CN2292095Y - Column shaped plane type magnetic controlled sputter target - Google Patents
Column shaped plane type magnetic controlled sputter target Download PDFInfo
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- CN2292095Y CN2292095Y CN 96207094 CN96207094U CN2292095Y CN 2292095 Y CN2292095 Y CN 2292095Y CN 96207094 CN96207094 CN 96207094 CN 96207094 U CN96207094 U CN 96207094U CN 2292095 Y CN2292095 Y CN 2292095Y
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Abstract
The utility model discloses a column-shaped plane type magnetic controlled sputter target used for a vacuum magnetron sputtering film-plating machine, composed of a target pipe (1), four bar-shaped permanent magnets (2), a fixed magnet integral pole piece (3), a rotary mechanism (4), a cooling water channel (5), a target cap (6), a shield cover (8) and a magnetic field connector (7) which is arranged on both ends of the four bar-shaped permanent magnets. Because the structure of the utility model is composed of the column-shaped target pipe, the four bar-shaped permanent magnets, the integral pole piece, the magnetic field connector and the rotary mechanism, the cooling water channel is unblocked and the layer thickness of film-plating is uniform (the color difference of filming coating glass delta E is less than or equal to 4 and the utilization rate of target materials is more than 70 percent). The utility model has the advantages of quick sputtering deposition rate, high target power and film-plating efficiency, and strong adhesion of film-forming.
Description
The utility model provides a kind of cylinder shape plane formula magnetic control sputtering target that is used on the vacuum magnetic-control sputtering coating equipment, be applicable to fields such as building materials, the energy, electronics, optics and optical communications, machinery, plastics industry, also can be used in the production of plane liquid-crystal display, magneticsubstance and magnetic recording media.
Present magnetron sputtering equipment both domestic and external, the structural shape of its sputtering source---target mainly contain two kinds of coaxial magnetron sputtering target and plane magnetic controlled sputtering targets.Coaxial magnetron sputtering target is to be provided with annular permanent-magnet body and pole shoe (magnetic conduction pad) formation in the cast sputter material, form the gapped ring-type glow discharge zone of several and target axis normal during sputter, when being coated with large area substrates (as cladding glass), form the alternate striped of thickness inevitably, cause serious membrane thickness unevenness, influence quality product.Plane magnetic controlled sputtering target adopts the bar-shaped magnet structure, forms the strip aura district parallel with the target axis during sputter, has alleviated preferably by the membrane thickness unevenness phenomenon on the plating matrix, makes coating even, has guaranteed quality product.But, make target utilization extremely low (less than 20%) because the target surface etching region concentrates on the rectangle frame.
Task of the present utility model is that a kind of improved cylinder shape plane formula magnetic control sputtering target will be provided, adopt strip permanent magnet and monoblock type pole shoe structure (magneticsubstance is made) parallel with the target axis, at the uniform velocity rotation are set in the tubular target, form continual, uniform bar shaped glow discharge zone, make the thickness of coating that deposits to by on the plating base material even, aberration little (Δ E≤4) when being used to produce coated glass.Because during work is at the uniform velocity to rotate, the target surface etching is even, so the consumption of target is even, and long service life is compared with the target of other structure, and the life-span improves more than four times, and target utilization surpasses 70%.Because the water coolant runner is unimpeded, so the good cooling results of target, the target power output height, plated film efficient is also high, and the sputtering sedimentation speed of target is fast, film forming strong adhesion.
Below in conjunction with the accompanying drawing description detailed in addition to the utility model.
Fig. 1 is a structural representation of the present utility model
Fig. 2 is a drawing in side sectional elevation of the present utility model
Fig. 3 is a magnetic field of the present utility model coupling device
With reference to Fig. 1: cylinder shape plane formula magnetic control sputtering target is made of target pipe (1), strip permanent magnet (2), monoblock type pole shoe (3), rotating mechanism (4), water coolant Inlet and outlet water passage (5), target cap (6), magnetic field coupling device (7), shielding case (8).Strip permanent magnet (2) is arranged in four groups of bar shaped magnetic fields along target pipe (1), is fixed on pole shoe (3) and goes up in the symmetric groove.The surperficial residual magnetic flux density Br＞300mT of strip permanent magnet.There is magnetic field coupling device (7) at two ends, bar shaped magnetic field.Target pipe (1) one end links to each other with rotating mechanism (4) and target cap (6), and the other end links to each other with shielding case (8).During use target is installed on the coating equipment, connects water coolant, connect the direct supply negative electrode, make its vacuum tightness reach 10
-10
-3In the time of in the Pa scope, injecting inert gas (as argon gas etc.), make the discharge of target build-up of luminance, it is stable to keep aura, the adjusting process parameter, and can obtain evenly firm rete.
Owing to adopted the continuous closed magnetic circuit coupling device of rectangle at the target end on the structure, formed the electronics runway of a closure when guaranteeing glow discharge, sputter is stablized carry out, avoided arcing (discharge) problem of end, make the target can be at 1～2A/dm
2High current density under stable work.The utility model is designed to the monoblock type pole shoe structure in addition, and assurance magnetic field does not have gap and uniform distribution continuously, and sputter is evenly carried out.
With reference to Fig. 2: (1) is that target pipe, (2) are that one of four bar shaped permanent magnets, (3) are that monoblock type pole shoe, (5) are the Inlet and outlet water passages among the figure.Fig. 2 has determined that four permanent magnets and pole shoe (3) must press the position shown in the figure and install.
With reference to Fig. 3: Fig. 3 is the magnetic field coupling device of this target.It is made up of strip permanent magnet (2) and the special ring magnetic material (7) of a cover.It is arranged on the two ends of four bar shaped permanent magnets, is used for making the magnetic field of four bar shaped permanent magnets to connect (closure) in the end, forms closed magnetic circuit.This magnetic field coupling device is enclosed within on the water-cooled tube (5).
Claims (3)
1, a kind of cylinder shape plane formula magnetic control sputtering target, it is by target pipe (1), strip permanent magnet (2), monoblock type pole shoe (3), rotating mechanism (4), water coolant Inlet and outlet water passage (5), target cap (6), magnetic field coupling device (7) and shielding case (8) constitute, it is characterized in that strip permanent magnet (2) is arranged in four groups of bar shaped magnetic fields along target pipe (1), being fixed on pole shoe (3) goes up in the symmetric groove, there is magnetic field coupling device (7) at two ends, bar shaped magnetic field, owing to adopted the continuous closed magnetic circuit coupling device of rectangle at the target end on the structure, formed the electronics runway of a closure when guaranteeing glow discharge, sputter is stablized carry out, avoided arcing (discharge) problem of end.
2, by the described cylinder shape plane formula of claim 1 magnetic control sputtering target, it is characterized in that its magnetic field coupling device is made up of bar-shaped magnet (2) and special ring magnetic material (7).
3, by claim 1 or 2 described cylinder shape plane formula magnetic control sputtering targets, it is characterized in that pole shoe (3) must form with the magneticsubstance integral manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96207094 CN2292095Y (en) | 1996-04-05 | 1996-04-05 | Column shaped plane type magnetic controlled sputter target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96207094 CN2292095Y (en) | 1996-04-05 | 1996-04-05 | Column shaped plane type magnetic controlled sputter target |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2292095Y true CN2292095Y (en) | 1998-09-23 |
Family
ID=33891491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 96207094 Expired - Fee Related CN2292095Y (en) | 1996-04-05 | 1996-04-05 | Column shaped plane type magnetic controlled sputter target |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2292095Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011120267A1 (en) * | 2010-03-30 | 2011-10-06 | 东莞宏威数码机械有限公司 | Automatic cooling type power supply device |
| CN103409725A (en) * | 2013-05-22 | 2013-11-27 | 东莞宏威数码机械有限公司 | Rotary alien target cathode mechanism and magnetron sputtering coating device |
| CN107740059A (en) * | 2017-10-19 | 2018-02-27 | 浙江上方电子装备有限公司 | Electrochromic device ioning method, preparation method and product |
| TWI645060B (en) * | 2016-01-28 | 2018-12-21 | Ｊｘ金屬股份有限公司 | Cylindrical ceramic sputtering target and cylindrical ceramic sputtering target formed by joining one or more cylindrical ceramic sputtering targets by a backing tube |
| CN110621804A (en) * | 2017-05-12 | 2019-12-27 | 应用材料公司 | Redeposition-free sputtering system |
| CN111826623A (en) * | 2020-06-30 | 2020-10-27 | 浙江上方电子装备有限公司 | Magnetron for carrying out magnetron sputtering |
-
1996
- 1996-04-05 CN CN 96207094 patent/CN2292095Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011120267A1 (en) * | 2010-03-30 | 2011-10-06 | 东莞宏威数码机械有限公司 | Automatic cooling type power supply device |
| CN103409725A (en) * | 2013-05-22 | 2013-11-27 | 东莞宏威数码机械有限公司 | Rotary alien target cathode mechanism and magnetron sputtering coating device |
| TWI645060B (en) * | 2016-01-28 | 2018-12-21 | Ｊｘ金屬股份有限公司 | Cylindrical ceramic sputtering target and cylindrical ceramic sputtering target formed by joining one or more cylindrical ceramic sputtering targets by a backing tube |
| CN110621804A (en) * | 2017-05-12 | 2019-12-27 | 应用材料公司 | Redeposition-free sputtering system |
| CN107740059A (en) * | 2017-10-19 | 2018-02-27 | 浙江上方电子装备有限公司 | Electrochromic device ioning method, preparation method and product |
| CN107740059B (en) * | 2017-10-19 | 2019-12-10 | 浙江上方电子装备有限公司 | Ionization method of electrochromic device, preparation method and product |
| CN111826623A (en) * | 2020-06-30 | 2020-10-27 | 浙江上方电子装备有限公司 | Magnetron for carrying out magnetron sputtering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |