JP2005236786A - Method and apparatus of manufacturing piezoelectric device, control program of manufacturing apparatus, and computer-readable recording medium recording control program of manufacturing apparatus therein - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric device which can ensure a sufficient joining area for acquiring a satisfactory joining strength by correctly positioning a conductive adhesive applied to a package side in joining a piezoelectric vibrating piece. <P>SOLUTION: In the method of manufacturing a piezoelectric device in which the piezoelectric vibrating piece is joined to the inside of the package, if a predetermined time elapses after the conductive adhesive is applied in an applying process, the joining process is not performed for the package in which the conductive adhesive is applied. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric device manufacturing method, a piezoelectric device manufacturing apparatus, a manufacturing apparatus control program, and a computer-readable recording medium storing a manufacturing apparatus control program in which a piezoelectric vibrating piece is accommodated in a package.

Piezoelectric vibrators in small information devices such as HDDs (hard disk drives), mobile computers, IC cards, mobile communication devices such as mobile phones, car phones, and paging systems, and measuring devices such as gyro sensors Piezoelectric devices such as piezoelectric oscillators are widely used.
A conventional piezoelectric device accommodates, for example, a piezoelectric vibrating piece formed of a piezoelectric material in a package.
The piezoelectric vibrator is manufactured, for example, by accommodating in a package a piezoelectric vibrating piece formed by etching a quartz wafer into a rectangular or tuning fork shape and providing an excitation electrode.

That is, a package terminal is provided in the package, and an electrode portion connected to the package terminal is exposed in the package. A conductive adhesive is applied to the electrode portion exposed inside the package, and the portion of the extraction electrode of the excitation electrode of the piezoelectric vibrating piece is placed on the application portion of the conductive adhesive on the package side. Is hardened so that it is electrically connected.
Here, the conductive adhesive used for the connection is applied to the electrode portion, and a crystal resonator assembling apparatus as a manufacturing apparatus having means for applying such a conductive adhesive is proposed. (For example, refer to Patent Document 1).

JP 2003-124765 A

In the assembly apparatus disclosed in Patent Document 1, a ceramic package is placed on a rotary table, and the assembly process is sequentially executed while the rotary table is indexed every predetermined angle. In this apparatus, after a predetermined time has elapsed after the coating head has applied the adhesive to one package, the coating head as the coating means further releases the adhesive.
That is, the adhesive used in such an apparatus hardens when the solvent evaporates and clogs the thin nozzles of the coating head. Therefore, in order to ensure the discharge of the adhesive, the application head releases the adhesive at regular intervals so that the adhesive is applied to the package with a high yield.

However, in such an assembly apparatus, even if the clogging of the nozzle is improved and the adhesive is surely applied to the package, the piezoelectric vibrating piece is further held by adsorption or chucking in the conductive adhesive application area. Must be carried, properly positioned and joined.
That is, if the direction and orientation of the piezoelectric vibrating piece are not properly adjusted and joined, vibration performance is adversely affected.Therefore, adjustment of the posture and direction in holding the piezoelectric vibrating piece by such chucking may take time. is there.
Then, with such a lapse of time, the conductive adhesive applied to the package is cured, and when the piezoelectric vibrating piece is bonded, a sufficient bonding area cannot be obtained and the bonding strength is insufficient. May end up.

  The present invention solves the above problems, and when bonding the piezoelectric vibrating piece, it is positioned correctly with respect to the conductive adhesive applied to the package side to ensure a sufficient bonding area and obtain a good bonding strength. An object of the present invention is to provide a method for manufacturing a piezoelectric device, an apparatus for manufacturing a piezoelectric device capable of realizing such a process, a control program for the manufacturing apparatus, and a computer-readable recording medium storing the control program for the manufacturing apparatus. It is said.

  According to the first aspect of the present invention, there is provided a piezoelectric device manufacturing method in which a piezoelectric vibrating piece is bonded in a package using a conductive adhesive, and transporting means for feeding the package in the order of processes. A preparatory step for obtaining an application position of the conductive adhesive by image recognition with respect to the electrode part arranged in the package, and applying the conductive adhesive corresponding to the application position Corresponding to the package position after being applied, and after the joining step, confirming the joining state of the piezoelectric vibrating piece to the package after the joining step, A post-processing step for determining whether the product is good or not, and when a predetermined time has elapsed after applying the conductive adhesive in the coating step, the package coated with the conductive adhesive. In There are, by the manufacturing method of the piezoelectric devices is not performed the joining step is achieved.

According to the configuration of the first invention, in the application step, when a predetermined time elapses after the conductive adhesive is applied, the bonding with respect to the package to which the conductive adhesive is applied is performed. The process is not performed. For this reason, when curing of the conductive adhesive proceeds, the piezoelectric vibrating piece is not bonded to the package. This prevents a piezoelectric device having insufficient bonding strength from being manufactured.
Thus, when the piezoelectric vibrating piece is bonded, the piezoelectric device can be properly positioned with respect to the conductive adhesive applied on the package side, and a sufficient bonding area can be secured to obtain a good bonding strength. A method can be provided.

A second invention is characterized in that, in the configuration of the first invention, the joining step is not performed when approximately 60 seconds have elapsed after the application of the conductive adhesive.
According to the configuration of the second aspect of the invention, the curing progresses after approximately 60 seconds from the application of the conductive adhesive, so that the bonding strength is insufficient. On the other hand, sufficient bonding strength can be ensured within 60 seconds.

Further, in the third invention, the above-mentioned object is a manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package, and a transport unit that transports the package in the order of steps; An application part that is disposed adjacent to the transport means and applies a conductive adhesive to the electrode part of the package, and a mounting part that stacks and mounts the piezoelectric vibrating piece on the applied conductive adhesive When the predetermined time has passed after the application unit has applied the conductive adhesive to the package, the package to which the conductive adhesive has been applied, This is achieved by a manufacturing apparatus configured not to perform processing by the mounting unit.
According to the configuration of the third invention, it is possible to provide an apparatus for manufacturing a piezoelectric device capable of obtaining sufficient bonding strength based on the same principle as described in the first invention.

  In the fourth invention, the above-mentioned object is a control program for causing a manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package to execute the following steps. Corresponding to the application position, a preparation step of arranging the package in a transport means for sending the process in order, and obtaining the application position of the conductive adhesive by image recognition for the electrode part arranged in the package, A bonding step of applying the conductive adhesive and bonding the piezoelectric vibrating piece corresponding to the package position after the application, and bonding of the piezoelectric vibrating piece to the package after the bonding step A post-processing step for confirming the state and determining whether the product is good or not, and when a predetermined time has elapsed after applying the conductive adhesive in the coating step, For the package to which the adhesive is applied, the control program of the manufacturing device for not performed the bonding step is achieved.

  According to the configuration of the fourth aspect of the invention, it is suitable for a piezoelectric device manufacturing apparatus that can obtain good bonding strength when bonding piezoelectric vibrating reeds, based on the same principle as described in the first aspect of the invention. A control program can be provided.

  According to the fifth aspect of the present invention, there is provided a computer-readable computer storing a control program for causing a manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package to execute the following steps. A preparatory process for obtaining a position where the conductive adhesive is applied by image recognition with respect to an electrode portion disposed in the package, the recording medium being a possible recording medium, arranged in a transport means for sending the package in the order of processes; , Corresponding to the application position, applying the conductive adhesive, and corresponding to the package position after the application, the bonding step of bonding the piezoelectric vibrating piece, after the bonding step, And confirming the bonding state of the piezoelectric vibrating piece with respect to the package, and performing a post-processing step for determining the quality of the piezoelectric vibrating piece, and applying the conductive adhesive in the coating step. Later, when a predetermined time elapses, a computer-readable recording medium that records a control program of a manufacturing apparatus that does not perform the bonding step for the package to which the conductive adhesive is applied, Achieved.

  According to the configuration of the fifth aspect of the invention, according to the control program recorded on the recording medium of the present invention, a piezoelectric that can obtain good bonding strength based on the same principle as described in the first aspect of the invention. A control program suitable for a device manufacturing apparatus can be provided.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
1 and 2 show a preferable shape example of a piezoelectric device manufactured by the method for manufacturing a piezoelectric device according to the present embodiment.
FIG. 1 is a schematic perspective view showing a part of a lid body of a piezoelectric device by breaking it, and FIG. 2 is a schematic sectional view taken along line AA of FIG.

The piezoelectric device 30 shown in FIGS. 1 and 2 shows an example in which a piezoelectric vibrator is configured. The piezoelectric device 30 has a structure in which a piezoelectric vibrating piece 31 is accommodated in a case or a package 36.
The piezoelectric device 30 includes a package 36, a seal ring 35 that is a seal member, a lid 37, and a piezoelectric vibrating piece 31. Here, the sealing member is used as a sealing material when the package 36 is hermetically sealed with a lid as will be described later. In this embodiment, a metal ring such as Kovar is used. It is used. When the lids are joined by seam welding, the seal ring 35 is also referred to as a “seam ring”.
The package 36 is an electrical insulator, and has, for example, a box-like structure having a structure in which a plurality of ceramic plates are stacked and opened upward. In this embodiment, the package 36 is a rectangular box. A space 30S is formed inside the package 36, and the piezoelectric vibrating piece 31 is accommodated in the space 30S. Electrode portions 32, 32 and another electrode portion 33 are formed on the inner bottom surface 36 </ b> M of the package 36. As shown in FIG. 1, the electrode portions 32 and 32 are provided apart from both end portions in the width direction. The other electrode part 33 is provided on the opposite side to the electrode parts 32, 32 on the inner bottom surface 36M.
For the package 36, a material having a thermal expansion coefficient that matches or is very close to that of the piezoelectric vibrating piece 31 and the lid 37 can be selected as a preferable material.
The seal ring 35 is made of a metal such as Kovar, for example. The lid body 37 is joined to the seal ring 35, whereby the space 30S of the package 36 is hermetically sealed.

Next, the piezoelectric vibrating piece 31 will be described.
As shown in FIG. 2, the piezoelectric vibrating piece 31 is formed by, for example, a so-called AT-cut vibrating piece obtained by processing a wafer formed of a piezoelectric material into a thin rectangular shape, so that a vibrating piece piece that is a piezoelectric chip is formed. Yes. As the piezoelectric material, for example, quartz is used in this embodiment, and other piezoelectric materials such as lithium tantalate and lithium niobate can be used. Further, the piezoelectric chip is not limited to the AT-cut vibrating piece, and a convex type or a reverse mesa type vibrating piece can be used. Further, a wafer made of a crystal Z plate is made of, for example, a hydrofluoric acid solution. Alternatively, a so-called tuning fork type resonator element may be used by wet etching or dry etching.

The piezoelectric vibrating piece 31 of FIGS. 1 and 2 has excitation electrodes 51 and 51 on the front surface side and the back surface side. The lead-out electrode 51A of the front-side excitation electrode 51 is joined and electrically connected to the one electrode portion 32 by the conductive adhesive 80. The extraction electrode 51 </ b> B of the excitation electrode 51 on the back side is joined and electrically connected via a conductive adhesive 80.
One excitation electrode 51 and the other excitation electrode 51 are respectively formed on one surface and the other surface of the piezoelectric vibrating piece 31, but the one excitation electrode 51 and the other excitation electrode 51 have opposite polarities. In this way, it is connected to the drive voltage source side via the mounting terminals 41 on the back side. An external drive voltage source applies a drive voltage to one excitation electrode 51 and the other excitation electrode 51 via the mounting terminal 41 and the electrode part 32, so that the piezoelectric vibrating piece 31 efficiently generates an electric field therein. Can be excited.

  As the conductive adhesives 80 and 80, for example, a material obtained by adding conductive particles such as silver particles (Ag) to a solvent containing a binder component and a volatile component made of a predetermined synthetic resin can be used. The resin component can be a silicone resin or an epoxy resin.

3A is a side view of the piezoelectric device 30 shown in FIG. 1 as viewed from the direction F, and FIG. 3B is a bottom view of the piezoelectric device 30. FIG. The mounting terminals 41 are arranged at the four corners of the bottom surface 36T of the package 36.
FIG. 4 shows a planar shape on the inner bottom surface 36 </ b> M side of the package 36. FIG. 4A shows two electrode portions 32 and another electrode portion 33 in the package 36. The electrode portions 32, 32 on the package side are electrically connected to mounting terminals 41, 41 located diagonally among the mounting terminals at the four corners of the bottom surface 36T of the package 36. That is, they are electrically connected through a conductive through hole penetrating the bottom plate of the package 36 and a conductive pattern 33a provided on the inner bottom surface 36M. In contrast, the electrode portion 33 is a dummy terminal that is not connected to the mounting terminals at the four corners of the bottom surface 36T of the package 36.

FIG. 4B shows an example in which a conductive adhesive 80 for bonding the piezoelectric vibrating piece 31 is applied to both the two electrode portions 32 and 32 and the other electrode portion 33. Yes. The conductive adhesive 80 is formed on each of the electrode portions 32 and 32 and the electrode portion 33 so as to have a substantially circular shape when seen in a plan view.
FIG. 4C shows an example in which the piezoelectric vibrating piece 31 is accommodated in the space 30 </ b> S of the package 36. In this example, the piezoelectric vibrating piece 31 is bonded and fixed on a total of three conductive adhesives of the electrode portions 32 and 32 and the electrode portion 33 by three-point support.
In this case, the conductive adhesive 80 on the electrode portions 32, 32 side is electrically connected to the excitation electrode 51 on one surface of the piezoelectric vibrating piece 31 and the excitation electrode 51 on the other surface. The conductive adhesive 80 of the electrode portions 32 and 32 supports the base portion 31K side of the piezoelectric vibrating piece 31 at two points. On the other hand, the conductive adhesive 80 on the other electrode portion 33 side only mechanically supports the other end portion side of the piezoelectric vibrating piece 31. Thereby, the piezoelectric vibrating piece 31 is held in the space 30S by three-point support.

FIG. 4D shows a fixing structure different from the case of FIG. 4B. In this example, the conductive adhesive 80 is formed only on the two electrode portions 32 and 32. . The conductive adhesive 80 is not formed on the other electrode portion 33.
Therefore, when the piezoelectric vibrating piece 31 is joined in the space 30S of FIG. 4D, the piezoelectric vibrating piece 31 is cantilevered by so-called two-point support with the electrode portions 32 and 32 supported by the conductive adhesive 80. Mechanically and electrically joined to the formula.

FIG. 5 shows an example of a cross-sectional structure of the package 36 in FIG. 4, and is for explaining a state in which the piezoelectric vibrating reed is joined in a manufacturing process described later. 5A shows a cross section taken along line BB in FIG. 4A, FIG. 5B shows a cross section taken along line CC in FIG. 4B, and FIG. Shows an example of a cross-sectional structure taken along line DD in FIG.
FIG. 5A shows a state where two electrode portions 32 and 32 are formed on the inner bottom surface 36M of the package 36. FIG. FIG. 5B shows a stage in which the conductive adhesive 80 is applied on the two electrode portions 32 and 32, respectively. FIG. 5C shows a state where the piezoelectric vibrating reed 31 is mounted and bonded onto the conductive adhesives 80 and 80. Here, one conductive adhesive 80 is electrically and mechanically joined to one extraction electrode 51A. The other conductive adhesive 80 is electrically and mechanically joined to the other extraction electrode 51A.

Next, a preferred embodiment of a piezoelectric device manufacturing apparatus for carrying out the piezoelectric device manufacturing method of the present embodiment will be described.
FIG. 6 is a plan view showing an embodiment of the piezoelectric device manufacturing apparatus of the present invention.
The piezoelectric device manufacturing apparatus 100 applies a conductive adhesive 80 to the electrode portion 32 in the package 36 of the piezoelectric device 30 as shown in FIG. 1 as shown in FIG. This is an apparatus for bonding the piezoelectric vibrating piece 31 into the package 36 using an adhesive 80.
The piezoelectric device manufacturing apparatus 100 shown in FIG. 6 includes a base 400 and various components provided on the base 400. The piezoelectric device manufacturing apparatus 100 performs a preparation step T1, a joining step T2, and a post-processing step T3 in the piezoelectric device manufacturing process. In FIG. 6, the X direction, the Y direction, and the Z direction are orthogonal to each other. The Z direction is a vertical direction on the paper surface of FIG. The θ direction is the rotation direction with respect to the Z direction.

  The base 400 shown in FIG. 6 has a circular index table 200 as a conveying means at the approximate center thereof. The index table 200 rotates in the rotation direction R and is positioned at the angle indexing position, so that the package 36 of FIG. 4A can be conveyed in the order of the process over the preparation process T1, the joining process T2, and the post-processing process T3. It is an example of the conveying means made. In this embodiment, the index table 200 includes a step S1, a step S2, a step S3, a step S4, a step S5, and a step corresponding to the index positions of equiangular intervals constituting the preparation step T1, the joining step T2, and the post-processing step T3. S6, step S7, and step S8 are advanced while being sent by rotation of 45 degrees.

The preparation process T1 includes a process S1 and a process S2.
Step S1 in FIG. 6 includes a package supply unit 301. Step S <b> 2 includes a package application position measurement unit 350.
The package supply unit 301 includes a supply head 303, a guide unit 304, and a guide unit 305. The package tray 306 accommodates a plurality of packages 306 as shown in FIG. That is, a predetermined number of packages are prepared by being accommodated in the package tray 36. In the stage of the preparation step T1, the electrode portions 32 and 33 are formed in the package 36 mounted on the package tray 306, but the conductive adhesive 80 is not yet applied, and the piezoelectric vibrating piece 31 is not yet applied. Is not yet joined.

  The supply head 303 has package holding means such as a suction nozzle and a chucking device. The supply head 303 holds the package 36 on the package tray 306 in a detachable manner. The supply head 303 can be positioned by moving in the X direction along the guide portion 305. Similarly, the guide part 305 can be positioned by moving in the Y direction along the guide part 304. Guide sections 304 and 305 are XY robots. The suction nozzle of the supply head 303 can move up in the X direction, the Y direction, and the Z direction, so that the package 36 on the package tray 306 can be sucked and raised.

As a result, the supply head 303 can transfer the package 36 on the package tray 306 by moving it to the mounting portion 201 at the position P 1 of the index table 200.
In the index table 200, eight mounting portions 201 are provided, for example, every 45 degrees. The plurality of mounting portions 201 can be sequentially supplied from position P1 to position P8.

The package application position measuring unit 350 shown in FIG. 6 captures an image of the package 36 mounted on the mounting unit 201 positioned at the position P2. Thereby, the package application position measurement unit 350 performs image recognition of the application position of the conductive adhesive corresponding to the positions of the electrode parts 32 and 32 shown in FIG. Thereby, the application position of the conductive adhesive can be accurately obtained as data in advance.
The package application position measurement unit 350 can also recognize the relationship between the mutual position of the package 36 and the seal ring 35 by recognizing the image.

Moreover, as joining process T2, it has process S3, process S4, and process S5. Step S3 shown in FIG. 6 includes an application portion 360 of a conductive adhesive. Step S4 includes a package position measurement and application state determination unit 380. Step S <b> 5 includes a piezoelectric vibrating piece measurement and mounting portion 430.
The conductive adhesive application section 360 shown in FIG. 6 includes an application head 361 and guide sections 362 and 364. The application head 361 has a syringe 363.

The guide part 362 can position the coating head 361 by moving it in the Y direction. The guide part 364 can be positioned by moving the guide part 362 in the X direction. The guide parts 362 and 364 are XY robots for application.
A conductive adhesive is accommodated in the syringe 363 of the coating head 361. The syringe 363 applies the conductive adhesive 80 to the electrode portions 32 and 32 in the package 36 placed on the mounting portion 201 positioned at the position P3 as shown in FIG. 4B. Can be done.

Next, the package position measurement and application state determination unit 380 shown in FIG. 6 measures the position of the package 36 on the mounting unit 201 positioned at the position P4 and determines the application state of the conductive adhesive 80. It is a part to do.
The package position measurement and application state determination unit 380 confirms the application diameter of the applied conductive adhesive from the image. For the confirmation, the image is binarized and the application area of the applied conductive adhesive is measured. The other is to confirm the coating diameter by measuring the width of the shading position of the conductive adhesive using the shading edge around the substantially circular shape of the applied conductive adhesive.
In addition to determining only the binarized area of the conductive adhesive applied in this way, the application diameter according to the width of the light and shade edge is directly measured and confirmed to determine the binarized area or directly apply the application diameter. If any of the measurements passes the standard, it is possible to determine whether the conductive adhesive is applied or not.
6 includes a suction nozzle 431, a slider 434, and guide portions 432 and 435. The piezoelectric vibration piece measurement and mounting portion 430 illustrated in FIG. The guide parts 432 and 435 are XY robots.

The slider 434 has, for example, a suction nozzle 431 as a means for holding the piezoelectric vibrating piece, and the positions of the slider 434 and the suction nozzle 431 can be positioned by moving in the Y direction by the guide portion 432. The guide part 435 can be positioned by moving the guide part 432 in the X direction.
Accordingly, the suction nozzle 431 can be moved and positioned in the X and Y directions. The suction nozzle 431 is for sucking and holding the piezoelectric vibrating piece 31 shown in FIG. 1 and mounting and bonding the piezoelectric vibrating piece 31 in the package 36 of the mounting portion 201 at the position P5. The plurality of piezoelectric vibrating reeds 31 are mounted side by side on the tray 450.
Accordingly, the suction nozzle 431 moves the piezoelectric vibrating piece 31 on the tray 450 toward the mounting portion 201 and mounts it in the package 36, and uses the conductive adhesive 80 to connect the extraction electrode of the piezoelectric vibrating piece 31 to the electrode portion 32, 32 is electrically connected.
The suction nozzle 431 can be positioned by moving in the Z direction in order to suck and hold the piezoelectric vibrating piece 31 and mount it in the package 36. Moreover, the suction nozzle 431 can adjust the direction of rotation of the piezoelectric vibrating piece 31 by rotating in the θ direction.

Next, post-processing process T3 has process S6, process S7, and process S8.
Step S6 in FIG. 6 includes a mount state inspection unit 500 after the piezoelectric vibrating piece is mounted. Step S7 includes a finished product storage 540. Step S8 includes a remaining product detection unit 600.
The mounting state inspection unit 500 after mounting the piezoelectric vibrating piece inspects the mounting state of the piezoelectric vibrating piece 31 mounted in the package 36 by image recognition as shown in FIG. That is, the mount state inspection unit 500 checks the mounting posture of the piezoelectric vibrating piece 31 with respect to the package 36 in the mounting unit 201 at the position P6.

The finished product storage unit 540 in FIG. 6 includes guide units 541 and 542 and a mechanical chuck 543.
The mechanical chuck 543 can be positioned by moving in the Z direction. The mechanical chuck 543 can be positioned by moving in the Y direction by the guide portion 542. The guide part 542 can be positioned by moving in the Y direction by the guide part 541.
The guide portion 541 has a finished product storage position PP1 and a standby position PP2. The product tray 570 is movable in the X direction between the finished product storage position PP1 and the standby position PP2. At the finished product storage position PP1, the defective product discharge unit 578, which is a position for replacing the finished product package 36 chucked by the mechanical chuck 543 with the product tray 570, is for discharging the raw material defective product of the package 36 to the outside. The defective discharge rail 579 is a portion for aligning the defective application of the conductive adhesive and the defective position of mounting the piezoelectric vibrating piece.
The mechanical chuck 543 chucks the package 36 on the mounting portion 201 positioned at the position P7 and carries it from the mounting portion 201 to the product tray 570.
The product remaining detection unit 600 shown in FIG. 6 is a part that detects whether the product package 36 remains on the mounting unit 201 positioned at the position P8 by image processing.

FIG. 7 shows an example of an electrical connection configuration of the piezoelectric device manufacturing apparatus 100 of FIG.
As illustrated in FIG. 7, the control unit 700 includes a programmable controller 701. The control unit 700 includes an index table drive unit 703, a package supply unit drive unit 704, a package application position measurement unit 350, a conductive adhesive application unit drive unit 705, a conductive adhesive air pressure supply unit 706, The package position measurement and application state determination unit 380, the measurement and mounting unit 430 of the piezoelectric vibrating piece, the mount state inspection unit 500 after mounting the piezoelectric vibrating piece, the finished product storage unit 540, and the remaining product detection unit 600 are electrically connected. Connected.
The control unit 700 includes an index table drive unit 703, a package supply unit drive unit 704, a conductive adhesive application unit drive unit 705, a conductive adhesive air pressure supply unit 706, and a piezoelectric vibrating piece measurement and mounting unit. 430, command to drive the storage unit 540 of the finished product.
The control unit 700 includes a package application position measurement unit 350, a package position measurement and application state determination unit 380, a piezoelectric vibration piece measurement and mounting unit 430, a mount state inspection unit 500 after the piezoelectric vibration piece is mounted, and a remaining product detection unit. A signal from 600 can be received.

Here, FIG. 8 is a diagram showing a hardware configuration showing a configuration of a programmable controller (hereinafter referred to as “controller”) constituting the control unit 700. The controller 701 includes a CPU (central processing unit) as an arithmetic unit, and includes a memory 712 and an input / output unit 716. The CPU 711, the memory 712, and the input / output unit 716 are connected by a transmission line 715 such as a bus. Therefore, it is possible to exchange signals with each other.
The memory 712 included in the controller 701 includes a ROM (read-only memory) that is a non-volatile storage unit and a RAM (random access memory) that is a volatile storage unit for providing a predetermined work area. It includes necessary storage means such as a hard disk capable of storing data, and holds a program for a manufacturing apparatus, which will be described later, and reads it out as appropriate. The input / output unit 716 is an interface of a controlled unit connected to the control unit 700 described with reference to FIG. 7 and includes an appropriate input unit such as a keyboard. As will be described later, the user inputs data related to driving. Includes means to enable.

  Furthermore, the input / output means 716 can write and read the program using a recording medium storing the operation program. Here, the recording medium that can be read by the input / output means is usually the same as the recording medium that is installed in the computer and used to make it executable by the computer, such as a floppy (registered trademark). Packages such as flexible disk, CD-ROM (Compact Disc Only Memory), CD-R (Compact Disc-Recordable), CD-RW (Compact Disc-Rewriterable), DVD (Digital Versatile Disc), and other media programs A semiconductor memory, a magnetic disk, a magneto-optical disk, or the like that is temporarily or permanently stored can be used.

FIG. 9 is an enlarged view showing the measurement and mounting portion 430 described in FIG.
In the drawing, the measurement and mounting portion 430 of the piezoelectric vibrating piece includes a suction nozzle 431, a slider 434, and guide portions 432 and 435. The guide parts 432 and 435 are XY robots.
The slider 434 has a suction nozzle 431, and the positions of the slider 434 and the suction nozzle 431 can be moved and positioned in the Y direction by the guide portion 432. The guide part 435 can be positioned by moving the guide part 432 in the X direction.
Accordingly, the suction nozzle 431 can be moved and positioned in the X and Y directions. The suction nozzle 431 is for sucking and holding the piezoelectric vibrating piece 31 shown in FIG. 1 and mounting the piezoelectric vibrating piece 31 in the package 36 of the mounting portion 201 at the position P5. The plurality of piezoelectric vibrating reeds 31 are mounted on the tray 450 side by side in the vertical and horizontal directions (in the X and Y directions).

That is, on the tray 450, for example, 300 or 720 piezoelectric vibrating reeds 31 are accommodated depending on the type of tray. The number of accommodated piezoelectric vibrating reeds 31 is the number that can be assembled by continuously operating the manufacturing apparatus 100.
The suction nozzle 431 can be positioned by moving in the Z direction by the first driving means 436 when approaching the piezoelectric vibrating piece 31 on the tray. Further, the suction nozzle 431 can be rotated in the θ direction by the second driving means 437 to adjust the direction of the rotation direction within the plane on which the piezoelectric vibrating piece 31 is placed. As a result, as will be described later, the suction nozzle 431 can adjust the suction position with respect to the piezoelectric vibrating piece 31 on the tray serving as a supply unit, or move the sucked and held piezoelectric vibrating piece 31 in the X and Y directions. Then, it can be mounted in the package by adjusting its rotation direction.

FIG. 10 shows a support structure of the suction nozzle 431 as the suction means, and shows a structure around the head portion of the mounter 270 for mounting the piezoelectric vibrating piece 31. A vacuuming means such as a vacuum pump (not shown) is connected to the suction nozzle 431 so as to vacuum-suck a work such as the piezoelectric vibrating piece 31 located at the tip.
As shown in FIG. 9, the mounter 270 is disposed near the middle between the tray 450 and the index table 200.
In FIG. 10, a camera 275 is provided as an imaging unit for image processing of the mounter 270. A lens 277 that is an optical system is attached to the camera 275 via a close-up ring 276. The lens 277 has functions of aperture and focusing.

The camera 275 is connected to the image controller 278. The image controller 278 has an image capturing procedure necessary for measurement, which will be described later, and performs processing. Therefore, the input controller of one or a plurality of cameras or the programmable controller 701 described with reference to FIG. Connection terminals, a monitor 279 connection terminal, and other input / output connectors.
The piezoelectric vibrating piece 31 sucked and held by the suction nozzle 431 enters the field of view of the lens 277 so as to be illuminated by the small coaxial epi-illumination 274 as the illumination means.
Here, the head portion 271 held by the slider 434 described with reference to FIG. 9 has a first portion 272 and a second portion 273 that are supported so as to be able to approach and separate from each other. Between the first portion 272 and the second portion 273, a spring 271a, which is a biasing means for applying a biasing force in the direction of the arrow, is interposed.
As a result, the piezoelectric vibrating piece 31 sucked by the suction nozzle 431 is photographed by the camera 275 and used to form correction data based on the imaging result as described later.
Further, the head part 271 is mounted on the conductive adhesive by being carried to the mounting part 201 (see FIG. 9) on the index table and moving in the arrow G direction. At the time of mounting, a weight is applied by the head portion 271 in the direction of arrow G, and this weight is adjusted by a spring 271a.

Next, an operation example of the piezoelectric device manufacturing apparatus 100 shown in FIG. 6 will be described with reference to FIGS. 11 and 12.
In FIG. 11 and FIG. 12, “1st”, “2st”,..., Etc. correspond to the above-described “step S1”, “step S2”,.
With the support of the control unit 700, the manufacturing apparatus 100 starts an operation based on the control program. Prior to the operation, the administrator or the user, via the input / output means 716 of FIG. 8, at least the number X of piezoelectric vibrating reeds 31 prepared on the tray 450 described in FIG. The process number n from the supply of 36 to the mounting of the piezoelectric vibrating piece 31 is input. X and / or n may be a default number and may be changed as necessary. In this embodiment, for example, “320” as X and “4” stages as n are input or determined in advance.

  In step S1 of FIG. 11 (same as “1st”, hereinafter “nst” is the same as “step Sn”), on the tray 306 of the package supply unit 301 of FIG. For example, 420 packages 36 are arranged and set. Here, in this embodiment, it is assumed that the total number of packages 36 accommodated in the tray 306 is larger than the total number X of piezoelectric vibrating reeds 31 accommodated in the tray 450 described with reference to FIGS. 6 and 9.

  The suction nozzle of the supply head 303 sucks the arbitrary package 36. In this case, the supply head 303 moves to the tray 306 side and sucks the package 36. The supply head 303 performs centering in the X and Y directions by the guide portions 304 and 305, the suction head of the supply head 303 supplies the package 36 onto the index table 200, and the package 36 onto the mounting portion 201 at the position P1. It is mounted (ST11). If it is determined in ST11 that the suction nozzle cannot successfully hold the package 36, the process proceeds to ST12, where the package 36 in the tray 306 is further sucked. If this adsorption is not successful, the adsorption is attempted only a predetermined number of times m (ST13). If the adsorption is still unsuccessful, the manufacturing apparatus 100 is stopped (ST14), and a buzzer (not shown) is sounded if necessary. And / or check the administrator by blinking the warning lamp.

After the package 36 is sucked by the suction head, the process proceeds to step S2 (ST15).
Here, the package application position measurement unit 350 shown in FIG. 6 measures the application position of the conductive adhesive in advance by image recognition. That is, an image is taken by a camera provided in the application position measurement unit 350, and the positions of the electrode units 32 and 33 shown in FIG. In this case, if there is a defect in the relative position of the electrode portions 32 and 33 with respect to the package or a defect in the relative position of the seal ring 35 with respect to the package 36, the package is determined to be defective at this point, and a process described later is performed. 7 is discharged to the NG box 578 of FIG. 6 (ST16).

Based on the coordinate position obtained from the image processing result, the data of the application position in the X, Y, and θ directions in FIG. 6 and the package pass / fail determination are transferred from the image controller of the package application position measuring unit 350 to the programmable controller 701.
Then, the index table 200 shown in FIG. 6 further rotates 45 degrees along the rotation direction R. Next, the process proceeds to step S3 (ST17).
In step 17, the conductive adhesive 80 is applied to the electrode portions 32 and 33 of the package 36 shown in FIG. 4A in which the coating head 361 of the conductive adhesive coating portion 360 is positioned at the position P 3. Apply as shown in (B).
In this case, the coating head 361 shown in FIG. 6 is positioned by moving in the X and Y directions using the guide portions 364 and 362, and the conductive adhesive 80 is applied to the electrode portions 32 and 33 by the coating head 361. It is applied as shown in FIG. Here, timing is started for each package 36 to which the conductive adhesive 80 is applied.

Next, the index table 200 is further rotated in the rotation direction R by 45 degrees. As a result, as shown in FIG. 4B, the package 36 to which the conductive adhesive 80 is applied moves from the position P3 to the position P4 (ST18).
In step S4, the package position measurement and application state determination unit 380 performs image recognition of the applied state of the applied conductive adhesive and the position of the package.

In ST18, the application shape of the conductive adhesive 80 applied on the electrode portions 32 and 33 is binarized, and the determination based on the obtained area and the direct application diameter by the predetermined shade edge width are performed. If any of the determinations by the confirmation is good, it is determined that the package 36 having the conductive adhesive is a non-defective product, and the process proceeds to ST20. If both are not good in the application determination, it is determined that the application state is defective, the package 36 is determined to be a defective product, the process proceeds to ST19, and is discharged to NGBOX 578 in step 7.
The application diameter of the conductive adhesive obtained in ST18 is fed back to the programmable controller 701 side shown in FIG. As described in detail, the positions of the package 36 and the seal ring 35 are image-recognized by the above-described method, and it is confirmed whether the position of the seal ring 35 is largely deviated from the package 36.

Subsequently, the index table 200 is further rotated 45 degrees in the rotation direction R. The package 36 moves from position P4 in FIG. 6 to position P5 (ST20).
In this step S5, the piezoelectric vibrating piece 31 is mounted in the package 36, which is a good product, as shown in FIG.
As a part of this joining process, adsorption and adsorption determination of the piezoelectric vibrating reed 31 for mounting are performed.
The piezoelectric vibrating reeds 31 are arranged vertically and horizontally on the tray 450 in FIG. That is, the arranged piezoelectric vibrating reeds 31 are disposed so as to be exposed from the opening provided in the jig of the tray 450, and the suction nozzle 431 described with reference to FIG. Thus, each piezoelectric vibrating piece 31 is adsorbed.

  In this stage, the number of the piezoelectric vibrating pieces 31 that have been attracted is counted. If the adsorption fails in ST20, the next piezoelectric vibrating piece 31 on the tray 450 is adsorbed (ST21), and if m adsorption failures continue for a predetermined number (ST22), the control unit 700 The manufacturing apparatus 100 is stopped (ST23). In this embodiment, the manufacturing apparatus 100 is stopped when the adsorption of the five piezoelectric vibrating reeds 31 of the tray 450 fails continuously. Further, the time counted from the application of the conductive adhesive described in ST17 is integrated to determine whether, for example, it has exceeded 60 seconds (ST24). If within 60 seconds, the remaining amount of the piezoelectric vibrating piece 31 of the tray 450 is determined. Is confirmed (ST25). If the piezoelectric vibrating piece 31 is not left on the tray 450, the process returns to ST23, and the manufacturing apparatus 100 continues to stop. If there is a remaining amount of the piezoelectric vibrating piece 31, the process returns to ST21, and the piezoelectric vibrating piece 31 is again placed on the tray 450. Adsorb from. Further, in ST24, when a predetermined time has elapsed since the application of the conductive adhesive, that is, in this embodiment, 60 seconds have elapsed, only the package 36 associated with that time is discharged to the NGBOX 578 in step 7.

That is, when a predetermined time elapses after the conductive adhesive is applied, the subsequent bonding process is not performed on the package 36 to which the conductive adhesive is applied.
For this reason, it is prevented that the conductive adhesive 80 is hardened and a piezoelectric device having insufficient bonding strength is manufactured.

Thus, according to this embodiment, when the piezoelectric vibrating reed 31 is bonded, the piezoelectric vibrating reed 31 is correctly positioned with respect to the conductive adhesive 80 applied to the package 36 side, and a sufficient bonding area is ensured and good bonding is achieved. A method for manufacturing a piezoelectric device capable of obtaining strength can be provided.
When the conductive adhesive 80 is applied, curing starts from the surface. Then, when approximately 60 seconds have elapsed from the application, the surface is hardened, so that it becomes difficult to bond and the bonding strength is insufficient. On the other hand, within 60 seconds, since the surface has not been cured, good bonding strength can be ensured.

On the other hand, if a positive result is obtained in ST20, the process proceeds to ST27. In this step 27, when the number prepared in advance in the tray 450 is X, and the number of stages from the supply of the package 36 to the adsorption of the piezoelectric vibrating piece 31 is n stages,
Conventional adsorption number QN of piezoelectric vibrating piece QN = (X−n) + n Expression 1
It is determined whether or not.
When Expression 1 is satisfied, the process proceeds to ST28, where the control unit 700 issues an instruction to the drive unit 704 of the package supply unit of the manufacturing apparatus 100, stops the supply of the package 36, and further n piezoelectric vibrating pieces. The index table 200 is continuously driven until 31 is sucked, and after the n piezoelectric vibrating reeds 31 are sucked, the operation mode is switched (ST29). The operation after the mode switching will be described in detail later.
While ST1 is not satisfied in ST27, the process proceeds to ST30.

That is, in step 30, with the suction nozzle 431 sucking one piezoelectric vibrating piece 31 from the tray 450, as described with reference to FIG. 10, the camera 275 photographs the piezoelectric vibrating piece (blank) 31. To do. Then, for example, the imaging result is shown on the monitor 279.
Based on the position where the piezoelectric vibrating piece 31 is sucked by the suction nozzle 431 as the holding means, the data in the X, Y, and θ directions are transferred to the programmable controller 701 in FIG. Thereby, the quality of the blank suction position and the blank shape is determined. If the piezoelectric vibrating piece 31 is a defective product that deviates from the standard, it is discharged to the NGBOX 578 in step 7 (ST31). In ST30, at the same time, data in the X, Y, and θ directions measured based on the position sucked by the suction nozzle 431 are used for the correction work for the next suction.

Subsequently, in ST32, the control unit 700 of FIG. 7 calculates the position of the package 36 and the position of the blank, and transfers the data to the X / Y robot of the piezoelectric vibrating piece measurement and mounting unit 430. As a result, as shown in FIG. 4C, the piezoelectric vibrating piece 31 is arranged in the internal space of the package 36 mounted on the mounting portion 201 at the position P5, and the electrode portion of the excitation electrode 51 is conductive. It is bonded electrically and mechanically to the corresponding electrode part 32 via the adhesive 80. The pattern portion of the piezoelectric vibrating piece 31 is mechanically connected to the other electrode portion 33 using the conductive adhesive 80.
In this way, the piezoelectric vibrating piece 31 is mounted and mounted on the package 36.
Further, when the index table 200 rotates 45 degrees, the package 36 in the state of FIG. 4C moves from the position P5 shown in FIG. 6 to the position P6.

In step S <b> 6 of step 33, the mounting position of the piezoelectric vibrating piece 31 is image-recognized by the mount state inspection unit 500 after mounting the piezoelectric vibrating piece in FIG. 6 to determine whether the position of the piezoelectric vibrating piece 31 with respect to the package 36 is good or bad. To do.
The index table 200 rotates in the rotation direction R, and the package 36 moves from position P6 to position P7. Here, the mechanical chuck 543 of the finished product storage section 540 shown in FIG.
The defective determination and mounting failure of the conductive adhesive are aligned on the dedicated tray 570. Further, the defective product of the package 36 is discharged to the NG box 578 (ST34). Here, if the number of defective products continues in ST34 for a predetermined number m, that is, five in this embodiment, the control unit 700 stops the operation of the manufacturing apparatus 100 (ST36), and sounds a buzzer (not shown) if necessary. And / or check the administrator by blinking the warning lamp.

  The non-defective package 36 is aligned on the product tray 570 shown in FIG. 6 (ST37). Further, the index table 200 rotates in the rotation direction R, and the mounting unit 201 moves from position P7 to position P8 (ST38). Here, the remaining product detection unit 600 detects whether the package 36 remains on the mounting unit 201 at the position P8. If there is a remainder in ST38, the process returns to ST11 again. If not, the process proceeds to ST36, where the control unit 700 stops the operation of the manufacturing apparatus 100 and ends the operation.

Next, the operation when the operation mode is changed in ST29 described above will be described with reference to the flowchart of FIG. 12 and the explanatory diagram of FIG. FIG. 13 is a diagram showing the index table 200 in a simplified manner.
In this operation mode, since the point of performing the operation by holding the piezoelectric vibrating piece 31, that is, for example, confirming the suction first is different from the case of FIG. 11, the overlapping description is omitted, and the difference is mainly described. Explained.
In FIG. 12, the control unit 700 changes the operation mode when the number of remaining piezoelectric vibrating pieces 31 in the tray 450 becomes n, and first performs an operation of sucking the piezoelectric vibrating pieces 31 from the tray 450. It precedes (ST41).

  If the suction of the piezoelectric vibrating piece 31 fails in ST41, the process proceeds to ST42 so that the next piezoelectric vibrating piece 31 is sucked, and if it fails further, the process proceeds to ST61. Since the processing of ST61 is the same processing as ST22, ST23, ST24, ST25, and ST26 of FIG. That is, also here, after the conductive adhesive is applied, adsorption is attempted until it is not suitable for the mount, and when the adsorption cannot be performed, the package is discarded.

When the piezoelectric vibrating reed 31 can be adsorbed in ST41, the process proceeds to ST43, and the same processing as ST30 described in ST11 is performed.
If the piezoelectric vibrating piece 31 is reliably adsorbed, the process proceeds to ST45, where the control unit 700 supplies the package 36 onto the index table 200 and proceeds with the subsequent operations. ST46 during this time is the same as ST12 in FIG. 11, and the subsequent ST47 to ST53 corresponding to step S2, step S3, and step S4 are the same as ST19 in FIG.

  In the operation mode of FIG. 12, the difference from FIG. 11 is that, after the image processing of ST52 is completed, the piezoelectric vibrating reed 31 has already been adsorbed, so that the process proceeds to ST54 and the operations after ST32 of FIG. is there. The operations from ST54 to ST60 are the same as ST32 to ST38 in FIG.

As described above, in the operation mode of FIG. 12, the package 36 is supplied as much as the piezoelectric vibrating piece 31 is sucked as a result of the suction of the piezoelectric vibrating piece 31 preceding.
That is, in this type of manufacturing apparatus 100, after supplying the package 36 to the index table 200, the coating process is performed, and then the joining process and the post-processing process are sequentially performed. Here, in manufacturing, the same number of packages 36 and piezoelectric vibrating reeds 31 may be prepared and used, but the same number may not be prepared, or these numbers may not match due to any defect during the process. It may disappear.
When the above-described steps are performed in such a state, for example, the package 36 is first supplied onto the rotary table, the conductive adhesive 80 is applied, and the piezoelectric vibrating piece 31 is placed at the mounting position. When the piezoelectric vibrating piece 31 is not supplied, the package 36 is exposed with the conductive adhesive 80 applied while the piezoelectric vibrating piece 31 is replenished.
When the conductive adhesive 80 is cured, when the piezoelectric vibrating piece 31 is bonded, a bonding area is insufficient, and the bonding cannot be surely performed. It is necessary to discard the package 36 supplied in advance of the portion to which the conductive adhesive 80 is applied.

Therefore, when the number of piezoelectric vibrating reeds 31 prepared in the supply tray 450 is X, and the number of feeds of the index table 200 required from the supply of the package 36 to the suction of the piezoelectric vibrating reeds 31 is n, the process While proceeding in order, the adsorption number of the piezoelectric vibrating reed 31 is counted in ST20, and when the counted number becomes (Xn), the operation mode of FIG. After that, the package 36 is supplied onto the index table 200. Thereby, after the piezoelectric vibrating piece is adsorbed, the corresponding package 36 is supplied onto the index table 200 and the conductive adhesive 80 is applied, so that the package is not wasted.
In addition, since the input / output means described with reference to FIG. 8 allows X and / or n to be varied, it is possible to flexibly deal with individual losses and changes in the number of parts prepared in advance when handling individual parts. It can correspond to.

By the way, the present invention is not limited to the above embodiment.
In the present invention, the piezoelectric vibrating piece is accommodated so as to be covered with a package, and the conductive adhesive is configured to join the piezoelectric vibrating piece, regardless of the name of the piezoelectric vibrator, the piezoelectric oscillator, or the like. The present invention can be applied to the manufacture of all piezoelectric devices.
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the claims.
In the above-described embodiment, the case where the circular index table is used as the conveying unit and the number of processes is eight has been described. However, the conveying unit is not limited to the index table, and the number of processes may be smaller or larger. It is the scope of the invention.
A part of each configuration of the above embodiment can be omitted, or can be arbitrarily combined so as to be different from the above.

The perspective view which shows the structural example of the piezoelectric device obtained by the manufacturing method of the piezoelectric device which concerns on embodiment of this invention. The figure which shows the cross-section structural example in AA of the piezoelectric device of FIG. The figure which shows the side surface and bottom face of a piezoelectric device. The figure which shows the example of a shape of the package of a piezoelectric device, an electrode part, a conductive adhesive, and a piezoelectric vibrating piece. Sectional drawing which shows the example of shapes, such as a package of FIG. 1 is a schematic plan view showing an example of a piezoelectric device manufacturing apparatus for carrying out a method for manufacturing a piezoelectric device of an embodiment. The figure which shows the electrical connection example of the manufacturing apparatus of the piezoelectric device of FIG. The block diagram which shows the hardware structural example of the control part of FIG. FIG. 7 is an enlarged view of the vicinity of the measurement and mounting portion of the manufacturing apparatus of FIG. 6. Schematic which shows the structural example of the mounter of the piezoelectric vibration piece of the manufacturing apparatus of FIG. The flowchart which shows the operation example of the manufacturing apparatus of the piezoelectric device of FIG. The flowchart which shows the operation example of the manufacturing apparatus of the piezoelectric device of FIG. Explanatory drawing which shows operation | movement of the index table of the manufacturing apparatus of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 30 ... Piezoelectric device, 36 ... Package, 31 ... Piezoelectric vibrating piece (blank), 32 ... Electrode part, 80 ... Conductive adhesive, 200 ... Index table.

Claims (5)

A method of manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package using a conductive adhesive,
A preparatory step in which the package is disposed in a transport unit that sends the package in the order of steps, and an application position of the conductive adhesive is obtained by image recognition with respect to the electrode portion disposed in the package;
A bonding step of applying the conductive adhesive corresponding to the application position, and bonding the piezoelectric vibrating piece corresponding to the package position after being applied;
A post-processing step of confirming the bonding state of the piezoelectric vibrating piece with respect to the package after the bonding step, and determining whether the package is good or bad;
In the applying step, when a predetermined time has elapsed after applying the conductive adhesive, the bonding step is not performed on the package to which the conductive adhesive is applied. A method for manufacturing a piezoelectric device.   2. The method of manufacturing a piezoelectric device according to claim 1, wherein the joining step is not performed when approximately 60 seconds elapse after application of the conductive adhesive. A manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package,
Conveying means for conveying the package in the order of processes;
An application part that is arranged adjacent to the conveying means and applies a conductive adhesive to the electrode part of the package;
A mounting portion for stacking and mounting the piezoelectric vibrating piece on the applied conductive adhesive;
When a predetermined time has elapsed after the application unit has applied the conductive adhesive to the package, the package applied with the conductive adhesive is processed by the mounting unit. A manufacturing apparatus characterized by being configured not to perform. A control program for causing a manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package to execute the following steps,
A preparatory step in which the package is disposed in a transport unit that sends the package in the order of steps, and an application position of the conductive adhesive is obtained by image recognition with respect to the electrode portion disposed in the package;
A bonding step of applying the conductive adhesive corresponding to the application position, and bonding the piezoelectric vibrating piece corresponding to the package position after being applied;
After the joining step, confirm the joining state of the piezoelectric vibrating piece with respect to the package, and perform a post-processing step to determine its quality,
In the application step, when a predetermined time has elapsed after applying the conductive adhesive, the bonding step is not performed on the package to which the conductive adhesive is applied. A control program for a manufacturing apparatus. A computer-readable recording medium storing a control program for executing the following steps in a manufacturing apparatus for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package,
A preparatory step in which the package is disposed in a transport unit that sends the package in the order of steps, and an application position of the conductive adhesive is obtained by image recognition with respect to the electrode portion disposed in the package;
A bonding step of applying the conductive adhesive corresponding to the application position, and bonding the piezoelectric vibrating piece corresponding to the package position after being applied;
After the joining step, confirm the joining state of the piezoelectric vibrating piece with respect to the package, and perform a post-processing step to determine its quality,
And in the said application | coating process, when predetermined time passes after apply | coating the said conductive adhesive, it is made not to perform the said joint process about the said package with which the said conductive adhesive was apply | coated. A computer-readable recording medium on which the control program is recorded.

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