CN100456909C - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN100456909C CN100456909C CNB2004100597663A CN200410059766A CN100456909C CN 100456909 C CN100456909 C CN 100456909C CN B2004100597663 A CNB2004100597663 A CN B2004100597663A CN 200410059766 A CN200410059766 A CN 200410059766A CN 100456909 C CN100456909 C CN 100456909C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- weld zone
- electrode
- mounted component
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
Abstract
According to the printed circuit board of the present invention, length in the same direction as a pad on a side having a small number of electrodes is extended for forming an extended pad, thus a lead electrode is soldered to the corresponding pad on the printed circuit board. The lead electrode is on a side having a small number of electrodes in the surface packaging component. A sufficient solder junction surface is maintained by solder.
Description
Technical field
The present invention relates to have the printed circuit board (PCB) of the surface mounted component of varying number electrode respectively on opposite both sides as mounting object.
Background technology
With soldering fixedly weld zone configuration up and down or the asymmetric surface mounted component in the left and right sides reflux (reflow) soldering on printed circuit board (PCB) the time, meeting generation tension force acts on surface mounted component along the direction of expansion of the soldering fusion face on the weld zone, the unfavorable condition that surface mounted component is fixed by soldering to direction skew (moving) back of the more side of number of electrodes.At this moment, not only can produce the offset of surface mounted component, but also the soldering that can not correctly carry out the less side of number of electrodes in the surface mounted component is fixed.Particularly, for example, as the Japanese Patent Application Publication spy open in the 2000-299548 communique disclosed, along with increasingly sharpening of the densification of in recent years substrate technology, since to make element electrode shape, comprise the pattern form granular of the weld zone on the printed circuit board (PCB), therefore above-mentioned situation will display more significantly.
As mentioned above, there was such situation in the past, that is: in that fixedly weld zone configuration is up and down or the asymmetric surface mounted component reflow soldering in the left and right sides on printed circuit board (PCB) the time with soldering, tension force can act on surface mounted component along the direction of expansion of the soldering fusion face on the weld zone, surface mounted component is fixed by soldering to direction skew (moving) back of the more side of number of electrodes, accompany therewith, just can not correctly carry out the soldering of the less side of number of electrodes in the surface mounted component and fix.
Summary of the invention
The object of the present invention is to provide a kind of printed circuit board (PCB), in that fixedly weld zone configuration is up and down or the asymmetric surface mounted component reflow soldering in the left and right sides on printed circuit board (PCB) the time with soldering, all electrodes are fixed in soldering correctly, thereby described printed circuit board (PCB) has good product qualified rate and higher reliability.
Technical scheme of the present invention provides a kind of printed circuit board (PCB) by coming the installation surface installation elements to form according to the Wiring pattern that is formed on the insulated substrate, it is characterized in that, possess: circuit board main body, have the installed surface that described surface mounted component is installed, described surface mounted component has the electrode of varying number respectively on opposite two limits of element body; The weld zone is arranged on the described circuit board main body, corresponding with the electrode of described surface mounted component and to the direction of the more side of described electrode the weld zone length of the less side of described electrode is extended.
In addition, technical scheme of the present invention also provides a kind of printed circuit board (PCB) by coming the installation surface installation elements to form according to the Wiring pattern that is formed on the insulated substrate, it is characterized in that, possess: circuit board main body, have the installed surface that described surface mounted component is installed, described surface mounted component has the electrode of varying number respectively on opposite two limits of element body; The weld zone is arranged on the described circuit board main body, corresponding with the electrode of described surface mounted component and make the length shift position, weld zone of the less side of described electrode to the direction of the more side of described electrode.
In addition, technical scheme of the present invention also provides a kind of printed circuit board (PCB) by coming the installation surface installation elements to form according to the Wiring pattern that is formed on the insulated substrate, it is characterized in that, possess: circuit board main body, have the installed surface that described surface mounted component is installed, described surface mounted component has the electrode of varying number respectively on opposite two limits of element body; The weld zone is arranged on the described circuit board main body, corresponding with the electrode of described surface mounted component and enlarge the width of the weld zone of the less side of described electrode along the weld zone orientation of the more side of described electrode.
Thus, in that fixedly weld zone configuration is up and down or the asymmetric surface mounted component reflow soldering in the left and right sides on printed circuit board (PCB) the time with soldering, just all electrodes are fixed in soldering correctly, thereby produce the printed circuit board (PCB) with good product qualified rate and high reliability.
Can understand other purpose of the present invention and advantage by the following description, and part purpose wherein and advantage can obviously be seen by specification, or understand by implementing the present invention.Can realize and obtain objects and advantages of the present invention by device and the combination thereof that particularly points out in the back.
Description of drawings
The respective drawings that adopts in specification and constitute a specification part has illustrated the most preferred embodiment that the present invention is present, and comes together to explain the principle of the invention with generality explanation that provides above and detailed description to most preferred embodiment given below.
Fig. 1 is for showing the view of the present invention the 1st embodiment.
Fig. 2 is for showing the view of the present invention the 1st embodiment.
Fig. 3 is for showing the view of the present invention the 1st embodiment.
Fig. 4 is for showing the view of the present invention the 2nd embodiment.
Fig. 5 is for showing the view of the present invention the 2nd embodiment.
Fig. 6 is for showing the view of the present invention the 2nd embodiment.
Fig. 7 is for showing the view of the present invention the 3rd embodiment.
Fig. 8 is for showing the view of the present invention the 3rd embodiment.
Fig. 9 is for showing the view of the present invention the 3rd embodiment.
Figure 10 is for showing the view that relates to element installation example among the present invention the 3rd embodiment.
Figure 11 is for showing the front view that relates to element installation example among the present invention the 3rd embodiment.
Figure 12 is for showing that element is installed the left view of example shown in Figure 11.
Figure 13 is for showing that element is installed the right view of example shown in Figure 11.
Figure 14 is the view that shows the structure example of the PCB design CAD system (computer aided design system) that relates to the present invention the 4th embodiment.
Figure 15 is the flow chart that shows the processing procedure example of the PCB design CAD system that relates to the present invention the 4th embodiment.
Embodiment
Below, with reference to accompanying drawing embodiments of the invention are described.
At first, with reference to accompanying drawing 1～accompanying drawing 3 explanations the 1st embodiment of the present invention.
The patterning that described the 1st embodiment adopts is: have respectively with opposite both sides on the printed circuit board (PCB) of surface mounted component as mounting object of varying number electrode, the weld zone length of the less side of electrode on the installed surface of surface mounted component is extended to the direction of the more side of electrode.
In the present embodiment, be provided with 2 lead-in wire electrodes 21 (1), 21 (2) in the side on a limit, be provided with 1 lead-in wire electrode 22 (1) in the side of the another side relative with this limit, with (up and down) about electrode structure asymmetrical surface mounted component 20 is example, has shown its pattern arrangement.
In Fig. 1, shown the pattern arrangement of mounting portion in the surface mounted component that forms by the configuration of standard design pattern, and an example that is installed in the surface mounted component on this installed surface.On printed circuit board (PCB) (circuit board main body) 10,, dispose the weld zone 11 (1), 11 (2), 12 (1) that scolding tin engages described lead-in wire electrode 21 (1), 21 (2), 22 (1) corresponding to the configuration of standard design pattern.Each lead-in wire electrode 21 (1), 21 (2), 22 (1) of surface mounted component 20 is respectively identical shape and has identical solder bonding faces.In addition, the weld zone 11 (1), 11 (2), 12 (1) of printed circuit board (PCB) 10 also is identical shape.
In the weld zone in 11 (1), 11 (2), 12 (1), with each lead-in wire electrode 21 (1), 21 (2), 22 (1) be provided with is relevant, along the bearing of trend of described lead-in wire electrode, and electrode engagement face top between, have the gap of the fusion scolding tin stationary plane that has formed length a (referring to Fig. 2).Arrow t among Fig. 1 has shown at electrode 21 (1) that each is gone between, 21 (2), 22 (1) reflow solderings are in the weld zone 11 (1) of printed circuit board (PCB) 10,11 (2), 12 (1) when going up, and the diffusion of upwards stating gap area by fusion scolding tin acts on the direction and the equalization of strain of the tension force on the surface mounted component 20.
In Fig. 2, shown the patterning of the 1st embodiment among the present invention corresponding with Fig. 1.
Be with the difference of patterning among Fig. 1: establishing weld zone shown in Figure 1 11 (1), 11 (2), the length of the arrow t direction in 12 (1) gap is a, weld zone 11 (1), 11 (2), when 12 (1) equidirectional length (total length) is b, the equidirectional length c of the weld zone 12 (1) of the less side of number of electrodes is extended to more than or equal to (a+b), and promptly (c 〉=(a+b)).The weld zone that has shown described extension in the accompanying drawings with label 12 (1a).In addition, shown the weld zone allocation position that forms by the configuration of standard design pattern with double dot dash line.
In Fig. 3, shown in patterning corresponding to the 1st embodiment shown in Figure 2, with each lead-in wire electrode 21 (1), 21 (2), 22 (1) reflow solderings are in the weld zone 11 (1) of printed circuit board (PCB) 10, arrangements of components state on the printed circuit board (PCB) in the time of on 11 (2), 12 (1).At electrode 21 (1) that each is gone between, 21 (2), 22 (1) reflow solderings are in the weld zone 11 (1), 11 (2), under the state on 12 (1a), surface mounted component 20 is mounted after producing offset on the printed circuit board (PCB) 10, so that make the lead-in wire electrode 21 (1) of the more side of number of electrodes in the surface mounted component 20,21 (2) soldered joint face roughly is arranged in the weld zone 11 (1) of printed circuit board (PCB) 10 correspondences, 11 (2) central authorities, and the lead-in wire electrode 22 (1) of the less side of number of electrodes of surface mounted component 20 guarantees that sufficient soldered joint face ground is by on the weld zone 12 (1a) of soldered joint correspondence in printed circuit board (PCB) 10.
Below, with reference to accompanying drawing 4～Fig. 6 the 2nd embodiment of the present invention is described.
The patterning of described the 2nd embodiment is: have respectively with opposite both sides on the printed circuit board (PCB) of surface mounted component as mounting object of varying number electrode, make in the weld zone length of the less side of installed surface top electrode of the surface mounted component direction shift position to the more side of electrode.
Described the 2nd embodiment is the same with the 1st embodiment, be provided with 2 lead-in wire electrodes 21 (1) in the side on a limit, 21 (2), be provided with 1 lead-in wire electrode 22 (1) in the side of the another side relative with this limit, with (up and down) about electrode structure asymmetrical surface mounted component 20 is example, has shown its pattern arrangement.
In Fig. 4, shown pattern arrangement according to standard design pattern mounting portion configuration, surface mounted component 20 identical with Fig. 1, and an example that is installed in the surface mounted component 20 on this installed surface.In Fig. 4, the gap length of establishing corresponding to the weld zone 12 (1) of the less side of number of electrodes in the printed circuit board (PCB) 10 of length a among Fig. 2 is d.
In Fig. 5, shown patterning corresponding to the 2nd embodiment among the present invention of Fig. 4.
Herein, the allocation position of weld zone 12 (1b) that makes the less side of number of electrodes in the printed circuit board (PCB) 10 standard layout configuration from the Fig. 4 shown in the double dot dash line is also moved distance more than or equal to a (d 〉=a) to the weld zone of the more side of number of electrodes 11 (1), 11 (2) directions.Shown weld zone after described move with label 12 (1b) in the accompanying drawings.
In Fig. 6, shown in patterning, each lead-in wire electrode 21 (1) corresponding to the present invention the 2nd embodiment of Fig. 5,21 (2), 22 (1) reflow solderings are in the weld zone 11 (1), 11 (2) of printed circuit board (PCB) 10, the arrangements of components state on the printed circuit board (PCB) when 12 (1b) go up.At electrode 21 (1) that each is gone between, 21 (2), 22 (1) reflow solderings are in the weld zone 11 (1), 11 (2), under the state on 12 (1b), surface mounted component 20 is mounted after producing offset on the printed circuit board (PCB) 10, so that make the lead-in wire electrode 21 (1) of the more side of number of electrodes in the surface mounted component 20,21 (2) soldered joint face roughly is arranged in the weld zone 11 (1) of printed circuit board (PCB) 10 correspondences, 11 (2) central portion, owing to make the weld zone 11 (1) of allocation position in advance to the more side of number of electrodes, 11 (2) directions have moved a, and above (d 〉=a) is so the lead-in wire electrode 22 (1b) of the less side of number of electrodes guarantees that also sufficient soldered joint face ground is by on the weld zone 12 (1b) of soldered joint correspondence in printed circuit board (PCB) 10 in the surface mounted component 20.
Below, with reference to accompanying drawing 7～Fig. 9 the 3rd embodiment of the present invention is described.
The patterning of described the 3rd embodiment is: having respectively with opposite both sides on the printed circuit board (PCB) of surface mounted component as mounting object of varying number electrode, enlarge the weld zone width of the less side of installed surface top electrode of above-mentioned surface mounted component along the weld zone orientation of the more side of electrode.
Described the 3rd embodiment is the same with the 1st and 2 embodiment, be provided with 2 lead-in wire electrodes 21 (1) in the side on a limit, 21 (2), be provided with 1 lead-in wire electrode 22 (1) in the side of the another side relative with this limit, with (up and down) about electrode structure asymmetrical surface mounted component 20 is example, has shown the configuration of its pattern.
In Fig. 7, shown according to the standard design pattern identical configuration with Fig. 4, the pattern arrangement of mounting portion in the surface mounted component, an and example that is installed in the surface mounted component on this installed surface.
In Fig. 8, shown patterning corresponding to the 3rd embodiment among the present invention of Fig. 7.
Herein, weld zone 11 (1) along the more side of electrode, 11 (2) orientation is extended to the weld zone 11 (1) of the more side of number of electrodes with the width of the weld zone 12 (1) of the less side of number of electrodes in the above-mentioned printed circuit board (PCB) 10, and more than 2 times or 2 times of 11 (2) width (y 〉=2x).The weld zone that has enlarged described width is represented with label 12 (1c) in the drawings.In addition, y among the figure is the gap length from the soldered joint end of the lead-in wire electrode 22 (1) on the above-mentioned Width on the weld zone 12 (1c) of the less side of number of electrodes to the weld zone end, x is the weld zone 11 (1) from the more side of number of electrodes, the soldered joint end of the lead-in wire electrode 21 (1), 21 (2) of the above-mentioned Width on 11 (2) is to the gap length of weld zone end.
In Fig. 9, shown in patterning, each lead-in wire electrode 21 (1) corresponding to the present invention the 3rd embodiment of Fig. 8,21 (2), 22 (1) reflow solderings are in the weld zone 11 (1), 11 (2) of printed circuit board (PCB) 10, the arrangements of components state on the printed circuit board (PCB) when 12 (1c) go up.At each lead-in wire electrode 21 (1) with described surface mounted component 20,21 (2), 22 (1) reflow solderings are in the weld zone 11 (1) of printed circuit board (PCB) 10,11 (2), under the state on 12 (1c), follow lead-in wire electrode 21 (1) with the more side of number of electrodes, 21 (2) the corresponding weld zones 11 (1) that are provided with, 11 (2) and the tension force that acts on the element with the expansion of the fusion soldering of the weld zone 12 (1c) of lead-in wire electrode 22 (1) the corresponding settings of the less side of number of electrodes all equate, thereby can not cause the offset of surface mounted component 20 being installed on the printed circuit board (PCB) 10 with guaranteeing sufficient composition surface on the design attitude.
The installation example that in Figure 10～Figure 13, has shown the element among described the 3rd embodiment.In Figure 10, show lead-in wire electrode 21 (1), 21 (2), the state of 22 scolding tin of covering of having eliminated.The weld zone 11 (1), 11 (2) of this moment, the soldering fusion face on 12 (1c) shows with oblique line in the drawings.Figure 11, Figure 12, Figure 13 are that (3 directions) observes side view surface mounted component 20, expression element installment state from each side.Figure 11 is a front view, and Figure 12 is a left view, and Figure 13 is a right view.Label 30 among the figure is that 22 (1) reflow solderings are in the weld zone 11 (1), 11 (2) of printed circuit board (PCB) 10, the scolding tin when 12 (1c) go up with each lead-in wire electrode 21 (1), 21 (2) of surface mounted component 20.
Figure 14 and Figure 15 have shown the structure example that can carry out by the PCB design CAD system of the design of above-mentioned each embodiment.
Figure 14 is for showing the block diagram of above-mentioned PCB design CAD system structure, and it has PCB design CAD110, input part 120, database 130 and display part 140, and PCB design supplementary module 150 and constituting.
PCB design CAD110 is according to the instruction by the designer of input part 120 input, carries out the configuration of each layer pattern, through hole, non through hole, via pattern (via pattern) etc. in the multilayer board for example and the processing of connection.Supply with the design information of the patterned arrangement of printed circuit board (PCB) herein, to PCB design supplementary module 150.
The information of database 130 storage thermal change key element during about the element of fitting printed circuit board, the substrate when comprising the soldering fusion and installation elements.
PCB design supplementary module 150 has carried out the design information of the printed circuit board (PCB) of patterned arrangement from above-mentioned PCB design CAD110 acquisition, the various information of the thermal change key element of substrate when above-mentioned database 130 obtains element about fitting printed circuit board, when comprising the soldering fusion and installation elements, based on the various information of these acquisitions, the manufacturing inspection when execution is installed in the element soldering on the above-mentioned printed circuit board (PCB), pattern inspection etc.
In this case, carry out design aid in treatment routine shown in Figure 15.
(step S11 during the surface mounted component of design aid in treatment routine (up and down) asymmetrical electrode about selecteed element is to have shown in Figure 15, S12Yes), utilize user interface to allow the designer select to carry out which kind of design (step S13) in the foregoing description 1～3.Herein, when selective rule 1 (step S14), relate to the pattern correction (step S21) of the foregoing description 1, when selective rule 2 (step S15), relate to the pattern correction (step S22) of the foregoing description 2, when selective rule 3 (step S16), relate to the pattern correction (step S23) of the foregoing description 3.
, selecting (step S14YES) at regular 1 o'clock herein, as shown in Figure 1 to Figure 3, making the pattern correction that the weld zone length of the less side of installed surface top electrode of surface mounted component extends to the direction of the more side of electrode (c 〉=(a+b)) (step S21).
When selective rule 2 (step S15YES), to shown in Figure 6, the weld zone length of the less side of installed surface top electrode that makes surface mounted component is to pattern correction (d 〉=a) (the step S22) of the direction shift position of the more side of electrode as Fig. 4.
When selective rule 3 (step S16YES), to shown in Figure 9, carry out along pattern correction (y 〉=2x) (the step S23) of the weld zone width of the less side of installed surface top electrode of the orientation enlarged surface installation elements of the weld zone of the more side of electrode as Fig. 7.
In addition, in step S12 and step S16, be under the situation of NO, do not carry out the pattern correction, be transferred to next process.
Those skilled in the art with can easy to understand other advantage and improvement.Therefore, should not be limited to shown here and described specific detail and respective embodiments in the present invention of broad aspect more.So, under the situation of thought that does not break away from total inventive concept that claim and equivalent thereof limit and scope, can make various improvement.
Claims (2)
1. printed circuit board (PCB) by coming the installation surface installation elements to form according to the Wiring pattern that is formed on the insulated substrate is characterized in that possessing:
Circuit board main body has the installed surface that described surface mounted component is installed, and described surface mounted component has the electrode of varying number respectively on opposite two limits of element body;
The weld zone is arranged on the described circuit board main body, corresponding with the electrode of described surface mounted component and the weld zone length of the less side of described electrode is extended to the direction of the more side of described electrode.
2. printed circuit board (PCB) according to claim 1 is characterized in that:
The distance along the soldering fusion face between the electrode allocation position front end of the action direction of described soldering tension force along the front end of the action direction of described soldering tension force and described surface mounted component on will the weld zone before extending is made as a,
Described weld zone is made as b along the length of the action direction of described soldering tension force,
With the weld zone that is extended of the less side of described electrode when the length of bearing of trend is made as c,
Make c 〉=(a+b).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP424959/2003 | 2003-12-22 | ||
| JP2003424959A JP4227008B2 (en) | 2003-12-22 | 2003-12-22 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1638608A CN1638608A (en) | 2005-07-13 |
| CN100456909C true CN100456909C (en) | 2009-01-28 |
Family
ID=34784990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100597663A Expired - Fee Related CN100456909C (en) | 2003-12-22 | 2004-06-18 | Printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4227008B2 (en) |
| KR (1) | KR100606221B1 (en) |
| CN (1) | CN100456909C (en) |
| TW (1) | TWI244360B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112006000153B4 (en) * | 2005-03-29 | 2009-11-26 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Arrangement with an electronic component and a circuit board |
| JP2007123617A (en) * | 2005-10-28 | 2007-05-17 | Toshiba Corp | Printed wiring board, electronic apparatus incorporating printed wiring board, and process for producing printed wiring board |
| US10160092B2 (en) | 2013-03-14 | 2018-12-25 | Cabot Microelectronics Corporation | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls |
| CN107079586B (en) | 2014-10-23 | 2019-06-11 | 三菱电机株式会社 | Distributing board, motor, electrical equipment and air conditioner |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350219A (en) * | 1993-06-11 | 1994-12-22 | Rohm Co Ltd | Board mounting structure for solid electrolytic capacitor |
| US6069323A (en) * | 1997-01-21 | 2000-05-30 | Dell Usa, L.P. | Pad with indentations surface mount |
| JP2000299548A (en) * | 1999-04-12 | 2000-10-24 | Kenwood Corp | Land structure for printed board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0690077A (en) * | 1992-01-31 | 1994-03-29 | Hitachi Telecom Technol Ltd | Printed wiring board |
| JPH06334320A (en) * | 1993-05-20 | 1994-12-02 | Mitsubishi Electric Corp | Mounting method for electronic component |
| KR200157790Y1 (en) | 1993-11-19 | 1999-10-01 | 손욱 | Parts installation system of pcb using lithograph display module |
| JPH07288378A (en) * | 1994-04-18 | 1995-10-31 | Fujikura Ltd | Printed wiring board |
-
2003
- 2003-12-22 JP JP2003424959A patent/JP4227008B2/en not_active Expired - Fee Related
-
2004
- 2004-05-31 TW TW093115549A patent/TWI244360B/en not_active IP Right Cessation
- 2004-06-08 KR KR1020040041683A patent/KR100606221B1/en not_active IP Right Cessation
- 2004-06-18 CN CNB2004100597663A patent/CN100456909C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350219A (en) * | 1993-06-11 | 1994-12-22 | Rohm Co Ltd | Board mounting structure for solid electrolytic capacitor |
| US6069323A (en) * | 1997-01-21 | 2000-05-30 | Dell Usa, L.P. | Pad with indentations surface mount |
| JP2000299548A (en) * | 1999-04-12 | 2000-10-24 | Kenwood Corp | Land structure for printed board |
Non-Patent Citations (4)
| Title |
|---|
| 影响SMT焊接质量的几个工艺性设计因素. 刘秀峰，张军强.宁夏工程技术，第2003卷第04期. 2003 |
| 影响SMT焊接质量的几个工艺性设计因素. 刘秀峰，张军强.宁夏工程技术，第2003卷第04期. 2003 * |
| 表面贴装印制板设计要点. 彭占勇.电子工艺技术，第2001卷第01期. 2001 |
| 表面贴装印制板设计要点. 彭占勇.电子工艺技术，第2001卷第01期. 2001 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4227008B2 (en) | 2009-02-18 |
| TWI244360B (en) | 2005-11-21 |
| TW200522822A (en) | 2005-07-01 |
| JP2005183797A (en) | 2005-07-07 |
| CN1638608A (en) | 2005-07-13 |
| KR20050063656A (en) | 2005-06-28 |
| KR100606221B1 (en) | 2006-07-31 |
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