JP2016225559A - Component mounting board, component mounting method and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow for arbitrary selection of surface mounting components of different size, and stabilized mounting thereof.SOLUTION: A component mounting board has a metal layer (3), on which a resist pattern is provided, and a land where the metal layer (3) is exposed for connecting the electrode of a component mounted on the board. The land consists of a pair of first land (1) and a second land (1'), which are separated by a predetermined distance and arranged to face each other. The first land (1) and second land (1') are formed of a region where the metal layer (3) is exposed except a resist coat region (2), in a rectangular region (4) where the resist coat region (2) is formed partially. The resist coat region (2) includes at least two strip regions (21) extending in the facing direction of the first land (1) and second land (1'), and the strip regions (21) are arranged at a predetermined interval in a direction perpendicular to the facing direction of the first land (1) and second land (1').SELECTED DRAWING: Figure 2

Description

  The present invention relates to a component mounting board, a component mounting method, and an electronic device. More specifically, the present invention relates to a component mounting board on which a land for soldering and mounting a surface mounted component is formed. The present invention relates to a component mounting method for mounting a mounted component, and an electronic device on which the component mounting board is mounted.

  For example, a printed circuit board provided in an electronic device such as a television apparatus has a metal layer and a resist patterned on the metal layer, and connects the electrodes of the surface mount component by the patterned resist. The component mounting board is provided with a land on which the metal layer is exposed. Then, solder is applied to the lands, and a surface mounting component is mounted on the land and soldered, so that the surface mounting component is mounted on the component mounting substrate.

In the component mounting substrate, the surface mounting component is placed on the component mounting substrate by an automatic mounting device. For this reason, it is designed to be arranged on the component mounting board at a constant interval so that the surface mounted components do not contact each other.
In the actual surface mounting component mounting process, by creating a metal mask according to the component size of each surface mounting component placed on the component mounting board, and applying cream solder using the metal mask, The surface mount component is mounted on the component mounting board by adjusting the amount of solder for each surface mount component to be optimum.

  With respect to a component mounting board for soldering such a surface mounting component, for example, in Patent Document 1, a printed wiring board having a configuration in which a soldering land corresponding to a large and small electrode is provided on the printed wiring board and no pattern change is required. Is disclosed. In this printed wiring board, the anode electrode side land is divided into two regions, or the pattern is completely divided. When soldering a surface mount component, in the case of a large electrode, the electrode is soldered to both of the two areas on the anode side, and in the case of a small electrode, it is only inside the two areas on the anode side. The electrode is soldered. This makes it possible to solder to both large and small electrodes without requiring a change in the pattern of the substrate.

JP-A-6-350243

As surface mount components, for example, electric field capacitors and coils require a relatively large area in the component mounting substrate. In particular, the coils around the audio circuit have design limitations such that the distance between the coils needs to be separated by, for example, 10 mm or more in order to prevent noise, and the coils must be arranged in the vicinity of an IC (Integrated Circuit).
In addition, by using a common component mounting board, it is necessary to arrange a plurality of coils having different sizes at the same time in order to correspond to a plurality of types of speakers having different outputs on a single component mounting board. In this case, as the number of display mounting components such as coils increases, a larger area is required on the component mounting board. For example, the distance between the coils cannot be properly maintained, or the wiring pattern has a sufficient wiring width. The problem that it becomes impossible to install is generated.

  As in the invention described in Patent Document 1, for example, by forming a land shape that can selectively mount two different types of surface-mounted components, a common component mounting board is used, and different surface-mounted components are appropriately selected. Can be implemented. However, the invention described in Patent Document 1 is intended to enable mounting of different surface mount components by designing the shape of the land. For example, if there are unnecessary land parts on the board that are not used for mounting surface mount parts, solder will adhere to the unnecessary land parts, causing the surface mount parts to shift or surface mount parts. However, Cited Document 1 does not consider such a problem at all. Further, in order to fix the surface mount component, there is an appropriate amount of solder and an appropriate land size, but the cited document 1 does not mention such a problem at all.

  The present invention has been made in view of the above circumstances, and a component mounting board capable of arbitrarily selecting and mounting a surface mounting component of a different size, and a surface mounting component on the component mounting board. An object of the present invention is to provide a component mounting method for mounting and an electronic device on which the component mounting board is mounted.

  In order to solve the above problems, a first technical means of the present invention is to provide a metal layer and a resist pattern on the metal layer, and the metal layer is connected to connect an electrode of a component to be mounted on a substrate. A component mounting board having exposed lands, wherein the lands include a pair of first lands and second lands arranged to face each other at a predetermined distance, and the first lands and the second lands Each is formed by a region where the metal layer excluding the resist coating region is exposed in a rectangular region where the resist coating region covered with the resist is partially formed, and the resist coating region is formed by the first land. And at least two belt-like regions extending in the direction in which the second land faces each other, and the two belt-like regions are directly in the direction in which the first land and the second land face each other. Are arranged with a predetermined interval in the direction, that is obtained by it said.

  According to a second technical means, in the first technical means, the resist coating region includes a bent region in which ends of the belt-shaped region are bent so as to face each other in a direction orthogonal to the opposing direction, and the belt-shaped region And the bent region form a key-type region.

  According to a third technical means, in the second technical means, the resist coating region formed as the key-shaped region is formed so that one side including the bent region is continuous with the resist existing outside the rectangular region. In addition, a key-shaped step is formed on the outer periphery of each of the first land and the second land along the outer periphery by the resist coating region.

  According to a fourth technical means, in the second or third technical means, the bent region is opposite to a side where the first land and the second land are opposed to each other, and is orthogonal to the facing direction. The above-mentioned bending is characterized by the above.

  A fifth technical means includes an entire area of the first land and an entire area of the second land on the first land and the second land of the component mounting board according to any one of the first to fourth technical means. A step of applying solder using a metal mask including a region, a step of placing a surface mount component on the first land and the second land to which the solder is applied, and the component on which the surface mount component is placed And mounting the surface-mounted component on the first land and the second land by heating a mounting substrate.

  The sixth technical means is an electronic device on which the component mounting board according to any one of the first to fourth technical means is mounted.

  According to the present invention, a component mounting board capable of stably selecting and mounting surface mount components of different sizes, a component mounting method for mounting a surface mount component on a component mounting board, and the component mounting It is possible to provide an electronic device on which an industrial board is mounted.

It is a figure for demonstrating the structural example of the component connected to the component mounting board | substrate of embodiment which concerns on this invention. It is a figure which shows the shape of the land of the board | substrate for component mounting by 1st Embodiment concerning this invention. It is a figure for demonstrating the structural example of the metal mask for apply | coating solder with respect to the land of the shape shown in FIG. It is a figure for demonstrating an effect | action when mounting a surface mounting component in a land in the 1st Embodiment of this invention. It is a figure which shows the shape of the land of the board | substrate for component mounting by 2nd Embodiment which concerns on this invention. It is a figure for demonstrating an effect | action when mounting a surface mounting component in a land in the 2nd Embodiment of this invention. It is a figure which shows the shape of the land of the board | substrate for component mounting by 3rd Embodiment concerning this invention. It is a figure for demonstrating an effect | action when mounting a surface mounting component in a land in the 3rd Embodiment of this invention.

(Embodiment 1)
FIG. 1 is a diagram for explaining a configuration example of components connected to a component mounting board according to an embodiment of the present invention. The component mounting board according to the present embodiment is configured so that surface mount components of different sizes can be arbitrarily selected and stably mounted.
Here, a component mounting board having a land shape capable of arbitrarily mounting the surface mount component shown in FIG. 1A and the surface mount component shown in FIG. 1B is provided. The surface mount component is, for example, a coil, but the type is not limited.

FIG. 1A shows the electrode shape of the relatively large surface mount component 100. The two electrode portions 101 are a pair of electrode portions 101 provided on one surface mounting component 100, and solder applied to a land (not shown) of the component mounting substrate is attached to the region of the electrode portion 101. The electrode unit 101 is mounted on the land.
FIG. 1B shows the electrode shape of the relatively small surface mount component 200. The two electrode portions 201 are a pair of electrode portions 201 provided on one surface mount component 200, and solder applied to a land (not shown) of the component mounting substrate is attached to the region of the electrode portion 201. The electrode part 201 is mounted on the land.

  FIG. 1C is a diagram for explaining a positional relationship when the surface-mounted component 100 shown in FIG. 1A and the surface-mounted component 200 shown in FIG. 1B are mounted on a common land. . As shown in FIG. 1C, the electrode portion 101 of the relatively large surface mount component 100 is wider than the electrode portion 201 of the relatively small surface mount component 200, and the width direction (the electrode portion is The length in the direction orthogonal to the opposing direction is also long. In order to be able to select and mount any one of these surface-mounted components 100 and 200, a land shape as shown below is used.

FIG. 2 is a diagram showing the shape of the land of the component mounting board according to the first embodiment of the present invention. FIG. 2A is a diagram showing an overall image of the land shape in this embodiment, and FIG. ) Is a diagram for explaining a key-shaped resist coating region formed around the land, and FIG. 2C is an enlarged view of one of the key-shaped shapes.
The component mounting board has a metal layer and a resist pattern provided on the metal layer, and the above metal layer is exposed in order to connect the electrodes of the surface mount component mounted on the component mounting board. Land is provided. Here, as the lands, in order to mount the surface mounting components 100 and 200 having a pair of electrode portions 101 and 201 as shown in FIG. Two lands 1 'are provided. The metal layer is formed of, for example, copper foil.

As shown in FIGS. 2B and 2C, each of the first land 1 and the second land 1 ′ is a rectangular region 4 in which a resist-covered region 2 covered with a resist is partially formed. The metal layer 3 excluding the resist coating region 2 is formed by the exposed region.
The resist coating region 2 includes at least two belt-like regions 21 extending in the direction Y in which the first land 1 and the second land 1 ′ face each other. The two belt-like regions 21 are arranged at a predetermined interval in a direction X orthogonal to the direction Y in which the first land 1 and the second land 1 ′ face each other.

The resist-coated region 2 includes a bent region 22 in which the end of the band-shaped region 21 is bent so as to face each other in the direction X orthogonal to the direction Y. The band-shaped region 21 and the bent region 22 form a key shape. A bent key-shaped region is formed.
The resist coating region 2 formed as the key-shaped region is formed so that one side including the bent region 22 is connected to the resist existing outside the rectangular region 4. In other words, the resist formed in the resist coating region 2 is formed around the lands 1 and 1 ′ on one side outside the outer periphery of the rectangular region of the bent region 22 without forming the metal layer 3 on the outer side. It is comprised so that it may be connected with the resist currently made.
Thereby, a key-shaped step 23 is formed on the outer periphery of each of the first land 1 and the second land 1 ′ along the outer periphery of the first land 1 and the second land 1 ′ by the resist coating region 2. It is formed. Further, the bent region 22 is bent so as to face each other in the orthogonal direction X of the direction Y on the side opposite to the side where the first land 1 and the second land 1 ′ face each other.

  FIGS. 3A and 3B show examples of metal masks for applying solder to the lands having the shape shown in FIG. 2 (first land 1 and second land 1 ′). It is a figure for demonstrating. FIG. 3A shows the shape of the lands (first land 1 and second land 1 ′) shown in FIG. 2A for comparison, and FIG. 3B shows the shape of FIG. The shape of the metal mask 5 for applying solder to the land is shown. Here, the metal mask 5 indicates the shape of an opening for applying cream solder provided on the metal mask.

  The metal mask 5 is formed in a pair of mask shapes according to the first land 1 and the second land 1 ′. Each metal mask 5 and the first land 1 and the second land 1 ′ have substantially the same shape, but only in the portion of the extended portion 6 shown in FIG. This is expanded more than the first land 1 and the second land 1 ′. Basically, each metal mask 5 covers the entire area of the first land 1 and the second land 1 ′, and further includes a partial extension portion 6. As a result, at least solder is applied to the entire exposed surface of the metal layer 3 of the first land 1 and the second land 1 ′.

The application of solder using the metal mask 5 is performed as follows, for example. First, for example, cream solder is applied as a molten conductive material on a component mounting board provided with lands for connecting each surface mount component. Here, first, a metal mask 5 having an opening in a shape that requires supply of cream solder is brought into close contact with the component mounting board. Next, cream solder is filled into the opening of the metal mask 5 from above the metal mask 5 using a squeegee or the like. Thereafter, the metal mask 5 is separated from the component mounting board.
Thereby, the cream solder filled in the opening of the metal mask 5 is applied onto the component mounting board. After the cream solder is applied, the necessary surface-mounted components are placed on a component mounting board, and the cream solder is heated and melted using a reflow furnace or the like, and then cooled to solidify the solder. As a result, the component mounting board and the surface mounting component mounted on the land are joined, and the surface mounting component is mounted on the component mounting board.

FIG. 4 is a diagram for explaining the operation when the surface-mounted component is mounted on the land in the first embodiment of the present invention.
FIG. 4A is a diagram showing a positional relationship when a relatively large surface-mounted component is mounted on the land 1. The relatively larger surface mount component is the surface mount component 100 shown in FIG. 1A, and the positional relationship between the electrode portion 101 and the first land 1 is as shown in FIG. 4A. ing.
FIG. 4B is a diagram showing a positional relationship when a relatively smaller surface-mounted component is mounted on the land 1. The relatively smaller surface-mounted component is the surface-mounted component 200 shown in FIG. 1B, and the positional relationship between the electrode portion 201 and the first land 1 is as shown in FIG. 4B. ing.
The positional relationship between the second land 1 ′ and the electrode portions 101 and 201 is the same as that of the first land 1, and therefore the first land 1 will be described as an example.

  First, as shown in FIG. 4A, when a relatively large surface-mounted component is mounted on the land 1, the width direction (first) in the region corresponding to the electrode portion 101 of the surface-mounted component 100. The entirety of the direction X) perpendicular to the direction Y in which the land 1 and the second land 1 ′ face each other is included in the area of the land 1 except for the resist coating area 2. In the region corresponding to the electrode portion 101, the electrode portion 101 is included in the land 1 region except for the resist coating region 2 in the direction Y in which the first land 1 and the second land 1 ′ face each other. .

  For the relatively large surface-mounted component, the shape of the land 1 causes solder to adhere to almost the entire bottom surface of the electrode portion 101, so that the position of the electrode portion 101 does not shift even during heating such as reflow. , There is no problem in its mountability. Further, as shown in FIG. 4A, the metal mask 5 is provided with an extended portion 6 slightly larger than the land 1, and the extended portion 6 is also soldered. The solder in this portion moves to the metal electrode portion 101 side during heating such as reflow and becomes a so-called fillet shape, and supports the electrode portion 101 from the side surface, so that the fixed connection becomes more effective.

  Next, as shown in FIG. 4B, when mounting a relatively smaller surface mounting component on the land 1, the first land 1 and the second land among the electrode portions 201 of the surface mounting component 200. The metal layer 3 of the land 1 is not provided at one end portion in the direction Y facing 1 ′ (one end portion in the direction in which the pair of electrode portions 201 face each other), and is a resist layer. This area is indicated by hatching and will be described as a non-land area 202.

On the non-land region 202, a part of the electrode portion 201 of the relatively smaller surface-mounted component is placed. In the present embodiment, this non-land region 202 is intentionally The land where the metal layer 3 is exposed is not formed. When only the smaller surface mount component is targeted, it is preferable that a land is formed below the electrode portion 201. 202 is provided.
When the land where the metal layer 3 is exposed is formed also in the non-land region 202, when a relatively large surface mount component is mounted, the lower portion of the surface mount component (the component bottom surface between the electrode portions 101) is placed. Solder is attached. In this case, solder is attached to a portion unrelated to the electrode portion 101, which may cause a short circuit or the like.
For this reason, in consideration of stable mounting of a relatively large surface-mounted component, a non-land region 202 is provided, and solder is not applied to this region.

  The resist coating region 2 formed on the outer periphery of the land 1 of the present embodiment is formed in a key shape composed of a band-shaped region 21 and a bent region 22, and the inner side (electrode portion 201) of this key shape. The arrangement region side) is a shape along the outer peripheral shape of the electrode portion 201 of the relatively smaller surface mount component. That is, the resist coating region 2 is formed in a key shape along the outer periphery of the electrode unit 201 at a predetermined interval in the vicinity of the outer periphery with respect to the mounting position of the electrode unit 201. Solder is not applied to the key-shaped resist coating region 2.

In general, when a surface-mounted component having a small area electrode part is placed in a land area having a large area, if the solder is applied to the entire land, the solder that has melted during heating such as reflow may cause a small area. In some cases, the position of the electrode portion is displaced, and the surface mount component cannot be bonded to a desired position.
In the case where a rectangular land with the metal layer 3 exposed is formed without forming the key-shaped resist coating region 2, when a relatively small surface-mounted component is placed on the land 1, it is illustrated. Since the metal layer 3 is exposed even at the position of the resist coating region 2 and solder is applied, the solder melts during heating such as reflow, and the electrode portion 201 of the surface mount component is easily displaced in the X and Y directions shown in the figure. turn into. On the other hand, by forming the key-shaped resist coating region 2 along the outer shape of the corner portion of the electrode portion 201, the displacement of the electrode portion 201 in the X direction and the Y direction can be suppressed at that portion.

  Further, when soldering a relatively small surface-mounted component, since the non-land region 202 exists, the solder is not applied to the entire bottom surface of the electrode portion 201. In this case, it can be said that there is a fear that the adhesive force is insufficient. However, the solder applied to the land 1 flows to some extent in the non-land region 202, and an effect of fixing the electrode portion 201 on the non-land region 202 is obtained. Further, in the present embodiment, the solder around the electrode part 201 is melted during heating, and flows around the electrode part 201 to be supplied, thereby fixing the electrode part 201 to the land 1 firmly.

That is, as shown in the figure, when mounting a relatively small surface mount component, both sides of the electrode part 201 (both outer sides in the X direction) and the rear side of the electrode part 201 (a pair of electrode parts 201 face each other). Solder is present in the region in the direction opposite to the side). These solders melt upon heating such as reflow and flow so as to be attracted to the metal electrode part 201. The directions of flow are mainly three directions indicated by arrows a, b, and c shown in the figure.
Then, the flowed solder forms a fillet on the side surface of the electrode part 201 and fixes the electrode part 201 more firmly. By supplying the solder from these three directions, the shortage of solder due to the non-land region 202 can be compensated, and the electrode portion 201 of the surface mount component can be firmly fixed to the land 1.
With the land configuration and the solder coating metal mask configuration, a component mounting board is obtained in which surface mount components of different sizes can be arbitrarily selected and stably mounted.

(Embodiment 2)
In the second embodiment according to the present invention, a component mounting board having a land shape different from that of the first embodiment is provided. As in the first embodiment, the component mounting board according to the present embodiment is configured such that surface-mounted components having different sizes can be arbitrarily selected and stably mounted.
Here, as in the first embodiment, a component mounting board having a land shape capable of arbitrarily mounting the surface mount component 100 shown in FIG. 1A and the surface mount component 200 shown in FIG. 1B is provided. Is done.

FIG. 5 is a diagram showing a land shape of a component mounting board according to the second embodiment of the present invention. FIG. 5A is a diagram showing an overall image of the land shape in the present embodiment, and FIG. ) Is an enlarged view of one of the key-shaped resist coating regions formed on the land.
The component mounting board has a metal layer and a resist pattern provided on the metal layer, and the above metal layer is exposed in order to connect the electrodes of the surface mount component mounted on the component mounting board. Land is provided. Here, as the lands, in order to mount the surface mounting components 100 and 200 having a pair of electrode portions 101 and 201 as shown in FIG. Two lands 1 'are provided.

As shown in FIGS. 5A and 5B, each of the first land 1 and the second land 1 ′ is a rectangular region 4 in which a resist-covered region 2 covered with a resist is partially formed. The metal layer 3 excluding the resist coating region 2 is formed by the exposed region.
The resist coating region 2 includes at least two belt-like regions 21 extending in the direction Y in which the first land 1 and the second land 1 ′ face each other. The two belt-like regions 21 are arranged at a predetermined interval in a direction X orthogonal to the direction Y in which the first land 1 and the second land 1 ′ face each other.

The resist-coated region 2 includes a bent region 22 in which the end of the band-shaped region 21 is bent so as to face each other in the direction X orthogonal to the direction Y. The band-shaped region 21 and the bent region 22 form a key shape. A bent key-shaped region is formed.
Unlike the first embodiment, in the second embodiment, the resist-covered region 2 formed as a key-shaped region is formed as an island-shaped region that is entirely surrounded by the metal layer 3. That is, unlike the first embodiment, one side including the bent region 22 is not formed so as to be continuous with the resist existing outside the rectangular region 4. The bent region 22 is bent so that the first land 1 and the second land 1 ′ face each other in the orthogonal direction X of the direction Y on the side opposite to the side where the first land 1 and the second land 1 ′ face each other.

  In the metal mask of this embodiment, the shape of the opening for applying cream solder has the same shape as the first land 1 and the second land 1 ′. That is, the metal mask is formed in a pair of mask shapes according to the first land 1 and the second land 1 ′, and each metal mask, the first land 1 and the second land 1 ′ have the same shape. ing. Therefore, the opening of the metal mask covers the entire area of the first land 1 and the second land 1 ′. As a result, solder is applied to the entire exposed surface of the metal layer 3 of the first land 1 and the second land 1 ′. The application of cream solder using a metal mask and the mounting process of the surface mount component are performed according to the procedure described in the first embodiment.

  FIG. 6 is a diagram for explaining the operation when a surface-mounted component is mounted on a land in the second embodiment of the present invention. FIG. 6A is a diagram showing a positional relationship when a relatively large surface-mounted component is mounted on the land 1. The relatively large surface mount component is the surface mount component 100 shown in FIG. 1A, and the positional relationship between the electrode portion 101 and the first land 1 is as shown in FIG. 6A. ing.

  FIG. 6B is a diagram showing a positional relationship when a relatively smaller surface-mounted component is mounted on the land 1. The relatively smaller surface-mounted component is the surface-mounted component 200 shown in FIG. 1B, and the positional relationship between the electrode portion 201 and the first land 1 is as shown in FIG. 6B. ing. The positional relationship between the second land 1 ′ and the electrode portions 101 and 201 is the same as that of the first land 1, and therefore the first land 1 will be described as an example.

  First, as shown in FIG. 6A, when a relatively large surface-mounted component is mounted on the land 1, the width direction (first) in the region corresponding to the electrode portion 101 of the surface-mounted component 100 The entirety of the direction X) perpendicular to the direction Y in which the land 1 and the second land 1 ′ face each other is included in the area of the land 1 except for the resist coating area 2. In the region corresponding to the electrode portion 101, the electrode portion 101 is included in the land 1 region except for the resist coating region 2 in the direction Y in which the first land 1 and the second land 1 ′ face each other. .

  For the relatively large surface-mounted component, the shape of the land 1 causes solder to adhere to almost the entire bottom surface of the electrode portion 101, so that the position of the electrode portion 101 does not shift even during heating such as reflow. , There is no problem in its mountability.

  Next, as shown in FIG. 6B, when mounting a relatively smaller surface-mounted component on the land 1, the first land 1 and the second land among the electrode portions 201 of the surface-mounted component 200. The metal layer of the land 1 is not provided at one end portion in the direction Y facing 1 ′ (one end portion in the direction in which the pair of electrode portions 201 face each other), and is a resist layer. This area is indicated by hatching and is designated as a non-land area 202.

  On the non-land region 202, a part of the electrode portion 201 of the relatively smaller surface-mounted component is placed. In the present embodiment, as in the first embodiment, this non-land region is dared. In the region 202, no land where the metal layer is exposed is formed. When only the smaller surface-mounted component is targeted, it is preferable that a land is formed below the electrode portion 201. However, in order to use it together with a relatively large surface-mounted component, a non-land region is used. 202 is provided. The reason is the same as in the first embodiment. When a land having a metal layer exposed is formed in the non-land region 202, when a relatively large surface-mounted component is placed, the lower portion of the surface-mounted component ( Solder adheres to the component bottom surface between the electrode portions 101. In this case, solder is attached to a portion unrelated to the electrode portion 101, which may cause a short circuit or the like. For this reason, in consideration of stable mounting of a relatively large surface-mounted component, a non-land region 202 is provided, and solder is not applied to this region.

  The two resist-coated regions 2 formed in an island shape on the land 1 of the present embodiment are each formed in a key shape composed of a band-shaped region 21 and a bent region 22. The electrode portion 201 is disposed on the side where the electrode portion 201 is disposed, and has a shape along the outer peripheral shape of the electrode portion 201 of the relatively smaller surface mount component. That is, the resist coating region 2 is formed in a key shape along the outer periphery of the electrode unit 201 at a predetermined interval in the vicinity of the outer periphery with respect to the mounting position of the electrode unit 201. Solder is not applied to the key-shaped resist coating region 2.

  In the case where a rectangular land with the metal layer 3 exposed is formed without forming the key-shaped resist coating region 2, when a relatively small surface-mounted component is placed on the land 1, it is illustrated. Since the metal layer 3 is exposed even at the position of the resist coating region 2 and solder is applied, the solder melts during heating such as reflow, and the electrode portion 201 of the surface mount component is easily displaced in the X and Y directions shown in the figure. turn into. On the other hand, by forming the key-shaped resist coating region 2 along the outer shape of the corner portion of the electrode portion 201, the displacement of the electrode portion 201 in the X direction and the Y direction can be suppressed at that portion.

  Further, when soldering a relatively small surface-mounted component, since the non-land region 202 exists, the solder is not applied to the entire bottom surface of the electrode portion 201. In this case, it can be said that there is a fear that the adhesive force is insufficient. However, the solder applied to the land 1 flows to some extent in the non-land region 202, and an effect of fixing the electrode portion 201 on the non-land region 202 is obtained. Further, in the present embodiment, the solder around the electrode part 201 is melted during heating, and flows around the electrode part 201 to be supplied, thereby fixing the electrode part 201 to the land 1 firmly.

That is, as shown in the figure, when mounting a relatively small surface mount component, both sides of the electrode part 201 (both outer sides in the X direction) and the rear side of the electrode part 201 (a pair of electrode parts 201 face each other). Solder is present in the region in the direction opposite to the side). These solders melt upon heating such as reflow and flow so as to be attracted to the metal electrode part 201. The flowing solder forms a fillet on the side surface of the electrode part 201, and fixes the electrode part 201 more firmly. Such supply of solder from the periphery makes it possible to make up for the shortage of solder due to the non-land region 202 and firmly fix the electrode portion 201 of the surface mount component to the land 1.
With the land configuration and the solder coating metal mask configuration, a component mounting board is obtained in which surface mount components of different sizes can be arbitrarily selected and stably mounted.

(Embodiment 3)
In the third embodiment according to the present invention, a component mounting board having a land shape different from those of the first and second embodiments is provided. As in the first and second embodiments, the component mounting board according to the present embodiment is configured such that surface-mounted components having different sizes can be arbitrarily selected and stably mounted. Here, as in the first and second embodiments, a component mounting board having a land shape capable of arbitrarily mounting the surface mount component 100 shown in FIG. 1A and the surface mount component 200 shown in FIG. 1B. Is provided.

FIG. 7 is a diagram showing the land shape of the component mounting board according to the third embodiment of the present invention, and FIG. 7A is a diagram showing an overall image of the land shape in this embodiment, and FIG. ) Is an enlarged view of one of the resist coating regions formed on the land.
The component mounting board has a metal layer and a resist pattern provided on the metal layer, and the above metal layer is exposed in order to connect the electrodes of the surface mount component mounted on the component mounting board. Land is provided. Here, as the lands, in order to mount the surface mounting components 100 and 200 having a pair of electrode portions 101 and 201 as shown in FIG. Two lands 1 'are provided.

As shown in FIGS. 7A and 7B, each of the first land 1 and the second land 1 ′ is a rectangular area 4 in which a resist-covered area 2 covered with a resist is partially formed. The metal layer 3 excluding the resist coating region 2 is formed by the exposed region.
The resist coating region 2 is composed of two belt-like regions 21 extending in the direction Y in which the first land 1 and the second land 1 ′ face each other. The two belt-like regions 21 are arranged at a predetermined interval in a direction X orthogonal to the direction Y in which the first land 1 and the second land 1 ′ face each other.

  In the third embodiment, the resist coating region 2 is formed as an island-like region that is entirely surrounded by the metal layer 3. That is, unlike the first embodiment, one side including the bent region 22 of the resist coating region 2 is not formed to be continuous with the resist existing outside the rectangular region 4.

  In the metal mask of this embodiment, the shape of the opening for applying cream solder has the same shape as the first land 1 and the second land 1 ′. That is, the metal mask is formed in a pair of mask shapes according to the first land 1 and the second land 1 ′, and each metal mask, the first land 1 and the second land 1 ′ have the same shape. ing. Therefore, the opening of the metal mask covers the entire area of the first land 1 and the second land 1 ′. As a result, solder is applied to the entire exposed surface of the metal layer 3 of the first land 1 and the second land 1 ′. The application of cream solder using a metal mask and the mounting process of the surface mount component are performed according to the procedure described in the first embodiment.

  FIG. 8 is a diagram for explaining the operation when the surface-mounted component is mounted on the land in the third embodiment of the present invention. FIG. 8A is a diagram showing a positional relationship when a relatively large surface-mounted component is mounted on the land 1. The relatively large surface-mounted component is the surface-mounted component 100 shown in FIG. 1A, and the positional relationship between the electrode portion 101 and the first land 1 is as shown in FIG. 8A. ing.

  FIG. 8B is a diagram showing a positional relationship when a relatively smaller surface-mounted component is mounted on the land 1. The relatively small surface-mounted component is the surface-mounted component 200 shown in FIG. 1B, and the positional relationship between the electrode portion 201 and the first land 1 is as shown in FIG. 8B. ing. The positional relationship between the second land 1 ′ and the electrode portions 101 and 201 is the same as that of the first land 1, and therefore the first land 1 will be described as an example.

  First, as shown in FIG. 8A, when a relatively large surface-mounted component is mounted on the land 1, the width direction (first) in the region corresponding to the electrode portion 101 of the surface-mounted component 100. The entirety of the direction X) perpendicular to the direction Y in which the land 1 and the second land 1 ′ face each other is included in the area of the land 1 except for the resist coating area 2. In the region corresponding to the electrode portion 101, the electrode portion 101 is included in the land 1 region except for the resist coating region 2 in the direction Y in which the first land 1 and the second land 1 ′ face each other. .

  For the relatively large surface-mounted component, the shape of the land 1 causes solder to adhere to almost the entire bottom surface of the electrode portion 101, so that the position of the electrode portion 101 does not shift even during heating such as reflow. , There is no problem in its mountability.

  Next, as shown in FIG. 8B, when mounting a relatively smaller surface-mounted component on the land 1, the first land 1 and the second land 1 among the electrode portions 201 of the surface-mounted component. The metal layer of the land 1 is not provided at one end portion in the direction Y in which “′” faces (one end portion in the direction in which the pair of electrode portions 201 face each other), and is a resist layer. This area is indicated by hatching and is designated as a non-land area 202.

  On the non-land region 202, a part of the electrode portion 201 of the smaller surface mount component is placed. In the present embodiment, like the first and second embodiments, this part is intentionally placed. In the portion of the non-land region 202, a land where the metal layer is exposed is not formed. When only the smaller surface-mounted component is targeted, it is preferable that a land is formed below the electrode portion 201. However, in order to use it together with a relatively large surface-mounted component, a non-land region is used. 202 is provided. The reason is the same as in the first and second embodiments.

The two resist coating regions 2 formed in an island shape on the land 1 of the present embodiment are respectively a belt-shaped belt-shaped region 21 extending in a direction Y in which the first land 1 and the second land 1 ′ are opposed to each other. However, the inner side of the belt-like region (the region where the electrode portion 201 is arranged in the X direction) is a shape partially along the outer peripheral shape of the electrode portion 201 of the relatively smaller surface-mounted component. It has become.
That is, the resist coating region 2 is formed in a belt-like shape along the outer periphery of the electrode part 201 with a predetermined interval near the outer periphery in the X direction with respect to the mounting position of the electrode part 201. Solder is not applied to the strip-shaped resist coating region 2.

  When a rectangular land with the metal layer 3 exposed is formed without forming the strip-shaped resist coating region 2, when a relatively small surface-mounted component is placed on the land 1, the resist coating shown in the figure Since the metal layer is exposed at the position of the region 2 and the solder is applied, the solder is melted during heating such as reflow, and the electrode portion 201 of the surface mount component is likely to be displaced in the X direction shown in the figure. On the other hand, by forming the strip-shaped resist coating region 2, it is possible to suppress the displacement of the electrode portion 201 in the X direction at that portion.

  Here, in the Y direction, since the resist coating region 2 is not formed in a key shape as in the second embodiment, the displacement of the electrode portion 201 in the Y direction cannot be suppressed by the resist coating region 2. However, in this case, the electrode portions 201 in the Y direction are unlikely to be generated because the forces acting on the first land 1 and the second land 1 ′ cancel each other and balance. Therefore, even if the displacement of the electrode portion 201 in the X direction is mainly suppressed as in the third embodiment, the effect of preventing the displacement of the electrode portion 201 can be obtained.

  Similarly to the first and second embodiments, when soldering a relatively small surface-mounted component, the non-land region 202 is present, so that the entire bottom surface of the electrode unit 201 is not soldered. In this case, it can be said that there is a fear that the adhesive force is insufficient. However, the solder applied to the land 1 flows to some extent in the non-land region 202, and an effect of fixing the electrode portion 201 on the non-land region 202 is obtained. Further, in the present embodiment, the solder around the electrode part 201 is melted during heating, and flows around the electrode part 201 to be supplied, thereby fixing the electrode part 201 to the land 1 firmly.

That is, as shown in the figure, when mounting a relatively small surface mount component, both sides of the electrode part 201 (both outer sides in the X direction) and the rear side of the electrode part 201 (a pair of electrode parts 201 face each other). Solder is present in the region between the two resist coating regions 2 in the direction opposite to the side). These solders melt upon heating such as reflow and flow so as to be attracted to the metal electrode part 201. The flowing solder forms a fillet on the side surface of the electrode part 201, and fixes the electrode part 201 more firmly. Such supply of solder from the periphery makes it possible to make up for the shortage of solder due to the non-land region 202 and firmly fix the electrode portion 201 of the surface mount component to the land 1.
With the land configuration and the solder coating metal mask configuration, a component mounting board is obtained in which surface mount components of different sizes can be arbitrarily selected and stably mounted.

  The embodiment according to the present invention can be implemented as an electronic device on which the component mounting board described in each of the above embodiments is mounted. The electronic device is, for example, a television device, but is not limited thereto, and the component mounting board of the above embodiment can be mounted on various electronic devices. The present invention relates to a component mounting board capable of stably selecting and mounting surface mount components of different sizes, a component mounting method for mounting a surface mount component on a component mounting board, and the component mounting board It can be implemented as an electronic device equipped with.

  The technical features (components) described in each of the above embodiments can be combined with each other, and new technical features can be formed by combining them.

DESCRIPTION OF SYMBOLS 1,1 '... Land, 2 ... Resist coating area | region, 3 ... Metal layer, 4 ... Rectangular area | region, 5 ... Metal mask, 6 ... Expansion part, 21 ... Band-shaped area | region, 22 ... Bending area | region, 23 ... Level difference, 100 ... Surface Mounted parts, 101... Electrode part, 200... Surface mounted part, 201... Electrode part, 202.

Claims (6)

A component mounting board having a metal layer and a land on which the metal layer is exposed in order to provide a resist pattern on the metal layer and connect an electrode of a component to be mounted on the board,
The land is composed of a pair of first land and second land arranged facing each other at a predetermined distance,
Each of the first land and the second land is
In the rectangular region in which the resist coating region covered with the resist is partially formed, the metal layer excluding the resist coating region is formed by the exposed region,
The resist coating region includes at least two belt-shaped regions extending in a direction in which the first land and the second land face each other,
The component mounting board, wherein the two belt-like regions are arranged with a predetermined interval in a direction orthogonal to a direction in which the first land and the second land face each other. In the component mounting board according to claim 1,
The resist coating region is
A part including a bent region in which ends of the band-shaped region are bent so as to face each other in a direction orthogonal to the opposing direction, and the band-shaped region and the bent region form a key-shaped region. Mounting board. The component mounting board according to claim 2,
The resist-covered area formed as the key-shaped area is formed so that one side including the bent area is connected to the resist existing outside the rectangular area, and each of the first land and the second land A component mounting board characterized in that a key-shaped step is formed along the outer periphery on the outer periphery by the resist coating region. In the component mounting board according to claim 2 or 3,
The component mounting board according to claim 1, wherein the bent region is bent in a direction orthogonal to the facing direction on a side opposite to a side where the first land and the second land are opposed to each other. 5. A metal mask including an entire area of the first land and an entire area of the second land is used for the first land and the second land of the component mounting board according to claim 1. Applying solder, and
Placing a surface mount component on the first land and the second land coated with the solder;
Heating the component mounting board on which the surface mounting component is mounted, and mounting the surface mounting component on the first land and the second land. An electronic device on which the component mounting board according to claim 1 is mounted.

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