JP2005178363A5 - - Google Patents
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- Publication number
- JP2005178363A5 JP2005178363A5 JP2004314145A JP2004314145A JP2005178363A5 JP 2005178363 A5 JP2005178363 A5 JP 2005178363A5 JP 2004314145 A JP2004314145 A JP 2004314145A JP 2004314145 A JP2004314145 A JP 2004314145A JP 2005178363 A5 JP2005178363 A5 JP 2005178363A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- manufacturing
- semiconductor device
- thru
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010408 film Substances 0.000 claims 16
- 239000004065 semiconductor Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 9
- 238000000034 method Methods 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 7
- 230000001681 protective effect Effects 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 229920001709 polysilazane Polymers 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004314145A JP4974452B2 (ja) | 2003-10-28 | 2004-10-28 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003368056 | 2003-10-28 | ||
| JP2003368056 | 2003-10-28 | ||
| JP2004314145A JP4974452B2 (ja) | 2003-10-28 | 2004-10-28 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005178363A JP2005178363A (ja) | 2005-07-07 |
| JP2005178363A5 true JP2005178363A5 (OSRAM) | 2007-11-08 |
| JP4974452B2 JP4974452B2 (ja) | 2012-07-11 |
Family
ID=34797130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004314145A Expired - Fee Related JP4974452B2 (ja) | 2003-10-28 | 2004-10-28 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4974452B2 (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5145636B2 (ja) * | 2005-12-27 | 2013-02-20 | 富士ゼロックス株式会社 | 液滴吐出ヘッド及び液滴吐出装置 |
| JP2009141145A (ja) * | 2007-12-06 | 2009-06-25 | Sharp Corp | 半導体素子及びその製造方法並びに表示装置 |
| WO2011004755A1 (en) | 2009-07-10 | 2011-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5399805B2 (ja) * | 2009-08-04 | 2014-01-29 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP5402799B2 (ja) * | 2010-04-07 | 2014-01-29 | コニカミノルタ株式会社 | 有機電子デバイスの製造方法、有機電子デバイスおよびガスバリアフィルム前駆体 |
| DE102010030696A1 (de) * | 2010-06-30 | 2012-01-05 | Evonik Degussa Gmbh | Modifizierung von Siliciumschichten aus Silan-haltigen Formulierungen |
| JP5852810B2 (ja) * | 2010-08-26 | 2016-02-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP5488582B2 (ja) * | 2011-12-27 | 2014-05-14 | ソニー株式会社 | 有機ｅｌ表示装置の製造方法 |
| US11074025B2 (en) | 2012-09-03 | 2021-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP6182909B2 (ja) | 2013-03-05 | 2017-08-23 | 株式会社リコー | 有機ｅｌ発光装置の製造方法 |
| JP6294670B2 (ja) | 2014-01-07 | 2018-03-14 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
| JP6784969B2 (ja) | 2015-10-22 | 2020-11-18 | 天馬微電子有限公司 | 薄膜デバイスとその製造方法 |
| FR3060601B1 (fr) * | 2016-12-20 | 2018-12-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Composition adhesive et son utilisation dans l'electronique |
| JP6837032B2 (ja) * | 2018-05-30 | 2021-03-03 | 双葉電子工業株式会社 | 高分子基板の製造方法及び電子装置の製造方法 |
| CN109913954B (zh) * | 2019-03-13 | 2021-08-06 | 电子科技大学 | 具有隔离层的单晶薄膜的制备方法、单晶薄膜及谐振器 |
| CN109981069B (zh) * | 2019-03-13 | 2022-03-15 | 电子科技大学 | 具有隔离层的薄膜体声波谐振器制备方法及体声波谐振器 |
| CN110011632B (zh) * | 2019-03-13 | 2022-05-03 | 电子科技大学 | 单晶薄膜体声波谐振器的制备方法及体声波谐振器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11251347A (ja) * | 1998-03-03 | 1999-09-17 | Hitachi Cable Ltd | 半導体パッケージの製造方法 |
-
2004
- 2004-10-28 JP JP2004314145A patent/JP4974452B2/ja not_active Expired - Fee Related
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