JP2005236268A - 多層プリント基板 - Google Patents
多層プリント基板 Download PDFInfo
- Publication number
- JP2005236268A JP2005236268A JP2005002824A JP2005002824A JP2005236268A JP 2005236268 A JP2005236268 A JP 2005236268A JP 2005002824 A JP2005002824 A JP 2005002824A JP 2005002824 A JP2005002824 A JP 2005002824A JP 2005236268 A JP2005236268 A JP 2005236268A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer printed
- wiring
- substrate
- ground
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005002824A JP2005236268A (ja) | 2004-01-19 | 2005-01-07 | 多層プリント基板 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004011015 | 2004-01-19 | ||
| JP2005002824A JP2005236268A (ja) | 2004-01-19 | 2005-01-07 | 多層プリント基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005236268A true JP2005236268A (ja) | 2005-09-02 |
| JP2005236268A5 JP2005236268A5 (enExample) | 2007-11-22 |
Family
ID=35018852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005002824A Withdrawn JP2005236268A (ja) | 2004-01-19 | 2005-01-07 | 多層プリント基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005236268A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128973A (ja) * | 2005-11-01 | 2007-05-24 | Technology Alliance Group Inc | 基板の配線構造 |
-
2005
- 2005-01-07 JP JP2005002824A patent/JP2005236268A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007128973A (ja) * | 2005-11-01 | 2007-05-24 | Technology Alliance Group Inc | 基板の配線構造 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071005 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20071005 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20081017 |