CN101824596B - Automatic cooling type power supply device - Google Patents
Automatic cooling type power supply device Download PDFInfo
- Publication number
- CN101824596B CN101824596B CN2010101393777A CN201010139377A CN101824596B CN 101824596 B CN101824596 B CN 101824596B CN 2010101393777 A CN2010101393777 A CN 2010101393777A CN 201010139377 A CN201010139377 A CN 201010139377A CN 101824596 B CN101824596 B CN 101824596B
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- Prior art keywords
- power supply
- electrode bar
- evaporation source
- supply device
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 61
- 238000001704 evaporation Methods 0.000 claims abstract description 47
- 230000008020 evaporation Effects 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 12
- 230000000630 rising effect Effects 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 description 11
- 238000009434 installation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses an automatic cooling type power supply device, which is suitable for fixing an evaporation source in a vacuum cavity and supplying power to the evaporation source. The automatic cooling type power supply device comprises a power supply unit, a sealing unit and a cooling unit, wherein the power supply unit comprises two electrode rods in hollow structures, the hollow structures form water inlet grooves, the inner ends of the two electrode rods are respectively connected with both ends of the evaporation source, the outer ends of the two electrode rods are connected with electrode wires, the sealing unit comprises a flange and an insulation element clamped and arranged on the flange, the electrode rod passes through the insulation element and is fixed on the flange in an insulated way, the flange is arranged on the vacuum cavity for forming a sealed space, the cooling unit comprises a water outlet pipe, a water inlet joint and a water outlet joint, the water outlet pipe is suspended in the water inlet, the water inlet joint is communicated with the water inlet groove, the water outlet joint is communicated with the water outlet pipe, and the water inlet joint, the water inlet groove, the water outlet pipe and the water outlet joint form a cooling passage. The automatic cooling type power supply device has the cooling function, so good power supply performance and safety performance can be provided.
Description
Technical field
The present invention relates to a kind of electric supply installation, relate in particular to a kind of automatic cooling type power supply device that carries refrigerating function.
Background technology
Along with the further investigation of organic semiconductor technology, the application of organic assembly more and more widely, as organic electroluminescence device (OLED).The preparation of OLED be unable to do without the generation of organic film, and proven technique is to finish the preparation of organic film by evaporation coating technique in the prior art.
When using vacuum evaporation to prepare film, three class heating sources such as resistive heating source, electron beam heating and induction heating source are normally used for heating and evaporating materials.The induction heating source is mainly used in extensive coating instrument, because because high-frequency use, it tends to use complicated peripherals.Because electron beam heating can evaporate the material of almost all kinds, so it is widely used in main equipment, also is used for the manufacturing of experimental thin films.But the shortcoming of electron beam heating is to cost an arm and a leg.Because simple and cheap feature is installed in the resistive heating source, therefore be used to various fields.
Usually the evaporation mode of OLED is to adopt resistance-type heating evaporation source (electrifying electrodes is to the evaporation source heat supply), selected evaporation source material is anti-special pyritous material, such as semiconductor material and metal, concrete can select metal such as tungsten, tantalum, molybdenum etc., can be boron chloride etc. in addition.The using method of evaporation source is as follows: the two ends of evaporation source are connected electric supply installation, add bigger electric current and make it owing to electricresistance effect generates heat, make the material to be deposited put into wherein such as fusions such as metallic substance, semiconductor material, evaporation, obtain vapor-deposited film.
Yet, when electric current when the electric supply installation, electric current also can work done and consumed power can produce heat owing to the heat effect of electric current.So when electric supply installation passed through bigger electric current, electric supply installation also can produce bigger heat and temperature.Then it can produce bigger resistance if electric supply installation can not get cooling timely, is unfavorable for the transmission of big electric current.In addition, electric supply installation and evaporation source also can be delivered to heat in the vacuum cavity, the vacuum chamber body wall is first-class, the heat of evaporation source can cause substrate surface temperature to be plated too high, be unfavorable for the preparation of OLED rete, and the vacuum chamber body wall of comparatively high temps also can produce bigger potential safety hazard, and operator easily for example burns.
Therefore, be badly in need of a kind of electric supply installation of refrigerating function that carries so that power supply performance and safety performance preferably to be provided.
Summary of the invention
The object of the present invention is to provide a kind of automatic cooling type power supply device, thereby this automatic cooling type power refrigerating function provides power supply performance and safety performance preferably.
To achieve these goals, technical scheme of the present invention is: a kind of automatic cooling type power supply device is provided, be applicable to fixedly the intravital evaporation source of vacuum chamber and to described evaporation source power supply, described automatic cooling type power supply device comprises power supply unit, sealing unit and cooling unit, described power supply unit comprises that two are the electrode bar of hollow structure, described hollow structure forms inlet flume, described electrode bar comprises and is positioned at the intravital the inner of described vacuum chamber and is positioned at the outer outer end of described vacuum cavity, described outer end is connected with electrode wires, wherein the inner of a described electrode bar links to each other with an end of described evaporation source, and the inner of another described electrode bar links to each other with the other end of described evaporation source, described sealing unit comprises flange and the insulating part that is placed on the described flange, described electrode bar passes described insulating part insulation ground and is fixed on the described flange, described flange is installed on the space that constitutes sealing on the described vacuum cavity with described vacuum cavity, described cooling unit comprises rising pipe, water supply connector and water out adapter, described rising pipe is suspended in the described inlet flume, described water supply connector is connected with described inlet flume, described water out adapter is connected with described rising pipe, described water supply connector, inlet flume, rising pipe and water out adapter constitute cooling channel.
Compared with prior art, because automatic cooling type power cooling unit of the present invention, can cool off automatically the fixing automatic cooling type power supply device of evaporation source by this cooling unit, can provide evaporation source needed low-voltage and high-current through the automatic cooling type power supply device that cools, have power supply performance preferably, the temperature that also can reduce vacuum cavity simultaneously effectively is to improve safety performance.
Preferably, described automatic cooling type power supply device also comprises load bearing unit, and described load bearing unit comprises permanent seat that is fixed on the described flange and the insulation retaining clip that is fixed on the described permanent seat, and described electrode bar is fixed on the described insulation retaining clip.
Preferably, the outer end of described electrode bar is provided with the conduction nut, and described conduction nut is fixed on described electrode wires on the described electrode bar.
Preferably, described cooling unit also comprises Connection Block, described Connection Block is fixed in the outer end of described electrode bar, described Connection Block offers main through hole that is connected with described inlet flume and the side through hole that is connected with described main through hole, described rising pipe passes described main through hole and is connected with water out adapter, and described water supply connector is installed on the described side through hole.
Preferably, described power supply unit also comprises the evaporation source retaining clip, and the inner of described electrode bar links to each other with described evaporation source by the evaporation source retaining clip.
Preferably, described insulating part and described flange connections are provided with sealing-ring, and described insulating part and described electrode bar junction also are provided with sealing-ring.
Description of drawings
Fig. 1 is the synoptic diagram that automatic cooling type power supply device of the present invention is installed on vacuum cavity.
Fig. 2 is the enlarged diagram of A part among Fig. 1.
Fig. 3 is the enlarged diagram of B part among Fig. 1.
Fig. 4 is the stereographic map of automatic cooling type power supply device of the present invention.
Fig. 5 is the vertical view of automatic cooling type power supply device of the present invention shown in Figure 4.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Fig. 1 is installed on the synoptic diagram of vacuum cavity 20 for embodiment of the invention automatic cooling type power supply device 10.As shown in Figure 1, embodiment of the invention automatic cooling type power supply device 10 be used for fixing in the vacuum cavity 20 evaporation source 30 and to described evaporation source 30 power supplies.
Please refer to Fig. 1 and Fig. 4, embodiment of the invention automatic cooling type power supply device 10 comprises power supply unit, sealing unit and cooling unit, and wherein, described power supply unit is used for described evaporation source 30 power supplies; Described sealing unit is used for described power supply unit insulation ground is fixed in the described vacuum cavity 20, and described cooling unit is used for described power supply unit and vacuum cavity 20 are cooled.
Particularly, described power supply unit comprises the electrode bar 111 that is hollow structure and 112 and evaporation source retaining clip 113 and 114, described electrode bar 111 and 112 includes the inner that is positioned at described vacuum cavity 20 and the outer end that is positioned at outside the described vacuum cavity 20, described evaporation source retaining clip 113 and 114 is individually fixed in the inner of described electrode bar 111 and 112, and clamps the two ends of described evaporation source 30 respectively so that two described electrode bars 111 and 112 are connected to the two ends of described evaporation source 30.And all being fixed with some conduction nuts 115 on the outer end of described electrode bar 111 and 112, described conduction nut 115 is fixedly attached on described electrode bar 111 and 112 electrode wires of outside to introduce electric current to described evaporation source 30.Electrode bar 111 and electrode bar 112 are basic symmetrical structure in the automatic cooling type power supply device 10 of the present invention, below mainly describe other concrete structure of automatic cooling type power supply device 10 of the present invention in detail with electrode bar 111 1 sides.
Please refer to Fig. 2-4, described sealing unit comprises flange 121 and insulating part 122, and described insulating part 122 is used for described electrode bar 111 insulation ground are fixed in described flange 121.Particularly, described insulating part 122 comprises the first collets 122a and the second collets 122b, described first collets 122a and the described second collets 122b are the insulating sleeve with flange, the described first collets 122a and the second collets 122b are installed on the open holes of described flange 121 and lay respectively at the both sides of described flange 121, the described first collets 122a is passed in the outer end of described electrode bar 111 and thereby the described second collets 122b is fixed on the described flange 121 hermetically, and described flange 121 is installed on the space that constitutes sealing on the described vacuum cavity 20 with described vacuum cavity 20.Preferably, the described first collets 122a and described electrode bar 111 junctions and be respectively equipped with sealing- ring 123 and 124 stopping propertys that are connected with described flange 121 with the described electrode bar 111 of further raising with described flange 121 junctions.Preferably, described automatic cooling type power supply device 10 also comprises load bearing unit, described load bearing unit comprises permanent seat 141 and some insulation retaining clips 142, described permanent seat 141 is fixed on the described flange 121, described insulation retaining clip 142 is fixed on the described permanent seat 141 equally spacedly, and two described electrode bars 111 and 112 are installed on the described insulation retaining clip 142 constant to guarantee the relative position between two described electrode bars 111 and 112 in parallel to each other.Need to prove that described insulation retaining clip 142 is fixed on the described permanent seat 141 in the mode of bolting or welding.
Described cooling unit comprises rising pipe 132, water supply connector 133, water out adapter 134 and Connection Block 135, the hollow structure of described electrode bar 111 forms inlet flume 131, described rising pipe 132 is suspended in the described inlet flume 131, described inlet flume 131 and described rising pipe 132 all extend along the central axial direction of described electrode bar 111, described Connection Block 135 is fixed in the end of described electrode bar 111, offer main through hole 135a that is connected with described inlet flume 131 and the side through hole 135b that is connected with described main through hole 135a on the described Connection Block 135, described rising pipe 132 passes described main through hole 135a and is connected with water out adapter 134, described water supply connector 133 is installed on the described side through hole 135b, then described water supply connector 133 is connected with described inlet flume 131, described water out adapter 134 is connected with described rising pipe 132, thus described water supply connector 133, inlet flume 131, rising pipe 132 and water out adapter 134 constitute cooling channel.
Please refer to Fig. 1-5, below describe the principle of work of automatic cooling type power supply device 10 of the present invention in detail.
In the automatic cooling type power supply device 10 of the present invention, electrode bar 111 and 112, evaporation source 30 and outside electrode wires constitute a current circuit, foreign current can flow into electrode bar 111 by electrode wires, flow into evaporation source 30 through evaporation source retaining clip 113, flow out from electrode bar 112 again, also can flow into electrode bar 112 earlier, flow into evaporation source 30, flow out from electrode bar 111 again through evaporation source retaining clip 114 by electrode wires.Flow into and flow out by above-mentioned electric current, realized evaporation source 30 heating of powering.Meanwhile, the cooling unit of automatic cooling type power supply device 10 also enters working order, with electrode bar 111 is example, heat-eliminating medium can enter from water supply connector 133, enter into the inlet flume 131 of electrode bar 111 by the side through hole 135b in the Connection Block 135, and then flowing into rising pipe 132 also at last from described water out adapter 134 outflows, water (flow) direction is shown in the arrow of Fig. 2 and Fig. 3.On the contrary, described heat-eliminating medium also can enter from water out adapter 134, the rising pipe 132 of flowing through, and then flow into the inlet flume 131 of electrode bar 111, and flow out from described water out adapter 134 at last.Understandably, electrode bar 112 also is provided with identical cooling loop, by above-mentioned cooling loop can with on electrode bar 111 and 112 and the heats in the vacuum cavity 20 take to endlessly outside the vacuum cavity 20, effectively reduce electrode bar 111 and 112 and the temperature of vacuum cavity 20.
Compared with prior art, because automatic cooling type power supply device 10 of the present invention carries cooling unit, can cool off automatically the fixing automatic cooling type power supply device 10 of evaporation source 30 by this cooling unit, can provide evaporation source 30 needed low-voltage and high-currents through the automatic cooling type power supply device 10 that cools, have power supply performance preferably, the temperature that also can reduce vacuum cavity 20 effectively is to improve safety performance.In addition, when automatic cooling type power supply device 10 of the present invention was applied to large-scale vacuum cavity 20 or needs evaporation source 30 contact conductors than situation about growing, its effect was more obvious.
Need to prove that heat-eliminating medium of the present invention is preferably the pure water that freezes, but be not limited to the pure water that freezes, any other insulating fluid-type heat-eliminating medium all may be utilized.And rising pipe material of the present invention is preferably stainless steel, but also is not limited to stainless steel, and other metals similar with stainless steel all may be utilized.
Above invention has been described in conjunction with most preferred embodiment, but the present invention is not limited to the embodiment of above announcement, and should contain various modification, equivalent combinations of carrying out according to essence of the present invention.
Claims (6)
1. automatic cooling type power supply device is applicable to fixedly the intravital evaporation source of vacuum chamber and to described evaporation source power supply, it is characterized in that described automatic cooling type power supply device comprises:
Power supply unit, described power supply unit comprises that two are the electrode bar of hollow structure, described hollow structure forms inlet flume, described electrode bar comprises and is positioned at the intravital the inner of described vacuum chamber and is positioned at the outer outer end of described vacuum cavity, described outer end is connected with electrode wires, wherein the inner of a described electrode bar links to each other with an end of described evaporation source, and the inner of another described electrode bar links to each other with the other end of described evaporation source;
Sealing unit, described sealing unit comprises flange and the insulating part that is placed on the described flange, described insulating part comprises first collets and second collets, described first collets and described second collets are the insulating sleeve with flange, described first collets and second collets are installed on the both sides of described flange, described electrode bar passes described first collets and second collets and is fixed on the described flange with insulating, and described flange is installed on the space that constitutes sealing on the described vacuum cavity with described vacuum cavity;
Cooling unit, described cooling unit comprises rising pipe, water supply connector and water out adapter, described rising pipe is suspended in the described inlet flume, described water supply connector is connected with described inlet flume, described water out adapter is connected with described rising pipe, and described water supply connector, inlet flume, rising pipe and water out adapter constitute cooling channel.
2. automatic cooling type power supply device as claimed in claim 1, it is characterized in that: also comprise load bearing unit, described load bearing unit comprises permanent seat that is fixed on the described flange and the insulation retaining clip that is fixed on the described permanent seat, and described electrode bar is fixed on the described insulation retaining clip.
3. automatic cooling type power supply device as claimed in claim 1 is characterized in that: the outer end of described electrode bar is provided with the conduction nut, and described conduction nut is fixed on described electrode wires on the described electrode bar.
4. automatic cooling type power supply device as claimed in claim 1, it is characterized in that: described cooling unit also comprises Connection Block, described Connection Block is fixed in the outer end of described electrode bar, described Connection Block offers main through hole that is connected with described inlet flume and the side through hole that is connected with described main through hole, described rising pipe passes described main through hole and is connected with water out adapter, and described water supply connector is installed on the described side through hole.
5. automatic cooling type power supply device as claimed in claim 1 is characterized in that: described power supply unit also comprises the evaporation source retaining clip, and the inner of described electrode bar links to each other with described evaporation source by the evaporation source retaining clip.
6. automatic cooling type power supply device as claimed in claim 1 is characterized in that: described insulating part and described flange connections are provided with sealing-ring, and described insulating part and described electrode bar junction also are provided with sealing-ring.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393777A CN101824596B (en) | 2010-03-30 | 2010-03-30 | Automatic cooling type power supply device |
| PCT/CN2010/074975 WO2011120267A1 (en) | 2010-03-30 | 2010-07-05 | Automatic cooling type power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101393777A CN101824596B (en) | 2010-03-30 | 2010-03-30 | Automatic cooling type power supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101824596A CN101824596A (en) | 2010-09-08 |
| CN101824596B true CN101824596B (en) | 2011-12-14 |
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ID=42688758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101393777A Expired - Fee Related CN101824596B (en) | 2010-03-30 | 2010-03-30 | Automatic cooling type power supply device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101824596B (en) |
| WO (1) | WO2011120267A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107130214A (en) * | 2017-05-11 | 2017-09-05 | 成都西沃克真空科技有限公司 | A kind of evaporator is with rotatable water cooled electrode device |
| CN106987806A (en) * | 2017-05-11 | 2017-07-28 | 成都西沃克真空科技有限公司 | A kind of electrode input locking device of electrode stem |
| CN108385065A (en) * | 2018-05-23 | 2018-08-10 | 北京铂阳顶荣光伏科技有限公司 | A kind of equipment and method of controlling security with evaporation source |
| CN109487218A (en) * | 2018-11-27 | 2019-03-19 | 北京铂阳顶荣光伏科技有限公司 | Evaporation source heats electric gatherer and vacuum evaporation coating film device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2438724Y (en) * | 2000-09-07 | 2001-07-11 | 中国科学院长春光学精密机械与物理研究所 | Vacuum coating film medium resistance heating evaporation boat active electrode |
| CN1494819A (en) * | 2001-02-26 | 2004-05-05 | 株式会社尼康 | Extreme ultraviolet generating device, exposure device using the same and semiconductor mfg. method |
| CN201217688Y (en) * | 2008-07-18 | 2009-04-08 | 泰艺电子(南京)有限公司 | Six-plating head electrode structure of film-plating machine |
| CN201648507U (en) * | 2010-03-30 | 2010-11-24 | 东莞宏威数码机械有限公司 | Automatic cooling type power transmission device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2292095Y (en) * | 1996-04-05 | 1998-09-23 | 永胜诚信工贸公司 | Column shaped plane type magnetic controlled sputter target |
| DE19628102A1 (en) * | 1996-07-12 | 1998-01-15 | Bayerische Motoren Werke Ag | Vacuum coating system with a coating chamber and at least one source chamber |
| JP2004149832A (en) * | 2002-10-29 | 2004-05-27 | Sumitomo Heavy Ind Ltd | Method and apparatus for ion plating |
| JP4563698B2 (en) * | 2004-03-12 | 2010-10-13 | 株式会社アルバック | Vacuum deposition equipment |
| JP5063143B2 (en) * | 2007-03-02 | 2012-10-31 | 株式会社リケン | Arc type evaporation source |
-
2010
- 2010-03-30 CN CN2010101393777A patent/CN101824596B/en not_active Expired - Fee Related
- 2010-07-05 WO PCT/CN2010/074975 patent/WO2011120267A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2438724Y (en) * | 2000-09-07 | 2001-07-11 | 中国科学院长春光学精密机械与物理研究所 | Vacuum coating film medium resistance heating evaporation boat active electrode |
| CN1494819A (en) * | 2001-02-26 | 2004-05-05 | 株式会社尼康 | Extreme ultraviolet generating device, exposure device using the same and semiconductor mfg. method |
| CN201217688Y (en) * | 2008-07-18 | 2009-04-08 | 泰艺电子(南京)有限公司 | Six-plating head electrode structure of film-plating machine |
| CN201648507U (en) * | 2010-03-30 | 2010-11-24 | 东莞宏威数码机械有限公司 | Automatic cooling type power transmission device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-149832A 2004.05.27 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101824596A (en) | 2010-09-08 |
| WO2011120267A1 (en) | 2011-10-06 |
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