JP2005183143A - Electrical contact structure body and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical contact structure body capable of realizing smaller size and less number of parts especially as compared with the conventional one, and capable of being easily and surely electrically connected with among a connection part such as a printed-circuit board in a simple structure, and to provide its manufacturing method. <P>SOLUTION: The electrical contact structure body 24 is constituted of a spiral contactor 26, a holding body 25 holding the spiral contactor 26 and a conduction part 28 formed in a recessed part 27 leading from under the base part 26b of the spiral contactor 26 to a rear surface of the holding body. Thereby, the electrical contact structure body having small size, excellent conductivity and a simple structure as compared with the conventional one can be obtained with low production cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electrical contact structure having an electrical contact portion that is electrically contacted with a contacted body, and more particularly to an electrical contact structure used as a component such as an IC socket or a connector. In particular, it is possible to reduce the number of parts and reduce the number of parts compared to the conventional case, and it is possible to easily and reliably conduct electrical connection with a connected part such as a printed wiring board with a simple structure. The present invention relates to a structure and a manufacturing method thereof.

  As an example of a device in which an electrical contact structure is incorporated, the following semiconductor inspection device is given. The semiconductor inspection apparatus described in Patent Document 1 electrically temporarily connects a semiconductor to an external circuit board or the like. A large number of spherical contacts arranged in a lattice shape or a matrix shape are provided on the back side of the semiconductor, and a large number of concave portions are provided on an insulating substrate opposite to the spherical contacts, and spiral contacts are provided in the concave portions. Opposed.

When the back side of the semiconductor is pressed toward the insulating substrate, the spiral contact contacts the outer surface of the spherical contact so that the spiral contact wraps spirally. The electrical connection between the two is ensured.
JP 2002-175859 A

  The electrical contact structure including the insulating substrate and the spiral contact has a shape shown in FIG. 17, for example.

  The electrical contact structure 1 has a structure in which a plurality of spiral contacts 2 are attached to an insulating substrate (hereinafter referred to as a base) 3. The base 3 is provided with a plurality of recesses (through holes) 3a penetrating from the front surface to the back surface, and the spiral contactor 2 is provided on the upper surface of the recess 3a.

  FIG. 18 is a partially enlarged back surface of the spiral contact 2 shown in FIG. 17 when one spiral contact 2 is viewed from the back surface side of the base 3.

  As shown in FIG. 18, a conductive portion 10 that is conductively connected to the spiral contact 2 is exposed around the recess 3a. The back surface of the conducting part 10 is flush with the back surface of the base 3.

The electrical contact structure 1 is formed through the steps shown in FIG. 19, for example.
In the step of FIG. 19A, a resist layer 5 in which the pattern 5 a of the spiral contact 2 is formed by exposure and development is formed on the Cu substrate 4, and the spiral contact 2 is formed in the pattern 5 a of the resist layer 5.

  In the step shown in FIG. 19B, after removing the resist layer 5, the guide frame 6 made of resin or the like is positioned so that the hole 6a provided in the guide frame 6 just faces each spiral contactor 2. Thereafter, the guide frame 6 is pasted between the bases 2a of the spiral contacts 2 (see also FIG. 17).

  Next, in the step of FIG. 19C, the Cu substrate 4 is removed by using a method such as etching. Each spiral contact 2 is connected by the guide frame 6.

  Next, in the process of FIG. 19D, the spiral contact 2 is bonded and fixed to the base 3 in which the through hole 3a is formed just at the position facing the spiral contact 2 using a conductive adhesive 8 or the like.

A conductive portion 10 is formed on the inner surface 7b of the through hole 3a of the base 3 by sputtering or the like.
Then, in step 19E, the spiral contact 2 is three-dimensionally formed using the protrusion adjusting member 9.

  In the step of FIG. 19F, the connection terminal 11 is provided on the back side of the base 3 via the conductive adhesive 14.

  Furthermore, a printed circuit board 12 having a plurality of wiring patterns and other circuit components is provided below the base 3, and the base 3 is fixed on the printed circuit board 12.

  A counter electrode 13 is provided on the surface of the printed circuit board 12 so as to oppose the connection terminal 11 provided on the bottom surface of the base 3. The connection terminal 11 and the counter electrode 13 are connected to each other by a conductive adhesive. Conductive connection is made through such as.

  Incidentally, the electrical contact structure 1 obtained through the steps of FIGS. 19A to 19F has the following problems.

  First of all, the electrical structure 1 mainly includes a spiral contact 2, a base 3, a guide frame 6, a conduction part 10, and a connection terminal 11. The formation of the electrical structure 1 has a large number of parts, leading to an increase in production cost. In particular, the base 3 is a complex structure in which the conductive portion 10 is formed on the inner surface of the through-hole 3a by a sputtering method. The cost of the base 3 is high, and the production cost of the electrical structure 1 is large. It was a factor.

  Secondly, the spiral contact 2 and the connection terminal 11 are bonded and fixed to the conductive portion 10 via conductive adhesives 8 and 14, and between the connection terminal 11 and the counter electrode 13 of the printed circuit board 12. Was also bonded and fixed via a conductive adhesive.

  However, in the bonding and fixing method using a conductive adhesive, it is necessary to thermocompression between the members at that time. If the thermocompression bonding is not uniform between the entire members, the continuity between the two members is deteriorated and reliability is increased. As a result, it was necessary to perform fine manufacturing because of the need to perform thermocompression bonding with high accuracy.

  Third, the conventional electrical contact structure 1 is unsuitable for downsizing. For example, if the spiral contact 1 itself is further reduced in size, the through hole 3a provided in the base 3 must be reduced accordingly. If the through hole 3a is too small, the through hole 3a is reduced. The conduction part 10 cannot be formed with an appropriate film thickness in the hole 3a, resulting in an electrical contact structure 1 having inferior electrical characteristics. For this reason, the through hole 3a cannot be made very small. As a result, even if the spiral contact 1 itself can be made small, the base 3 cannot be made small, and the film thickness of the base 3 is made too thin. If it is too high, the strength of the base 3 itself is lowered, and the spiral contact 2 and the connection terminal 11 cannot be connected to the base 3 with good electrical conductivity by thermocompression bonding using a conductive adhesive. Therefore, the size reduction of the electrical contact structure 1 could not be further promoted.

  Therefore, the present invention is for solving the above-described conventional problems, and in particular, it can realize a reduction in size and a reduction in the number of parts as compared with the conventional one, and a simple structure with a connected portion such as a printed wiring board. It is an object of the present invention to provide an electrical contact structure that can be easily and surely conductively connected and a method for manufacturing the same.

The present invention provides an electrical contact structure including an electrical contact portion that is electrically contacted with a contacted body, and a holding body that holds the electrical contact portion.
The electrical contact portion is held on the front surface side of the holding body, the holding body is provided with a recess reaching the back surface, and a conducting portion is provided in the recess,
The conductive portion is directly connected to the electrical contact portion and is conductively connected to the connected portion on the back side of the holding body.

  The electrical contact structure according to the present invention is composed of an electrical contact portion, a holding body, and a conductive portion, and the number of parts can be reduced as compared with the prior art, thereby obtaining an electrical contact structure having a simple structure. be able to.

In particular, a base that has been necessary in the past is not necessary, and a holding body is provided instead.
In addition, the conductive portion is directly connected to the electrical contact portion and can provide a structure having excellent conductivity without requiring a conductive adhesive as in the prior art.

  In the present invention, the holding body is preferably formed of an organic insulating material. This facilitates the molding and processing of the holding body, and the holding body is thinned in the process of forming the holding body. It can also be formed, and the electrical contact structure can be thinned.

  In the present invention, a solder resist is preferably used for the organic insulating material. In the present invention, this solder resist remains as a holder until the end. In the present invention, it is possible to perform the above-described concave portion formation and conductive portion formation on the holding body formed of the solder resist using a simple manufacturing method, and it is possible to reduce the production cost.

In the present invention, the holding body is provided with a through-hole that leads from the front surface to the back surface, and an end of the electrical contact portion is held at a peripheral portion of the through-hole on the holding body. The portion of the electrical contact portion excluding the end portion is provided to extend to a position facing the through hole in the film thickness direction,
It is preferable that the concave portion is formed from the back surface of the holding body to the end portion at a position away from the through hole.

  As described above, predetermined processing such as three-dimensional forming can be performed from the through hole to the electrical contact portion. In addition, due to the formation of the through hole, the electrical contact portion can be bent into the through hole by contact with the contacted body, and as a result, the electrical contact portion in the through hole can It can be deformed so as to be wrapped, and the electrical contact between the electrical contact portion and the contacted body can be improved. In addition, the recess is provided at a position away from the through hole, and as a result, the conduction portion formed in the recess is not affected by the formation process of the through hole, and the electrical It is possible to obtain an electrical contact structure excellent in electrical characteristics while maintaining good conductivity with the contact part and the contacted part.

  According to the present invention, the electrical contact portion includes a spiral contact portion formed in a spiral shape and a base connected to the spiral contact portion and surrounding the spiral contact portion, and the base is held by the holding portion. It is preferable that the spiral contact portion is provided at a position facing the through hole in the film thickness direction while being held on the body.

  As described above, the electrical contact portion has a spiral contact portion as one specific example. The electrical contact portion having the spiral contact portion can appropriately make electrical contact with the contacted object.

  Further, in the case of the above configuration, the recess is formed from the back surface of the holder to the base so as to surround the periphery of the through hole at a position away from the through hole. It is preferable that the conductive portion formed inside is exposed in a shape surrounding the peripheral portion of the through hole on the back surface of the holding body.

In this invention, it is preferable that the said conduction | electrical_connection part is plated.
In the present invention, the conducting portion has a protruding portion protruding from the back surface of the holding body toward the contacted body portion, and the protruding portion is wider than the width dimension of the conducting portion formed in the recessed portion. It is preferably formed with a width dimension. Thereby, the conduction connection area between the to-be-connected part and the conduction part can be increased, and a good conduction connection between them can be achieved.

  In the present invention, the surface of the protruding portion may be a convex curved surface, and the conductive portion is preferably connected and fixed to the connected portion by solder. In the present invention, it becomes possible to connect and fix with solder to the connected portion by using the protruding portion protruding from the back surface of the holding body as a bump portion among the conductive portions. As compared with the case of thermocompression bonding with a conductive adhesive or the like, the electrical conductivity between the two can be improved.

Moreover, in this invention, the said to-be-connected part is applicable to the form currently formed on the printed circuit board.
The present invention also relates to a method for manufacturing an electrical contact structure comprising an electrical contact portion that is electrically contacted with a contacted body, and a holding body that holds the electrical contact portion.
(A) plating an electrical contact portion on the substrate;
(B) a step of covering the electrical contact portion and the substrate with an organic insulating material layer serving as a holder;
(C) forming a recess in the organic insulating material layer from the surface side of the organic material layer to a predetermined portion of the electrical contact portion;
(D) plating a conductive part in the recess and electrically connecting the conductive part directly on the electrical contact part;
(E) removing the substrate;
It is characterized by having.

  In the present invention, an electrical contact structure having an electrical contact portion, a holding body, and a conduction portion can be manufactured by the above-described steps. The number of manufacturing steps can be reduced as compared with the prior art, and a base that has been conventionally required for manufacturing an electrical contact structure is not necessary, and a holder made of an organic insulating material layer is provided instead. As shown in the steps (c) and (d), the concave portion and the conductive portion can be easily formed in the holding body, and the production cost can be reduced as compared with the conventional case.

  Further, in the above process, since the holding body formed of the organic insulating material layer is formed on the substrate and the electrical contact portion in the step (b) when the substrate still exists, the base unit alone as in the prior art. And the electrical contact portion removed from the substrate is not attached by thermocompression bonding or the like, and the holding body can be easily reduced in thickness according to demand, and the electrical contact structure can be downsized.

  Further, in the step (d), since the conductive portion can be directly connected to the electrical contact portion, it is troublesome to fix the connection while thermocompression bonding between the two using a conductive adhesive as in the past. A process is not necessary, and electrical conductivity between the electrical contact portion and the conductive portion can be improved as compared with the prior art.

Moreover, in this invention, it is preferable to have the following processes between (d) process and (e) process.
(F) A through hole is formed from the surface of the organic insulating material layer to the back surface at a position away from the conductive portion and facing at least a part of the electrical contact portion in the film thickness direction; Exposing a part of the electrical contact portion in the through hole;

Furthermore, it is preferable to have the following process between the said (f) process and the said (e) process.
(G) A step of three-dimensionally forming the electrical contact portion exposed in the through hole.

In the present invention, in the step (a), a spiral contact portion in which the electrical contact portion is formed in a spiral shape, and a base portion that is integrally formed with the spiral contact portion and surrounds the spiral contact portion. Formed with
In the step (c), the organic insulating material layer is formed with a recess that leads from the surface side of the organic material layer to the base of the electrical contact portion,
In the step (f), it is preferable that a portion of the spiral contact portion constituting the electrical contact portion is exposed in the through hole by forming the through hole.

  Moreover, in this invention, it is preferable to use a soldering resist for the organic insulating material layer used at the said (b) process.

  At this time, it is preferable that a positive resist is used as the solder resist, and the exposed portion of the solder resist is removed by exposure and development using the mask layer in the step (c) to form a recess. Further, it is preferable to form a through hole by removing the exposed portion of the solder resist by exposure and development using the mask layer in the step (f).

  As described above, by using a positive solder resist, it is possible to easily and appropriately form the recess and the through hole in the holding body. In the present invention, the organic insulating material layer formed of the solder resist can be left to the end to function as a holding body.

  Conventionally, there has been a need to separately prepare a base on which the electrical contact portion is attached. However, in the present invention, in a series of manufacturing processes, a holding body serving as a base can also be formed. There is a feature point. In the case where a base is provided separately as in the prior art, there are problems such as an increase in production cost and a lengthening of the manufacturing process. The holding body can be manufactured, the electrical contact structure can be manufactured by a simple method, and the structure of the electrical contact structure can be simplified.

  In the present invention, it is preferable that bumps are formed in the step (d) so that the conductive portion rises from the surface of the organic insulating material layer. As a result, the connection area between the connected portion provided on the printed circuit board and the conductive portion can be increased, and the conductive portion protrudes toward the connected portion, so that the conductive portion and the connected portion are opposed to each other. Sometimes, a space is easily formed between the back surface of the holding body and the connected part, and this space can be made a space part for soldering, and the conductive part and the connected part can be easily soldered. Can be fixed.

  The electrical contact structure according to the present invention is composed of an electrical contact portion, a holding body, and a conductive portion, and the number of parts can be reduced as compared with the prior art, thereby obtaining an electrical contact structure having a simple structure. be able to. In particular, a base that has been necessary in the past is not necessary, and a holding body is provided instead.

  In addition, the conductive portion is directly connected to the electrical contact portion and can provide a structure having excellent conductivity without requiring a conductive adhesive as in the prior art.

  Further, according to the manufacturing method of the present invention, the number of manufacturing processes can be reduced as compared with the conventional method, and the base that has been conventionally required for manufacturing the electrical contact structure is not necessary, and an organic insulating material can be used instead. A holding body made of a material layer is provided. In the present invention, the concave portion and the conductive portion can be easily formed on the holding body, and the production cost can be reduced as compared with the conventional case.

  In the above process, since the holding body formed of the organic insulating material layer is formed on the substrate and the electrical contact portion when the substrate still exists, it is removed from the base unit and the substrate as in the conventional case. The electrical contact portion is not attached by thermocompression bonding or the like, and the holding body can be easily reduced in thickness according to demand, and the electrical contact structure can be downsized.

  Furthermore, since the conductive portion can be directly connected on the electrical contact portion, a complicated process such as connecting and fixing while thermocompression bonding using a conductive adhesive is not required as in the prior art. The electrical conductivity between the electrical contact portion and the conducting portion can also be made better than the conventional one.

  FIG. 1 is a perspective view showing an inspection apparatus used in a test for confirming the operation of an electronic component.

  As shown in FIG. 1, the inspection apparatus 20 includes a concave-shaped base 21 and a lid 22 that is rotatably supported via a hinge part 23 provided on one edge of the base 21. Configured. The base 21 and the lid body 22 are made of an insulating resin material or the like, and a loading area 21A that is concave in the Z2 direction is formed at the center of the base 21. An electrical contact structure 24 to be described below is provided in the loading region 21A, and an electronic component 25 such as a semiconductor can be mounted on the electrical contact structure 24. A locked portion 24 is formed on the other edge of the table 21.

  As shown in FIG. 1, at the center position of the inner surface of the lid 22 of the inspection apparatus 20, a convex pressing portion 22a that presses the electronic component 25 downward in the figure is provided so as to face the loading area 21A. Yes. In addition, a lock portion 26 is formed at a position opposite to the hinge portion 23.

  Between the inner surface of the lid body 22 and the pressing portion 22a, a biasing member made of a coil spring or the like that biases the pressing portion 22a away from the inner surface of the lid body 22 is provided (not shown). . Therefore, when the electronic component 25 is mounted in the mounting region 21A and the lid 22 is closed and locked, the electronic component 25 can be elastically pressed in the direction approaching the surface of the mounting region 21A (Z2 direction). It has become.

  2 is a plan view of the electrical contact structure 24, FIG. 3 is a partially enlarged plan view in which the area A shown in FIG. 2 is enlarged, and FIG. 3 is a view of the A area from the back side of the electrical contact structure 24. 5 is a partially enlarged rear view, FIG. 5 is a partially enlarged sectional view of the electrical contact structure 24 when the region A shown in FIG. 2 is cut from the film thickness direction, and from the upper side of the electrical contact structure 24. FIG. 3 is a partial enlarged cross-sectional view of an electronic component 25 that abuts and a printed circuit board 30 that is connected and fixed to the lower side of the electrical contact structure 24;

  The electrical contact structure 24 shown in FIG. 2 includes a holding body 25 and a large number of spiral contacts (electrical contact portions) 26. In FIG. 2, the spiral contacts 26 are regularly arranged so as to form a two-row frame shape surrounding the periphery of the surface of the holding body 25, but how the spiral contacts 26 are arranged is as follows. Depending on the position where the contact 35 (contacted body) provided on the back side of the electronic component 25 is formed.

  As shown in FIGS. 3 and 5, the holding body 25 is provided with a through hole 25a penetrating from the front surface 25b to the back surface 25c. In FIG. 3, the through hole 25a has a substantially circular cross section in the film surface direction (direction parallel to the XY plane shown in the drawing). Although the shape of the through hole 25a may be other forms, the contact 26 provided on the through hole 25a has a spiral shape, so that the spiral contact 26 is appropriately opposed to the through hole 25a. In order for the spiral contactor 26 to smoothly enter the through hole 25a during electrical contact with the contact 35 of the electrical component 25, the cross section of the through hole 25a parallel to the film surface direction is substantially circular. The shape is preferred. In FIG. 3, the spiral contact 26 located on the through hole 25a is shown by hatching.

  As shown in FIGS. 3 and 5, the spiral contact 26 is exposed on the through hole 25a, is formed in a spiral shape, and contacts the contact of the electronic component 25; The contact portion 26a is formed integrally with a base portion 26b surrounding the contact portion 26a. As shown in FIG. 5, the contact portion 26a is three-dimensionally shaped so as to protrude spirally upward. Thereby, good electrical connection can be obtained with the contact 35 provided on the back surface of the electronic component 25.

  As shown in FIG. 5, the base portion 26 b is held on the surface 25 b of the holding body 25. The surface 25b of the holding body 25 has a low surface 25b1 formed around the through hole 25a, and a high surface 25b2 that is one step higher from the outer edge of the low surface 25b1 in a direction away from the through hole 25a. Is formed. The base 26b is formed in a notch between the high surface 25b2 and the low surface 25b1, and the surface 26b1 of the base 26b and the high surface 25b2 are flush with each other.

  No other member such as a conductive adhesive is interposed between the base portion 26b and the holding body 25, and the base portion 26b and the holding body 25 are directly joined. As will be described later in the manufacturing method, the holding body 25 is formed of an organic insulating material, and is first applied so as to cover the spiral contact 26, and a base portion 26 b of the spiral contact 26. The holding body 25 is connected and fixed by an anchor effect or the like.

  As shown in FIG. 5, a concave portion 27 is formed from the lower surface 26b2 of the base portion 26b to reach the holding body 25 to the back surface 25c. A conducting portion 28 is formed in the recess 27 by, for example, plating.

  The concave portion 27 is formed so as to surround the through hole 25a at a position farther outward than the through hole 25a formed in the holding body 25. As shown in FIG. The conductive portion 28 is exposed in a substantially circular border shape surrounding the peripheral portion of the through hole 25a on the back surface 25c of the holding body 25.

  The conducting portion 28 is formed in the holding body 25 and is not exposed from other parts of the holding body 25 except that it is exposed from the back surface 25c of the holding body 25. That is, the conductive portion 28 is not exposed in the through hole 25a. The conductive portion 28 can be formed so as to be exposed in the through hole 25a. However, since the conductive portion 28 may be deteriorated in electrical characteristics, the conductive portion 28 may be formed in the through hole 25a. It is not preferable to expose the conductive portion 28.

  Therefore, in the present invention, in order to form the conductive portion 28 in the holding body 25, the concave portion 27 in which the conductive portion 28 is to be formed is provided at a position away from the through hole 25a.

  As shown in FIG. 5, the concave portion 27 is formed in a straight shape from the lower surface 26b2 of the base portion 26b of the spiral contactor 26 to the back surface 25c of the holding body 25, but may have a shape other than the straight shape. . However, the straight shape is most preferable, and the continuity between the base portion 26b and the conductive portion 28 can be improved, which is preferable.

  As shown in FIG. 5, the conductive portion 28 has a protruding portion 28 a protruding from the back surface 25 c of the holding body 25, and the protruding portion 28 a is a width dimension of the conductive portion 28 formed in the concave portion 27. It is formed with a wider width dimension.

  The protruding portion 28a is formed by bump formation when the conductive portion 28 is plated, and the surface 28a1 of the protruding portion 28a is formed in a convex curved surface shape. Thus, the formation of the protruding portion 28a by bump formation results in a conductive contact area with the counter electrode 31 (connected portion) located on the printed wiring board 30 provided on the lower side of the electrical contact structure 24. Further, when the counter electrode 31 and the protrusion 28a are brought together, a space portion 32 is formed between the holding body 25 and the counter electrode 31. 32 can be used as a solder forming portion when the counter electrode 31 and the protruding portion 28a are connected by the solder 33, and the counter electrode 31 and the protruding portion 28a can be appropriately soldered. And the conductive connection between the conductive portions 28 can be kept good. Further, in the present invention, since the counter electrode 31 and the protruding portion 28a can be soldered, there is no need for a thermocompression bonding process or the like when using a conductive adhesive as in the prior art, and the counter electrode can be easily and reliably provided. 31 and the protruding portion 28a can be electrically connected.

  The material of each member will be described. The spiral contact 26 is formed by plating, copper foil, or the like, but it is preferable that the spiral contact 26 is finely processed because the spiral contact 26 can be finely processed. The spiral contact 26 formed by plating preferably has a laminated plating structure. For example, the spiral contact 26 has a structure in which Au / Ni / Au are laminated in this order from the bottom.

  The holding body 25 is preferably formed of an organic insulating material. By forming the holding body 25 from an organic insulating material, it is possible to appropriately and easily form the concave portion 27 and the through hole 25a in the holding body 25 without damaging the spiral contact 26, and the concave portion 27 can be formed with high accuracy. Or the through hole 25a can be formed.

  In particular, the holding body 25 is preferably formed using a solder resist. As will be described later in the manufacturing method, the concave portions 27 and the through holes 25a can be easily and accurately formed by exposure and development on the holding body 25 formed of a solder resist.

The conductive portion 28 is preferably formed by plating. The conductive portion 28 is preferably made of a metal material having excellent conductivity such as Cu, Au, or a platinum group element. In the present invention, the conductive portion 28 can be plated and grown under the base portion 26b of the metal spiral contact 26 by plating the conductive portion 28, and the conductive portion 28 and the base portion 26b are electrically conductive. Both can be connected appropriately and reliably without using a conductive adhesive or the like.
For example, cream solder is used for the solder 33.

  The electronic component 25 is set on the electrical contact structure 24 formed as described above from the direction of the arrow shown in FIG. 5, and the lock portion 26 of the lid 22 shown in FIG. When locked, the electronic component 25 is pressed downward in the figure by the pressing portion 22a, so that the contact 35 provided on the back surface of the electronic component 25 has each spiral contact 26 formed in the through hole 25a formed in the holding body 25. Is pushed down in the internal direction (downward in the figure). At the same time, the outer shape of the spiral contactor 26 is deformed so as to be spread and wound so as to embrace the outer surface of the contactor 35 so that each contactor 35 and each spiral contactor 26 are electrically connected well. The

  FIG. 6 is an exploded perspective view of the connector 45 having the electrical contact structure 41 according to the present invention.

  As shown in FIG. 6, the electrical contact structure 41 has a large number of spiral contacts 43 and a holding body 44. The specific internal structure and the like are shown in FIGS. As explained in.

  The electrical contact structure 41 is accommodated in a notch 40a formed in the base 40, and the electrical contact with a connection terminal (not shown) provided on the surface of the notch 40a. The conducting portion of the structure 41 (the same configuration as the conducting portion 28 shown in FIG. 5) is connected and fixed by soldering.

Reference numeral 46 denotes a printed wiring board 46, and a large number of electrode parts (not shown) are provided on the back surface of the printed wiring board 46. A lid 42 made of resin or the like is provided on the printed wiring board 46, and the lid 42 is fitted in the notch 40 a of the base 40. When the lid 42 is fitted into the notch 40 a of the base 40, the spiral contact 43 of the electrical contact structure 41 is conductively connected to the electrode portion of the printed wiring board 46.
The connector 45 shown in FIG. 6 can be mounted and used in an electronic device such as a mobile phone.

The characteristic part of the electrical contact structure 24 in the present invention will be described below.
In the present invention, the electrical contact structure 24 includes a spiral contact 26 that is an electrical contact part, a holding body 25, and a conduction part 28, and can basically be constituted by only these members. Therefore, the number of parts can be reduced as compared with the conventional electrical contact structure, and the electrical contact structure 24 having a simple structure can be manufactured.

  In the present invention, the spiral contact 26 can be directly attached to the holding body 25, and the conducting portion 28 can be formed by plating or the like in the recess 27 provided in the holding body 25. The conductive portion 28 can be directly conductively connected. In the past, the spiral contactor 26 was attached to a base that was purchased separately using a conductive adhesive, and was electrically connected to a conductive portion provided on the base. However, in the present invention, the spiral contact 26 is directly attached to the holding body 25 without using a conductive adhesive, and the conduction is not achieved. The portion 28 can be conductively connected, and can be easily attached and can have good conductivity.

  In particular, in the present invention, the holding body 25 is formed of an organic insulating material or the like, and the recess 27 and the through hole 25a are easily and accurately formed in the holding body 25 without damaging the spiral contactor 26. be able to. In the present invention, the conductive portion 28 is formed in the concave portion 27 by plating or the like, but the through hole 25a and the concave portion 27 are formed separately, and the inner surface of the through hole provided in the base like a conventional base. The conductive part is not formed by sputtering. In the conventional internal structure of the base, the through hole of the base cannot be made very small due to the necessity of ensuring the film thickness of the conductive portion, and the size of the entire electrical contact structure is appropriately promoted. In the present invention, the through hole 25a is formed separately from the formation of the recess 27 for forming the conducting portion 28, and in particular, the holding body 25 is formed of a material that can be easily processed precisely such as an organic insulating material. Therefore, a fine through hole 25a can be formed in the holding body 25 in accordance with the size of the spiral contact 26, and the size of the electrical contact structure 25 can be promoted as compared with the conventional structure. It has become.

  In the present invention, the conductive portion 28 can be formed in a bump shape protruding from the back surface 25 c of the holding body 25, and the connection by the solder 33 between the conductive portion 28 and the counter electrode 33 on the printed circuit board 30. Fixing is possible, and the electrical contact structure 24 and the printed circuit board 30 can be fixed easily and reliably.

  7 to 16 are process diagrams showing a method of manufacturing the electrical contact structure 24 according to the present invention. Each process drawing is a partial cross-sectional view of the electrical contact structure 24 cut from the film thickness direction during the manufacturing process.

  Reference numeral 50 shown in FIG. 7 is, for example, a Cu substrate. An exposed pattern 51a having the same shape as the spiral contact 26 is exposed on a resist layer 51 formed by pasting a dry film resist on the Cu substrate 50 or applying and forming a liquid resist by a spin coat method or the like. Formed by development.

  Next, in the step shown in FIG. 8, the spiral contact 26 is formed by plating in the extraction pattern 51a, and the resist layer 51 is dissolved and removed using an alkaline aqueous solution or the like as shown in FIG. In FIG. 9, only the spiral contact 26 plated on the Cu substrate 50 is left.

  10, the Cu substrate 50 and the spiral contact 26 are covered with an organic insulating material, and an organic insulating material layer 52 is formed on the Cu substrate 50 and the spiral contact 26.

  It is preferable to use a solder resist as the organic insulating material. By using the solder resist, it is possible to easily and accurately form the recesses 54 and the through holes 61 in the subsequent process. The solder resist is preferably a positive type. That is, a resist that solubilizes the light irradiated portion is used. In this process, the formation of the concave portion 54 and the formation of the through hole 61 are performed by exposure and development processing. However, by using a positive solder resist, the two formation steps can be appropriately performed. The organic insulating material layer 52 is a layer left as the holding body 25 until the end.

  Next, in a step shown in FIG. 11, a mask layer 53 is disposed above the organic insulating material layer 52. A blanking pattern 53 a is formed on the mask layer 53.

  The punching pattern 53a is located just above the base portion 26b of the spiral contactor 26. For example, since the base portion 26b is formed in a circular rim shape so as to surround the spiral contact portion 26a of the spiral contactor 26 (see FIG. 3), the punch pattern 53a is also the above-mentioned It is preferably in the form of a circular edging shape along the base 26b.

  The organic insulating material layer 52 is exposed and developed by irradiating light from the punched pattern 53a and facing the punched pattern 53a in the film thickness direction, and the surface 52a of the organic insulating material layer 52 is formed on the organic insulating material layer 52. To the base 26b of the spiral contact 26 is formed. The concave portion 54 is vertically formed on the base portion 26b of the spiral contactor 26 from the surface 52a of the organic insulating material layer 52, and when viewed from directly above, the concave portion 26b is substantially circular along the base portion 26b. Appears in the form of a border.

  The formation position of the recess 54 can be arbitrarily determined, but is preferably formed on the end of an electrical contact portion such as the spiral contactor 26. The electrical contact portion other than the end portion is exposed in a through hole 61 formed in a later process, and is pushed in the electrical connection with the contact 35 of the electronic component 25 to be elastic in the through hole 61. It becomes a part that transforms and enters. Therefore, it is preferable to form the concave portion 54 at the end of the electrical contact portion as much as possible. In the case of the spiral contactor 26, since the part of the spiral contact part 26a is exposed in the through hole 61 and is a part that can be elastically deformed, the concave part 54 is provided on the base part 26b.

  In the step shown in FIG. 12, the conductive portion 55 is formed in the recess 54 by plating. The base portion 26b is exposed in the recess 54, and the base portion 26b formed of metal functions as an electrode for electrolytic plating. Therefore, the conductive portion 55 is appropriately grown on the base portion 26b. .

  In the present invention, as shown in FIG. 12, the conductive portion 55 is not formed only in the concave portion 54, but the protruding portion 55 a rising from the surface 52 of the organic insulating material layer 52 is further formed in the concave portion 54. The conductive part 55 is continuously plated (so-called bump formation). The protrusion 55 a is formed not only on the recess 54 but also on the surface 52 a of the organic insulating material layer 52. However, in the portion extending on the surface 52a of the organic insulating material layer 52, the base is an insulating layer, so that the plating growth is slowed down, and as shown in FIG. 13, the surface of the protruding portion 55a has a convex curve. Formed as a surface. Thus, by forming the bump-shaped protruding portion 55a protruding from the surface 52a of the organic insulating material layer 52 in the conductive portion 55, the protruding portion 55a is connected to the counter electrode provided on the printed wiring board. Can effectively function as a mounting surface.

  In the process of FIG. 14, the mask layer 60 is opposed to the organic insulating material layer 52. A blank pattern 60a is formed in the mask layer 60, and the planar shape of the blank pattern 60a is, for example, the same circular shape as the through hole 25a formed in the holding body 25 shown in FIG. Here, the punch pattern 60a is formed at a position facing the spiral contact portion 26a of the spiral contact 26 in the film thickness direction. In other words, the blank pattern 60a is positioned inside the concave portion 54 formed in the organic insulating material layer 52 so that the blank pattern 60a does not face the concave portion 54 in the film thickness direction. The organic insulating material layer 52 at the position facing the extraction pattern 60a is removed by exposure and development in the next step. If the concave portion 54 exists at the position facing the extraction pattern 60a in the film thickness direction, the next step is performed. The conductive portion 55 plated in the concave portion 54 is exposed in the through hole formed in the process. Therefore, the blank pattern 60 a is positioned inside the recess 54 formed in the organic insulating material layer 52.

  In the step of FIG. 14, light is irradiated from the punched pattern 60 a toward the organic insulating material layer 52. As already described, the organic insulating material layer 52 is formed of a positive solder resist. In the step of FIG. 11, only the organic insulating material layer 52 at a position where the concave portion 54 should be formed is irradiated using the mask layer 53 in order to form the concave portion 54 in the organic insulating material layer 52. Therefore, light irradiation is not performed on the organic insulating material layer 52 remaining at the time of the step of FIG.

  Accordingly, in the step of FIG. 14, it becomes possible to appropriately perform exposure and development by partial light irradiation on the organic insulating material layer 52 at the position where the through hole 61 is to be formed, using the mask layer 60. In the case of a negative resist, a portion that has not been irradiated with light is removed, but when the organic insulating material layer 52 is formed using a negative resist, the organic insulation remaining at the time of FIG. The material layer 52 is a portion irradiated with light. Therefore, the problem that the through-hole 61 cannot be formed appropriately occurs. Therefore, when the recesses 54 and the through holes 61 are formed in the organic insulating material layer 52 using different processes, it is preferable to use a positive solder resist for the organic insulating material layer 52.

  As shown in FIG. 15, using the mask layer 60, the organic insulating material layer 52 located at a position facing the cut pattern 60a of the mask layer 60 in the film thickness direction is exposed and developed to form the through hole 61 shown in FIG. . As shown in FIG. 15, the through hole 61 is formed from the front surface 52 a to the back surface 52 c of the organic insulating material layer 52, and the spiral contact portion 26 a of the spiral contactor 26 is exposed from the through hole 61.

  Next, in the step shown in FIG. 16, the through hole 61 of the electrical contact structure completed up to the step of FIG. By pushing up the protrusion adjusting member 62, the three-dimensional forming is performed so that the spiral contact portion 26a exposed in the through hole 61 is spiraled upward. Thereby, as shown in FIG. 5, the contact portion 26a can be three-dimensionally formed.

  In the process of FIG. 16, the electrical contact structure in the process of FIG. 15 is turned over, the contact part 26a is positioned on the upper side of the holding body 52, and the protrusion part 55a of the conduction part 55 is positioned on the lower side. Although the adjustment member 62 is pushed upward from the through hole 61, the protrusion adjustment member 62 is positioned below the through hole 61 and the protrusion adjustment member 62 is pushed upward while maintaining the state of FIG. Of course, the contact portion 26a can be three-dimensionally formed in the through hole 61.

  The electrical contact structure formed in each step shown in FIGS. 7 to 16 can be basically composed of only the spiral contactor 26, the holding body constituted by the organic insulating material layer 52, and the conduction part 55. Thus, an electrical contact structure having a very simple structure can be formed using a series of steps.

  In particular, in the past, since the base was separately purchased, a step of connecting the spiral contacts using a guide frame (FIG. 19B) so that a large number of spiral contacts are not separated from each other, Although the process of attaching to the base (FIG. 19D) was necessary, such a process is not necessary and the manufacturing process can be simplified. In particular, there is no need for a base as in the prior art, and the base is complicatedly processed and expensive. However, according to the present invention, an organic insulation that holds a large number of spiral contacts 26 in a very simple manner. The material layer 52 can be formed in a series of manufacturing processes, and the organic insulating material layer 52 can be finally left as a holding body, so that the manufacturing process for forming the holding body is easy and the production cost can be reduced conventionally. It can be compared.

  In particular, the concave portion 54 and the through hole 61 can be easily and accurately formed on the holding body at an arbitrary position, and the organic insulating material layer 52 is formed on the substrate 50 on which the spiral contactor 26 is formed. Therefore, the base and the spiral contact 26 are formed in separate steps as in the prior art, and the two members are not bonded together in the subsequent process. As a result, the spiral contact 26 is not attached to the holding body 54. The miniaturization of the electrical contact structure can be further promoted compared to the prior art, such as the formation of the fine through-holes 61 and the film thickness can be arbitrarily reduced as compared with the prior art.

  Further, in the present invention, a solder resist or the like is used as the organic insulating material layer 52 constituting the holder, and the spiral contact 26 can be directly attached to the organic insulating material layer 52 in the process of forming the solder resist. In addition, a concave portion 54 is formed in the organic insulating material layer 52, and a conductive portion 55 is plated therein, whereby the base portion 26b of the spiral contactor 26 and the conductive portion 55 can be directly conductively connected. It is possible to simplify the mounting process by using a conductive adhesive, which was necessary in the past, and the conductive part is not necessary in the case of using a conductive adhesive. It is possible to make the continuity between 55 and the spiral contact 26 better than before.

  In the present invention, a solder resist is exemplified as the organic insulating material layer 52. However, the organic insulating material layer 52 may be formed of a resin such as polyimide. In such a case, it is preferable to form the concave portion 54 and the through hole 61 by laser processing or the like.

  Further, in the present invention, the contact portion 26a of the spiral contactor 26 can be three-dimensionally formed using the through hole 61 formed in the organic insulating material layer 52 as shown in the step of FIG. 16, and the conduction shown in FIG. When the protruding portion 55a of the portion 55 is electrically connected to the counter electrode of the printed circuit board provided on the lower side of the electrical contact structure, the space portion 32 is formed between both members as described with reference to FIG. Therefore, it is possible to solder between the protruding portion 55a and the counter electrode 31 using the space portion 32. In particular, the protrusion 55a is bump-formed and has a large conductive connection area with the counter electrode 31, so that the protrusion 55a and the counter electrode 31 can be easily and reliably soldered. .

  In each step shown in FIGS. 7 to 16, the spiral contact 26 is exemplified as the electrical contact portion, but it goes without saying that the electrical contact portion may have a form other than the spiral shape.

The perspective view which shows the test | inspection apparatus used for the test for confirming operation | movement of an electronic component, The top view of the electrical contact structure in the present invention, FIG. 2 is a partially enlarged plan view of an electrical contact structure in which the region A in FIG. 2 is enlarged; FIG. 3 is a partially enlarged back view of the electrical contact structure as seen from the back side; 2 is a partially enlarged cross-sectional view of the electrical contact structure in which the region A in FIG. 2 is enlarged, and an electronic component facing above the electrical contact structure, and a printed circuit board connected to the lower side of the electrical contact structure And a partial enlarged sectional view with When the electrical contact structure of the present invention is used as an internal part of the connector, an exploded perspective view of the connector, 1 process drawing which shows the manufacturing method of the electrical contact structure in the present invention, FIG. 7 is a process diagram to be performed next to FIG. 8 is a process diagram performed next to FIG. FIG. 9 is a process diagram performed next to FIG. FIG. 10 is a process diagram performed next to FIG. FIG. 11 is a process diagram to be performed next to FIG. FIG. 12 is a process diagram performed next to FIG. FIG. 13 is a process diagram performed next to FIG. FIG. 14 is a process diagram to be performed next to FIG. FIG. 15 is a process diagram that is performed next to FIG. Partial enlarged perspective view of a conventional electrical contact structure, The partially expanded back view which expanded further a part of electrical contact structure shown in FIG. 17, 1 process drawing which shows the manufacturing process for manufacturing the electrical contact structure in the past, FIG. 19A is a process diagram performed next to FIG. FIG. 19B is a process diagram performed next to FIG. FIG. 19C is a process diagram performed next to FIG. FIG. 19D is a process diagram performed next to FIG. FIG. 19E is a process diagram performed next to FIG.

Explanation of symbols

24, 41 Electrical contact structure 25, 44 Holding body 25a, 61 Through hole 26, 43 Spiral contact 27 Recess 28, 55 Conducting portion 28a, 55a Protrusion 30, 46 Printed circuit board 45 Connector 50 Cu substrate 51 Resist layer 52 Organic insulating material layers 53, 60 Mask layer 62 Projection adjusting member

Claims (19)

In an electrical contact structure comprising an electrical contact portion that is in electrical contact with a contacted body, and a holding body that holds the electrical contact portion,
The electrical contact portion is held on the front surface side of the holding body, the holding body is provided with a recess reaching the back surface, and a conducting portion is provided in the recess,
The electrical connection structure is characterized in that the conductive portion is directly conductively connected to the electrical contact portion and is electrically connected to the connected portion on the back side of the holding body.   The electrical contact structure according to claim 1, wherein the holding body is made of an organic insulating material.   The electrical contact structure according to claim 2, wherein a solder resist is used as the organic insulating material. The holding body is provided with a through-hole that leads from the front surface to the back surface, and the end portion of the electrical contact portion is held at the peripheral portion of the through-hole on the holding body, and the end portion is Excluding the part of the electrical contact portion extending to a position facing the through hole in the film thickness direction,
The electrical contact structure according to any one of claims 1 to 3, wherein the concave portion is formed from the back surface of the holding body to the end portion at a position distant from the through hole.   The electrical contact portion includes a spiral contact portion formed in a spiral shape and a base portion connected to the spiral contact portion and surrounding the spiral contact portion, and the base portion is held on the holding body. The electrical contact structure according to claim 4, wherein the spiral contact portion is provided at a position facing the through hole in the film thickness direction.   The concave portion is formed from the back surface of the holding body to the base portion so as to surround the through hole at a position away from the through hole, and is formed in the concave portion. The electrical contact structure according to claim 5, wherein the back surface of the holding body is exposed in a shape surrounding the periphery of the through hole.   The electrical contact structure according to any one of claims 1 to 6, wherein the conductive portion is formed by plating.   The conducting portion has a protruding portion that protrudes from the back surface of the holding body toward the connected portion, and the protruding portion has a width that is wider than the width of the conducting portion formed in the recess. The electrical contact structure according to claim 1, which is formed.   The electrical contact structure according to claim 8, wherein a surface of the protrusion is a convex curved surface.   The electrical contact structure according to claim 1, wherein the conductive portion is connected and fixed to the connected portion with solder.   The electrical contact structure according to claim 1, wherein the connected portion is formed on a printed circuit board. In the method of manufacturing an electrical contact structure comprising an electrical contact portion that is electrically contacted with a contacted body, and a holding body that holds the electrical contact portion,
(A) plating an electrical contact portion on the substrate;
(B) a step of covering the electrical contact portion and the substrate with an organic insulating material layer serving as a holder;
(C) forming a recess in the organic insulating material layer from the surface side of the organic material layer to a predetermined portion of the electrical contact portion;
(D) plating a conductive part in the recess and electrically connecting the conductive part directly on the electrical contact part;
(E) removing the substrate;
A method for producing an electrical contact structure characterized by comprising: The method for manufacturing an electrical contact structure according to claim 12, comprising the following steps between step (d) and step (e).
(F) A through hole is formed from the surface of the organic insulating material layer to the back surface at a position away from the conductive portion and facing at least a part of the electrical contact portion in the film thickness direction; Exposing a part of the electrical contact portion in the through hole; The method for manufacturing an electrical contact structure according to claim 13, comprising the following steps between the step (f) and the step (e).
(G) A step of three-dimensionally forming the electrical contact portion exposed in the through hole. In the step (a), the electrical contact portion is formed by a spiral contact portion formed in a spiral shape, and a base portion that is integrally formed with the spiral contact portion and surrounds the periphery of the spiral contact portion,
In the step (c), the organic insulating material layer is formed with a recess that leads from the surface side of the organic material layer to the base of the electrical contact portion,
The electrical contact structure according to claim 13 or 14, wherein, in the step (f), by forming the through hole, a portion of a spiral contact portion constituting the electrical contact portion is exposed in the through hole. Production method.   The method for producing an electrical contact structure according to claim 12, wherein a solder resist is used for the organic insulating material layer used in the step (b).   The electrical contact according to claim 16, wherein a positive resist is used as the solder resist, and the exposed portion of the solder resist is removed by exposure and development using a mask layer in the step (c) to form a recess. Manufacturing method of structure.   18. The method of manufacturing an electrical contact structure according to claim 17, wherein the exposed portion of the solder resist is removed by exposure and development using a mask layer in the step (f) to form a through hole.   The method of manufacturing an electrical contact structure according to claim 12, wherein in the step (d), bumps are formed so that the conductive portion rises from the surface of the organic insulating material layer.

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