JP2001255280A - Board inspection device and board inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a board inspection device and a board inspection method capable of enhancing load reduction of an inspector and shortening of work man-hours by omitting a specific work on a part loading spot to be inspected visually, and executing inexpensively appearance visual inspection of a printed circuit board where high density mounting is executed. SOLUTION: This inspection device is equipped with plural simple visual inspection means 2, 3 equipped with magnifying lenses having different imaging powers, according to the size of loaded parts on the board 4 to be inspected, and a general control means for selecting and controlling the optimum visual inspection means for imaging the size of the loaded parts on the board to be inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus and a board inspection method for visually inspecting a printed circuit board (substrate to be inspected) on which minute components are mounted using a camera and a magnifying lens. In particular, the present invention relates to a board inspection apparatus and a board inspection method that simplify the configuration of hardware and software, reduce the load on inspectors, reduce the number of man-hours, and reduce costs.

[0002]

2. Description of the Related Art In recent years, printed circuit boards on which electronic components are mounted have been widely used in various electronic devices. However, the number of mounted components has been increasing year by year, and high-density mounting has been achieved by chipping the components. I'm advancing.

Conventionally, in order to inspect the mounting status of components of this type of printed circuit board, a visual inspection system based on visual inspection of an inspector has been generally provided.
The quality of the printed circuit board is determined by visually observing a predetermined inspection location in a predetermined procedure.

However, as described above, when a printed circuit board to be inspected is mounted at a high density, an area where a large number of components are densely packed or an area where components having similar shapes are concentrated. In the case where there is a defective part, considerable attention and concentration are required for the inspector performing the visual inspection, so that the mental burden increases,
Work man-hours also become enormous.

[0005] Also, when the inspection results are recorded and left,
It is necessary to read the circuit symbols and the like of the found defective parts from the complicated drawings, and the mental burden on the inspector increases similarly to the above.

In order to solve such a problem, there has recently been proposed an appearance inspection apparatus which applies an image recognition processing technique and automatically specifies a defective portion by using a photographed image of an inspection object.

FIG. 8 shows, for example, Japanese Patent Application Laid-Open No. 8-193958.
FIG. 1 is a block diagram showing a conventional board inspection apparatus based on an automatic appearance inspection system described in Japanese Patent Application Publication No. JP-A-2006-115139. In FIG. 8, reference numeral 4 denotes a printed board to be inspected (hereinafter, simply referred to as "printed board 4"), and reference numeral 11 denotes an XY stage on which the printed board 4 is mounted and fixed and moved in the XY directions.

Reference numeral 12 denotes a camera serving as an image pickup means for picking up an image of the printed circuit board 4. The camera 12 is provided with a zoom lens 13, and a plurality of different image pickup magnifications can be selected. Reference numeral 14 denotes a control unit including a microcomputer, which captures an image signal from the camera 12 and drives and controls the XY stage 11 and the zoom lens 13.

Although not shown here, the microcomputer 14 includes an identification number of a mounted component when inspecting the printed circuit board 4 and inspection information (reference data composed of characteristic parameters such as coordinates, area and shape). And a positioning control unit for controlling an imaging position and an imaging magnification of the printed circuit board 4, and A / D conversion of a captured image signal to extract characteristic parameters of each electronic component (mounted component). Image recognition processing means, input means such as a keyboard for inputting inspection procedures, inspection locations, and processing procedures such as imaging magnification, and output means such as a printer and a CRT display.

Next, the operation of the conventional substrate inspection apparatus shown in FIG. 8 will be described. First, the control unit 14 calculates the position of the inspection point, and controls the XY stage 11 based on the calculation result.

As a result, the designated inspection location on the printed circuit board 4 is moved so as to be located near the center of the field of view of the camera 12 and the size of the component mounted on the designated location on the printed circuit board 4 is reduced. Together with the zoom lens 1
The imaging magnification of 3 is controlled, and the imaging range of the designated inspection location is set.

Subsequently, the image signal of the designated inspection location imaged by the camera 12 is A / D-converted by the image recognition processing means in the control means 14 and then extracted for extracting the characteristic parameters of the component at the designated inspection location. Used.

The extracted feature parameters are stored in the control unit 1
4 is compared with reference data stored in advance in the storage means in the storage means 4.
The output is provided via an output means in the device.

As described above, the characteristic parameters of all the components on the printed circuit board 4 are extracted and compared with the reference data stored in advance in the storage unit in the control unit 14 to thereby check the mounting state of the components. Automated visual inspection is realized.

However, in the conventional apparatus to which the image recognition processing technique shown in FIG. 8 is applied, the hardware and software configurations are complicated and the production cost is enormous. In addition, in order to obtain reference data for performing an appearance inspection, it is necessary to collect reference data using a model substrate. Therefore, it is necessary to manufacture an ideal model substrate in advance.

Further, since the criterion for the quality judgment is determined based on the manufacturing accuracy of the model board, when the appearance is delicate,
The judgment result differs depending on the setting condition of the reference data, and the pass / fail judgment cannot be immediately determined by the above-described automatic inspection apparatus alone in many cases.

Further, if the inspection standard of the printed circuit board 4 is set strictly, the number of defective products is increased and the yield is deteriorated.
It is necessary for a skilled inspector to perform a visual inspection using a magnifying glass. Therefore, after all, efficient board inspection cannot be realized.

[0018]

As described above, the conventional board inspection apparatus and board inspection method use the automatic inspection technique referred to in Japanese Patent Application Laid-Open No. 8-193958 to reduce the burden on the inspector. However, since the configuration becomes complicated and the manufacturing cost increases, and the criterion depends on the quality of the model board, the reliability of the determination result cannot be ensured.
Since the visual inspection by a skilled inspector cannot be omitted again, there is a problem that the economy and efficiency cannot be sufficiently improved.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and inspects using a visual inspection means having a magnifying lens having a different imaging magnification according to the size of a component mounted on a substrate to be inspected. A member performs a visual inspection,
By automatically specifying only the parts to be inspected through the integrated control means, the hardware and software configurations are simplified, reducing the load on inspectors and shortening the number of man-hours, as well as reducing costs. It is an object to obtain an apparatus and a board inspection method.

[0020]

According to a first aspect of the present invention, there is provided a board inspection apparatus comprising: an XY stage on which a board to be inspected having components mounted thereon is mounted; A plurality of visual inspection means corresponding to the size of the mounted component for inspecting the substrate to be inspected, and a visual inspection optimum for the size of the mounted component of the inspected substrate among the plurality of visual inspection means A general control means for performing distributed processing together with a plurality of visual inspection means by selectively controlling the means, and each photographing means of the plurality of visual inspection means is provided with an arbitrary It has magnifying lenses of different imaging magnifications for photographing the component mounting position, and the plurality of visual inspection means fetches image data from the photographing means and XY in association with the overall control means.
A visual inspection processing unit for controlling the stage, an input unit operated by an inspector, and a display for displaying at least image data, wherein the overall control unit and the visual inspection processing unit perform a visual inspection photographed by the imaging unit; Target image,
Based on the inspection information on the visual inspection target image, the inspection of the inspection target substrate is performed, and the input, recording, and processing of the inspection result data are performed.

According to a second aspect of the present invention, in the board inspection apparatus according to the first aspect, the visual inspection processing unit is configured to determine the history data of the defective determination component position and the captured image data from the previous inspection result information of the inspection target board. The display is to display the history data and the picked-up image data of the extracted defective determination component position on the same screen together with the current picked-up image of the same component position on the inspected board.

According to a third aspect of the present invention, there is provided a board inspection method using the board inspection apparatus according to the first or second aspect, wherein at least one of the plurality of visual inspection means is controlled by the general control means. A first step of selecting and downloading inspection information for one of them, a second step of performing a visual inspection using at least one of a plurality of visual inspection means, and an inspection from the visual inspection means to the overall control means. And a third step of uploading the result information.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram schematically showing a substrate inspection apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a block configuration diagram showing visual inspection means according to Embodiment 1 of the present invention.

FIG. 3 is a flowchart for explaining the operation (first step) of selecting and downloading inspection information to the visual inspection means by the general control means according to the first embodiment of the present invention, and FIG. FIG. 5 is a flowchart for explaining the visual inspection processing operation (second step) in the inspection means, and FIG. 5 shows the upload processing operation (third processing) of the inspection result information from the visual inspection means by the general control means according to the first embodiment of the present invention. 3) is a flowchart for explaining step (2).

In FIG. 1, reference numeral 4 denotes a printed circuit board similar to that described above, on which components having different sizes are mounted. 1
Is a general control unit including a microcomputer, and selectively controls a plurality of visual inspection units 2 and 3.

The plurality of visual inspection units 2 and 3 differ from each other only in the imaging magnification, and are composed of an A-times visual inspection unit 2 with a large imaging magnification A and a B-times visual inspection unit 3 with a small imaging magnification B. .

The detailed structure of each of the visual inspection means 2 and 3 will be described later with reference to FIG. In FIG. 1, only two visual inspection means 2 and 3 are shown for simplification of description, but an arbitrary number of visual inspection means may be provided side by side.

Reference numeral 4a denotes another printed circuit board which is juxtaposed with the printed circuit board 4 as required. Printed circuit board 4, 4a
Is visually inspected for the appearance such as the mounting state by the A-fold visual inspection means 2 or the B-fold visual inspection means 3 selected for each component based on the inspection information.

In FIG. 2, reference numeral 5 denotes an XY stage on which the printed circuit board 4 is mounted and moved in the XY directions while corresponding to the XY stage 11 described above. Reference numeral 6 denotes a camera for capturing an image of the printed circuit board 4 from above the XY stage 5, and for example, a magnifying lens 7 having an imaging magnification A is mounted.

Reference numeral 8 denotes a visual inspection processing unit including a microcomputer associated with the overall control means 1, which controls the positioning of the XY stage 5 based on the inspection information sent from the overall control means 1. 9 and 10 are a display and an input unit connected to the visual inspection processing unit 8.

The display 9 has a function of specifying a visual inspection target by synthesizing and displaying an image signal of the printed circuit board 4 captured by the camera 6 together with inspection information. The input unit 10 includes a keyboard, a mouse, and the like, and is used for performing execution control of a visual inspection process manually, inputting an inspection result at the time of defect determination, and the like.

In FIG. 2, only the A-fold visual inspection means 2 is representatively shown, but the B-fold visual inspection means 3 has the same configuration.

Next, the operation of the substrate inspection apparatus according to the first embodiment of the present invention shown in FIGS. 1 and 2 will be described with reference to the flowcharts of FIGS.

The board inspection step according to the present invention includes the step of selecting and downloading board inspection information when visually inspecting the printed circuit board 4 (the first step shown in FIG. 3), the A-times visual inspection means 2 and the B-times visual inspection. From the visual inspection process of the printed circuit board 4 by the inspection means 3 (the second process shown in FIG. 4) and the uploading process of the inspection result information at the end of the visual inspection of the printed circuit board 4 (the third process shown in FIG. 5). Become.

Hereinafter, a step (first step) of selecting and downloading the board inspection information to the A-fold visual inspection means 2 and the B-fold visual inspection means 3 by the overall control means 1 will be described with reference to FIG.

First, in step S1a in FIG.
The board inspection information file of the printed circuit board 4 prepared in advance is read. The board inspection information file stores identification numbers, names, model names, coordinates, set magnifications, and the like for each electronic component mounted on the printed circuit board 4.

Subsequently, in steps S1b to S1f, the set magnification information is checked from the board inspection information file. If the electronic component on the printed circuit board 4 has the set magnification of A, the board inspection information of the electronic component is checked. Is selected and stored in the memory A used for the A-times visual inspection means 2,
Electronic components that are not doubled are selectively stored in the memory B used for the B-fold visual inspection means 3.

That is, it is determined whether or not the set magnification is A times (step S1b). If it is determined that the set magnification is A times (ie, YES), the component inspection information is written into the memory A (step S1c). If it is determined that the set magnification is not A (ie, NO), the component inspection information is written to the memory B (step S1d).

Subsequently, it is determined whether or not the selective storage is completed (step S1e), and the selection and storage are completed (ie, YES).
If determined to be, the process proceeds to the next step S1g, and if it is determined to be incomplete (that is, NO), the next inspection information is read (step S1f) and the process returns to step S1b.

In this manner, the above-described step S1b is performed until the selective storage processing for all information on the printed circuit board 4 is completed.
After completing the selection by repeating steps S1f to S1f, step S1
In step g, the board inspection information selected and stored in the memory A is downloaded to the A-fold visual inspection means 2.

In the subsequent step S1h, the board inspection information selectively stored in the memory B is downloaded to the B-fold visual inspection means 3, and the processing in FIG. 3 is terminated.

By the above processing operation, the board inspection information for the board visual inspection with the large imaging magnification A is set in the A-magnification visual inspection means 2, and the board visual information with the small imaging magnification is set in the B-magnification visual inspection means 3. Inspection board inspection information is set.

Therefore, in the next visual inspection step (second step) centered on the visual inspection processing section 8, on the A-times visual inspection means 2, fine electronic devices such as chip parts on the printed circuit board 4, etc. The mounting status of parts is subject to inspection,
On the B-fold visual inspection means 3, the mounting status of a relatively large electronic component on the printed circuit board 4 is to be inspected.

The visual inspection (the second step) by the A-times visual inspection means 2 and the B-times visual inspection means 3 is executed as follows. In FIG. 4, determination steps S2b, S2f
And S2i are processing operations performed by the inspector.

First, in step S2a in FIG.
When the board inspection information of the printed circuit board 4 is downloaded from the integrated control means 1 to the visual inspection processing unit 8, step S2
The process proceeds to the inspection start waiting state of b.

If it is determined in step S2b that the inspection is to be started (ie, YES) based on an instruction from the input unit 10 such as a keyboard or a mouse, the process proceeds to step S2c, where a visual inspection of the board can be started.

In step S2c, the visual inspection processing section 8 reads the component information to be inspected from the board inspection information of the printed circuit board 4, and in step S2d, the XY stage 5 uses the coordinate data of the component to be inspected from the component information.
To move.

As a result, the printed board 4 mounted and fixed on the XY stage 5 is controlled and stopped so that the center of the components on the board becomes the center position of the image pickup range of the camera 6.

Subsequently, the visual inspection processing section 8 determines in step S
In step 2e, the image signal of the printed circuit board 4 captured by the camera 6 is synthesized and displayed on the display 9 together with the component information of the inspection target component.

At this time, the part displayed enlarged at the center of the image display area is the inspection target, and the identification number, the component name, the model name, the coordinates, etc. of the inspection target position are displayed on the same screen.

Therefore, there is no need to search for the inspection position.
Since there is no erroneous view of the mounted components, the following step S2f
The visual inspection by hand can be easily performed.

If the state of the mounted components on the printed circuit board 4 is good and the result of the visual inspection is determined to be OK (ie, YES) in step S2f, the process proceeds to step S2i described later, and the failure (ie, NO) ), The process proceeds to the next step S2g, and display and input of defect information are performed.

When a defect is determined in step S2f as a result of the visual inspection, the item of the defect content is displayed on the screen as shown in step S2g.
It is only necessary to select and operate the defective item displayed on the screen with the input unit 10 such as a mouse or a keyboard.

In the subsequent step S2h, the picked-up image determined to be defective and defect information can be stored, so that a database of inspection results can be created.

When the inspection of the component mounting position based on the component information is completed, the inspector next proceeds to step S2i.
In, whether to proceed to the next inspection position is determined by an input instruction of the input unit 10.

That is, it is determined whether or not to move to the next component inspection position, and the apparatus is in a standby state until it is determined that a movement instruction has been issued (ie, YES). When the movement instruction is input by the input unit 10, the process proceeds to the next step S2j, and it is determined whether the process is completed (inspection completed).

At this time, the board inspection information file is checked. If the inspection is not completed, the component information to be inspected is updated, and the operations of steps S2c to S2i are repeatedly executed until all the inspections are determined to be completed in step S2j. I do.

If it is determined in step S2j that all the inspections have been completed, the process proceeds to step S2k, where the inspection result information of the printed circuit board 4 is uploaded to the overall control means 1, and the processing operation of FIG. 4 ends. .

The second step described with reference to FIG.
A plurality of visual inspection means, that is, A-times visual inspection means 2 and B-times visual inspection means 3, perform distributed processing via the overall control means 1, and complete the visual inspection of the printed circuit board 4 in both. Thereby, the second step is completed.

As described above, by performing the distributed processing by the overall control means 1 and the visual inspection means 2 and 3, the continuous time involved in visual inspection per printed circuit board 4 is reduced. Therefore, the mental burden on the inspector can be reduced, and the inspection can be continued without interruption of the inspector's attention and concentration.

Further, if there are a plurality of inspectors, as shown in FIG. 1, the inspection work can be performed on the printed circuit board 4 and another printed circuit board 4a simultaneously and in parallel. In this case, it goes without saying that the XY stage 5 and the visual inspection means 2 and 3 are provided side by side for each inspector.

Hereinafter, the overall control means 1 uploads the inspection result information from the A-times visual inspection means 2 and the B-times visual inspection means 3. Next, a step of uploading inspection result information at the end of the visual inspection of the printed circuit board 4 (third step) will be described with reference to FIG.

First, in step S3a in FIG.
It is checked whether or not the inspection has been completed by the A-times visual inspection means 2. If it is determined that the inspection has been completed (ie, YES), the inspection result information from the A-times visual inspection means 2 is uploaded in step S3b.

If it is determined in step S3a that the inspection has not been completed (that is, NO), the process proceeds to step S3a.
The process proceeds to step S3c without executing 3b.

Subsequently, in step S3c, it is checked whether or not the inspection has been completed by the B-fold visual inspection means 3, and if it is determined that the inspection has been completed (ie, YES), the process proceeds to step S3c.
At d, the inspection result information from the B-fold visual inspection means 3 is uploaded.

If it is determined in step S3c that the inspection is not completed (that is, NO), the process proceeds to step S3c.
The process proceeds to step S3e without executing 3d.

Subsequently, in step S3e, both the A-times visual inspection means 2 and the B-times visual inspection means 3 check whether or not the upload of the inspection result information has been completed, and determine that all of them have been completed (ie, YES). If so, an inspection result information file for the printed circuit board 4 is created in step S3f, and the processing operation in FIG. 5 ends.

If it is determined in Step S3e that the inspection is not completed (that is, NO), the process jumps to Step S3a and checks again whether the inspection is completed.

As described above, a plurality of simple visual inspection means 2 and 3 provided with magnifying lenses 7 having different imaging magnifications according to the size of components mounted on the printed circuit board 4 (substrate to be inspected), The inspection processing is executed in a distributed processing manner by using the general control means 1 for selecting and controlling the visual inspection means most suitable for imaging of the mounted component of the printed circuit board 4 from among 2, 3.

Therefore, the distributed processing by the plurality of simple visual inspection means and the integrated control means eliminates the need for the inspector to specify the component mounting location on the printed circuit board 4 to be visually inspected. Can be simplified, the load on the inspector can be reduced, the number of man-hours can be reduced, and the cost can be reduced.

Embodiment 2 In the first embodiment, the image display area of the display 9 is not specifically described, but the history data and the captured image data of the defective determination component position are extracted from the previous inspection result information of the inspection target board. Alternatively, the information may be displayed on the same screen together with the current captured image of the same component position on the same board to be inspected and used in the second step.

FIG. 6 shows an image display area of the display of the board inspection apparatus according to the second embodiment of the present invention, in which the component position of the board to be inspected and the current picked-up image included in the previous inspection result information are displayed on the same screen. It is explanatory drawing which shows schematically.

In FIG. 6, reference numeral 9a denotes A-times visual inspection means 2.
And a display screen provided in the B-fold visual inspection means 3. The left half of the display screen 9a is a current inspection information display area 9b, and the right half is a previous inspection result information display area 9e.

In the display screen 9a, the current inspection information display area 9b displays the component information 9c of the printed circuit board 4 and the current captured image 9d, and the previous inspection result information display area 9e displays the previous inspection result information area 9e. The defect history data 9f in the visual inspection and the captured image 9g are displayed.

Next, the operation according to the second embodiment of the present invention will be described with reference to the flowchart of FIG. 7 together with FIG. 1, FIG. 2 and FIG. FIG. 7 is a flowchart for displaying the previous inspection result information and the current inspection information on the display screen 9a in the second step.

In this case, the display 9, the A-fold visual inspection means 2 and the B-fold visual inspection means 3 extract the defect judgment data from the inspection result information of the printed circuit board 4, and obtain the defect history data included in the defect judgment data. XY stage 5 at the part position where the defect was determined last time
Is moved to display the current captured image together on the same display screen 9a.

It is assumed that the processing program of FIG. 7 is incorporated as a function in the visual inspection processing unit 8.

First, in step S4a in FIG.
The inspection result information is downloaded from the integrated control means 1 with reference to the inspection result information file of the printed circuit board 4 which has already been inspected.

In the inspection result information, the inspection result of the printed circuit board 4 is recorded for each component to be inspected, and in subsequent step S4b, the presence or absence of defect determination data in the inspection result information is checked.

If it is determined in step S4b that all data are non-defective (that is, NO), the processing operation of FIG. 7 is terminated without performing any processing, but it is determined that there is defective determination data (that is, YES). If so, the next step S4c
Proceed to.

In step S4c, the history information is searched for each component based on the defect determination, and the display screen 9 is searched.
The image data is displayed in the previous inspection result information display area 9e on a. As the display contents at this time, the failure determination content is displayed in the display area of the failure history data 9f, and the failure image data is displayed in the display area of the previous captured image 9g.

Subsequently, in step S4d, the XY stage 5 is moved based on the coordinate data of the components on the printed circuit board 4 extracted from the defect determination data. Thereby, the printed circuit board 4 mounted and fixed on the XY stage 5
Is controlled so that the center of the extracted component is located at the center position of the imaging range of the camera 6 and stops.

Subsequently, in step S4e, an image signal captured by the camera 6 is displayed on the screen in the current inspection information display area 9b together with the component information. As display contents at this time, the component information is displayed in the display area of the component information 9c, and the image signal captured by the camera 6 is displayed in the display area of the current captured image 9d.

In this display state, on the display screen 9a, the inspection result information at the time of the defect determination in the previous visual inspection and the current inspection information are simultaneously displayed on the same screen.

Therefore, in the confirmation work when the defective portion of the printed circuit board 4 is repaired, it is easy to check the quality of the repaired state. Although not shown in FIG. 7, by uploading the inspection result information to the general control means 1 again, the inspection result information can be accumulated as history data.

Thereafter, in step S4f, the input unit 1
0, the next data is searched. When the data search (that is, YES) is confirmed, step S
Proceed to 4g.

In step S4g, a confirmation of termination is executed, and the termination is not completed (ie, NO).
If the determination is made, the process returns to step S4b, and when the end (that is, YES) is confirmed, the processing operation of FIG. 7 ends.

As described above, by simultaneously displaying the history data and the like on the display screen 9a, the inspection process of the inspector can be further facilitated.

In the first and second embodiments, a case has been described in which two visual inspection means having different imaging magnifications are used. However, for example, three or more visual inspection means may be used in a dispersed manner, and the number of used devices is limited. It will not be done.

[0090]

As described above, according to the first aspect of the present invention, there is provided an XY stage for mounting a substrate to be inspected on which components are mounted, and an image pickup means corresponding to the size of the component mounted on the substrate to be inspected. A plurality of visual inspection means according to the size of the mounted components for inspecting the inspected board, and a visual inspection means optimal for the size of the mounted components of the inspected substrate selected from the plurality of visual inspection means A plurality of visual inspection means, and an integrated control means for performing distributed processing, wherein each photographing means of the plurality of visual inspection means has an arbitrary component mounting position in accordance with the size of the component to be inspected. A plurality of visual inspection means for capturing the image data from the imaging means, and a visual inspection processing unit for controlling the XY stage in association with the overall control means. An input unit that is operated by the inspector,
A display for displaying at least image data, the general control unit and the visual inspection processing unit, based on the visual inspection target image captured by the imaging unit and the inspection information on the visual inspection target image, In addition to performing the inspection, inputting, recording, and processing the inspection result data, the inspector performs a visual inspection by a visual inspection unit having a magnifying lens having a different imaging magnification according to the size of the mounted component on the substrate to be inspected. At the same time, since only the parts to be inspected are automatically specified, the hardware and software configurations have been simplified to reduce the load on inspectors, reduce the number of man-hours, and reduce costs. There is an effect that can be obtained.

According to a second aspect of the present invention, in the first aspect, the visual inspection processing unit extracts the history data and the captured image data of the defective part position from the previous inspection result information of the inspection target board. Since the display displays the history data and the captured image data of the extracted defect determination component position on the same screen together with the current captured image of the same component position on the inspected board, the hardware and software configuration Is simplified, the load on the inspector is reduced, the number of man-hours is reduced, and the cost of the substrate inspection apparatus is reduced.

According to a third aspect of the present invention, selection and download of inspection information from the central control means to at least one of the plurality of visual inspection means using the board inspection apparatus of the first or second aspect. A first step of performing
The method includes a second step of performing a visual inspection using at least one of the plurality of visual inspection means, and a third step of uploading inspection result information from the visual inspection means to the overall control means. This has the effect of simplifying the software configuration, reducing the load on the inspector, shortening the number of work steps, and achieving a board inspection method that achieves cost reduction.

[Brief description of the drawings]

FIG. 1 is a block diagram schematically showing a substrate inspection apparatus according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a visual inspection unit of the substrate inspection apparatus according to the first embodiment of the present invention.

FIG. 3 is a flowchart for explaining a first step (an operation of selecting and downloading inspection information to a visual inspection unit by an integrated control unit) of the substrate inspection method according to the first embodiment of the present invention;

FIG. 4 is a flowchart illustrating a second step (a visual inspection operation by a visual inspection unit) of the substrate inspection method according to the first embodiment of the present invention;

FIG. 5 is a flowchart illustrating a first step (upload operation of inspection result information from a visual inspection unit by an integrated control unit) of the substrate inspection method according to the first embodiment of the present invention;

FIG. 6 is an explanatory diagram schematically showing an image display area of a display of a substrate inspection apparatus according to a second embodiment of the present invention.

FIG. 7 is a flowchart illustrating an operation of displaying previous inspection result information and current inspection information on a display in a second step of the substrate inspection method according to the second embodiment of the present invention.

FIG. 8 is a block diagram schematically showing a conventional substrate inspection apparatus.

[Explanation of symbols]

1 overall control means, 2A visual inspection means, 3B visual inspection means, 4, 4a printed circuit board (substrate to be inspected), 5
XY stage, 6 cameras, 7 magnifying lens, 8 visual inspection processing unit, 9 display, 9a display screen, 9b current inspection information display area, 9c parts information,
9d Current captured image, 9e Previous inspection result information display area, 9f Failure history data, 9g Previous captured image,
10 input units.

Claims (3)

[Claims] 1. An XY stage for mounting a substrate to be inspected on which components are mounted, and an imaging unit corresponding to a size of a component mounted on the substrate to be inspected, wherein the imaging unit performs inspection of the substrate to be inspected. A plurality of visual inspection means corresponding to the size of the mounted component; and a plurality of visual inspection means selected and controlled from among the plurality of visual inspection means, the optimal visual inspection means for the size of the mounted component of the board to be inspected. Control means for performing distributed processing together with the means, and each photographing means of the plurality of visual inspection means is adapted to photograph an arbitrary component mounting position in accordance with the size of the mounted component of the board to be inspected. A plurality of visual inspection means for capturing image data from the photographing means and controlling the XY stage in association with the general control means; A processing unit, an input unit operated by an inspector, and a display for displaying at least the image data, wherein the general control unit and the visual inspection processing unit are images to be visually inspected photographed by the photographing unit. And inspecting the inspected substrate based on the inspection information relating to the visual inspection target image and inputting, recording, and processing inspection result data. 2. The visual inspection processing unit extracts history data and captured image data of a defect determination component position from previous inspection result information of the inspection target board, and the display displays the extracted defect determination component position. The board inspection apparatus according to claim 1, wherein the history data and the captured image data are displayed on the same screen together with the current captured image at the same component position on the board to be inspected. 3. A first step of selecting and downloading the inspection information from the general control unit to at least one of the plurality of visual inspection units, and performing visual inspection using at least one of the plurality of visual inspection units. 3. The method according to claim 1, further comprising: a second step of performing an inspection; and a third step of uploading inspection result information from the visual inspection unit to the general control unit. 4. A board inspection method using a board inspection apparatus.