JP2005209777A - Circuit module and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a circuit module by lessening the total mounting area of an IC chip and circuit components and reducing dead spaces in dielectric boards. <P>SOLUTION: The circuit module 10A is formed by mounting one IC chip 14 and a plurality of circuit components 16 separately on a wiring board 12, where the IC chip 14 and the circuit components 16 are sealed in a resin layer 60. Each circuit component 16 includes one or more circuits which are formed in the dielectric board 26 composed of a plurality of laminated dielectric layers, and an upper surface terminal 32 and a lower surface terminal 34 which are lead out from the upper surface and lower surface of the dielectric board 26, respectively. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

  The present invention relates to a circuit module, for example, a circuit module having one IC chip and one or more circuit components, and a manufacturing method thereof.

  In general, for example, a circuit module having one IC chip and one or more circuit components has the following structure.

  That is, as shown in FIG. 12, on the upper surface of the wiring substrate 100, a die 104 on which at least one IC chip 102 is mounted, a land 108 on which, for example, two circuit components 106 are mounted, and an IC wiring pattern 110. Is formed.

  Then, the IC chip 102 is mounted on the die 104 of the wiring board 100, and the circuit components 106 are mounted on the lands 108, respectively. The pads (not shown) of the IC chip 102 and the IC wiring pattern 110 are electrically connected by bonding wires 112, respectively.

  The IC chip 102 is sealed with a resin layer 114 including a wire bonding portion. The IC chip 102 and the circuit component 106 mounted on the wiring board 100 are covered with a metal or resin housing 116.

  Signal exchange with the outside is performed through a terminal 118 formed on the lower surface of the wiring board 100. The terminal 118 is electrically connected to a land 108 formed on the upper surface of the wiring board 100 via a through hole (not shown) (for example, Patent Document 1).

  Further, as another structure, as shown in FIG. 13, one dielectric substrate 122 in which a plurality of circuits 120 are incorporated is used. A die (not shown) and a plurality of electrodes 124 are formed on the upper surface of the dielectric substrate 122. Then, the IC chip 102 is mounted on the die of the dielectric substrate 122, and pads (not shown) of the IC chip 102 and the electrodes 124 of the dielectric substrate 122 are electrically connected by bonding wires 126. .

  The IC chip 102 mounted on the upper surface of the dielectric substrate 122 is sealed with a resin layer 128 including a wire bonding portion. Signal exchange with the outside is performed through a terminal 130 formed on the lower surface of the dielectric substrate 122.

  Here, the manufacturing process of the circuit module shown in FIG. 13 will be briefly described with reference to FIGS.

  First, as shown in step 1 of FIG. 14, a base substrate 140 is prepared. A heat resistant sheet 142 is attached to the upper surface of the base substrate 140. Both surfaces of the heat-resistant sheet 142 are adhesive. Thereafter, as shown in Step 2 of FIG. 14, a plurality of dielectric substrates 122 are attached to the upper surface of the heat-resistant sheet 142. Thereafter, as shown in step 3 of FIG. 14, the IC chip 102 is mounted on the upper surface of each dielectric substrate 122, and further, formed on the pads of the IC chip 102 and the upper surface of the dielectric substrate 122 as shown in FIG. Wire bonding is performed between the formed electrodes 124.

  Next, as shown in Step 4 of FIG. 14, the IC chip 102 mounted on the upper surface of the dielectric substrate 122 is sealed with the resin layer 128 including the wire bonding portion, thereby completing the circuit module 144 (FIG. 16). reference). Thereafter, as shown in Step 5 of FIG. 14, after marking the upper surface of the resin layer 128, each circuit module 144 is separated from the heat-resistant sheet 142 as shown in Step 6 of FIG. 14.

Japanese Patent Laid-Open No. 9-31522

  In general, in a circuit module, an IC chip and one or more circuit components are each mounted on a wiring board with a solder layer, so that a land space is required for mounting the IC chip and the circuit component with a solder layer. Become.

  In addition to the land space described above, the circuit module shown in FIG. 12 has a space for wire bonding and a space for escape in consideration of the droop of the resin layer 114 formed to protect the wire bonding portion. Therefore, it is impossible to reduce the size of the circuit module.

  On the other hand, the circuit module shown in FIG. 13 needs to prepare a large-sized dielectric substrate 122. That is, since the IC chip 102 is mounted on the dielectric substrate 122, an area for arranging the area of the IC chip 102 and the electrodes 124 to be wire-bonded is required as an area seen from a plane.

  Furthermore, in order to prevent interference between the plurality of circuits 120 built in the dielectric substrate 122, a dead space 132 in which an electrode pattern cannot be formed is generated, and the dielectric substrate 122 cannot be effectively used. .

  The present invention has been made in consideration of such problems, and can reduce the entire mounting area of the IC chip and circuit components, and can reduce the dead space in the dielectric substrate. An object of the present invention is to provide a circuit module and a method for manufacturing the circuit module that can realize a reduction in size of the circuit module.

  In the circuit module according to the present invention, at least one IC chip and one or more circuit components are separately arranged, and the IC chip and the circuit component are sealed with a resin layer. Has one or more circuits formed in a dielectric substrate formed by laminating a plurality of dielectric layers, and one or more terminals respectively led to the upper and lower surfaces of the dielectric substrate. Features.

  Examples of the circuit components include RF circuits such as filters, couplers, and baluns installed around the IC chip, bypass capacitors necessary for the power supply circuit, and the like.

  In the present invention, since terminals are led out to the upper surface and the lower surface of these circuit components, various mounting methods such as wire bonding and soldering can be selected according to the application. Moreover, since the IC chip and one or more circuit components can be integrated and mounted, the entire mounting area of the circuit module can be reduced.

  In the above configuration, the pad of the IC chip and the terminal led to the upper surface of the dielectric substrate may be electrically connected by a bonding wire. As a result, there is no need to newly secure a space for wire bonding between the circuit component and the IC chip and a space for escape in consideration of the dripping of the resin layer formed to protect the bonding wire portion. . This contributes to a reduction in the overall mounting area of the circuit module.

  In addition, since the IC chip is not mounted on the dielectric substrate, a dielectric substrate having a size corresponding to the formation pattern of electrodes and the like constituting circuit components can be used as the dielectric substrate. This leads to a reduction in dead space in the dielectric substrate.

  Further, in the above configuration, the IC chip and the circuit component are separated and mounted on the upper surface of the wiring substrate, and the upper surface of the wiring substrate is sealed with the resin layer together with the IC chip and the circuit component, The lower surface of the wiring board may be exposed to the outside.

  In this case, a terminal led to the lower surface of the dielectric substrate in the circuit component and a pad formed on the lower surface of the wiring substrate may be electrically connected.

  Moreover, in the said structure, you may make it expose the terminal formed in the lower surface of the said circuit component outside from the said resin layer at least. In this case, the lower surface of the IC chip may be exposed to the outside from the resin layer together with at least terminals formed on the lower surface of the circuit component. That is, the terminal led to the lower surface of the dielectric substrate is used as an external terminal after resin sealing. This eliminates the need for a wiring board and makes it possible to reduce the thickness of the circuit module.

  In addition, the method of manufacturing a circuit module according to the present invention includes a step of attaching at least one IC chip and one or more circuit components to the upper surface of the base substrate, and a pad of the IC chip and an upper surface of the circuit component. Electrically connecting the formed terminals with a bonding wire, applying a resin layer so as to cover the IC chip and the circuit component, and sealing the IC chip and the circuit component with resin And removing the base substrate to expose a terminal formed on at least a lower surface of the circuit component sealed with the resin to the outside.

  Thereby, the circuit module according to the present invention described above, that is, a circuit module in which at least terminals formed on the lower surface of the circuit component are exposed to the outside from the resin layer can be easily manufactured. As described above, the manufactured circuit module can be reduced in size and thickness.

  According to another aspect of the present invention, there is provided a circuit module manufacturing method comprising: mounting at least one IC chip and at least one circuit component on a wiring pattern formed on an upper surface of a wiring board; Electrically connecting a terminal formed on the upper surface of the circuit component with a bonding wire; and applying a resin layer so as to cover the IC chip and the circuit component; And a resin sealing step. In this case, in the wiring substrate, a wiring pattern formed on the upper surface of the wiring substrate and a terminal formed on the lower surface of the wiring substrate may be electrically connected through a through hole.

  Thereby, the circuit module according to the present invention described above, that is, the IC chip and the circuit component are separated and mounted on the upper surface of the wiring board, and the upper surface of the wiring board is the resin layer together with the IC chip and the circuit component. It is possible to easily manufacture a circuit module that is sealed with the above and the lower surface of the wiring board is exposed to the outside. As described above, the manufactured circuit module can be reduced in size and thickness.

  As described above, according to the circuit module and the manufacturing method thereof according to the present invention, the entire mounting area of the IC chip and the circuit component can be reduced, and the dead space in the dielectric substrate can be reduced. Thus, the circuit module can be reduced in size.

  Embodiments of a circuit module and a manufacturing method thereof according to the present invention will be described below with reference to FIGS.

  As shown in FIG. 1, the circuit module 10A according to the first embodiment includes one wiring board 12, one IC chip 14, and four circuit components (first to fourth circuit components 16A to 16D). : See FIG. 2). Of course, the number of IC chips 14 may be two or more, and the number of first to fourth circuit components 16A to 16D may be one, two, three, or five or more.

  Here, two types of arrangement forms (first and second arrangement forms) of the four circuit components 16A to 16D will be described with reference to FIGS.

  First, as shown in FIG. 2, the first arrangement form includes a first short side surface 20a of the second circuit component 16B, a fourth long side 18a in the first circuit component 16A, and a fourth The second short side surface 20b of the second circuit component 16B and the fourth short side surface 22a of the third circuit component 16C are opposed to the first short side surface 22a of the third circuit component 16D. The second short side surface 22b of the circuit component 16D is opposed to the second short side surface 22b.

  In the first arrangement, the first circuit component 16A includes a plurality of electrodes formed in a first dielectric substrate 26A formed by laminating a plurality of dielectric layers as shown in FIG. One or more circuits 30 composed of the layer 28, a plurality of terminals (upper surface terminals) 32A led to the upper surface of the first dielectric substrate 26A as shown in FIG. 2, and a first as shown in FIG. And a plurality of terminals (lower surface terminals) 34A led to the lower surface of the dielectric substrate 26A.

  The second circuit component 16B includes at least one circuit including a plurality of electrode layers (not shown) formed in a second dielectric substrate 26B (see FIG. 2) formed by laminating a plurality of dielectric layers. 2, a plurality of terminals (upper surface terminals) 32B led out to the upper surface of the second dielectric substrate 26B and a lower surface of the second dielectric substrate 26B as shown in FIG. 3. And a plurality of terminals (lower surface terminals) 34B.

  As shown in FIG. 1, the third circuit component 16C includes one or more circuits including a plurality of electrode layers 36 formed in a third dielectric substrate 26C formed by stacking a plurality of dielectric layers. 38, a plurality of terminals (upper surface terminals) 32C led to the upper surface of the third dielectric substrate 26C as shown in FIG. 2, and a lower surface of the third dielectric substrate 26C as shown in FIG. And a plurality of derived terminals (lower surface terminals) 34C.

  The fourth circuit component 16D includes one or more circuits including a plurality of electrode layers (not shown) formed in a fourth dielectric substrate 26D (see FIG. 2) formed by laminating a plurality of dielectric layers. 2, a plurality of terminals (upper surface terminals) 32D led to the upper surface of the fourth dielectric substrate 26D, and a lower surface of the fourth dielectric substrate 26D as shown in FIG. 3. And a plurality of terminals (lower surface terminals) 34D.

  Next, as shown in FIG. 4, the second arrangement form is a part of the first long side surface 42a of the second circuit component 16B with respect to the first short side surface 40a of the first circuit component 16A. Is opposed to the second short side surface 20b of the second circuit component 16B, and a part of the first long side surface 24a of the third circuit component 16C is opposed to the first short side of the third circuit component 16C. A part of the first long side surface 46a of the fourth circuit component 16D is opposed to the short side surface 44a of the first circuit component, and the first circuit component is opposed to the first short side surface 22a of the fourth circuit component 16D. A part of the first long side surface 18a of 16A is in a facing state.

  In the following description, when the first to fourth circuit components 16A to 16D are generically shown, they are described as the circuit component 16, and when the first to fourth dielectric substrates 26A to 26D are generically shown, This is referred to as a dielectric substrate 26. Further, when the upper surface terminals 32A to 32D in the first to fourth circuit components 16A to 16D are collectively referred to as the upper surface terminal 32, the lower surface terminals 34A to 34D in the first to fourth circuit components 16A to 16D are described. Are collectively referred to as a lower surface terminal 34. The dielectric substrate 26 can be made of LTCC (Low Temperature Co-fired Ceramics).

  The one or more circuits formed in the first to fourth dielectric substrates 26A to 26D include RF circuits such as filters, couplers, and baluns that are peripheral circuits of the IC chip, bypass capacitors necessary for the power supply circuit, etc. Is mentioned. In this case, a filter and a coupler may be integrally formed in the dielectric substrate 26, or a filter and a balun may be integrally formed. Of course, a filter, a coupler, and a balun may be integrally formed in the dielectric substrate 26.

  The IC chip 14 and the circuit component 16 are separated and mounted on the upper surface of the wiring board 12. Specifically, the IC chip 14 is mounted on a die 50 formed at a substantially central portion on the upper surface of the wiring board 12, and the lower surface electrode 52 of the IC chip 14 and the die 50 are electrically connected via a solder layer (not shown). Connected.

  The circuit component 16 is mounted on a land 54 of a wiring pattern (not shown) formed on the upper surface of the wiring board 12, and the lower surface terminal 34 of the dielectric substrate 26 and the land 54 are electrically connected via a solder layer (not shown). Is done.

  The upper surface of the wiring substrate 12 is sealed with a resin layer 60 together with the IC chip 14 and the circuit component 16, and the lower surface of the wiring substrate 12 is exposed to the outside. The lower surface terminal 34 of the circuit component 16 is electrically connected to a pad 62 formed on the lower surface of the wiring board 12. In this case, the land 54 to which the lower surface terminal 34 is electrically connected and the pad 62 may be directly connected via the through hole 64, or the land 54 and the pad 62 may be connected to the wiring pattern (not shown) and the through hole. It may be connected via a hole 64.

  In the first arrangement form and the second arrangement form, as shown in FIGS. 2 and 4, the pads 66 of the IC chip 14 and the upper surface terminals of the circuit components are electrically connected by bonding wires 68. .

  Thus, since the circuit module 10A according to the first embodiment leads out the terminals 32 and 34 to the upper surface and the lower surface of the circuit component 16, respectively, for example, the first module shown in FIGS. As in the arrangement form and the second arrangement form shown in FIGS. 4 and 5, various mountings such as wire bonding and soldering can be selected in accordance with the application. Moreover, since the IC chip 14 and the circuit component 16 can be integrated and mounted in various arrangement forms, the entire mounting area of the circuit module 10A can be reduced.

  Further, since the pads 66 of the IC chip 14 and the upper surface terminals 32 of the circuit component 16 are electrically connected by the bonding wires 68, a space for wire bonding between the circuit component 16 and the IC chip 14, It is not necessary to secure a new space for escape in consideration of the dripping of the resin layer 60 formed to protect the portion where the bonding wire 68 is formed. This contributes to a reduction in the overall mounting area of the circuit module 10A.

  Moreover, since the IC chip 14 is not mounted on the dielectric substrate 26, the dielectric substrate 26 having a size corresponding to the formation pattern of the electrodes and the like constituting the circuit component 16 is used as the dielectric substrate 26. Can do. This leads to a reduction in dead space in the dielectric substrate 26.

  Next, a circuit module 10B according to a second embodiment will be described with reference to FIG.

  As shown in FIG. 6, the circuit module 10B according to the second embodiment has substantially the same configuration as the circuit module 10A according to the first embodiment described above, but the wiring board 12 does not exist. The difference is that the lower surface electrode 52 of the IC chip 14 and the lower surface terminal 34 of the circuit component 16 are directly exposed to the outside from the resin layer 60.

  In the circuit module 10B according to the second embodiment, since the lower surface terminal 34 of each circuit component 16 can be used as an external terminal after resin sealing, the wiring board 12 becomes unnecessary, and the circuit module 10B. This is advantageous in reducing the thickness.

  Next, a method for manufacturing the circuit module 10B according to the second embodiment will be described with reference to FIGS.

  In this manufacturing method, first, a base substrate 70 is prepared as shown in step 1 of FIG. A heat resistant sheet 72 is attached to the upper surface of the base substrate 70. Both surfaces of the heat-resistant sheet 72 are adhesive. Note that a base substrate coated with an adhesive material may be used as the base substrate 70.

  Thereafter, as shown in Step 2 in FIG. 7, the plurality of IC chips 14 and the plurality of circuit components 16 are attached to the upper surface of the heat-resistant sheet 72. FIG. 7 shows an example in which one IC chip 14 is attached to one circuit component 16 for the sake of simplicity. Specifically, as shown in FIG. 72, when a portion where one circuit module 10B is manufactured is defined as one section, one IC chip 14 and first to fourth circuit components 16A to 16D are attached to each section. . Thereafter, as shown in Step 3 of FIG. 7, wire bonding is performed between the pads 66 (see FIG. 2) of the IC chip 14 and the upper surface terminals 32 of the circuit components 16 and between the circuit components 16 in each section. (See FIG. 9).

  Next, as shown in Step 4 in FIG. 7, the circuit module 10 </ b> B is completed by sealing the IC chip 14 and the first to fourth circuit components 16 </ b> A to 16 </ b> D with the resin layer 60 in each section. (See FIG. 10).

  Thereafter, as shown in Step 5 of FIG. 7, after marking each on the upper surface of the resin layer 60 of each circuit module 10 </ b> B, each circuit module 10 </ b> B is separated from the heat-resistant sheet 72 as shown in Step 6 of FIG. 7. (See FIG. 11).

  As described above, in the manufacturing method shown in FIG. 7, the circuit module 10 </ b> B according to the second embodiment described above, that is, the lower surface electrode 52 of the IC chip 14 and the lower surface terminal 34 of the circuit component 16 are externally connected from the resin layer 60. The circuit module 10B exposed to can be easily manufactured.

  Note that the circuit module and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

It is a longitudinal section showing a circuit module concerning a 1st embodiment. It is a figure which sees the 1st arrangement form of the circuit components in the circuit module concerning a 1st embodiment from the upper surface. It is a figure which shows the 1st arrangement form of the circuit components in the circuit module concerning a 1st embodiment seeing from the bottom. It is a figure which shows the 2nd arrangement form of the circuit components in the circuit module concerning a 1st embodiment from the upper surface. It is a figure which shows the 2nd arrangement form of the circuit components in the circuit module concerning a 1st embodiment seeing from the bottom. It is a longitudinal cross-sectional view which shows the circuit module which concerns on 2nd Embodiment. It is explanatory drawing which shows the manufacturing method of the circuit module which concerns on 2nd Embodiment. It is explanatory drawing which shows the process 2 (process of sticking an IC chip and a circuit component on a heat-resistant sheet | seat) of FIG. It is explanatory drawing which shows the process 3 (wire bonding process) of FIG. It is explanatory drawing which shows the process 4 (resin sealing process) of FIG. It is explanatory drawing which shows the process 6 (process which isolate | separates a circuit module from a heat-resistant sheet | seat) of FIG. It is a longitudinal cross-sectional view which shows the circuit module which concerns on a prior art example. It is a longitudinal cross-sectional view which shows the circuit module which concerns on another prior art example. It is explanatory drawing which shows the manufacturing method of the circuit module which concerns on another prior art example. It is explanatory drawing which shows the process 3 (wire bonding process) of FIG. It is explanatory drawing which shows the process 4 (resin sealing process) of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10A, 10B ... Circuit module 12 ... Wiring board 14 ... IC chip 16, 16A-16D ... Circuit component 32, 32A-32D ... Upper surface terminal 34, 34A-34D ... Lower surface terminal 60 ... Resin layer 68 ... Bonding wire

Claims (9)

At least one IC chip and one or more circuit components are separately arranged, and the IC chip and the circuit components are sealed with a resin layer,
The circuit component includes one or more circuits formed in a dielectric substrate configured by laminating a plurality of dielectric layers, and one or more terminals led to the upper surface and the lower surface of the dielectric substrate, respectively. A circuit module comprising: The circuit module according to claim 1,
A circuit module, wherein a pad of the IC chip and a terminal led to an upper surface of the dielectric substrate are electrically connected by a bonding wire. The circuit module according to claim 1 or 2,
The IC chip and the circuit component are separated and mounted on the upper surface of the wiring board,
The upper surface of the wiring board is sealed with the resin layer together with the IC chip and the circuit component,
A circuit module, wherein a lower surface of the wiring board is exposed to the outside. The circuit module according to claim 3, wherein
A circuit module, wherein a terminal led to the lower surface of the dielectric substrate in the circuit component and a pad formed on the lower surface of the wiring substrate are electrically connected. The circuit module according to claim 1 or 2,
A circuit module, wherein at least terminals formed on a lower surface of the circuit component are exposed to the outside from the resin layer. The circuit module according to claim 5, wherein
A circuit module, wherein the lower surface of the IC chip is exposed to the outside from the resin layer together with at least terminals formed on the lower surface of the circuit component. Adhering at least one IC chip and one or more circuit components to the upper surface of the base substrate;
Electrically connecting a pad of the IC chip and a terminal formed on the upper surface of the circuit component with a bonding wire;
Applying a resin layer so as to cover the IC chip and the circuit component and resin-sealing the IC chip and the circuit component;
Removing the base substrate and exposing the terminals formed on the lower surface of at least the circuit component sealed with the resin to the outside;
A method for manufacturing a circuit module, comprising: Mounting at least one IC chip and one or more circuit components on a wiring pattern formed on the upper surface of the wiring board;
Electrically connecting a pad of the IC chip and a terminal formed on the upper surface of the circuit component with a bonding wire;
Applying a resin layer so as to cover the IC chip and the circuit component and resin-sealing the IC chip and the circuit component;
A method for manufacturing a circuit module, comprising: In the manufacturing method of the circuit module of Claim 8,
The circuit board is manufactured by connecting a wiring pattern formed on the upper surface of the wiring board and a terminal formed on the lower surface of the wiring board through a through hole. Method.

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