JP2005183797A - Printed-wiring board and printed-wiring circuit board - Google Patents

Printed-wiring board and printed-wiring circuit board Download PDF

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JP2005183797A
JP2005183797A JP2003424959A JP2003424959A JP2005183797A JP 2005183797 A JP2005183797 A JP 2005183797A JP 2003424959 A JP2003424959 A JP 2003424959A JP 2003424959 A JP2003424959 A JP 2003424959A JP 2005183797 A JP2005183797 A JP 2005183797A
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pad
electrodes
wiring board
component
printed wiring
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JP2003424959A
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JP4227008B2 (en
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Minoru Takizawa
稔 滝澤
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Toshiba Corp
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Toshiba Corp
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Priority to JP2003424959A priority Critical patent/JP4227008B2/en
Priority to TW093115549A priority patent/TWI244360B/en
Priority to KR1020040041683A priority patent/KR100606221B1/en
Priority to CNB2004100597663A priority patent/CN100456909C/en
Publication of JP2005183797A publication Critical patent/JP2005183797A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a reliable printed-wiring circuit board that increases yields when performing reflow soldering to surface packaging components of which the number of electrodes is asymmetrical linearly on a printed wiring board. <P>SOLUTION: Length in the same direction as a pad 12(1) at a side having a small number of electrodes is extended for forming an extended pad 12 (1a), thus joining a lead electrode 22(1) at a side having a small number of electrodes in the surface packaging component 20 to the pad 12(1a) to which the printed-wiring board 10 corresponds while a sufficient solder junction surface is maintained by solder. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、相反する両辺にそれぞれ異なる数の電極を有した表面実装部品を実装対象としたプリント配線回路基板に関する。   The present invention relates to a printed circuit board for mounting a surface mount component having different numbers of electrodes on opposite sides.

はんだ付けパッドの配置が上下や左右で非対称の表面実装部品をプリント配線板上にリフローはんだ付けする際、表面実装部品に対して、パッド上のはんだ溶融面の拡がり方向に張力が作用し、表面実装部品が電極数の多い側の方向に位置がずれて（移動して）はんだ付けされるという不都合が生じる。この際は、表面実装部品の位置ずれのみならず、表面実装部品の電極数の少ない側のはんだ付けが適正に行われないという問題が生じる。特に、近年の基板技術は高密度化が著しく、これに伴い、部品の電極形状、プリント配線板上のパッドを含むパターン形状が微細化されることから、上記問題がより顕著に顕れるようになってきた。
特開２０００−２９９５４８ When reflow soldering a surface mount component with asymmetrical placement of soldering pads on the printed circuit board on the top and bottom or left and right, tension is applied to the surface mounting component in the direction of spreading of the solder melting surface on the pad. There is an inconvenience that the mounting component is soldered with the position shifted (moved) in the direction of the larger number of electrodes. In this case, there arises a problem that not only the positional displacement of the surface mounting component but also the soldering on the side of the surface mounting component where the number of electrodes is small is not properly performed. In particular, the recent substrate technology is remarkably high in density, and with this, the electrode shape of the component and the pattern shape including the pads on the printed wiring board are miniaturized, so that the above problem becomes more prominent. I came.
JP 2000-299548

上述したように、従来では、はんだ付けパッドの配置が上下や左右で非対称の表面実装部品をプリント配線板上にリフローはんだ付けする際、表面実装部品に対して、パッド上のはんだ溶融面の拡がり方向に張力が作用し、表面実装部品が電極数の多い側の方向に位置がずれて（移動して）はんだ付けされ、これに伴い、表面実装部品の電極数の少ない側のはんだ付けが適正に行われないという問題があった。   As described above, conventionally, when reflow soldering a surface mount component with asymmetrical placement of the soldering pad up and down or left and right on the printed wiring board, the solder melting surface on the pad is expanded with respect to the surface mount component. Tension is applied in the direction, and the surface mount component is soldered by shifting (moving) in the direction of the side with the larger number of electrodes. Accordingly, the soldering of the surface mount component with the smaller number of electrodes is appropriate. There was a problem that was not done.

本発明は、はんだ付けパッドの配置が上下や左右で非対称の表面実装部品をプリント配線板上にリフローはんだ付けする際に、すべての電極を適正にはんだ付けでき、歩留まりの良い信頼性の高いプリント配線回路基板を提供することを目的とする。   The present invention is capable of properly soldering all the electrodes when reflow soldering a surface mount component with asymmetrical arrangement of soldering pads up and down or left and right on a printed wiring board, and has high yield and high reliability. An object is to provide a printed circuit board.

本発明は、部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッド長を前記電極の多い側の方向に延長したパッドとを具備したプリント配線回路基板を特徴とする。   The present invention provides a wiring board body having a mounting surface on which surface mounting components having different numbers of electrodes on opposite sides of the component body are mounted, and the electrodes of the surface mounting parts provided on the wiring board body. And a printed circuit board including a pad having a pad length on the side with fewer electrodes extended in the direction of the side with more electrodes.

また本発明は、部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッド長を前記電極の多い側の方向に位置を移動させたパッドとを具備したプリント配線回路基板を特徴とする。   The present invention also provides a wiring board main body having a mounting surface on which surface mounting components having different numbers of electrodes are mounted on opposite sides of the component main body, and provided on the wiring board main body. The printed circuit board includes a pad corresponding to the electrode and having a pad length on the side with a small number of electrodes moved in a direction toward the side with the large number of electrodes.

また本発明は、部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッドの幅を前記電極の多い側のパッドの配列方向に拡げたパッドと
を具備したプリント配線回路基板を特徴とする。 The present invention also provides a wiring board main body having a mounting surface on which surface mounting components having different numbers of electrodes are mounted on opposite sides of the component main body, and provided on the wiring board main body. The printed circuit board includes a pad corresponding to the electrode and having a pad with a wider width in the arrangement direction of the pad with a larger number of the electrodes.

はんだ付けパッドの配置が上下や左右で非対称の表面実装部品をプリント配線板上にリフローはんだ付けする際に、すべての電極を適正にはんだ付けでき、歩留まりの良い信頼性の高いプリント基板を製造できる。   When reflow-soldering a surface-mounted component with asymmetrical solder pad placement on the printed wiring board, all electrodes can be properly soldered, and a printed circuit board with high yield and high reliability can be manufactured. .

以下図面を参照して本発明の実施形態を説明する。     Embodiments of the present invention will be described below with reference to the drawings.

先ず、図１を参照して本発明の第１実施形態を説明する。   First, a first embodiment of the present invention will be described with reference to FIG.

この第１実施形態は、相反する両辺にそれぞれ異なる数の電極を有した表面実装部品を実装対象とするプリント配線板に於いて、上記表面実装部品の実装面に於ける電極の少ない側のパッド長を電極の多い側の方向に延長したパターン構成としている。   The first embodiment is a printed wiring board for mounting a surface mount component having different numbers of electrodes on opposite sides, and a pad on the mounting surface of the surface mount component on the side with fewer electrodes. The pattern configuration is such that the length is extended in the direction of the electrode side.

この実施形態では、一辺の側に２つのリード電極２１（１），２１（２）、この辺と対向する他辺の側に１つのリード電極２２（１）を設けた、電極構造が左右（上下）非対称の表面実装部品２０を例に、そのパターン配置を示している。   In this embodiment, two lead electrodes 21 (1) and 21 (2) are provided on one side, and one lead electrode 22 (1) is provided on the other side opposite to this side. ) The pattern arrangement is shown by taking an asymmetric surface mount component 20 as an example.

図１（ａ）には標準設計パターン配置による上記表面実装部品の実装部分のパターン配置と、当該実装面に実装される表面実装部品の一例を示している。プリント配線板（配線板本体）１０には、標準設計パターン配置に対応して、当該リード電極２１（１），２１（２），２２（１）をはんだ接合するパッド１１（１），１１（２），１２（１）が配置されている。上記表面実装部品２０の各リード電極２１（１），２１（２），２２（１）はそれぞれ同一形状で同一のはんだ接合面を有する。また、上記プリント配線板１０のパッド１１（１），１１（２），１２（１）も同一形状である。   FIG. 1A shows an example of the pattern arrangement of the mounting portion of the surface-mounted component by the standard design pattern arrangement, and an example of the surface-mounted component mounted on the mounting surface. The printed wiring board (wiring board main body) 10 has pads 11 (1), 11 (11) for soldering the lead electrodes 21 (1), 21 (2), 22 (1) corresponding to the standard design pattern arrangement. 2) and 12 (1) are arranged. Each lead electrode 21 (1), 21 (2), 22 (1) of the surface mount component 20 has the same shape and the same solder joint surface. The pads 11 (1), 11 (2), 12 (1) of the printed wiring board 10 have the same shape.

上記プリント配線板１０のパッド１１（１），１１（２），１２（１）には、上記表面実装部品２０の各リード電極２１（１），２１（２），２２（１）の配置に関して、当該リード電極の延長方向に、電極接合面先端との間に、長さａ（図１（ｂ）参照）の溶融はんだ付着面を形成するクリアランスをもたせている。図中の矢印ｔは、上記表面実装部品２０各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１）にリフローはんだ付けした際に、上記クリアランスエリアへの溶融はんだの拡がりによって表面実装部品２０に作用する張力の方向および張力バランスを示している。   With respect to the pads 11 (1), 11 (2), and 12 (1) of the printed wiring board 10, the arrangement of the lead electrodes 21 (1), 21 (2), and 22 (1) of the surface mount component 20 is as follows. In the extension direction of the lead electrode, a clearance for forming a molten solder adhering surface having a length a (see FIG. 1B) is provided between the tip end of the electrode joint surface. The arrow t in the figure indicates that each of the lead electrodes 21 (1), 21 (2), 22 (1) of the surface mount component 20 is pad 11 (1), 11 (2), 12 (1) of the printed wiring board 10. ) Shows the direction and tension balance of the tension acting on the surface-mounted component 20 due to the spread of the molten solder to the clearance area when reflow soldering is performed.

図１（ｂ）には、図１（ａ）に対応した本発明の第１実施形態のパターン構成を示している。
上記図１（ａ）のパターン構成と異なるところは、上記図１（ａ）に示すパッド１１（１），１１（２），１２（１）のクリアランスエリアの矢印ｔ方向の長さをａ、パッド１１（１），１１（２），１２（１）の同方向の長さ（全長）をｂとしたとき、電極数の少ない側のパッド１２（１）の同方向の長さｃをａ＋ｂ以上（ｃ≧ａ＋ｂ）に延長している。この延長したパッドを図に符号１２（１ａ）を付して示している。また、標準設計パターン配置によるパッド配置位置を二点鎖線で示している。 FIG. 1B shows a pattern configuration of the first embodiment of the present invention corresponding to FIG.
A difference from the pattern configuration of FIG. 1A is that the length of the clearance area of the pads 11 (1), 11 (2), 12 (1) shown in FIG. When the length (full length) in the same direction of the pads 11 (1), 11 (2), and 12 (1) is b, the length c in the same direction of the pad 12 (1) on the side with the smaller number of electrodes is a + b. This is extended to (c ≧ a + b). This extended pad is indicated by reference numeral 12 (1a) in the figure. Further, the pad arrangement position by the standard design pattern arrangement is indicated by a two-dot chain line.

図１（ｃ）には、図１（ｂ）に対応した本発明の第１実施形態のパターン構成に於いて、上記表面実装部品２０各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ａ）にリフローはんだ付けした際のプリント基板上の部品配置状態を示している。この表面実装部品２０の各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ａ）にリフローはんだ付けした状態では、表面実装部品２０電極数が多い側のリード電極２１（１），２１（２）のはんだ接合面が、プリント配線板１０の対応するパッド１１（１），１１（２）のほぼ中央に位置するように、表面実装部品２０がプリント配線板１０上に位置ずれをおこして実装されるが、表面実装部品２０電極数が少ない側のリード電極２２（１）は、十分なはんだ接合面を保ってプリント配線板１０の対応するパッド１２（１ａ）にはんだ接合される。   FIG. 1C shows a pattern configuration of the first embodiment of the present invention corresponding to FIG. 1B, in which the surface mount component 20 lead electrodes 21 (1), 21 (2), 22 ( The component arrangement state on the printed circuit board when 1) is reflow soldered to the pads 11 (1), 11 (2), and 12 (1a) of the printed wiring board 10 is shown. The lead electrodes 21 (1), 21 (2), and 22 (1) of the surface mount component 20 are reflow soldered to the pads 11 (1), 11 (2), and 12 (1 a) of the printed wiring board 10. In the state, the solder joint surfaces of the lead electrodes 21 (1) and 21 (2) on the side having the larger number of electrodes of the surface mount component 20 are almost at the center of the corresponding pads 11 (1) and 11 (2) of the printed wiring board 10. The surface mount component 20 is mounted on the printed wiring board 10 so that the surface mount component 20 is positioned so that the lead electrode 22 (1) on the side where the number of electrodes is small is a sufficient solder joint surface. And soldered to the corresponding pad 12 (1a) of the printed wiring board 10.

次に、図２を参照して本発明の第２実施形態を説明する。   Next, a second embodiment of the present invention will be described with reference to FIG.

この第２実施形態は、相反する両辺にそれぞれ異なる数の電極を有した表面実装部品を実装対象とするプリント配線板に於いて、上記表面実装部品の実装面に於ける電極の少ない側のパッド長を電極の多い側の方向に位置を移動させたパターン構成としている。   In the second embodiment, in a printed wiring board for mounting a surface mount component having different numbers of electrodes on opposite sides, the pad on the side with the few electrodes on the mounting surface of the surface mount component The length is a pattern configuration in which the position is moved in the direction of the more electrodes.

この第２実施形態は、上記第１実施形態と同様に、一辺の側に２つのリード電極２１（１），２１（２）、この辺と対向する他辺の側に１つのリード電極２２（１）を設けた、電極構造が左右（上下）非対称の表面実装部品２０を例に、そのパターン配置を示している。   In the second embodiment, like the first embodiment, two lead electrodes 21 (1) and 21 (2) are provided on one side, and one lead electrode 22 (1 is provided on the other side facing the side. The pattern arrangement is shown by taking as an example a surface-mounted component 20 provided with an asymmetric left and right (vertical) electrode structure.

図２（ａ）には図１（ａ）と同様の標準設計パターン配置による上記表面実装部品の実装部分のパターン配置と、当該実装面に実装される表面実装部品の一例を示している。ここでは上記図１（ｂ）の長さａに対応する上記プリント配線板１０の電極数の少ない側のパッド１２（１）のクリアランスエリアの長さをｄとしている。   FIG. 2A shows an example of the pattern arrangement of the mounting portion of the surface-mounted component by the standard design pattern arrangement similar to FIG. 1A and an example of the surface-mounted component mounted on the mounting surface. Here, the length of the clearance area of the pad 12 (1) on the side of the printed wiring board 10 with the smaller number of electrodes corresponding to the length a in FIG.

図２（ｂ）には、図２（ａ）に対応した本発明の第２実施形態のパターン構成を示している。
ここでは上記プリント配線板１０の電極数の少ない側のパッド１２（１）の配置位置を、同図（ａ）の標準設計パターン配置よりもａ以上（ｄ≧ａ）、電極数の多い側のパッド１１（１），１１（２）方向へ移動させている。この移動させたパッドを図に符号１２（１ｂ）を付して示している。また、標準設計パターン配置によるパッド配置位置を二点鎖線で示している。 FIG. 2B shows a pattern configuration of the second embodiment of the present invention corresponding to FIG.
Here, the arrangement position of the pad 12 (1) on the side of the printed wiring board 10 having the smaller number of electrodes is set to a or more (d ≧ a) and the side having the larger number of electrodes than the standard design pattern arrangement of FIG. It is moved in the direction of the pads 11 (1) and 11 (2). The moved pad is indicated by reference numeral 12 (1b) in the figure. Further, the pad arrangement position by the standard design pattern arrangement is indicated by a two-dot chain line.

図２（ｃ）には、図２（ｂ）に対応した本発明の第２実施形態のパターン構成に於いて、上記表面実装部品２０各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ｂ）にリフローはんだ付けした際のプリント基板上の部品配置状態を示している。この表面実装部品２０の各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ｂ）にリフローはんだ付けした状態では、表面実装部品２０電極数が多い側のリード電極２１（１），２１（２）のはんだ接合面が、プリント配線板１０の対応するパッド１１（１），１１（２）のほぼ中央に位置するように、表面実装部品２０がプリント配線板１０上に位置ずれをおこして実装されるが、表面実装部品２０電極数が少ない側のリード電極２２（１ｂ）も予め配置位置をａ以上（ｄ≧ａ）、電極数の多い側のパッド１１（１），１１（２）方向へ移動させているため、十分なはんだ接合面を保ってプリント配線板１０の対応するパッド１２（１ｂ）にはんだ接合される。   FIG. 2 (c) shows the surface mount component 20 lead electrodes 21 (1), 21 (2), 22 () in the pattern configuration of the second embodiment of the present invention corresponding to FIG. 2 (b). The component arrangement state on the printed circuit board when 1) is reflow soldered to the pads 11 (1), 11 (2), 12 (1b) of the printed wiring board 10 is shown. The lead electrodes 21 (1), 21 (2), and 22 (1) of the surface mount component 20 are reflow soldered to the pads 11 (1), 11 (2), and 12 (1 b) of the printed wiring board 10. In the state, the solder joint surfaces of the lead electrodes 21 (1) and 21 (2) on the side having the larger number of electrodes of the surface mount component 20 are almost at the center of the corresponding pads 11 (1) and 11 (2) of the printed wiring board 10. The surface-mounted component 20 is mounted on the printed wiring board 10 so that the surface-mounted component 20 is displaced, but the surface-mounted component 20 has the lead electrode 22 (1b) on the side where the number of electrodes is small, the arrangement position being a or more in advance. (D.gtoreq.a), since it is moved in the direction of the pads 11 (1) and 11 (2) on the side with the larger number of electrodes, the corresponding pad 12 (1b) of the printed wiring board 10 is maintained with a sufficient solder joint surface. Soldered to.

次に、図３を参照して本発明の第３実施形態を説明する。   Next, a third embodiment of the present invention will be described with reference to FIG.

この第３実施形態は、相反する両辺にそれぞれ異なる数の電極を有した表面実装部品を実装対象とするプリント配線板に於いて、上記表面実装部品の実装面に於ける、電極の少ない側のパッドの幅を、電極の多い側のパッドの配列方向に拡げたパターン構成としている。   In this third embodiment, in a printed wiring board for mounting a surface-mounted component having a different number of electrodes on both opposite sides, on the mounting surface of the surface-mounted component on the side with fewer electrodes. The pad has a pattern configuration in which the width of the pad is increased in the arrangement direction of the pads on the side with many electrodes.

この第３実施形態は、上記した第１、第２実施形態と同様に、一辺の側に２つのリード電極２１（１），２１（２）、この辺と対向する他辺の側に１つのリード電極２２（１）を設けた、電極構造が左右（上下）非対称の表面実装部品２０を例に、そのパターン配置を示している。   In the third embodiment, similarly to the first and second embodiments described above, two lead electrodes 21 (1) and 21 (2) are provided on one side, and one lead is provided on the other side opposite to this side. The pattern arrangement of the surface mount component 20 provided with the electrode 22 (1) and having an asymmetric left and right (vertical) electrode structure is shown as an example.

図３（ａ）には図２（ａ）と同様の標準設計パターン配置による上記表面実装部品の実装部分のパターン配置と、当該実装面に実装される表面実装部品の一例を示している。   FIG. 3A shows an example of the pattern arrangement of the mounting portion of the surface mount component by the standard design pattern arrangement similar to FIG. 2A and an example of the surface mount component mounted on the mounting surface.

図３（ｂ）には、図３（ａ）に対応した本発明の第３実施形態のパターン構成を示している。
ここでは上記プリント配線板１０の電極数の少ない側のパッド１２（１）の幅を、電極数の多い側のパッド１１（１），１１（２）の配列方向に、電極数の多い側のパッド１１（１），１１（２）の幅の２倍以上（ｙ≧２ｘ）に拡げたパターン構造としている。この幅を拡げたパッドを図に符号１２（１ｃ）を付して示している。尚、図中のｙは電極数の少ない側のパッド１２（１ｃ）上に於ける上記幅方向のリード電極２２（１）のはんだ接合端からパッド端に至るクリアランスエリアの長さ、ｘは電極数の多い側のパッド１１（１），１１（２）上に於ける上記幅方向のリード電極２１（１），２１（２）のはんだ接合端からパッド端に至るクリアランスエリアの長さである。 FIG. 3B shows a pattern configuration of the third embodiment of the present invention corresponding to FIG.
Here, the width of the pad 12 (1) on the side having the smaller number of electrodes of the printed wiring board 10 is set in the arrangement direction of the pads 11 (1) and 11 (2) on the side having the larger number of electrodes. The pattern structure is expanded to more than twice the width of the pads 11 (1) and 11 (2) (y ≧ 2x). The pad with the expanded width is shown with reference numeral 12 (1c) in the figure. In the figure, y is the length of the clearance area from the solder joint end to the pad end of the lead electrode 22 (1) in the width direction on the pad 12 (1c) on the side having a smaller number of electrodes, and x is the electrode. This is the length of the clearance area from the solder joint end to the pad end of the lead electrodes 21 (1) and 21 (2) in the width direction on the pads 11 (1) and 11 (2) on the side having a large number. .

図３（ｃ）には、図３（ｂ）に対応した本発明の第３実施形態のパターン構成に於いて、上記表面実装部品２０各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ｃ）にリフローはんだ付けした際のプリント基板上の部品配置状態を示している。この表面実装部品２０の各リード電極２１（１），２１（２），２２（１）を上記プリント配線板１０のパッド１１（１），１１（２），１２（１ｃ）にリフローはんだ付けした状態では、電極数が多い側のリード電極２１（１），２１（２）に対応して設けられるパッド１１（１），１１（２）と、電極数が少ない側のリード電極２２（１）に対応して設けられるパッド１２（１ｃ）との溶融はんだの拡がりに伴う部品へ作用する張力が総体的に等しくなり、従って表面実装部品２０を位置ずれをおこすことなく設計位置にて十分なはんだ接合面を保ってプリント配線板１０に実装することができる。   FIG. 3C shows a pattern configuration of the third embodiment of the present invention corresponding to FIG. 3B, in which the lead electrodes 21 (1), 21 (2), 22 ( The component arrangement state on the printed circuit board when 1) is reflow soldered to the pads 11 (1), 11 (2), 12 (1c) of the printed wiring board 10 is shown. The lead electrodes 21 (1), 21 (2), and 22 (1) of the surface mount component 20 are reflow soldered to the pads 11 (1), 11 (2), and 12 (1 c) of the printed wiring board 10. In the state, the pads 11 (1) and 11 (2) provided corresponding to the lead electrodes 21 (1) and 21 (2) on the side with the larger number of electrodes and the lead electrode 22 (1) on the side with the smaller number of electrodes. As a result, the tension acting on the component accompanying the spread of the molten solder with the pad 12 (1c) provided corresponding to the solder is generally equal, and therefore, sufficient solder is provided at the design position without causing the surface-mounted component 20 to be displaced. It can be mounted on the printed wiring board 10 while maintaining the joint surface.

この第３実施形態に於ける部品実装例を図４および図５に示している。図４に於いては、リード電極２１（１），２１（２），２２（１）を覆うはんだを削除した状態を示している。この際のパッド１１（１），１１（２），１２（１ｃ）上のはんだ溶融面を図に斜線で示している。図５は表面実装部品２０を各側面（３方向）からみた、部品の実装状態を示す側面図である。図中の符号３０は、表面実装部品２０各リード電極２１（１），２１（２），２２（１）をプリント配線板１０のパッド１１（１），１１（２），１２（１ｃ）に、リフローはんだ付けした際の、はんだである。   An example of component mounting in the third embodiment is shown in FIGS. FIG. 4 shows a state in which the solder covering the lead electrodes 21 (1), 21 (2), and 22 (1) is deleted. The solder melting surfaces on the pads 11 (1), 11 (2), and 12 (1c) at this time are indicated by hatching in the drawing. FIG. 5 is a side view showing a mounted state of the component when the surface-mounted component 20 is viewed from each side (three directions). The reference numeral 30 in the figure designates the surface mount component 20 lead electrodes 21 (1), 21 (2), 22 (1) as pads 11 (1), 11 (2), 12 (1 c) of the printed wiring board 10. This is solder when reflow soldering is performed.

上記各実施形態によるパターン設計を可能にしたプリント配線板設計ＣＡＤシステムの構成例を図６および図７に示している。   A configuration example of a printed wiring board design CAD system that enables pattern design according to each of the above embodiments is shown in FIGS.

図６は上記プリント配線板設計ＣＡＤシステムの構成を示すブロック図であり、プリント配線板設計ＣＡＤ１１０、入力部１２０、データベース１３０、および表示部１４０と、プリント配線板設計支援モジュール１５０とを有して構成される。   FIG. 6 is a block diagram showing the configuration of the printed wiring board design CAD system, which includes a printed wiring board design CAD 110, an input unit 120, a database 130, a display unit 140, and a printed wiring board design support module 150. Composed.

プリント配線板設計ＣＡＤ１１０は、入力部１２０より入力される設計者の指示に従い、例えば多層プリント配線板に於ける各層のパターン、スルーホール、ノンスルーホール、ビアパターン等の配置並びに接続の処理を行う。ここでは、プリント配線板設計支援モジュール１５０に、プリント配線板のパターンレイアウトの設計情報を供給する。   The printed wiring board design CAD 110 performs arrangement and connection processing of patterns, through holes, non-through holes, via patterns, etc. of each layer in the multilayer printed wiring board, for example, in accordance with the instructions of the designer input from the input unit 120. . Here, the design information of the printed wiring board pattern layout is supplied to the printed wiring board design support module 150.

データベース１３０は、プリント配線板の部品実装時に於ける、はんだ溶融時の基板および実装部品を含む熱変動要素の情報を格納する。   The database 130 stores information on thermal fluctuation elements including the board and the mounted components when the solder is melted when mounting the components on the printed wiring board.

プリント配線板設計支援モジュール１５０は、上記プリント配線板設計ＣＡＤ１１０より、パターンレイアウトされたプリント配線板の設計情報を取得し、上記データベース１３０より、プリント配線板の部品実装時に於ける、はんだ溶融時の基板および実装部品を含む熱変動要素の各種パラメータを取得して、これら取得した各情報をもとに、上記プリント配線板に部品をはんだ付け実装する際の製造性のチェック、パターンチェック等を実施する。   The printed wiring board design support module 150 acquires the design information of the printed wiring board having a pattern layout from the printed wiring board design CAD 110, and from the database 130, when the solder is melted when the printed wiring board is mounted. Acquire various parameters of thermal fluctuation elements including board and mounting components, and perform manufacturability check, pattern check, etc. when soldering and mounting components on the printed wiring board based on each acquired information To do.

この際、図７に示すパターン設計支援処理ルーチンを実行する。   At this time, the pattern design support processing routine shown in FIG. 7 is executed.

この図７に示すパターン設計支援処理ルーチンは、選択された部品が左右（上下）非対称の電極をもつ表面実装部品であるとき（図７ステップＳ１１，Ｓ１２ Ｙｅｓ）、ユーザインタフェースを用いて上記した第１乃至第３実施形態のいずれのパターン設計を行うかを設計者に選択させる（図７ステップＳ１３）。ここでは、ルール１が選択されたとき（図７ステップＳ１４）、上記した第１実施形態に係るパターン修正を行い（図７ステップＳ２１）、ルール２が選択されたとき（図７ステップＳ１５）、上記した第２実施形態に係るパターン修正を行い（図７ステップＳ２２）、ルール３が選択されたとき（図７ステップＳ１６）、上記した第３実施形態に係るパターン修正を行う（図７ステップＳ２３）。   In the pattern design support processing routine shown in FIG. 7, when the selected component is a surface mount component having left and right (up and down) asymmetric electrodes (Yes in steps S11 and S12 in FIG. 7), the above-described pattern design support processing routine is performed using the user interface. The designer is allowed to select which pattern design of the first to third embodiments is to be performed (step S13 in FIG. 7). Here, when rule 1 is selected (step S14 in FIG. 7), the pattern correction according to the first embodiment described above is performed (step S21 in FIG. 7), and when rule 2 is selected (step S15 in FIG. 7), When the pattern correction according to the second embodiment is performed (step S22 in FIG. 7) and the rule 3 is selected (step S16 in FIG. 7), the pattern correction according to the third embodiment is performed (step S23 in FIG. 7). ).

ここで、ルール１が選択された際は（図７ステップＳ１４ ＹＥＳ）、図１（ａ）乃至（ｃ）に示すように、表面実装部品の実装面に於ける電極の少ない側のパッド長を電極の多い側の方向に延長したパターン修正（ｃ≧ａ＋ｂ）を行う（図７ステップＳ２１）。   Here, when the rule 1 is selected (step S14 YES in FIG. 7), as shown in FIGS. 1A to 1C, the pad length on the side with fewer electrodes on the mounting surface of the surface mounting component is set. Pattern correction (c ≧ a + b) extended in the direction of the electrode-rich side is performed (step S21 in FIG. 7).

またルール２が選択された際は（図７ステップＳ１５）、図２（ａ）乃至（ｃ）に示すように、表面実装部品の実装面に於ける電極の少ない側のパッド長を電極の多い側の方向に位置を移動させたパターン修正（ｄ≧ａ）を行う（図７ステップＳ２２）。   When rule 2 is selected (step S15 in FIG. 7), as shown in FIGS. 2 (a) to 2 (c), the pad length on the side with fewer electrodes on the mounting surface of the surface mount component is set to have more electrodes. Pattern correction (d ≧ a) is performed by moving the position in the direction of the side (step S22 in FIG. 7).

またルール３が選択された際は（図７ステップＳ１６）、図３（ａ）乃至（ｃ）に示すように、表面実装部品の実装面に於ける、電極の少ない側のパッドの幅を、電極の多い側のパッドの配列方向に拡げたパターン修正（ｙ≧２ｘ）を行う（図７ステップＳ２３）。   When rule 3 is selected (step S16 in FIG. 7), as shown in FIGS. 3A to 3C, the width of the pad on the side with fewer electrodes on the mounting surface of the surface mounting component is Pattern correction (y ≧ 2x) expanded in the arrangement direction of the pads on the side with many electrodes is performed (step S23 in FIG. 7).

本発明の第１実施形態を示す図。The figure which shows 1st Embodiment of this invention. 本発明の第２実施形態を示す図。The figure which shows 2nd Embodiment of this invention. 本発明の第３実施形態を示す図。The figure which shows 3rd Embodiment of this invention. 本発明の第３実施形態に係る部品実装例を示す図。The figure which shows the component mounting example which concerns on 3rd Embodiment of this invention. 本発明の第３実施形態に係る部品実装例を示す図。The figure which shows the component mounting example which concerns on 3rd Embodiment of this invention. 本発明の第４実施形態に係るプリント配線板設計ＣＡＤシステムの構成を示す図。The figure which shows the structure of the printed wiring board design CAD system which concerns on 4th Embodiment of this invention. 本発明の第４実施形態に係るプリント配線板設計ＣＡＤシステムの処理手順を示すフローチャート。The flowchart which shows the process sequence of the printed wiring board design CAD system which concerns on 4th Embodiment of this invention.

符号の説明Explanation of symbols

１０…プリント配線板（配線板本体）、１１（１），１１（２），１２（１），１２（１ａ），１２（１ｂ），１２（１ｃ）…パッド、２０…表面実装部品、２１（１），２１（２），２２（１）…リード電極、３０…はんだ、１１０…プリント配線板設計ＣＡＤ、１２０…入力部、１３０…データベース、１４０…表示部、１５０…プリント配線板設計支援モジュール。   DESCRIPTION OF SYMBOLS 10 ... Printed wiring board (wiring board main body), 11 (1), 11 (2), 12 (1), 12 (1a), 12 (1b), 12 (1c) ... Pad, 20 ... Surface mount component, 21 (1), 21 (2), 22 (1) ... lead electrode, 30 ... solder, 110 ... printed wiring board design CAD, 120 ... input unit, 130 ... database, 140 ... display unit, 150 ... printed wiring board design support module.

Claims (6)

部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、
この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッド長を前記電極の多い側の方向に延長したパッドと
を具備したことを特徴とするプリント配線回路基板。 A wiring board body having a mounting surface on which surface-mounted components having different numbers of electrodes are mounted on opposite sides of the component body;
Printed wiring comprising: a pad provided on the wiring board main body, corresponding to the electrode of the surface-mounted component, and having a pad length on the side with a smaller number of electrodes extended in a direction toward the side with the larger number of electrodes. Circuit board. 部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、
この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッド長を前記電極の多い側の方向に位置を移動させたパッドと
を具備したことを特徴とするプリント配線回路基板。 A wiring board body having a mounting surface on which surface-mounted components having different numbers of electrodes are mounted on opposite sides of the component body;
A pad provided on the wiring board main body, corresponding to the electrode of the surface-mounted component, and having a pad length on the side with fewer electrodes moved in a direction toward the side with more electrodes. Printed circuit board. 部品本体の相反する両辺にそれぞれ異なる数の電極を有した表面実装部品が実装される実装面を有した配線板本体と、
この配線板本体に設けられ、前記表面実装部品の電極に対応するとともに、前記電極の少ない側のパッドの幅を前記電極の多い側のパッドの配列方向に拡げたパッドと
を具備したことを特徴とするプリント配線回路基板。 A wiring board body having a mounting surface on which surface-mounted components having different numbers of electrodes are mounted on opposite sides of the component body;
A pad provided on the wiring board main body, corresponding to the electrode of the surface mount component, and having a pad whose width on the side with fewer electrodes is expanded in the arrangement direction of the pad on the side with more electrodes. Printed wiring circuit board. 前記パッドの延長方向の長さを
前記延長以前の基本パッド上の前記はんだ張力が作用する方向の先端と前記表面実装部品の同方向の電極配置位置先端との間のはんだ溶融面の距離をａ
前記基本パッドの同方向の長さをｂ
前記パッドの延長方向の長さをｃとしたとき
ｃ≧ａ＋ｂ
としたことを特徴とする請求項１記載のプリント配線回路基板。 The length in the extension direction of the pad is the distance of the solder melting surface between the tip in the direction in which the solder tension acts on the basic pad before the extension and the tip of the electrode mounting position in the same direction of the surface mount component a
The length of the basic pad in the same direction is b
C ≧ a + b where c is the length in the extension direction of the pad
The printed wiring circuit board according to claim 1, wherein: 前記パッドの位置の移動量を
前記はんだ張力が作用する方向の前記表面実装部品の電極のはんだ接合面の長さと前記パッドの同方向の電極接合面の長さとの差分以上にしたことを特徴とする請求項２記載のプリント配線回路基板。 The amount of movement of the pad position is greater than or equal to the difference between the length of the solder joint surface of the electrode of the surface mount component in the direction in which the solder tension acts and the length of the electrode joint surface of the pad in the same direction. The printed wiring circuit board according to claim 2. 前記パッドの幅を
前記パッドの数が多い側のパッドの同方向の幅の２倍以上にしたことを特徴とする請求項３記載のプリント基板。 The printed circuit board according to claim 3, wherein the width of the pad is set to be twice or more of the width in the same direction of the pad on the side where the number of pads is large.
JP2003424959A 2003-12-22 2003-12-22 Printed circuit board Expired - Fee Related JP4227008B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003424959A JP4227008B2 (en) 2003-12-22 2003-12-22 Printed circuit board
TW093115549A TWI244360B (en) 2003-12-22 2004-05-31 Printed circuit board
KR1020040041683A KR100606221B1 (en) 2003-12-22 2004-06-08 Printed circuit board
CNB2004100597663A CN100456909C (en) 2003-12-22 2004-06-18 Printed circuit board

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JP2003424959A JP4227008B2 (en) 2003-12-22 2003-12-22 Printed circuit board

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JP2005183797A true JP2005183797A (en) 2005-07-07
JP4227008B2 JP4227008B2 (en) 2009-02-18

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KR (1) KR100606221B1 (en)
CN (1) CN100456909C (en)
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2007123617A (en) * 2005-10-28 2007-05-17 Toshiba Corp Printed wiring board, electronic apparatus incorporating printed wiring board, and process for producing printed wiring board
US10160092B2 (en) 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US10601285B2 (en) 2014-10-23 2020-03-24 Mitsubishi Electric Corporation Wiring board, electric motor, electric apparatus, and air conditioner

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112006000153B4 (en) * 2005-03-29 2009-11-26 Murata Mfg. Co., Ltd., Nagaokakyo-shi Arrangement with an electronic component and a circuit board

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JPH0690077A (en) * 1992-01-31 1994-03-29 Hitachi Telecom Technol Ltd Printed wiring board
JPH06334320A (en) * 1993-05-20 1994-12-02 Mitsubishi Electric Corp Mounting method for electronic component
JP2744398B2 (en) * 1993-06-11 1998-04-28 ローム株式会社 Board mounting structure of solid electrolytic capacitor
KR200157790Y1 (en) 1993-11-19 1999-10-01 손욱 Parts installation system of pcb using lithograph display module
JPH07288378A (en) * 1994-04-18 1995-10-31 Fujikura Ltd Printed wiring board
US6069323A (en) * 1997-01-21 2000-05-30 Dell Usa, L.P. Pad with indentations surface mount
JP2000299548A (en) * 1999-04-12 2000-10-24 Kenwood Corp Land structure for printed board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123617A (en) * 2005-10-28 2007-05-17 Toshiba Corp Printed wiring board, electronic apparatus incorporating printed wiring board, and process for producing printed wiring board
US10160092B2 (en) 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US10601285B2 (en) 2014-10-23 2020-03-24 Mitsubishi Electric Corporation Wiring board, electric motor, electric apparatus, and air conditioner

Also Published As

Publication number Publication date
TW200522822A (en) 2005-07-01
KR20050063656A (en) 2005-06-28
TWI244360B (en) 2005-11-21
KR100606221B1 (en) 2006-07-31
CN100456909C (en) 2009-01-28
JP4227008B2 (en) 2009-02-18
CN1638608A (en) 2005-07-13

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