JP2005193191A - 廃水処理方法 - Google Patents
廃水処理方法 Download PDFInfo
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- JP2005193191A JP2005193191A JP2004004000A JP2004004000A JP2005193191A JP 2005193191 A JP2005193191 A JP 2005193191A JP 2004004000 A JP2004004000 A JP 2004004000A JP 2004004000 A JP2004004000 A JP 2004004000A JP 2005193191 A JP2005193191 A JP 2005193191A
- Authority
- JP
- Japan
- Prior art keywords
- peroxide
- metal
- treatment method
- waste water
- water treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004065 wastewater treatment Methods 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 24
- 150000002978 peroxides Chemical class 0.000 claims abstract description 22
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000002516 radical scavenger Substances 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims abstract description 9
- 230000002378 acidificating effect Effects 0.000 claims abstract description 8
- 239000007864 aqueous solution Substances 0.000 claims abstract description 8
- 239000000920 calcium hydroxide Substances 0.000 claims abstract description 8
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims abstract description 8
- 239000002244 precipitate Substances 0.000 claims abstract description 7
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims abstract description 6
- 229910001634 calcium fluoride Inorganic materials 0.000 claims abstract description 6
- 239000012286 potassium permanganate Substances 0.000 claims abstract description 6
- 239000002738 chelating agent Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract description 5
- 150000003573 thiols Chemical group 0.000 claims abstract description 4
- 231100000331 toxic Toxicity 0.000 claims description 12
- 230000002588 toxic effect Effects 0.000 claims description 12
- 230000001376 precipitating effect Effects 0.000 claims description 5
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 16
- 239000002699 waste material Substances 0.000 abstract description 15
- 239000000243 solution Substances 0.000 abstract description 7
- 231100000614 poison Toxicity 0.000 abstract 4
- 230000007096 poisonous effect Effects 0.000 abstract 4
- 239000002253 acid Substances 0.000 abstract 1
- 229910001512 metal fluoride Inorganic materials 0.000 abstract 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 229910021529 ammonia Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000706 filtrate Substances 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 150000007522 mineralic acids Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 229910000000 metal hydroxide Inorganic materials 0.000 description 2
- 150000004692 metal hydroxides Chemical class 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- HNSDLXPSAYFUHK-UHFFFAOYSA-N 1,4-bis(2-ethylhexyl) sulfosuccinate Chemical compound CCCCC(CC)COC(=O)CC(S(O)(=O)=O)C(=O)OCC(CC)CCCC HNSDLXPSAYFUHK-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 229920001429 chelating resin Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/38—Alkaline compositions for etching refractory metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Removal Of Specific Substances (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
Abstract
【解決手段】過酸化物、有害金属及びフッ化アンモニウムを含む酸性水溶液の処理において、(1)過酸化物を分解し、(2)金属捕集剤、及び水酸化カルシウムを添加して、PHを7以上に調整し、(3)有害金属の水酸化物とフッ化カルシウムを沈殿させ、(4)沈殿物を分離後、中和することを特徴とする廃水処理方法であり、過酸化物が過酸化水素、有害金属が銅であることを特徴とする該廃水処理方法であり、過マンガン酸カリウムを添加して過酸化物を分解することを特徴とする該廃水処理方法であり、金属捕集剤が、チオール系キレート剤であることを特徴とする該廃水処理方法である。
【選択図】 なし
Description
銅含有量 2%
フッ素含有量 10%
アンモニア含有量 10%
過酸化水素含有量 10%
(1) 過マンガン酸カリウムN/2水溶液を11リットル添加し、60分間撹拌して、エッチング廃液中の過酸化水素を分解した。
(2) 金属捕集剤(三協化成社製、商品名「サンチオール」)を、廃液に対して3質量%添加し、60分間撹拌した。
(3) 水酸化カルシウムを添加し、pHを10に調整した。
(4) 沈殿物とろ液をデカンターにて分離し、ろ液を硫酸でpH7に中和した。
銅含有量 2ppm
フッ素含有量 5ppm
アンモニア含有量 0%
過酸化水素含有量 0%
<銅含有量の測定>
試料を純水にて希釈し、誘導結合プラズマ発光分光分析装置(ICP-AES)(セイコーインスツルメンツ社製、型式:SPS-1700R)にて、測定波長324.754nmにて測定。
<フッ素含有量、アンモニア含有量の測定>
試料を純水にて希釈し、イオンクロマトグラフ(DIONEX社製、型式:DX-100型(フッ素の場合)、DX-320J型(アンモニアの場合))にて測定した。
<過酸化水素含有量の測定>
試料を純水にて希釈し、過マンガン酸カリウム水溶液での滴定により求めた。
表1に示す様に条件を変えたこと以外は、実施例1と同様に行った。ろ液の組成を表1に示す。
<二酸化マンガン> 三井金属社製
<鉄粉> 株式会社神戸製鋼所社製。
<高分子金属捕集剤>株式会社モリテックス製、商品名「エポフロック」
Claims (4)
- 過酸化物、有害金属及びフッ化アンモニウムを含む酸性水溶液の処理において、(1)過酸化物を分解し、(2)金属捕集剤、及び水酸化カルシウムを添加して、PHを7以上に調整し、(3)有害金属の水酸化物とフッ化カルシウムを沈殿させ、(4)沈殿物を分離後、中和することを特徴とする廃水処理方法。
- 過酸化物が過酸化水素、有害金属が銅であることを特徴とする請求項1記載の廃水処理方法。
- 過マンガン酸カリウムを添加して過酸化物を分解することを特徴とする請求項1または2記載の廃水処理方法。
- 金属捕集剤が、チオール系キレート剤であることを特徴とする請求項1〜3のうちいずれか一項記載の廃水処理方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004004000A JP3923046B2 (ja) | 2004-01-09 | 2004-01-09 | 廃水処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004004000A JP3923046B2 (ja) | 2004-01-09 | 2004-01-09 | 廃水処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005193191A true JP2005193191A (ja) | 2005-07-21 |
JP3923046B2 JP3923046B2 (ja) | 2007-05-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004004000A Expired - Fee Related JP3923046B2 (ja) | 2004-01-09 | 2004-01-09 | 廃水処理方法 |
Country Status (1)
Country | Link |
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JP (1) | JP3923046B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012033077A1 (ja) * | 2010-09-08 | 2012-03-15 | 栗田工業株式会社 | 銅エッチング廃液の処理方法 |
JP2013166120A (ja) * | 2012-02-15 | 2013-08-29 | Dowa Metaltech Kk | フッ素含有排水の処理方法 |
WO2019054291A1 (ja) * | 2017-09-12 | 2019-03-21 | 株式会社 東芝 | 活性金属ろう材用エッチング液およびそれを用いたセラミックス回路基板の製造方法 |
-
2004
- 2004-01-09 JP JP2004004000A patent/JP3923046B2/ja not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012033077A1 (ja) * | 2010-09-08 | 2012-03-15 | 栗田工業株式会社 | 銅エッチング廃液の処理方法 |
JP2012055825A (ja) * | 2010-09-08 | 2012-03-22 | Kurita Water Ind Ltd | 銅エッチング廃液の処理方法 |
CN103097302A (zh) * | 2010-09-08 | 2013-05-08 | 栗田工业株式会社 | 铜蚀刻废液的处理方法 |
CN103097302B (zh) * | 2010-09-08 | 2014-10-22 | 栗田工业株式会社 | 铜蚀刻废液的处理方法 |
KR101921342B1 (ko) * | 2010-09-08 | 2019-02-13 | 쿠리타 고교 가부시키가이샤 | 구리에칭폐액의 처리방법 |
JP2013166120A (ja) * | 2012-02-15 | 2013-08-29 | Dowa Metaltech Kk | フッ素含有排水の処理方法 |
WO2019054291A1 (ja) * | 2017-09-12 | 2019-03-21 | 株式会社 東芝 | 活性金属ろう材用エッチング液およびそれを用いたセラミックス回路基板の製造方法 |
JPWO2019054291A1 (ja) * | 2017-09-12 | 2020-08-27 | 株式会社東芝 | 活性金属ろう材用エッチング液およびそれを用いたセラミックス回路基板の製造方法 |
JP7049352B2 (ja) | 2017-09-12 | 2022-04-06 | 株式会社東芝 | 活性金属ろう材用エッチング液およびそれを用いたセラミックス回路基板の製造方法 |
Also Published As
Publication number | Publication date |
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JP3923046B2 (ja) | 2007-05-30 |
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