JP2005250875A - Ic module inlet, ic card, and ic card manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve flatness on the surface of an IC card and its resistibility against bending. <P>SOLUTION: An IC module inlet 4 has an IC chip 2 and an antenna coil 3 connected to the IC chip 2 on a base material 5. One end of the antenna coil 3 is connected to the other end via through-holes 6 and 7 formed on the base material 5, and the thickness of the through-hole A is 3 to 20 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an IC module inlet, an IC card, and an IC card manufacturing method used for a non-contact IC card or the like.

  Conventionally, a non-contact IC card on which a non-contact IC chip is mounted is known. As such a non-contact IC card, for example, a first sheet material and a second sheet material are bonded together with an adhesive, Some adhesives enclose an IC module inlet having an IC chip and an antenna coil in an adhesive.

  The antenna coil used in such a non-contact IC card is obtained by, for example, winding a copper wire in a coil shape and attaching it to a card substrate, or using a copper-clad substrate for the card substrate and etching it. The coil is laminated on the card substrate by forming a coil on one or both sides of the card.

  By the way, when the antenna coil is formed using copper wire, the winding start and winding end wires can be brought to the same place, so there is no need to form a through hole in the card substrate or provide a jumper wire. However, there is a problem that it is difficult to reduce the cost even if it is produced in large quantities due to poor mass productivity.

On the other hand, when a coil is formed only on one side of a card substrate by etching a copper-clad substrate, one end (for example, the inside) of the coil needs to be pulled out to the other end (for example, the outside) of the coil. One end of the coil is passed through the back surface of the substrate through the through hole formed in the card substrate, and is drawn out to the other end side of the coil with another pattern formed on the back surface, and another through hole formed in the card substrate is To return to the surface of the card. When coils are formed on both sides of the card substrate, for example, as disclosed in JP-A-8-87583, one end of the coil formed on each substrate surface is connected through a through hole, The other end of the coil formed on the substrate surface is drawn out to the other substrate surface through the through hole.
JP-A-8-87583

  Therefore, when an antenna coil is formed on a card substrate by etching, a through hole is formed in the card substrate, and the patterns formed on both sides of the substrate must be connected to each other through a conductive material provided in the through hole. If the thickness of the through-hole portion increases, irregularities occur in the portion corresponding to the through-hole on the surface of the non-contact IC card. If an image is provided in this portion, unevenness of the image is likely to occur due to the influence of the irregularities. Become.

  For this reason, the through-hole portion must be excluded from the image forming area and the ticket face must be laid out, which has the disadvantage that free expression is restricted.

  In addition, the IC card is required to have strength against bending, but if the bending action is applied when carrying the IC card, one end and the other end of the antenna coil connected via the through hole are disconnected to communicate. There was a problem that defects occurred.

  The present invention has been made in view of such circumstances, and provides an IC module inlet having a high surface smoothness, an IC card and an IC card manufacturing method, and further an IC module inlet for improving the strength against bending of the IC card, An object is to provide an IC card and an IC card manufacturing method.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

  The invention of an IC module inlet includes an IC module inlet having an IC chip on a substrate and an antenna coil connected to the IC chip, wherein one end and the other end of the antenna coil are connected to the substrate. It is connected through the formed through hole, and the thickness of the through hole portion is 3 to 20 μm.

  The substrate is preferably a resin film. The thickness of the IC chip is 50 to 200 μm. The IC chip is provided with a reinforcing plate.

  The invention of the IC card is characterized in that the IC module inlet described above is arranged between the first sheet material and the second sheet material.

  In the invention of the IC card manufacturing method, the IC module inlet is disposed between the first sheet material and the second sheet material, and the IC module inlet, the first sheet material, and the second sheet are arranged. The material is bonded to each other through an adhesive layer.

  With the above configuration, the present invention has the following effects.

  In the invention of the IC module inlet, one end and the other end of the antenna coil are connected through a through hole formed in the base material, and when the through hole is thinned, the antenna coil connected through the through hole One end and the other end are separated and communication failure occurs. When the thickness is increased, unevenness of image due to unevenness is likely to occur. However, since the thickness of the through-hole portion is 3 to 20 μm, communication failure is reduced. Moreover, the smoothness of the surface is high, and the occurrence of image unevenness can be prevented.

  The substrate is preferably a resin film. For example, an antenna coil pattern can be formed by screen printing. Further, when the thickness of the IC chip is 50 to 200 μm, it has strength and is effective in terms of workability and cost. The IC chip is provided with a reinforcing plate, and the IC chip is protected by the reinforcing plate.

  In the IC card invention, the above-described IC module inlet is arranged between the first sheet material and the second sheet material, so that communication failure is reduced, surface smoothness is high, and image unevenness is caused. Occurrence can be prevented.

  In the invention of the IC card manufacturing method, the IC module inlet described above is disposed between the first sheet material and the second sheet material, and bonded via an adhesive layer, communication failure is reduced, and the surface is smooth. It is possible to manufacture an IC card that has high performance and can prevent the occurrence of image unevenness.

  Hereinafter, embodiments of the IC module inlet, IC card, and IC card manufacturing method of the present invention will be described. However, the present invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the terminology of the present invention is not limited to this.

  FIG. 1 is a plan view of an IC module inlet showing an outline of a connection state between a terminal terminal portion of an antenna coil and an antenna terminal portion of the IC module, and FIG. 2 is a cross-sectional view of the IC module inlet.

  The IC module 1 includes at least an IC chip 2 and an antenna coil 3 connected thereto, and the IC module inlet 4 includes an IC module 1 disposed on a substrate 5.

  As the substrate 5 of the IC module 1, a resin film is preferable, and various materials such as PET, PET-G, polypropylene, polyethylene, polystyrene, polyethylene naphthalate (PEN), polyimide, and nylon can be used. Is preferably at least one selected from a low-shrinkage PET film, a low-shrinkage PEN film, and the like. Although the thickness D1 of the base material 5 of the IC module 1 can be 5 to 300 μm, it is more preferably 10 to 100 μm in view of strength, workability, cost, and the like.

  In FIG. 1, punching processing or the like is first performed on portions corresponding to the terminal terminal portion 3 a of the antenna coil 3 and the antenna terminal portion 3 b of the IC module 1 of the base member 5 of the IC module 1 made of polyethylene terephthalate (PET-G) or the like. After the through holes 6 and 7 are formed by the above method, the pattern of the antenna coil 3 is formed by screen printing on the surface side of the substrate 5 of the IC module 1 using a paste containing metal powder.

  After the pattern of the antenna coil 3 is heated and cured, the pattern of the jumper wiring 8 is similarly formed by means such as screen printing in a shape in which the through holes 6 and 7 are connected to the back surface side of the substrate 5 of the IC module 1. Then heat cure. Here, when a paste containing metal powder is applied, the inside of the through holes 6 and 7 is filled with a conductive paste, so that the terminal terminal portion 3a of the antenna coil 3 and the antenna terminal of the IC module 1 are filled. The part 3b is firmly connected to the back side of the substrate 5 of the IC module 1.

  Here, the thickness D2 of the through-hole portion A is preferably 3 to 20 μm. The thickness D2 of the through-hole portion A means the thickness of each part of the front side and the back side of the base material 5 that does not include the thickness D1 of the base material 5 and protrudes from the surface of the base material 5. Then, the pattern part of the jumper wiring 8 connected on the back side of the base material 5 is D2 on the back side, and the part protruding to the front side of the base material 5 is D2 on the front side.

  If the thickness D2 of the through-hole portion A exceeds 20 μm, there is a problem that irregularities occur in the portions corresponding to the through-holes 6 and 7 on the surface of the IC card when it is formed into an IC card. Characteristics are not obtained.

  Further, the thickness of the IC chip 2 is preferably 50 to 200 μm because it is strong and effective in terms of workability and cost. The IC chip 2 is provided with a reinforcing plate 9. If the reinforcing plate 9 is larger than the IC chip 2, the IC chip 2 is protected by the reinforcing plate 9.

  Next, an IC card of the present invention is shown in FIG. The IC card 11 of the present invention is defined by the ISO standard as having a thickness of 0.76 mm. The IC card 11 includes a base film as a first sheet material 12 and a second sheet material 13 which are two sheet materials, and is interposed between the first sheet material 12 and the second sheet material 13. The adhesive layers 14 and 15 are formed. An image receiving layer, a fixed information printing layer, or a writing layer may be formed on the surface of the first sheet material 12 and the second sheet material 13 on the side of the base film that does not pass through the adhesive. As an example of the image receiving layer, a material composed of a material that traps and fixes the dye when the sublimation dye ink is heated by TPH (thermal head) and thermally diffused can be cited. Fixed information, for example, in the case of a credential card, in addition to character information such as the type of qualification, “Issuance date” characters, “Name” characters, “Birth date” characters, “Address” characters, Frames, figures, patterns, etc. The writing layer can be formed, for example, by coating a polyester resin or the like in which a white pigment such as silica is dispersed.

  An IC module inlet 4 having an IC module 1 having an IC chip 2 and an antenna coil 3 as a base material 5 is enclosed in the adhesive layers 14 and 15.

  As the first sheet material 12 and the second sheet material 13 used in the IC card of the present invention, polyester resin, polyethylene naphthalate (PEN), ABS resin, polyimide resin, vinyl chloride used as various card base materials are used. Resin sheets such as resin, thermal transfer paper, high-quality paper, art paper, coated paper, and the like can be used. Among these, white PET is particularly preferable because it has a relatively low load on the environment and is excellent in whiteness and durability.

  In the present invention, it is preferable to use a hot-melt adhesive as an adhesive for forming the adhesive layers 14 and 15. Even after the hot melt adhesive is once formed into a sheet shape, the function as an adhesive is restored again when heated to a certain temperature. Examples of the hot melt adhesive include moisture curable and photo curable reactive hot melt adhesives, and moisture curable hot melt adhesives are more preferable. Moisture curable reactive hot melt adhesives are disclosed in JP 2000-036026, JP 2000-21855, JP 2000-21278, and JP 2002-175510.

  Here, an example of an IC card manufacturing method using a hot melt adhesive will be given. In producing the IC card, first, a hot melt adhesive is applied to a predetermined thickness on the front and back sheet materials with an applicator. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. An IC module inlet is mounted between the upper and lower sheet materials coated with the adhesive. The adhesive applied before mounting may be preheated with a heater or the like. After that, the IC module inlet mounted between the upper and lower sheet materials is pressed for a predetermined time with a press heated to the bonding temperature of the adhesive, or the sheet is conveyed in a constant temperature bath at a predetermined temperature instead of rolling with the press. Roll with a roll. Further, it is effective to perform vacuum pressing in order to prevent bubbles from entering during bonding. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. Here, after bonding with a press or the like, it is preferable to cut into a sheet and then form a card.

When a reactive adhesive is used for the adhesive, it is cut into a card shape after a curing reaction for a predetermined time. However, when cutting into a sheet after cutting into a sheet, the sheet is cut before the adhesive is cured. It is preferable to cut the sheet.
[Example]
(Example 1)
After two through-holes are formed by punching in a portion corresponding to the terminal terminal portion of the antenna coil formed on the base material of the IC module made of polyethylene terephthalate (PET-G) and the antenna terminal portion of the IC module, An antenna coil pattern was formed by screen printing using a paste containing metal powder on the surface side of the substrate of the IC module.

  After the antenna coil pattern is heat-cured, the jumper wiring pattern is similarly formed by means such as screen printing in the shape of connecting the two through-holes to the back side of the substrate of the IC module, and heat-cured. It was. Here, by applying a paste containing metal powder, the inside of the through hole is filled with a conductive paste, and the terminal terminal part of the antenna coil and the antenna terminal part of the IC module are the base material of the IC module. Connected on the back side.

  Here, a conductive paste was filled in the through hole so that the thickness of the through hole portion on the front side of the IC module inlet was 8 μm and the thickness of the through hole portion on the back side of the IC module inlet was 14 μm.

  Next, a hot melt adhesive layer was applied onto a white PET sheet having a thickness of 0.1 mm as a second sheet material, and the above-described IC module inlet was placed thereon. As the hot melt adhesive layer, Sdyne 2013MK manufactured by Sekisui Chemical Co., Ltd. was used.

On the mounted IC module inlet, a white PET sheet having a thickness of 0.1 mm is laminated as the first hot melt adhesive layer and the first sheet material, and an end plate flat heat press is used, and 75 ° C. An IC card having a thickness of 0.76 mm including an IC chip and an antenna coil was manufactured by heating and thermocompression bonding under conditions of 5 kgf / cm ² .

  When the surface smoothness of the IC card thus obtained was measured according to JIS standard X6305, the surface roughness was 23 μm and the smoothness was good. There were no irregularities on the surface of the IC card corresponding to the through hole.

Furthermore, the dynamic bending strength test of the IC card defined in JIS standard X6305 was performed. The IC card after the test did not have problems such as destruction and abnormal IC function.
(Example 2)
Example 1 except that the thickness of the through hole portion on the front side of the IC module inlet is 5 μm and the thickness of the through hole portion on the back side of the IC module inlet is 10 μm, except that the inside of the through hole is filled with a conductive paste. An IC module inlet was prepared in the same manner as described above, and an IC card was manufactured in the same manner as in Example 1 using this IC module inlet.

  The obtained IC card had a surface roughness of 19 μm and good smoothness. There were no irregularities on the surface of the IC card corresponding to the through hole.

Furthermore, when the dynamic bending strength test of the IC card was performed, there was no problem and no abnormality occurred in the IC function.
(Comparative Example 1)
Example 1 except that the thickness of the through hole portion on the front side of the IC module inlet is 27 μm and the thickness of the through hole portion on the back side of the IC module inlet is 35 μm, except that the inside of the through hole is filled with a conductive paste. An IC module inlet was prepared in the same manner as described above, and an IC card was manufactured in the same manner as in Example 1 using this IC module inlet.

The surface roughness of the IC card was 56 μm, and the smoothness was clearly inferior to the examples. Moreover, the unevenness | corrugation which can be visually confirmed generate | occur | produced in the site | part corresponding to a through hole on the IC card surface. Furthermore, when the dynamic bending strength test of the IC card was carried out, the sheet material was peeled off starting from the unevenness generated at the site corresponding to the through hole portion of the IC card.
(Comparative Example 2)
Example 1 except that the through hole was filled with a conductive paste so that the thickness of the through hole portion on the front side of the IC module inlet was 1 μm and the thickness of the through hole portion on the back side of the IC module inlet was 2 μm. An IC module inlet was prepared in the same manner as described above, and an IC card was manufactured in the same manner as in Example 1 using this IC module inlet.

  The obtained IC card had a surface roughness of 15 μm and good smoothness. There were no irregularities on the surface of the IC card corresponding to the through hole. Furthermore, when the dynamic bending strength test of the IC card was carried out, the obtained card could not be used as an IC card because the joint between the antenna coil and the jumper wiring was removed.

  Applied to an IC module inlet having an IC chip on the substrate and an antenna coil connected to the IC chip, and the IC module inlet is disposed between the first sheet material and the second sheet material. To an IC card and an IC card manufacturing method.

It is a top view of an IC module inlet which shows the outline of the connection state of the termination terminal part of an antenna coil, and the antenna terminal part of an IC module. It is sectional drawing of an IC module inlet. It is a figure which shows schematic structure of an IC card.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC module 2 IC chip 3 Antenna coil 3a Terminal terminal part 3b of antenna coil 3 Antenna terminal part of IC module 1 4 IC module inlet 5 Base material 6, 7 Through hole 9 Reinforcement plate 11 IC card 12 1st sheet material 13 Second sheet material 14, 15 Adhesive layer

Claims (6)

In an IC module inlet having an IC chip on the substrate and an antenna coil connected to the IC chip,
One end and the other end of the antenna coil are connected via a through hole formed in the base material,
An IC module inlet, wherein the through hole has a thickness of 3 to 20 µm. The IC module inlet according to claim 1, wherein the base material is a resin film. The IC module inlet according to claim 1 or 2, wherein the IC chip has a thickness of 50 to 200 µm. The IC module inlet according to any one of claims 1 to 3, wherein a reinforcing plate is provided on the IC chip. An IC card comprising the IC module inlet according to any one of claims 1 to 4 disposed between a first sheet material and a second sheet material. The IC module inlet according to any one of claims 1 to 4 is disposed between the first sheet material and the second sheet material,
An IC card manufacturing method, wherein the IC module, the first sheet material, and the second sheet material are bonded together through an adhesive layer.

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