JP2008283597A - Manufacturing methods of component storage container and piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a component storage container in which joining performance of a component is improved by forming an electrode pad of the storage container in a suitable shape, and a manufacturing method of a piezoelectric device using such a storage container. <P>SOLUTION: The manufacturing method of the component storage container which has the electrode pad 50 formed on an internal bottom surface of the storage container and also has electric and electronic components joined with the electrode pad, includes: a paste coating stage of coating a place where the electrode pad should be formed on a ceramic-made insulating substrate 34 to be the internal bottom surface with conductive paste a plurality of times; a burning stage of burning a ceramic material including the insulating substrate to be the storage container; a cutting processing stage of cutting the paste coating part having been cured after the coating stage to shape the part; and a plating stage of plating the surface of the paste coating part having been cut with electrode metal. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a storage container for storing electrical / electronic components and an improvement in a method for manufacturing a piezoelectric device in which a piezoelectric vibrating piece is stored in the storage container.

Piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators in small information devices such as HDDs (hard disk drives), mobile computers, and IC cards, and mobile communication devices such as mobile phones, car phones, and paging systems Is widely used.
A conventional piezoelectric device accommodates a piezoelectric vibrating piece formed of a piezoelectric material, for example, as an electronic component in a package that is a container.
The piezoelectric vibrating piece is formed, for example, by etching a quartz wafer into a rectangular shape and providing a driving electrode.

In the piezoelectric vibrating piece having such a configuration, the lead electrode is bonded to the electrode pad formed on the inner bottom surface of the container made of ceramic or the like by a conductive adhesive.
Such a technique is widely practiced as a method of joining the piezoelectric vibrating reed in the container. For example, a conductive adhesive is applied to the electrode pad, and the end of the piezoelectric vibrating reed is attached to the end of the piezoelectric vibrating reed. In the case of mounting on a coated conductive adhesive and joining it in a cantilever manner, there has been an effort to reduce the stress on the adhesive against an external impact.

For example, for a conductive adhesive interposed between an electrode pad and a piezoelectric vibrating piece, a technique for increasing the stress relaxation capability against external impact by applying a thicker thickness on the free end side than the base to be joined Is known (see Patent Document 1).
In addition, a method is known in which a step portion is formed on an electrode pad, and a conductive vibrating agent is applied to the electrode pad, and then a piezoelectric vibrating piece is joined to the inside of the step portion (see Patent Document 2).
By doing so, the area to which the conductive adhesive adheres becomes larger on the inner side than the step portion of the electrode pad, so that the bonding area between the piezoelectric vibrating piece and the electrode pad is increased, and the impact resistance is improved. That's it.

JP2004-222006 JP2005-117092

However, according to the methods described in the preceding patent documents, they are provided with a convex portion on the electrode pad (see Patent Document 1) or a predetermined step on the electrode pad (see Patent Document 2). Thus, as a special pad shape, the application amount of the conductive adhesive applied thereto is increased to improve the bonding strength.
However, particularly in the case of a small piezoelectric device, the electrode pad is also very small, and it is difficult to accurately form the shape of the electrode pad.
In other words, the convex portions and step portions of the electrode pad are formed by repeatedly applying a conductive paste at a predetermined position on the inner bottom portion of the package when the electrode pad is formed.
Such an electrode pad forming method has the following problems.

FIG. 12 shows the piezoelectric device 1, and an electrode pad 4 is formed on the inner bottom 3 of the package 2 that is a container. Reference numeral C is an imaginary straight line passing through the center position of the electrode pad 4, and a lead electrode (not shown) of the piezoelectric vibrating piece 7 is bonded to the electrode pad 4 by a conductive adhesive (not shown). The package 2 is hermetically sealed by the lid 8.
Here, the electrode pad 4 is formed by applying a conductive paste, sintering an insulating material such as ceramic for forming a package, and then performing gold plating.

And the above-mentioned convex part and step part formed in the electrode pad 4 are provided. This is formed by applying a conductive paste once by printing or the like as indicated by reference numeral 5 and then applying it again as indicated by reference numeral 6.
However, the second printing needs to be performed at the center position C of the electrode pad 4, but may deviate from the center position C as illustrated.
If it does so, a convex part and a step part will be formed in the place which shifted | deviated from the center position of the electrode pad 4, and there exists a problem that a suitable joint surface cannot be formed.

Further, when the conductive paste is applied by screen printing, a shift of about 50 μm occurs in the printing position due to deterioration of the mask or the like.
Furthermore, since the electrode pad 4 to be formed has a very small size, when a slight positional shift occurs for each application, the bonding performance of the piezoelectric vibrating piece may be affected depending on the shift amount. .
In addition, since the conductive paste is applied to form the electrode pad 4 before sintering of a piezoelectric material such as ceramic for forming the package 2, the sintering process is performed after the application. The position where the electrode pad is formed may be shifted due to shrinkage of the material.

  The present invention was made to solve the above problems, and by forming the electrode pad of the storage container into an appropriate shape, a method for manufacturing a component storage container that improves the joining performance of the parts, and An object of the present invention is to provide a method for manufacturing a piezoelectric device using such a container.

  According to the present invention, the electrode pad is formed on the inner bottom surface of the container, and the inner side of the container is a method of manufacturing a component container in which an electric / electronic component is joined to the electrode pad. A paste applying step of applying a conductive paste to a portion on the ceramic insulating substrate to be formed on the bottom surface, and a ceramic material for forming the container or the insulating substrate serving as a bottom plate of the container; A firing process for firing the ceramic material constituting the material, a cutting process for cutting the paste application part cured after the application process to adjust the shape, and a plating process for plating an electrode metal on the surface of the paste application part after the cutting process This is achieved by a method for manufacturing a component container that includes:

According to the said structure, after performing a paste application | coating process, the ceramic material for forming the insulating substrate used as the bottom plate of the said storage container or the ceramic material for forming a storage container is sintered by a baking process. At this time, the position of the paste application part to which the conductive paste is applied changes somewhat due to contraction. When this baking process is completed, there is no element that changes the position of the paste application part, and therefore, a cutting process is executed at that stage to arrange the paste application part into an appropriate desired shape. Thereafter, an electrode pad is formed by plating.
As described above, in the present invention, since the cutting process is performed after firing the ceramic material forming the container, for example, an electrode pad in which a desired convex portion or stepped portion is reliably formed at an accurate position is obtained. be able to. Thereby, a sufficient bonding area can always be obtained stably by applying a conductive adhesive to the electrode pad.
Preferably, in the paste application step, the conductive paste is applied a plurality of times to a position where the electrode pad on the insulating substrate is to be formed.
Thereby, since the paste application part becomes large, even if it is processed and removed by the cutting process, it becomes easy to leave a paste application part having a sufficiently large size.

  In the present invention, in the present invention, the electrode pad is formed on the inner bottom surface of the container, and the piezoelectric device manufacturing method for joining the lead electrode of the piezoelectric vibrating piece to the electrode pad, A pre-process that is a forming step for separately forming the storage container and the piezoelectric vibrating piece, and a joining step for bonding the piezoelectric vibrating piece to the electrode pad of the storage container as a post-process following the pre-process. And a sealing step for hermetically sealing the storage container, and the step of forming the storage container in the previous step is to form an electrode pad on the ceramic insulating substrate serving as the inner bottom surface A paste applying step of applying a conductive paste to the substrate, and firing a ceramic material for forming the storage container or a ceramic material constituting the insulating substrate serving as a bottom plate of the storage container A piezoelectric device comprising: a firing process; a cutting process for cutting a paste application part cured after the application process to adjust the shape; and a plating process for plating an electrode metal on the surface of the paste application part after the cutting process This is achieved by the manufacturing method.

According to the said structure, the electrode pad which formed the desired convex part, the step part, etc. in the exact position, for example by the same principle demonstrated by other invention can be obtained. Thus, by applying a conductive adhesive to the electrode pad, a sufficient bonding area can be obtained stably at all times when bonding the piezoelectric vibrating piece.
Also in the case of the present invention, preferably, in the paste applying step, the conductive paste is applied a plurality of times to the locations on the insulating substrate where the electrode pads are to be formed.

In another aspect of the invention, the paste application step includes a first application step and a second application step, and the second application area is equal to or less than the first application area. And
According to the configuration of the invention, the second coating step is performed so as to overlap the paste application portion in the first coating step, so that the first coating step is slightly shifted from the coating position in the first coating step. Even if the second application step is performed, if the second application area is smaller than the first application area, the second application position is less likely to protrude from the first application position. An application part can be formed in a fixed shape.

In another aspect, the electrode pad has a polygonal outer shape.
According to the structure of the said invention, if the shape of an electrode pad, ie, the said paste application part, is made into a polygon, it will be easy to identify by image recognition.

In another aspect of the invention, in the paste application step, the second and subsequent application portions are stacked on the first application portion, and the second and subsequent application heights are retained, A cutting step portion is formed in the cutting step outside the remaining portion.
According to the configuration of the above invention, when the second and subsequent coating portions are overlaid on the first coating portion and the portion to be retained while maintaining the second and subsequent coating heights is made, this remaining portion As a result, the height of the coating part after the second time is interposed between the piezoelectric vibrating piece and a sufficient gap for the conductive adhesive to enter is formed.
And, since the conductive adhesive properly enters the coating step portion by cutting the outer portion of the remaining portion, for example, the peripheral portion into a step portion, the applied conductive adhesive is more than necessary. It does not protrude above. For this reason, since the piezoelectric vibrating piece can be bonded and held at a low position, the overall height of the product can be reduced.

1 and 2 show an example of a piezoelectric device according to an embodiment of the manufacturing method of the present invention. FIG. 1 is a schematic plan view of the piezoelectric device with the internal structure exposed except for the lid, and FIG. FIG. 6 is a schematic end view taken along line AA of FIG. In FIG. 2, the electrodes of the piezoelectric vibrating piece are not shown.
In these drawings, the piezoelectric device 30 shows an example in which a piezoelectric vibrator is configured, and the piezoelectric device 30 houses a piezoelectric vibrating piece 40 in a package 36.
Specifically, as shown in FIG. 2, the piezoelectric device 30 houses a piezoelectric vibrating piece 40 in a package 36 including an insulating substrate 34 and, for example, a seal ring 35 precoated on the insulating substrate 34. . An inner space S is formed inside the seal ring 35, and a rectangular cavity for housing the piezoelectric vibrating piece 40 is formed as a whole.

An insulating substrate 34 constituting the package 36 is an insulating base and is made of ceramic. The upper surface is an inner bottom surface 39 of the package 36. In the case of FIG. 1, one electrode pad 50 is formed at each corner of the inner bottom surface 39 of the package 36.
These electrode pads are connected to mounting terminals 38 exposed on the bottom surface of the package 36 by a conductive pattern (not shown). A conductive adhesive 31 is applied to the electrode pad 50, and an extraction electrode, which will be described later, of the piezoelectric vibrating piece 40 is placed and cured by bonding.
A lid 37 made of a metal such as ceramic, glass or Kovar is joined to the package 36 via a seal ring 35. Thereby, the package 36 is hermetically sealed.

As the piezoelectric material forming the piezoelectric vibrating piece 40, for example, a quartz wafer made of quartz is used as the piezoelectric substrate.
The piezoelectric vibrating piece 40 is formed in a plate shape having the rectangular or square outer shape of the quartz crystal substrate. In this embodiment, the thickness of the central portion 41 is reduced, so that it is particularly suitable for high-frequency oscillation. It is an inverted mesa type resonator element.
In order to excite the central portion 41, excitation electrodes 42 are formed on the front and back of the central portion 41 as shown in FIG. Conductive patterns are extended from the excitation electrodes in the width direction, and lead electrodes 43 are formed toward one corner.
The lead electrodes 43 and 43 connected to the excitation electrodes 42 on the front and back sides of the piezoelectric vibrating piece 40 are also formed on the back surface of the piezoelectric vibrating piece 40 around the side surface.
That is, the piezoelectric vibrating piece 40 of FIG. 1 has the same form on both sides.

  The piezoelectric vibrating piece 40 is extremely small (for example, width × length × thickness is about 1.5 mm × 1.0 mm × 60 μm). Correspondingly, the electrode pad 50 of the package 36 is also extremely small. When the electrode pad 50 is formed in a rectangular shape, the size thereof is, for example, about 0.4 mm × 0.4 mm.

(Embodiment of Piezoelectric Device Manufacturing Method)
The piezoelectric device 30 is configured as described above and can be manufactured as follows.
(pre-process)
The manufacturing process of the piezoelectric device 30 includes a manufacturing process of the piezoelectric vibrating piece 40 and a manufacturing process of the package 36 shown in FIG.
First, the manufacturing process of the piezoelectric vibrating piece 40 will be briefly described.

As described with reference to FIG. 2, the piezoelectric vibrating piece 40 according to this embodiment is, for example, a so-called reverse mesa type piezoelectric vibrating piece in which the thickness of the central portion is thinned.
In FIG. 3, a crystal plate cut out from a single crystal of crystal with a plane inclined at a predetermined angle from the Z axis in an orthogonal coordinate system consisting of an X axis (electrical axis), a Y axis (mechanical axis), and a Z axis (optical axis). Get. The quartz plate is subjected to predetermined polishing or the like to obtain a quartz wafer (ST11).
Next, a protective film is formed on the entire quartz wafer (ST12), and this protective film is etched to obtain an external processing pattern (mask) (ST13). Then, an inverted mesa vibrating piece having an outer shape as shown in FIG. 2 is formed by etching (ST14). The protective film of ST12 is removed (ST15).
For example, piezoelectric materials such as lithium tantalate and lithium niobate can be used in addition to quartz. In addition, the shape of the piezoelectric chip for forming the piezoelectric vibrating piece is not limited to the inverted mesa type, and a flat type, a convex type, a mesa type, or a tuning fork type piezoelectric chip can be used.

Here, in the case of wet etching, a protective film in which gold is formed on a chromium or titanium base can be used. As an etchant, hydrofluoric acid (HF) or ammonium bifluoride (OLE_LINK2NH ₄ F · HFOLE_LINK2) can be used.
In the case of dry etching, a RIE (reactive ion etching) method can be used. In this case, CF ₄ gas can be used, and as the protective film, a protective film that is the same as the above, or contains any of chromium, titanium, and tungsten, and contains aluminum can be used.
Thereafter, the excitation electrode and the extraction electrode described in FIG. 1 are formed by a photolithography technique (ST16). That is, these drive electrodes are formed by, for example, forming a base of nickel or chrome on the surface of a quartz crystal and plating a conductive metal such as gold or silver to obtain the electrode shape shown in FIG. 1 by photolithography. Is.
Thus, the piezoelectric vibrating piece 40 as a chip can be obtained (ST17).

Apart from the process of FIG. 3, the process shown in FIG. 4 is performed.
First, the package 36 is formed.
The insulating substrate 34 and the seal ring 35 of the package 36 can be formed by sintering a green sheet formed into the shape shown in FIGS. In this case, the insulating substrate 34 is a substrate constituting the bottom portion of the package 36, and the seal ring 35 superimposed thereon can be provided by pre-coating the insulating substrate 34 in a frame shape such as Kovar. The seal ring 35 may be precoated on the lid 37 side. 2 substantially constitutes a wall portion of the package 36, the wall portion of the package may be formed by removing the inside of the ceramic substrate instead of the seal ring.
Further, the lid 37 to be joined to the insulating substrate 34 serving as the bottom plate via the seal ring 35 is not shaped as shown in FIG. It is good also as a structure joined so that it may face down. Thereby, a wide cavity is formed inside the lid 37.

On the insulating substrate 34, for example, a necessary conductive pattern is formed by printing using tungsten metallization, a conductive paste such as silver or palladium, or the like.
Here, metallization generally refers to a technology that metalizes the surface of ceramics and brazes it with metal parts or allows electricity to flow, and paste materials used in such cases are also used. means.
Then, the conductive paste is printed on the electrode pad 50 (ST21), and then the insulating substrate 34 made of a green sheet is baked (ST22).

Subsequently, mechanical processing, which is a cutting process described later, is performed (ST23), and thereafter, gold or silver or the like is sequentially plated with nickel or the like as a base (ST24), and the above-described electrode pad 50 or the like is formed. .
The conductive pattern for connecting the electrode pad 50 and the mounting terminal 38 may be formed on the surface of a castellation (not shown) used when the package 36 is formed, and the outer surface of the package 36 may be routed. Alternatively, they may be connected by a conductive through hole (not shown) that penetrates the insulating substrate 34.

Here, the step ST21 and the step ST23 will be described in more detail.
FIG. 5 and FIG. 6 are diagrams for explaining the mechanical processing step of ST22 after the completion of ST21 and the subsequent firing step (ST22).
In FIG. 5, electrode pads 50 are formed at the four corners of the insulating substrate 34 of the package 36, respectively. As shown in the drawing, each electrode pad 50 is preferably formed by applying a conductive paste a plurality of times. In this embodiment, the electrode pad 50 is formed on the first application portion 51 of the conductive paste. The second application part 52 is formed so as to overlap.
That is, it is formed by applying a conductive paste a plurality of times. The conductive paste is applied to form a predetermined electrode pad shape by being applied a plurality of times. That is, as illustrated in FIGS. 5 and 6, the process is performed to form a predetermined convex portion or stepped portion. For this reason, the conductive paste is applied as many times as necessary to make the electrode pad into a desired shape.
In the conductive paste application step, the application may be performed only once if the shape and size are suitable for the cutting process described later.

Here, as shown in FIG. 5, a plurality of electrode pads 50 are formed on the inner bottom surface 39 of the insulating substrate, four in the illustrated case.
These electrode pads 50 not only require the first application portion 51 to be applied at the correct position, but also the second application portion 52 includes all electrodes as shown in FIG. For example, the pad 50 must be properly positioned and applied to the central portion of the first application portion 51.
If it is not applied in this manner, the protrusions or steps to be formed on the electrode pad 50 are formed at positions shifted from the center position of the electrode pad 50, and an appropriate bonding surface cannot be formed. This is because, when a piezoelectric vibrating piece is bonded to such an electrode pad 50 as described later, there are various adverse effects such as insufficient bonding strength and poor bonding posture.

However, as described above, since the size of the electrode pad 50 is extremely small in the first place, when the mask used for screen printing is deteriorated, the electrode pad 50 is displaced by about 50 μm.
Referring to FIG. 6, when the second application part 52 is applied on the first application part 51 as shown in the illustrated electrode pad 50, as shown in part 53, It deviates from the virtual center line PC of the first application part 51, resulting in an irregular electrode pad or an electrode pad different from the desired shape.
Therefore, in this embodiment, in ST23, cutting, that is, mechanical processing is performed, and a portion indicated by reference numeral 53 is removed by cutting using a predetermined cutting jig.
The cutting tool can be used in cutting in ordinary mechanical processing, and a lathe using a die, a tap using a reamer, a drill using a reamer, an end mill attached to a milling machine, etc. are appropriately used. Alternatively, by applying these jigs, for example, a dedicated milling machine may be used in which end mills are individually arranged at the positions of the electrode pads 50 shown in FIG. 5 and all the electrode pads are processed simultaneously.

FIG. 7 illustrates a method of performing the above-described mechanical processing by image processing by applying each of the X and Y coordinate systems when there are a plurality of electrode pads 50 in the illustrated case.
Such image processing can be performed from the electrode pad printing step (ST21) for applying the conductive paste.
For image recognition, as shown in FIG. 7, it is preferable that the electrode pad 50 be a polygon, that is, a rectangle, a square, or the like in a plan view because the edge can be recognized accurately.

Please refer to FIG.
This figure is a view for explaining a preferred mode of the first application portion 51 and the second application portion 52 for forming the electrode pad 50.
A virtual line PE indicates an outer edge portion of the first application portion 51.
As shown in the drawing, the second application portion 52 is larger than the application portion 51 on the first surface, and the second application portion 52 is slightly shifted from the center position PC of the electrode pad 50. When applied, the second application part 52 is likely to protrude from the outer edge of the application part 51 on the first surface. As a result, the outer edge portion of the electrode pad 50 expands beyond the position of the outer edge portion of the first application portion 51, and as a result, the electrode pad 50 is formed so as to be shifted from a desired position. Become.
In order to effectively avoid such a situation, a plurality of times of application are performed using a mask in which the area of the application part of the second application part 52 is smaller than that of the first application part 51. Is preferred.

FIG. 9 is an explanatory diagram showing a state in which the height of the piezoelectric device is reduced by performing mechanical processing of ST23, that is, cutting processing.
In Fig.9 (a), when the 2nd application part is piled up and applied on the 1st application part 51,
In the piezoelectric vibrating piece joining step described later, when the conductive adhesive 31 is further applied, the height is further increased by h1, and the piezoelectric vibrating piece is joined thereon.

Therefore, it is preferable to make it as shown in FIG.
The second and subsequent application parts 52 are applied in layers on the first application part 51.
Next, the periphery is cut. At this time, a portion 56 to be retained while maintaining the coating height after the second time (a plurality of times of coating may be two times, three times or more) is provided, and the outer side 55 of the remaining portion 56 is cut. A low cutting step 57 is formed around the periphery.
As a result, the conductive adhesive is held up to the upper surface of the thin cutting step portion 57 and the remaining portion 56, and rises like h1 in FIG. 9A while maintaining a sufficient amount of adhesive applied. There is no. As a result, the piezoelectric vibrating reed is bonded low, and accordingly, the height of the package 36 described with reference to FIG. 2 can be reduced, and the height of the piezoelectric device can be reduced.

Next, as shown in FIG. 10, a case will be described in which countermeasures are taken by the above-described cutting process when the insulating substrate 34 of the package 36 is warped by firing (ST22).
The technique sequentially shown in FIG. 11 can be used.
That is, as shown in FIG. 11A, the first application part 51 is formed on the insulating substrate 34 before baking, and the second application part is formed thereon by being applied.
Subsequently, when the firing step (ST22) described in FIG. 4 is performed, as shown in FIG. 11B, the insulating substrate 34 is warped, and the inner bottom 39 of the package 36 in which the electrode pads 50 are formed is also curved. Resulting in.
Therefore, as shown in FIG. 11C, the electrode pad 50 is formed along the horizontal plane L that serves as a reference for joining, for example, the piezoelectric vibrating reed by the mechanical processing described in ST23 of FIG. The portion 56 is removed by cutting.
By doing in this way, the upper surface of the electrode pad 50 etc. can be made into a suitable joint surface.
10 and 11, the amount of warping of the insulating substrate 34 is shown extremely for the sake of easy understanding.

(Post-process)
(Adhesive application process)
A conductive adhesive is applied to all of the electrode pads 50 shown in FIGS.
In this case, each electrode pad is formed in an appropriate position so as to have a certain desired shape through the above-described cutting (mechanical processing) (ST23), and thus the applied conductive adhesive is applied. With respect to the agent, a sufficient coating amount can be maintained, and when the piezoelectric vibrating reed 40 is stacked, it can be maintained substantially horizontally.

(Joining process)
Next, the conductive vibrating agent 31 is cured by placing the piezoelectric vibrating piece 40 on the electrode pad as described above and heating. Thereby, the piezoelectric vibrating piece 40 is bonded to the package 36.
(Sealing process)
Next, for example, the package 36 is accommodated in a predetermined jig or the like, transferred to a vacuum chamber, and the lid 37 is joined to the package 36 by seam welding or the like by vacuuming.
Thereby, the package 36 is hermetically sealed.
Thereafter, the piezoelectric device 30 is completed through necessary inspections and the like.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
Since the package 36 is a container for a piezoelectric vibrating piece, various configurations are conceivable.
In addition, the present invention is applicable to all piezoelectric devices regardless of the names of piezoelectric vibrators, piezoelectric oscillators, etc., as long as they use a package as a box-shaped container and accommodate a piezoelectric vibrating piece inside. can do.

1 is a schematic plan view of a piezoelectric device according to an embodiment of the present invention. The AA cut | disconnection end elevation of FIG. The flowchart which shows a part of manufacturing process of the piezoelectric device of FIG. The flowchart which shows a part of manufacturing process of the piezoelectric device of FIG. The schematic plan view of the package of the piezoelectric device of FIG. The figure of the electrode pad of the piezoelectric device of FIG. The figure explaining the arrangement | positioning and image processing of the electrode pad of the piezoelectric device of FIG. The figure of the electrode pad of the piezoelectric device of FIG. The figure of the electrode pad of the piezoelectric device of FIG. The figure which shows the curvature after baking of the package of the piezoelectric device of FIG. Explanatory drawing of a process of the electrode pad in the package of FIG. Explanatory drawing for demonstrating the subject of this invention.

Explanation of symbols

  30 ... piezoelectric device, 35 ... seal ring, 36 ... package, 40 ... piezoelectric vibrating piece, 42 ... excitation electrode, 50 ... electrode pad, 51 ... first time Application part, 52 ... second application part

Claims (7)

An electrode pad is formed on the inner bottom surface of the container, and in the method of manufacturing a component container for joining electric / electronic components to the electrode pad,
A paste application step of applying a conductive paste to a place where an electrode pad on the ceramic insulating substrate serving as the inner bottom surface is to be formed;
A firing step of firing a ceramic material for forming the storage container or a ceramic material constituting the insulating substrate that becomes a bottom plate of the storage container;
A cutting process for adjusting the shape by cutting the paste application part cured after the application process;
And a plating step of plating an electrode metal on the surface of the paste application part after the cutting process.   The method for manufacturing a component container according to claim 1, wherein in the paste application step, the conductive paste is applied a plurality of times to a position where the electrode pad on the insulating substrate is to be formed. In the method for manufacturing a piezoelectric device, an electrode pad is formed on the inner bottom surface of the container, and the lead electrode of the piezoelectric vibrating piece is bonded to the electrode pad.
A pre-process which is a forming process for separately forming the container and the piezoelectric vibrating piece,
As a subsequent process following the previous process,
A bonding step of bonding the piezoelectric vibrating piece to the electrode pad of the container;
Sealing step for hermetically sealing the containing container,
The forming step of the container in the previous step is
A paste application step of applying a conductive paste to a place where an electrode pad on the ceramic insulating substrate serving as the inner bottom surface is to be formed;
A firing step of firing a ceramic material for forming the storage container or a ceramic material constituting the insulating substrate that becomes a bottom plate of the storage container;
A cutting process for adjusting the shape by cutting the paste application part cured after the application process;
And a plating step of plating an electrode metal on the surface of the paste application part after the cutting process.   4. The method of manufacturing a piezoelectric device according to claim 3, wherein, in the paste applying step, the conductive paste is applied a plurality of times at a position where the electrode pad on the insulating substrate is to be formed.   The paste application process includes a first application process and a second application process, and the second application area is equal to or less than the first application area. Of manufacturing a piezoelectric device.   6. The method of manufacturing a piezoelectric device according to claim 3, wherein the outer shape of the electrode pad is a polygon.   In the paste application step, the second and subsequent application portions are stacked on the first application portion, and the portion to be retained while maintaining the second and subsequent application heights, and the cutting portion outside the remaining portion. The method for manufacturing a piezoelectric device according to claim 3, wherein a cutting step portion is formed in the process.

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