JP2005164497A - Component mounting substrate inspection device equipped with mean value acquisition function of reference value - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting substrate inspection device equipped with a mean value acquisition function of a reference value capable of improving remarkably accuracy of a determination result of inspection of the component mounting substrate. <P>SOLUTION: This component mounting substrate inspection device equipped with the mean value acquisition function has a mean value calculation function for storing numerical data of thresholds in image data acquired by solder print inspection such as a solder print area, a solder print width or a solder print position after printing the solder on electric circuit patterns on a plurality of component mounting substrates, and determining the mean value thereof. A reference value calculated by the mean value calculation function is used for actual inspection of the component mounting substrate thereafter. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting board inspection apparatus having a reference value average value acquisition function for accurately inspecting a solder printing area, a solder printing width, a solder printing position, and the like after solder printing on a component mounting board. It is about.

  In the conventional component mounting board inspection apparatus, when acquiring the reference value of each inspection point of the component mounting board, the image of the solder printing state of one component mounting board that becomes the inspection reference when acquiring the parameter of each inspection data It was taken in using a processing apparatus and inspected based on the print area, print width, print position, etc. of the taken-in solder.

It is not such a solder printing inspection, but the image data recognized for the inspection of the circuit pattern formed on the surface of the semiconductor wafer with substantially the same technical idea is compared with a reference value that has been previously taught, and the semiconductor An image recognition technique for inspecting the quality of a wafer is disclosed in Japanese Patent Laid-Open Nos. 2003-242482 and 5-108800.
JP2003-242482 (first page, abstract and FIG. 1) Japanese Patent Laid-Open No. 5-108800 (first page, abstract and FIG. 1)

  In the case of the above component mounting board, the numerical value obtained at the time of obtaining the reference value is the reference. Therefore, if the reference value is obtained with only one component mounting board, the solder printing repeatability, temperature change, etc. There is a possibility that correct reference values corresponding to changes in solder after printing due to the above factors cannot be obtained and inspection with high accuracy cannot be performed.

  In addition, when an absolute comparison with a reference value in the inspection of printed solder is performed, since the component mounting board adopted at the time of acquiring the reference value is a base, quality assurance in the manufacturing process becomes difficult.

  In addition, since the inspection program is created at the beginning of production, the printed circuit board used as a reference may not be in a stable state in terms of quality. It was practically difficult to operate.

  The present invention is intended to solve these problems, and is a component mounting board inspection having a reference value average value acquisition function capable of significantly improving the accuracy of the determination result of the component mounting board inspection. The object is to obtain a device.

  The component mounting board inspection apparatus provided with the average value acquisition function of the reference value according to the present invention includes a solder printing area, a solder printing width, and solder printing after the solder is printed on the electric circuit patterns of the plurality of component mounting boards. It is characterized by having an average calculation function for storing numerical value data of threshold values in image data obtained by solder printing inspection such as position and obtaining an average value thereof.

  In the component mounting board inspection apparatus having an average value acquisition function of the reference value, the average is obtained from stored numerical information such as a solder printing area, a solder printing width, and a solder printing position on the plurality of component mounting boards. It is preferable to provide a function of selecting data to be validated / invalidated in the value calculation process so as to have a function of selecting items that are not subject to average values that can perform average value processing with higher accuracy. Before performing average value processing, the operator has a function to save image data exceeding the preset allowable value from the image data at the time of inspection of solder printing on the component mounting board. The image of the inspection point image recognition area of the inspection result is visually confirmed, and it is determined whether or not to apply to the average value calculation, whereby an image that can perform the average value processing with higher reliability can be performed. It is also preferable to have a temporary storage function, and furthermore, the image data obtained by the image recognition of the component mounting board a plurality of times can be sorted in descending order so that the image recognition points in question can be grasped instantly. It is also desirable to have a sort function.

According to the component mounting board inspection apparatus provided with the average value acquisition function of the reference value of the present invention,
1. 1. The accuracy of the test result is improved. 2. Obtaining a reference value as a judgment criterion can be obtained stably. Rather than specifying the mounting board that will be the inspection standard, the numerical value of the inspection data from the mounting board at the manufacturing site can be easily obtained, and reliable information can be obtained in the numerical data. 4. Product quality of consumer products is improved. 5. Improve production process quality analysis and factory management capabilities. Numerous excellent effects can be obtained, such as being applicable to quality confirmation of solder printing in the previous process.

  Hereinafter, a component mounting board inspection apparatus (hereinafter simply referred to as “component mounting board inspection apparatus”) having an average reference value acquisition function according to an embodiment of the present invention will be described with reference to the drawings.

  An outline of a solder printing inspection apparatus in development of a component mounting board inspection and measurement technique will be briefly described before a specific description of the present invention.

  The solder printing inspection apparatus is an apparatus that determines the quality of printing by using an image processing apparatus for the solder printing state of a board in which cream solder is printed on a component mounting board such as a printed board by a solder printer. The printing quality judgment method is based on the solder printing information (solder printing area, solder printing width, solder printing position) preset in the inspection device. The quality of solder printing is judged by comparing the information taken in using the processing device. In this determination process, it is important that the determination can be performed accurately.

  The present invention is a technique invented to establish the accuracy of this determination, and will be specifically described below.

  1 is a conceptual diagram of a system of a component mounting board inspection apparatus according to an embodiment of the present invention apparatus, FIG. 2 is a system block diagram of a main controller of the component mounting board inspection apparatus shown in FIG. 1, and FIG. FIG. 4 is a flowchart for explaining the reference value averaging of the board inspection in the component mounting board inspection apparatus shown in FIG. 2, and FIG. 4 is a comparison of NG images in which the reference value exceeds the allowable value with respect to the temporary reference value in the averaging operation. FIG. 5 is a main screen diagram showing the average value obtained by quantifying the inspection data for each inspection point when actually inspecting a plurality of sheets on the averaging operation screen, and FIG. 6 is a component mounting board. It is a screen figure showing the inspection information of this inspection point.

  First, the configuration of a component mounting board inspection apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  In FIG. 1, reference numeral 1 indicates a component mounting board inspection apparatus as a whole. The component mounting board inspection apparatus 1 is roughly divided into a main controller 10, a robot housing block 20, a mechanism controller 30, and the like.

  As will be described later, the main control device 10 is mainly configured by a computer and has an image processing control function and an arithmetic processing function.

  The robot housing block 20 is a block in which an illumination barrel 21 and an image capturing camera 22 are integrated together. A semiconductor light emitting element that emits red light suitable for illuminating the solder S and a reflecting mirror (both not shown) are incorporated in the inner surface of the lens barrel 21. The camera 22 includes a solid-state imaging device such as a CCD, for example, captures an image reflected by the reflecting mirror, and transmits it to the main control device 10.

  The mechanism control device 30 is connected to the main control device 10 and the interface If. The mechanism control device 30 drives and controls the robot housing block 20 in accordance with an instruction from the main control device 10, and the brightness of the illumination lamp in the lens barrel 21 is set appropriately. It is a device to adjust to. It also controls the shutter of the camera 22. The mechanism control device 30 is controlled by the main control device 10, and drives and controls the robot housing block 20 in the XY direction on the same horizontal plane according to a predetermined sequence.

  FIG. 1 also shows a component mounting board P on which paste solder S is printed at a predetermined position of an electric circuit pattern (not shown). The solder S including the electric circuit pattern is divided into a number of sections which are inspection units, and each section is illuminated by the lens barrel 21 under the mechanism control device 30 as described above.

  As shown in FIG. 2, the main control device 10 includes an image data conversion control unit 110, a main control panel 120, an information processing unit 130, and the like. Further, the image data conversion control unit 110 stores captured image data. Unit 111 and image processing application software 112, the main control panel 120 is composed of a screen operation unit 121 and an access unit 122 to the database 131, and the information processing unit 130 is composed of a database unit 131 and an inspection result. A data storage unit 132, an image data storage unit 133, an average reference value acquisition data storage unit 134, an arithmetic processing unit 135, and the like are included.

  By the operation of the screen operation unit 121, the image data captured by the camera 22 is input and stored in the captured image data storage unit 111 of the image data conversion control unit 110. The stored image data is digitized by the image processing application software 112.

  The digitized image data is written to or read from the database 131 by the operation of the access unit 122.

  The database 131 stores substrate data, image data, inspection result data, data for moving the lens barrel 21, data for changing the brightness of illumination, and the like.

  The inspection result data storage unit 132 stores all numerical data of the inspected component mounting board.

  In the image data storage unit 133, data required by the operator, for example, image data such as the printing area of the solder S, the printing width of the solder S, and the printing position of the solder S is extracted from the database 131 and stored.

  The average reference value acquisition data storage unit 134 stores and stores an average reference value used for inspection of the component mounting board obtained by the method described later.

  The arithmetic processing unit 135 executes a reference value averaging process and an averaging process based on the solder information obtained from the image data.

  Next, the operation of the component mounting board inspection apparatus 1 according to the present invention will be described using the flowchart shown in FIG.

  First, the component mounting board inspection apparatus 1 is started by operating the screen operation unit 121 (step S1).

  Next, the first component mounting board P of the type of component mounting board to be inspected in step S2 is placed and placed on a mounting board (not shown) below the robot casing block 20, and the robot casing block 20 is loaded. While illuminating the component mounting board P with an internal illumination device (not shown), the camera 22 sequentially photographs the inspection points of the component mounting board P according to a predetermined sequence.

  The captured image data is stored in the database 131 of the main controller 10 (step S3). This image data is set as a temporary reference value for the data of the first component mounting board P, and is taken into the arithmetic processing unit 135 (step S4).

  In step S5, the second and subsequent component mounting boards P are inspected by the same operation as that in step S2 and subsequent steps.

  Next, the temporary reference value acquired in step S4 and the image data of the second and subsequent component mounting boards P are respectively compared by the arithmetic processing unit 135 (step S6).

  If there is no difference from the tentative reference value in this comparison, the image data is first acquired and taken into the inspection result data storage unit 132 (step S7). If this series of operations is not completed, some component mounting boards P are further flowed to collect image data. If the operator determines that the image data of some component mounting boards P is taken and the operator decides that it is good, stop. Note that “NO” in step S7 means whether to see the next new component mounting board P.

  In step S6, if the acquired image data of the second and subsequent component mounting boards P deviates from the temporary reference value, it is determined as NG (abbreviation of No Good) and the process proceeds to step S8, which is also the inspection result data storage unit 132. Saved in.

  The NG warning is displayed on the screen of the screen operation unit 121 as a screen as shown in FIG. The solder portion of one inspection point of the component mounting board P that has acquired the temporary reference value on the left side is displayed, and the right side shows the NG of the NG that exceeds the allowable value from the temporary reference value by inspecting the second and subsequent component mounting boards P The detail confirmation screen which displayed the solder part of 1 inspection point same as the above of the component mounting board P is shown.

  In the lower part of each screen, a table image of each type of data is displayed with the fields of each inspection point, such as the name of each inspection, judgment, etc. displayed, and the upper threshold value, lower threshold value, and solder printing position deviation. Buttons such as inspection, binarization, display enlargement, display reduction, inspection, and histogram are displayed.

  Further, as shown as the average value acquisition main screen in FIG. 5, the hatched portion can be displayed in red, for example, so that the operator can clearly see that the comparison result is NG. . This NG warning can be performed only by warning and subsequently comparing the other component mounting boards P one after another. For example, after inspecting and comparing five component mounting boards P, the image data of the NG warning can be viewed in detail.

  In the mean value acquisition main screen of FIG. 5, the upper left screen displays one inspection region of the component mounting board P of the temporary reference value, while the upper right screen displays NG component mounting. In one inspection region of the substrate P, it is displayed so that both can be compared and contrasted. The table displayed on the lower half screen shows numerical data for each inspection point of the component mounting board P subjected to the inspection, and is indicated by an arrow A in the “history display” column at the right end. Thus, the numerical value of the solder printing area is shown. In addition, it is also possible to display the print width of solder (X-direction width, Y-direction width) and the amount of solder displacement (center of gravity X axis, center of gravity Y axis).

  In step S10, NG inspection points are extracted from the inspection result data storage unit 132, and in step S11, the operator visually determines whether or not to adopt the NG inspection point in the averaging process.

  This visual judgment may be made with numerical data, but by clicking the “histogram” button on the detail confirmation screen shown in FIG. 4, as shown in the lower right screen of FIG. 6 on the screen operation unit 121. It is preferable to make it easier for the operator to visually determine whether or not to adopt the averaging process. This histogram represents the printing area of the solder S, where the vertical axis indicates the brightness area and the horizontal axis indicates the brightness distribution. The right histogram indicates the solder S portion, and the left histogram indicates the electric circuit pattern Pa (copper) portion.

  The upper right screen is an overall view of the component mounting board P, and all inspection regions including inspection points are indicated by rectangular lines. The upper left screen is an enlarged view of one inspection point in one inspection region. The light gray square portion indicates the solder S portion, and the slightly dark gray portion is the electric circuit pattern Pa portion. This histogram represents the solder printing area, and in addition, the size of the solder printing width and the amount of deviation of the solder printing position can be similarly represented.

  Visual observation in step S11 may be performed by a histogram, or, as shown in the lower table of FIG. 5, the ratio of the average value of the printed area of the solder and the reference value is taken and rearranged in descending order of the ratio. For easy comparison, for example, the hatched portion in [Table 1] may be displayed in red to determine whether or not to adopt. If it is determined as “not adopted” in this comparison, by clicking the “delete” key of the average value calculation condition setting key K, the measurement result can be deleted and not taken into the average value calculation. In [Table 1], only four inspection points are extracted and enlarged.

  The inspection result data of the inspection point determined not to be adopted in step S11 is discarded, and the inspection result data determined to be adopted is added to the arithmetic processing unit 135 together with the inspection result data acquired in step S7, and is averaged to obtain an average reference value. (Step S12). By repeating this operation, the accuracy of the reference value averaging process can be improved.

  A numerical value obtained by the averaging process becomes a reference value for each inspection point. The respective reference values are taken into the average reference value acquisition data storage unit 134, and the component mounting board inspection apparatus 1 executes absolute value determination after solder printing of the component mounting board P based on these reference values by image recognition processing. It will be.

  By using this component mounting board inspection apparatus 1, it is possible to easily secure highly accurate inspection numerical data at the manufacturing site, thereby improving the accuracy of inspection determination and the reliability.

It is a conceptual diagram of the system of the component mounting board inspection apparatus of one Example of this invention apparatus. It is a system block diagram of the main controller of the component mounting board inspection apparatus shown in FIG. 3 is a flowchart for explaining reference value averaging of board inspection in the component mounting board inspection apparatus shown in FIGS. 1 and 2. It is an operation screen figure which compares the NG image which exceeded the reference value with respect to the temporary reference value by the averaging operation. It is the average value acquisition main screen figure which digitized the inspection data for every inspection point when actually inspecting a plurality of sheets on the averaging operation screen, and displayed it in a table. It is a screen figure showing the inspection information of the inspection point of a component mounting board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting board inspection apparatus of one Example of this invention 10 Main control apparatus 110 Image data conversion control part 111 Shooting image data storage part 112 Image processing application software 120 Main control panel 121 Screen operation part 122 Access part to database 131 DESCRIPTION OF SYMBOLS 130 Information processing part 131 Database 132 Inspection result data storage part 133 Image data storage part 134 Average reference value acquisition data storage part 135 Arithmetic processing part 20 Robot housing block 21 Lens barrel 22 Camera 30 Mechanism control device S Solder P Component mounting board If The interface

Claims (4)

  Stores numerical data of threshold values in image data obtained by solder printing inspection such as the solder printing area, the solder printing width, and the solder printing position after the solder is printed on the electric circuit patterns of a plurality of component mounting boards, A component mounting board inspection apparatus provided with an average value acquisition function of a reference value, characterized in that it has an average calculation function for obtaining an average value thereof.   By providing a function for selecting data to be valid / invalid in the average value calculation process from stored numerical information such as a solder printing area, a solder printing width, and a solder printing position on the plurality of component mounting boards, 2. The component mounting board inspection apparatus having a reference value average value acquisition function according to claim 1, further comprising an average value non-target item selection function capable of performing average value processing with higher accuracy.   Before performing average value processing by having a function of storing image data that exceeds a preset allowable value among the image data at the time of inspection of solder printing of the plurality of component mounting boards on a recording medium in the control device An image in which the worker can visually confirm the image of the inspection point image recognition area of the inspection result and determine whether or not to apply the calculation to the average value, so that the average value processing with higher reliability can be performed. The component mounting board inspection apparatus having a reference value average value obtaining function according to claim 1, further comprising a temporary storage function. 2. The image processing apparatus according to claim 1, further comprising: a sorting function capable of sorting the image data obtained by the image recognition of the component mounting board a plurality of times in the descending order and quickly grasping the image recognition points in question. 4. A component mounting board inspection apparatus comprising the reference value average value obtaining function according to claim 2.