JP2005252281A5 - - Google Patents

Download PDF

Info

Publication number
JP2005252281A5
JP2005252281A5 JP2005099664A JP2005099664A JP2005252281A5 JP 2005252281 A5 JP2005252281 A5 JP 2005252281A5 JP 2005099664 A JP2005099664 A JP 2005099664A JP 2005099664 A JP2005099664 A JP 2005099664A JP 2005252281 A5 JP2005252281 A5 JP 2005252281A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005099664A
Other languages
Japanese (ja)
Other versions
JP2005252281A (ja
JP4340638B2 (ja
Filing date
Publication date
Priority claimed from US10/790,252 external-priority patent/US20050195378A1/en
Priority claimed from US10/954,654 external-priority patent/US7177009B2/en
Application filed filed Critical
Publication of JP2005252281A publication Critical patent/JP2005252281A/ja
Publication of JP2005252281A5 publication Critical patent/JP2005252281A5/ja
Application granted granted Critical
Publication of JP4340638B2 publication Critical patent/JP4340638B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

JP2005099664A 2004-03-02 2005-03-02 基板の表側または裏側に結像するためのリソグラフィ装置、基板識別方法、デバイス製造方法、基板、およびコンピュータプログラム Expired - Fee Related JP4340638B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/790,252 US20050195378A1 (en) 2004-03-02 2004-03-02 Lithographic apparatus, method of substrate identification, device manufacturing method, substrate, and computer program
US10/954,654 US7177009B2 (en) 2004-10-01 2004-10-01 Position determination method and lithographic apparatus

Publications (3)

Publication Number Publication Date
JP2005252281A JP2005252281A (ja) 2005-09-15
JP2005252281A5 true JP2005252281A5 (enExample) 2005-10-27
JP4340638B2 JP4340638B2 (ja) 2009-10-07

Family

ID=35032411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005099664A Expired - Fee Related JP4340638B2 (ja) 2004-03-02 2005-03-02 基板の表側または裏側に結像するためのリソグラフィ装置、基板識別方法、デバイス製造方法、基板、およびコンピュータプログラム

Country Status (2)

Country Link
US (1) US7480028B2 (enExample)
JP (1) JP4340638B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050118532A1 (en) * 2003-11-14 2005-06-02 International Business Machines Corporation Back to Front Alignment with Latent Imaging
EP1744217B1 (en) * 2005-07-12 2012-03-14 ASML Netherlands B.V. Method of selecting a grid model for correcting grid deformations in a lithographic apparatus and lithographic assembly using the same
US20080020303A1 (en) * 2006-07-24 2008-01-24 Wei Wu Alignment for contact lithography
US7808613B2 (en) * 2006-08-03 2010-10-05 Asml Netherlands B.V. Individual wafer history storage for overlay corrections
JP5064079B2 (ja) * 2007-03-30 2012-10-31 富士フイルム株式会社 描画方法および描画システム
DE102009019140B4 (de) 2009-04-29 2017-03-02 Carl Zeiss Smt Gmbh Verfahren zum Kalibrieren einer Positionsmessvorrichtung und Verfahren zum Vermessen einer Maske
US10976572B2 (en) 2011-12-22 2021-04-13 Carl Zeiss Vision International Gmbh Method for storing information on a spectacles lens, spectacles lens blank or spectacles lens semi-finished product
JP6945316B2 (ja) * 2017-03-24 2021-10-06 キヤノン株式会社 検出装置、パターン形成装置、取得方法、検出方法、および物品製造方法
US12220819B2 (en) * 2020-10-21 2025-02-11 Divergent Technologies, Inc. 3-D printed metrology feature geometry and detection
CN114908329B (zh) * 2021-02-08 2024-03-08 台湾积体电路制造股份有限公司 校正方法及半导体制造设备
US12353123B2 (en) * 2022-05-23 2025-07-08 Winbond Electronics Corp. Semiconductor manufacturing apparatus and semiconductor manufacturing method thereof
CN117457550B (zh) * 2023-12-26 2024-03-29 深圳市森美协尔科技有限公司 晶圆对准方法及相关装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0443358A (ja) * 1990-06-11 1992-02-13 Fujitsu Ltd チップ位置識別パターンの形成方法
JP2789818B2 (ja) 1990-12-27 1998-08-27 富士電機株式会社 半導体ウエハの識別方法
JPH05217843A (ja) 1992-01-27 1993-08-27 Nec Corp 縮小投影露光装置
JP3637680B2 (ja) 1996-04-02 2005-04-13 株式会社ニコン 露光装置
AU1078700A (en) * 1998-11-06 2000-05-29 Nikon Corporation Exposure method and exposure apparatus
US6768539B2 (en) * 2001-01-15 2004-07-27 Asml Netherlands B.V. Lithographic apparatus
EP1353229A1 (en) * 2002-04-09 2003-10-15 ASML Netherlands B.V. Lithographic apparatus, device manufacturing method and device manufactured thereby
JP2004006527A (ja) * 2002-05-31 2004-01-08 Canon Inc 位置検出装置及び位置検出方法、露光装置、デバイス製造方法並びに基板
DE60322331D1 (de) * 2002-12-19 2008-09-04 Asml Netherlands Bv Verfahren zur Herstellung eines Artikels unter Verwendung einer lithographischen Projektionsmaske
JP3913715B2 (ja) * 2003-06-18 2007-05-09 株式会社東芝 不良検出方法
US7177009B2 (en) * 2004-10-01 2007-02-13 Asml Netherlands B.V. Position determination method and lithographic apparatus
US7259828B2 (en) * 2004-05-14 2007-08-21 Asml Netherlands B.V. Alignment system and method and device manufactured thereby

Similar Documents

Publication Publication Date Title
BE2021C519I2 (enExample)
BE2021C524I2 (enExample)
BE2013C074I2 (enExample)
BE2013C014I2 (enExample)
BE2012C042I2 (enExample)
BRPI0601358B8 (pt) Aplicador de clipe cirúrgico
BRPI0601402B8 (pt) Aplicador de grampos cirúrgicos
BR122017004707A2 (enExample)
BRPI0609157A8 (enExample)
BE2019C013I2 (enExample)
BRPI0608519A2 (enExample)
BR122020005056A2 (enExample)
AP2140A (enExample)
BR122016029989A2 (enExample)
BRPI0604219A (enExample)
BRPI0618215B8 (enExample)
BY2237U (enExample)
BE2017C062I2 (enExample)
CN105122969C (enExample)
CN300726016S (zh) 鞋帮
CN300725999S (zh) 鞋底
CN300726591S (zh) 冷冰食品制作器
CN300726508S (zh) 头部遮挡板
CN300726222S (zh) 包装纸(金色高金火腿肠)
CN300726008S (zh) 鞋帮