JP2005159326A5 - - Google Patents

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Publication number
JP2005159326A5
JP2005159326A5 JP2004311126A JP2004311126A JP2005159326A5 JP 2005159326 A5 JP2005159326 A5 JP 2005159326A5 JP 2004311126 A JP2004311126 A JP 2004311126A JP 2004311126 A JP2004311126 A JP 2004311126A JP 2005159326 A5 JP2005159326 A5 JP 2005159326A5
Authority
JP
Japan
Prior art keywords
conductive film
wiring
mask
convex portion
columnar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004311126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005159326A (ja
JP4748967B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004311126A priority Critical patent/JP4748967B2/ja
Priority claimed from JP2004311126A external-priority patent/JP4748967B2/ja
Publication of JP2005159326A publication Critical patent/JP2005159326A/ja
Publication of JP2005159326A5 publication Critical patent/JP2005159326A5/ja
Application granted granted Critical
Publication of JP4748967B2 publication Critical patent/JP4748967B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2004311126A 2003-11-04 2004-10-26 半導体装置の作製方法 Expired - Fee Related JP4748967B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004311126A JP4748967B2 (ja) 2003-11-04 2004-10-26 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003375038 2003-11-04
JP2003375038 2003-11-04
JP2004311126A JP4748967B2 (ja) 2003-11-04 2004-10-26 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2005159326A JP2005159326A (ja) 2005-06-16
JP2005159326A5 true JP2005159326A5 (fr) 2007-08-16
JP4748967B2 JP4748967B2 (ja) 2011-08-17

Family

ID=34741376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004311126A Expired - Fee Related JP4748967B2 (ja) 2003-11-04 2004-10-26 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4748967B2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1760798B1 (fr) * 2005-08-31 2012-01-11 Semiconductor Energy Laboratory Co., Ltd. Dispositif semi-conducteur et son procédé de fabrication
EP1793266B1 (fr) 2005-12-05 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. Système d'affichage à cristaux liquides transflectif avec une configuration horizontale du champ électrique
CN101796613B (zh) * 2007-09-14 2012-06-27 株式会社半导体能源研究所 半导体装置及电子设备
JP2009224238A (ja) * 2008-03-18 2009-10-01 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子及びその製造方法
JP5429454B2 (ja) * 2009-04-17 2014-02-26 ソニー株式会社 薄膜トランジスタの製造方法および薄膜トランジスタ
WO2011043194A1 (fr) 2009-10-09 2011-04-14 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteur et procédé pour fabriquer celui-ci
WO2019220266A1 (fr) * 2018-05-18 2019-11-21 株式会社半導体エネルギー研究所 Dispositif à semi-conducteurs et procédé de fabrication de dispositif à semi-conducteurs

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07109828B2 (ja) * 1988-09-14 1995-11-22 日本電気株式会社 多層配線構造体の製造方法
JPH08181213A (ja) * 1994-12-27 1996-07-12 Kawasaki Steel Corp 半導体装置の製造方法
JPH08274164A (ja) * 1995-03-31 1996-10-18 Seiko Epson Corp 半導体装置
JPH08306779A (ja) * 1995-05-10 1996-11-22 Sony Corp 半導体装置の製造方法
JP2000012683A (ja) * 1998-06-17 2000-01-14 Nec Corp 集積回路とその製造方法

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