これによりパーティクルの発生を防げると共に、供給系統７の耐久性向上をも図ることができる。   In addition, since the power supply system 7 and the cooling water supply system 7 required for the evaporation source 4 are inserted and arranged in the hollow shaft 5, the supply system 7 can be stably held as the evaporation source 4 moves, and thereby the particles Can be prevented, and the durability of the supply system 7 can be improved.

以上、本発明の実施の形態について説明したが、勿論、本発明はこれに限定されることなく、本発明の技術的思想に基づいて種々の変形が可能である。   The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

例えば以上の実施の形態では、成膜室２に蒸発源４を複数配置する例として、真空チャンバの隔壁３の同一面にそれぞれ図１に示した蒸発源駆動機構を並べて配置する構成を説明したが、これに限らず、例えば真空チャンバの相対向する一対の隔壁に上記蒸発源駆動機構をそれぞれ配置する構成例も適用可能である。   For example, in the above embodiment, as an example in which a plurality of evaporation sources 4 are arranged in the film forming chamber 2, the configuration in which the evaporation source driving mechanisms shown in FIG. 1 are arranged side by side on the same surface of the partition wall 3 of the vacuum chamber has been described. However, the present invention is not limited to this, and for example, a configuration example in which the evaporation source driving mechanism is disposed on a pair of opposing partition walls of a vacuum chamber can be applied.

また、蒸発源４の配置数も２に限らず、更にその数を増大することも可能である。   Further, the number of the evaporation sources 4 is not limited to 2, and the number can be further increased.

本発明の実施の形態による真空チャンバの蒸発源駆動機構の構成を示す側断面図である。It is a sectional side view which shows the structure of the evaporation source drive mechanism of the vacuum chamber by embodiment of this invention. 図１の蒸発源駆動機構の一作用を示す側断面図である。It is a sectional side view which shows an effect | action of the evaporation source drive mechanism of FIG. 蒸発源を複数配置する例を示す平面図である。It is a top view which shows the example which arrange | positions multiple evaporation sources.

符号の説明Explanation of symbols

１ 蒸発源駆動機構
２ 成膜室
３ 真空チャンバの隔壁
４ 蒸発源
５ 中空軸
５ａ 中空軸の閉塞端
５ｂ 中空軸の開放端
６ ベローズ
７ 供給系統
１０ ガイドレール
１２ スライドガイド
１５ 駆動部 DESCRIPTION OF SYMBOLS 1 Evaporation source drive mechanism 2 Deposition chamber 3 Vacuum chamber partition 4 Evaporation source 5 Hollow shaft 5a Hollow shaft closed end 5b Hollow shaft open end 6 Bellows 7 Supply system 10 Guide rail 12 Slide guide 15 Drive unit

Claims (4)

真空チャンバ内に、蒸着材料の蒸発源を備えた真空蒸着装置において、
一端が閉塞し他端が開放された中空軸と、この中空軸の一端側を前記真空チャンバの内部に挿通し前記中空軸を軸方向に移動させる移動機構とを有し、
前記蒸発源は、前記中空軸の一端側に取り付けられ、前記蒸発源に導入される電力及び冷却水が前記中空軸の内部を介して供給されると共に、前記移動機構は、前記真空チャンバの外部に設けられていることを特徴とする真空蒸着装置。 In a vacuum deposition apparatus provided with an evaporation source of a deposition material in a vacuum chamber,
A hollow shaft having one end closed and the other end opened, and a moving mechanism for inserting the one end side of the hollow shaft into the vacuum chamber and moving the hollow shaft in the axial direction;
The evaporation source is attached to one end of the hollow shaft, and electric power and cooling water introduced into the evaporation source are supplied through the inside of the hollow shaft, and the moving mechanism is disposed outside the vacuum chamber. A vacuum evaporation apparatus provided in the above. 前記中空軸が挿通される前記真空チャンバの挿通部と前記中空軸の他端側との間には、前記真空チャンバの内外の連通を遮断するベローズが設けられている請求項１に記載の真空蒸着装置。   The vacuum according to claim 1, wherein a bellows that blocks communication between the inside and outside of the vacuum chamber is provided between the insertion portion of the vacuum chamber through which the hollow shaft is inserted and the other end side of the hollow shaft. Vapor deposition equipment. 前記移動機構は、前記真空チャンバの外部に突出する前記中空軸の軸方向に沿って延在するスライドガイドと、前記中空軸を前記スライドガイドに沿って移動させる駆動部とを含んでなる請求項１に記載の真空蒸着装置。   The moving mechanism includes a slide guide extending along an axial direction of the hollow shaft protruding outside the vacuum chamber, and a drive unit that moves the hollow shaft along the slide guide. 2. The vacuum evaporation apparatus according to 1. 前記中空軸は複数本配置されており、前記蒸発源は前記複数本の中空軸に対してそれぞれ取り付けられている請求項１に記載の真空蒸着装置。

The vacuum deposition apparatus according to claim 1, wherein a plurality of the hollow shafts are arranged, and the evaporation sources are respectively attached to the plurality of hollow shafts.

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JP2012169168A (en) * 2011-02-15 2012-09-06 Hitachi High-Technologies Corp Crystal oscillation-type film thickness monitoring device and evaporation source device and thin film deposition system of el material using the same
JP2013122923A (en) * 2013-01-17 2013-06-20 Hitachi High-Technologies Corp Vacuum evaporation apparatus

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