JP2005238331A - 複合材およびその製造方法 - Google Patents

複合材およびその製造方法 Download PDF

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Publication number
JP2005238331A
JP2005238331A JP2005010020A JP2005010020A JP2005238331A JP 2005238331 A JP2005238331 A JP 2005238331A JP 2005010020 A JP2005010020 A JP 2005010020A JP 2005010020 A JP2005010020 A JP 2005010020A JP 2005238331 A JP2005238331 A JP 2005238331A
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JP
Japan
Prior art keywords
aluminum
composite material
main body
mold
ceramic particles
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2005010020A
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English (en)
Japanese (ja)
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JP2005238331A5 (enExample
Inventor
Mitsutomo Nagano
充朋 長野
Akiyoshi Nishino
明義 西野
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Individual
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Individual
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Priority to JP2005010020A priority Critical patent/JP2005238331A/ja
Publication of JP2005238331A publication Critical patent/JP2005238331A/ja
Publication of JP2005238331A5 publication Critical patent/JP2005238331A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005010020A 2004-01-26 2005-01-18 複合材およびその製造方法 Pending JP2005238331A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005010020A JP2005238331A (ja) 2004-01-26 2005-01-18 複合材およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004016694 2004-01-26
JP2005010020A JP2005238331A (ja) 2004-01-26 2005-01-18 複合材およびその製造方法

Publications (2)

Publication Number Publication Date
JP2005238331A true JP2005238331A (ja) 2005-09-08
JP2005238331A5 JP2005238331A5 (enExample) 2006-12-21

Family

ID=35020608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005010020A Pending JP2005238331A (ja) 2004-01-26 2005-01-18 複合材およびその製造方法

Country Status (1)

Country Link
JP (1) JP2005238331A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010007922A1 (ja) * 2008-07-17 2010-01-21 電気化学工業株式会社 アルミニウム－ダイヤモンド系複合体及びその製造方法
JP2015501073A (ja) * 2011-12-19 2015-01-08 サン−ゴバン グラス フランス 車両用の照明窓
CN107470588A (zh) * 2017-09-18 2017-12-15 上海开朋科技有限公司 在铝金刚石复合材料表面覆盖铜箔的方法
CN107552768A (zh) * 2017-09-18 2018-01-09 江苏凯讯新材料有限公司 铝碳化硅复合材料散热基板表面覆盖金属层的工艺
CN107611040A (zh) * 2017-09-18 2018-01-19 上海开朋科技有限公司 铝金刚石复合材料表面覆盖铜箔同时镶嵌陶瓷材料的工艺
CN107649663A (zh) * 2017-09-18 2018-02-02 江苏凯讯新材料有限公司 一种在铝金刚石复合材料表面覆盖钼箔的工艺方法
CN107695321A (zh) * 2017-09-18 2018-02-16 江南大学 一种在铝碳化硅复合材料表面覆盖铝箔的工艺
CN114582730A (zh) * 2022-02-28 2022-06-03 江南大学 一种制备高性能铝基复合材料散热基板的方法
CN114603315A (zh) * 2022-02-28 2022-06-10 江南大学 一种金属基陶瓷复合材料基板拱形表面的车削成形方法

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010007922A1 (ja) * 2008-07-17 2010-01-21 電気化学工業株式会社 アルミニウム－ダイヤモンド系複合体及びその製造方法
CN102149493A (zh) * 2008-07-17 2011-08-10 电气化学工业株式会社 铝-金刚石类复合体及其制造方法
RU2505378C2 (ru) * 2008-07-17 2014-01-27 Денки Кагаку Когио Кабусики Кайся Алюминиево-алмазный композиционный материал и способ его получения
US9017824B2 (en) 2008-07-17 2015-04-28 Denki Kagaku Kogyo Kabushiki Kaisha Aluminum-diamond composite and manufacturing method
JP5940244B2 (ja) * 2008-07-17 2016-06-29 デンカ株式会社 アルミニウム−ダイヤモンド系複合体及びその製造方法
CN105886825A (zh) * 2008-07-17 2016-08-24 电气化学工业株式会社 铝-金刚石类复合体及其制造方法
JP2015501073A (ja) * 2011-12-19 2015-01-08 サン−ゴバン グラス フランス 車両用の照明窓
CN107552768A (zh) * 2017-09-18 2018-01-09 江苏凯讯新材料有限公司 铝碳化硅复合材料散热基板表面覆盖金属层的工艺
CN107470588A (zh) * 2017-09-18 2017-12-15 上海开朋科技有限公司 在铝金刚石复合材料表面覆盖铜箔的方法
CN107611040A (zh) * 2017-09-18 2018-01-19 上海开朋科技有限公司 铝金刚石复合材料表面覆盖铜箔同时镶嵌陶瓷材料的工艺
CN107649663A (zh) * 2017-09-18 2018-02-02 江苏凯讯新材料有限公司 一种在铝金刚石复合材料表面覆盖钼箔的工艺方法
CN107695321A (zh) * 2017-09-18 2018-02-16 江南大学 一种在铝碳化硅复合材料表面覆盖铝箔的工艺
CN107470588B (zh) * 2017-09-18 2019-05-10 上海开朋科技有限公司 在铝金刚石复合材料表面覆盖铜箔的方法
CN107552768B (zh) * 2017-09-18 2019-06-14 江苏凯讯新材料有限公司 一种在铝金刚石复合材料表面覆盖钼箔的工艺方法
CN107611040B (zh) * 2017-09-18 2019-06-14 上海开朋科技有限公司 铝金刚石复合材料表面覆盖铜箔同时镶嵌陶瓷材料的工艺
CN107649663B (zh) * 2017-09-18 2019-06-14 江苏凯讯新材料有限公司 一种在铝金刚石复合材料表面覆盖钼箔的工艺方法
CN114582730A (zh) * 2022-02-28 2022-06-03 江南大学 一种制备高性能铝基复合材料散热基板的方法
CN114603315A (zh) * 2022-02-28 2022-06-10 江南大学 一种金属基陶瓷复合材料基板拱形表面的车削成形方法
CN114582730B (zh) * 2022-02-28 2022-11-04 江南大学 一种制备高性能铝基复合材料散热基板的方法

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