JP2005236268A - 多層プリント基板 - Google Patents

多層プリント基板 Download PDF

Info

Publication number
JP2005236268A
JP2005236268A JP2005002824A JP2005002824A JP2005236268A JP 2005236268 A JP2005236268 A JP 2005236268A JP 2005002824 A JP2005002824 A JP 2005002824A JP 2005002824 A JP2005002824 A JP 2005002824A JP 2005236268 A JP2005236268 A JP 2005236268A
Authority
JP
Japan
Prior art keywords
multilayer printed
wiring
substrate
ground
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005002824A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005236268A5 (enrdf_load_stackoverflow
Inventor
Eiji Takahashi
英治 高橋
Takeshi Nakayama
武司 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2005002824A priority Critical patent/JP2005236268A/ja
Publication of JP2005236268A publication Critical patent/JP2005236268A/ja
Publication of JP2005236268A5 publication Critical patent/JP2005236268A5/ja
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2005002824A 2004-01-19 2005-01-07 多層プリント基板 Withdrawn JP2005236268A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005002824A JP2005236268A (ja) 2004-01-19 2005-01-07 多層プリント基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004011015 2004-01-19
JP2005002824A JP2005236268A (ja) 2004-01-19 2005-01-07 多層プリント基板

Publications (2)

Publication Number Publication Date
JP2005236268A true JP2005236268A (ja) 2005-09-02
JP2005236268A5 JP2005236268A5 (enrdf_load_stackoverflow) 2007-11-22

Family

ID=35018852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005002824A Withdrawn JP2005236268A (ja) 2004-01-19 2005-01-07 多層プリント基板

Country Status (1)

Country Link
JP (1) JP2005236268A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007128973A (ja) * 2005-11-01 2007-05-24 Technology Alliance Group Inc 基板の配線構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007128973A (ja) * 2005-11-01 2007-05-24 Technology Alliance Group Inc 基板の配線構造

Similar Documents

Publication Publication Date Title
US10277193B2 (en) Circuit board and electronic circuit module using the same
JP6461437B2 (ja) ノイズフィルタ回路
JP4916300B2 (ja) 多層配線基板
JP6422395B2 (ja) 回路基板
JP6671551B1 (ja) 多層プリント基板
JP2988421B2 (ja) Ｅｍｉ抑制多層プリント基板
US20080164058A1 (en) Multi-layer printed wiring board
WO2012153835A1 (ja) プリント配線基板
JP4371766B2 (ja) プリント配線板
JP2005236268A (ja) 多層プリント基板
US8728874B2 (en) Method and apparatus for low inductive design pattern
JP2006073625A (ja) 電子部品
JP2007035710A (ja) 多層プリント配線板
JP6425632B2 (ja) プリント基板
KR100843220B1 (ko) 동일 평면상 엘.씨 벨런싱이 달성된 인쇄회로기판
US7061094B2 (en) Multilayer printed circuit board including first and second signal traces and a first ground trace
JP6187011B2 (ja) プリント回路基板
JP5234527B2 (ja) 部品内蔵基板
JP5576973B1 (ja) 電子部品内蔵基板
US7361845B2 (en) Wiring line for high frequency
JP2007281004A (ja) 多層配線構造体および多層プリント基板
JP2009164166A (ja) プリント基板
US20230104422A1 (en) Multilayer coil component
JP6520685B2 (ja) ノイズフィルタ
CN217982366U (zh) 一种用于实现寄生电容匹配的版图

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071005

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071005

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20081017