JP2005244493A5 - - Google Patents
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- Publication number
- JP2005244493A5 JP2005244493A5 JP2004050192A JP2004050192A JP2005244493A5 JP 2005244493 A5 JP2005244493 A5 JP 2005244493A5 JP 2004050192 A JP2004050192 A JP 2004050192A JP 2004050192 A JP2004050192 A JP 2004050192A JP 2005244493 A5 JP2005244493 A5 JP 2005244493A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- housing
- communication device
- attached
- portable communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 claims description 66
- 239000000463 material Substances 0.000 claims description 40
- 238000010295 mobile communication Methods 0.000 claims description 24
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 9
- 239000004917 carbon fiber Substances 0.000 claims description 9
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 9
- 239000007769 metal material Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 75
- 238000012546 transfer Methods 0.000 description 30
- 230000000694 effects Effects 0.000 description 22
- 230000005855 radiation Effects 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 230000000191 radiation effect Effects 0.000 description 4
- 230000005070 ripening Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000010985 leather Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004050192A JP2005244493A (ja) | 2004-02-25 | 2004-02-25 | 携帯通信機および携帯通信機の放熱方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004050192A JP2005244493A (ja) | 2004-02-25 | 2004-02-25 | 携帯通信機および携帯通信機の放熱方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005244493A JP2005244493A (ja) | 2005-09-08 |
| JP2005244493A5 true JP2005244493A5 (https=) | 2006-06-29 |
Family
ID=35025762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004050192A Pending JP2005244493A (ja) | 2004-02-25 | 2004-02-25 | 携帯通信機および携帯通信機の放熱方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005244493A (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007125718A1 (ja) | 2006-04-27 | 2007-11-08 | Kyocera Corporation | 電子機器 |
| JP5179746B2 (ja) | 2006-11-22 | 2013-04-10 | 京セラ株式会社 | 携帯端末装置 |
| JP5136525B2 (ja) * | 2009-08-24 | 2013-02-06 | 株式会社デンソーウェーブ | 携帯端末 |
-
2004
- 2004-02-25 JP JP2004050192A patent/JP2005244493A/ja active Pending
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