JP2005142352A - Sheet for internal electrode and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet for internal electrode that can suppress the occurrence of structural defects in a sintered compact for laminated ceramic capacitor manufactured by baking a laminate of a ceramic dielectric sheet, and the sheet for internal electrode and containing a ceramic dielectric layer and internal electrodes, and can stably make electrostatic capacitance unchanged; and to provide a method of manufacturing the sheet. <P>SOLUTION: The sheet for internal electrode is used for manufacturing the sintered compact for laminated ceramic capacitor containing the ceramic dielectric layer and internal electrodes. Further, the sheet has particles containing the chief material of the ceramic dielectric layer and metal powder. The sintered compact for laminated ceramic capacitor is obtained by baking the laminate of the ceramic dielectric sheet containing the chief material of the ceramic dielectric layer and the sheet for internal electrode. The mean particle diameter of the particles is adjusted to the 1/2-3/2 of the thicknesses of the internal electrodes. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an internal electrode sheet for producing a sintered body for a multilayer ceramic capacitor and a method for producing the same.

  An example of a multilayer ceramic capacitor is shown in FIG. 1 is a ceramic dielectric layer, 2 is an internal electrode, 3 is an element body, and 4 is an external electrode. In the element body 3, ceramic dielectric layers 1 and internal electrodes 2 are alternately laminated. The ceramic dielectric layer 1 has a ceramic dielectric powder material (for example, barium titanate) as a main component, and the internal electrode 2 has a metal material (for example, nickel) as a main component. The end faces of the internal electrodes 2 are alternately taken out on both end faces of the element body 3 and are electrically connected to the external electrodes 4 to constitute a multilayer ceramic capacitor.

  An example of the manufacturing process of the multilayer ceramic capacitor will be described with reference to FIG. First, a ceramic dielectric powder and a binder solution are sufficiently mixed and dispersed to prepare a slurry. The slurry is formed into a sheet on a carrier film to obtain a ceramic dielectric sheet having a thickness of about 2 to 50 μm. On the other hand, a metal powder and a binder solution are mixed and dispersed to prepare a paste. The paste is separately printed on a carrier film to obtain an internal electrode sheet having a thickness of about 1 to 3 μm. Using the ceramic dielectric sheet on the carrier film thus obtained and the internal electrode sheet on the carrier film, a predetermined number of ceramic dielectric sheets and internal electrode sheets were alternately laminated and pressure-bonded by transfer or the like. A laminate is obtained. The laminated body is cut into a predetermined size to obtain a green chip. This green chip is subjected to binder removal processing and firing processing to obtain a sintered body (element body). An external electrode material is applied to the sintered body and then baked to obtain a multilayer ceramic capacitor.

  In the manufacturing process of the multilayer ceramic capacitor, a multilayer body in which ceramic dielectric sheets and internal electrode sheets are alternately laminated and pressure-bonded is fired to obtain a sintered body. During firing, there is a problem that structural defects (delamination, cracks, etc.) are likely to occur in the obtained sintered body due to the difference in thermal shrinkage behavior between the ceramic dielectric sheet and the internal electrode sheet. A multilayer ceramic capacitor manufactured using a sintered body having such a structural defect also has a problem that it is greatly affected by insulation resistance and reliability.

  The multilayer ceramic capacitor for suppressing the occurrence of this structural defect includes, for example, an internal electrode and a ceramic dielectric layer, and the internal electrode has an opening through the plane, and the opening has a ceramic dielectric. A multilayer ceramic capacitor filled with a layer material is known (see, for example, Patent Document 1). In this multilayer ceramic capacitor, the internal electrodes and the ceramic dielectric layers located in the upper and lower layers thereof are in close contact with each other by the material of the ceramic dielectric layer filled in the openings of the internal electrodes. Also in the process of manufacturing this multilayer ceramic capacitor, a sintered body is obtained by firing a multilayer body in which ceramic dielectric sheets and internal electrode sheets are alternately laminated and pressure-bonded in the same manner as described above.

However, in this method, the opening of the internal electrode is formed by the additive added to the ceramic dielectric sheet oozing out during firing of the laminate. Therefore, in order to form the opening, it is necessary to adjust various factors such as the firing temperature of the laminate, the type and amount of the additive, and the opening has a certain size, that is, has a certain area. It was not easy to stably produce a sintered body having internal electrodes. Therefore, it is not easy to stably produce a sintered body having a certain capacitance.
JP-A-9-260198 (FIG. 6)

  In view of the above problems, the present invention provides a structural defect of a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and an internal electrode, which is produced by firing a multilayer body of a ceramic dielectric sheet and an internal electrode sheet. An object of the present invention is to provide an internal electrode sheet and a method for manufacturing the same, which can suppress the occurrence of the above and can make the electrostatic capacitance stable and constant.

The internal electrode sheet of the present invention is a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and internal electrodes by firing a multilayer body with a ceramic dielectric sheet containing the main material of the ceramic dielectric layer. An internal electrode sheet for
The internal electrode sheet includes particles including a main material of the ceramic dielectric layer and metal powder,
In the internal electrode sheet, the average particle size of the particles is ½ or more and 3/2 or less of the thickness of the internal electrode.

In addition, the manufacturing method of the present invention (hereinafter referred to as the first manufacturing method) includes a primary material including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode. A multilayer ceramic capacitor sintered body including a ceramic dielectric layer and an internal electrode is fired by firing a laminate of a ceramic dielectric sheet containing particles and metal powder and including a main material of the ceramic dielectric layer. A manufacturing method of an internal electrode sheet for manufacturing,
Surface treating the primary particles;
A step of forming a paste by mixing and dispersing the surface-treated primary particles and the metal powder in a binder solution;
And forming the paste into a sheet to obtain an internal electrode sheet.

Another manufacturing method of the present invention (hereinafter referred to as a second manufacturing method) includes a main material of a ceramic dielectric layer having an average particle size of ½ or more and 3/2 or less of the thickness of the internal electrode. A sintered body for a multilayer ceramic capacitor comprising a ceramic dielectric layer and an internal electrode by firing a laminated body of a ceramic dielectric sheet containing secondary particles and metal powder and including a main material of the ceramic dielectric layer A method for producing an internal electrode sheet for producing
A step of mixing and dispersing primary particles containing the main material of the ceramic dielectric layer in a solvent to form a slurry;
Forming the secondary particles by simultaneously drying and granulating the slurry; and
Heat treating the secondary particles;
Surface treating the heat treated secondary particles;
A step of mixing and dispersing the surface-treated secondary particles and the metal powder in a binder solution to form a paste;
And forming the paste into a sheet to obtain an internal electrode sheet.

Another manufacturing method of the present invention (hereinafter referred to as a third manufacturing method) includes a main material of a ceramic dielectric layer having an average particle size of ½ or more and 3/2 or less of the thickness of the internal electrode. A sintered body for a multilayer ceramic capacitor comprising a ceramic dielectric layer and an internal electrode by firing a laminated body of a ceramic dielectric sheet containing secondary particles and metal powder and including a main material of the ceramic dielectric layer A method for producing an internal electrode sheet for producing
A step of mixing and dispersing primary particles containing the main material of the ceramic dielectric layer in a binder solution to form a slurry;
Forming the secondary particles by simultaneously drying and granulating the slurry; and
A step of mixing and dispersing the secondary particles and the metal powder in a binder solution to form a paste;
And forming the paste into a sheet to obtain an internal electrode sheet.

Another manufacturing method of the present invention (hereinafter referred to as a fourth manufacturing method) includes a primary material including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode. A multilayer ceramic capacitor sintered body including a ceramic dielectric layer and an internal electrode is fired by firing a laminate of a ceramic dielectric sheet containing particles and metal powder and including a main material of the ceramic dielectric layer. A manufacturing method of an internal electrode sheet for manufacturing,
A step of mixing and dispersing the metal powder in a binder solution to form a paste;
Forming the paste into a sheet,
And a step of pressing the primary particles into the sheet to obtain an internal electrode sheet.

  As described above, the internal electrode sheet of the present invention includes particles containing the main material of the ceramic dielectric layer and metal powder, and the average particle size of the particles is ½ or more of the thickness of the internal electrode 3 / 2 or less. By firing a laminate of the internal electrode sheet and the ceramic dielectric sheet, the internal electrode sheet becomes an internal electrode, the ceramic dielectric sheet becomes a ceramic dielectric layer, and becomes a sintered body for a multilayer ceramic capacitor. . At this time, since the particles bind to the particles in the ceramic dielectric sheet, the upper and lower ceramic dielectric layers sandwiching the internal electrode are joined. As a result, the occurrence of structural defects such as delamination and cracks is suppressed in the sintered body.

  Further, the internal electrode sheet of the present invention is an internal electrode in a sintered body obtained after firing a laminate with the ceramic dielectric sheet by adjusting the content of the particles contained therein. It is possible to adjust the area. Therefore, since a sintered body having a certain area of internal electrodes can be obtained, a sintered body having a certain capacitance can be stably manufactured.

  In the internal electrode sheet of the present invention, the particles may be primary particles or secondary particles. The secondary particles are, for example, formed by aggregating primary particles. The particles are preferably secondary particles.

  When the particles are secondary particles, for example, the primary particles including the main material of the ceramic dielectric layer are mixed and dispersed in a solvent to form a slurry, and the slurry is dried and formed. You may manufacture a grain simultaneously. The obtained secondary particles may be further heat-treated. Alternatively, the secondary particles may be formed by, for example, mixing and dispersing primary particles including the main material of the ceramic dielectric layer in a solution containing a binder to form a slurry, and simultaneously drying and granulating the slurry. It may be manufactured.

  In the internal electrode sheet of the present invention, the thickness of the internal electrode is preferably 0.5 μm or more and 2.0 μm or less, and more preferably 0.7 μm or more and 1.5 μm or less.

  The thickness of the internal electrode is the type of the main material of the ceramic dielectric layer contained in the internal electrode sheet, the thickness of the internal electrode sheet, and the conditions for firing the laminate of the ceramic dielectric sheet Can be adjusted. For example, when the main material of the ceramic dielectric layer is barium titanate, the thickness of the internal electrode sheet is 1.2 μm, and the firing is performed at 1250 ° C. in a reducing atmosphere, the thickness of the internal electrode is 1.0 to 1.1 μm.

  In the internal electrode sheet of the present invention, the content of the main material of the ceramic dielectric layer in the particles is preferably 80% by weight or more, and more preferably 90% by weight or more.

  In the ceramic dielectric sheet, the content of the main material of the ceramic dielectric layer is more preferably 80% by weight or more, and more preferably 90% by weight or more.

  In the internal electrode sheet of the present invention, the main material of the ceramic dielectric layer is preferably barium titanate, aluminum oxide, a lead composite perovskite compound, strontium titanate, or the like.

  In the internal electrode sheet of the present invention, the thickness of the internal electrode sheet is preferably 0.6 μm or more and 2.5 μm or less, and more preferably 0.8 μm or more and 1.8 μm or less.

  In the internal electrode sheet of the present invention, the metal powder is preferably at least one selected from the group consisting of nickel powder, palladium powder, platinum powder and silver powder. The average particle size of the metal powder is not particularly limited, and is, for example, 0.05 μm or more and 0.5 μm or less.

  As described above, the internal electrode sheet of the present invention includes particles containing the main material of the ceramic dielectric layer and metal powder. In addition, the internal electrode sheet may contain a binder (for example, butyral resin, acrylic resin, polyethylene, or the like).

The sheet-integrated ceramic dielectric sheet for internal electrodes of the present invention is a sheet-integrated ceramic dielectric sheet for internal electrodes for producing a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and internal electrodes. ,
The internal electrode sheet-integrated ceramic dielectric sheet includes an internal electrode sheet and a ceramic dielectric sheet,
The internal electrode sheet is the internal electrode sheet of the present invention,
The internal electrode sheet is an internal electrode sheet-integrated ceramic dielectric sheet formed directly on the ceramic dielectric sheet.

The multilayer ceramic capacitor of the present invention is a multilayer ceramic capacitor including a multilayer ceramic capacitor sintered body including a ceramic dielectric layer and an internal electrode, and a pair of external electrodes,
The multilayer ceramic capacitor sintered body is obtained by firing a multilayer body including a ceramic dielectric sheet and an internal electrode sheet,
The internal electrode sheet is the internal electrode sheet of the present invention,
The pair of external electrodes is a multilayer ceramic capacitor electrically connected to the internal electrodes.

Another multilayer ceramic capacitor of the present invention is a multilayer ceramic capacitor including a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and an internal electrode, and a pair of external electrodes,
The multilayer ceramic capacitor sintered body is obtained by firing a laminate of the internal electrode sheet-integrated ceramic dielectric sheet of the present invention,
The pair of external electrodes is a multilayer ceramic capacitor electrically connected to the internal electrodes.

  In the first method for producing an internal electrode sheet of the present invention, the surface treatment of the primary particles is preferably performed by bringing a coupling agent into contact with the primary particles, drying, and heating.

  In the second method for producing an internal electrode sheet of the present invention, the surface treatment of the secondary particles is preferably performed by bringing a coupling agent into contact with the secondary particles, drying, and heating.

  As the coupling agent, a silane coupling agent or a titanate coupling agent can be used, and among these, a silane coupling agent is preferably used. When an appropriate coupling agent is selected and the surface treatment is performed, the surface of the particles and the binder become incompatible, so that the binder solution containing metal powder is repelled from the surface of the particles. As a result, the surface smoothness of the internal electrode sheet is improved, and when a laminate with the ceramic dielectric sheet is formed, the layers of the sheet are formed in parallel to each other. In the sintered body obtained after firing such a laminate, the distance between the internal electrodes formed from the internal electrode sheet is kept constant, and it is considered that the occurrence of a short circuit can be suppressed.

  In the second and third manufacturing methods of the sheet for internal electrodes of the present invention, the method of forming secondary particles by simultaneously drying and granulating the slurry is not limited. For example, a spray dryer is used. Spray drying, fluidized bed granulation and the like.

  In the fourth method for producing an internal electrode sheet of the present invention, as a method for press-fitting primary particles containing the main material of the ceramic dielectric layer into the metal powder sheet, for example, on the metal powder sheet, A method of supporting the primary particles and then applying pressure to the sheet from above the primary particles can be used. By adjusting the supported amount of the primary particles, the content of the primary particles contained in the internal electrode sheet can be adjusted.

  In the first to fourth manufacturing methods of the internal electrode sheet of the present invention, the paste is formed into a sheet shape as described above. Examples of the method for forming the sheet include gravure printing, die uniaxial forming method, isotropic pressure pressing method, doctor blade method, calendar method, roll coater method and the like.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
This embodiment demonstrates the preferable form of the sheet | seat for internal electrodes of this invention formed on the carrier film. In the present embodiment, the particles in the internal electrode sheet of the present invention are primary particles. FIG. 1 shows a top view of an example of the sheet for internal electrodes of the present invention formed on a carrier film, and FIG. 2 shows a cross-sectional view thereof. Reference numeral 5 denotes particles containing the main material of the ceramic dielectric layer (hereinafter referred to as co-powder), 6 is nickel powder, 7 is a binder, 8 is an internal electrode sheet, and 9 is a carrier film. In the present embodiment, the co-powder 5 is a primary particle containing the main material of the ceramic dielectric layer. For example, the co-powder 5 has such a size that it penetrates the cross section of the internal electrode sheet 8 as shown in FIG. is there. Therefore, when a laminated body of the internal electrode sheet and the ceramic dielectric sheet is produced, the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet at the location where the co-powder 5 exists are pressed through the co-powder 5. The Thereafter, when the laminate is fired, the main material of the ceramic dielectric layer in the co-powder 5 is sintered together with the main material of the ceramic dielectric layer in the upper and lower ceramic dielectric sheets. As a result, the upper and lower ceramic dielectric layers sandwiching the internal electrode are joined via the co-powder 5. Therefore, occurrence of structural defects such as delamination and cracks can be suppressed. Further, by adjusting the amount of the co-powder 5, the area of the obtained internal electrode can be adjusted, and a sintered body having a constant capacitance can be obtained.

  As described above, the average particle diameter of the co-powder in the internal electrode sheet is in the range of 1/2 or more and 3/2 or less of the thickness of the internal electrode. This is because when the average particle size of the co-powder is ½ or more of the thickness of the internal electrode, the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet are sufficiently pressed through the co-powder. Further, when the average particle size of the co-powder is smaller than 3/2, the surface smoothness of the internal electrode sheet is good, and when the ceramic dielectric sheet and the internal electrode sheet are laminated and pressure-bonded, the ceramic dielectric locally This is because a portion where the sheet becomes thin does not occur, and occurrence of a short circuit when the laminate is fired can be prevented.

  In the internal electrode sheet of the present invention, the content of the co-powder is preferably 1% by weight to 30% by weight, and more preferably 3% by weight to 15% by weight with respect to the metal powder. preferable. When the content of the co-powder is 1% by weight or more, the existence probability of the co-powder in the internal electrode sheet is sufficiently high, so that the bonding of the upper and lower ceramic dielectric layers sandwiching the internal electrode can be sufficiently formed, and after firing Structural defects occurring in the obtained green chip sintered body can be suppressed. In addition, when the content of the co-powder is 30% by weight or less, the existence probability of the co-powder in the internal electrode sheet does not become too high, so that the effective electrode area of the internal electrode in the obtained sintered body can be sufficiently secured This is because a desired capacitance can be obtained.

(Embodiment 2)
In this embodiment, another preferred embodiment of the sheet for internal electrodes of the present invention formed on a carrier film will be described. In the present embodiment, the particles in the internal electrode sheet of the present invention are secondary particles. A top view of an example of the sheet for internal electrodes of the present invention formed on a carrier film is shown in FIG. 3 and a cross-sectional view is shown in FIG. 15 is a co-powder, 16 is a nickel powder, 17 is a binder, 18 is a sheet for internal electrodes, and 19 is a carrier film. In the present embodiment, the co-powder 15 is a secondary particle in which primary particles are aggregated. Similar to the first embodiment, the co-powder 15 is present so as to penetrate the cross section of the internal electrode sheet 18 (see FIG. 4).

  Therefore, when a laminated body of the internal electrode sheet and the ceramic dielectric sheet is produced, the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet at the location where the co-powder 15 exists are pressed through the co-powder 15. The Thereafter, when the laminate is fired, the main material of the ceramic dielectric layer in the co-powder 15 is sintered together with the main material of the ceramic dielectric layer in the upper and lower ceramic dielectric sheets. As a result, the upper and lower ceramic dielectric layers sandwiching the internal electrode are joined via the co-powder 15. Therefore, occurrence of structural defects such as delamination and cracks can be suppressed. Further, by adjusting the amount of the co-powder 15, the area of the obtained internal electrode can be adjusted, and a sintered body having a constant capacitance can be obtained.

  Furthermore, in this embodiment, the assembly of primary particles in the co-powder in the internal electrode sheet can be loosened by pressure bonding when producing a laminate of the internal electrode sheet and the ceramic dielectric sheet. Therefore, the surface smoothness of the internal electrode sheet in the laminate is further improved as compared with the case where primary particles are used, and the distance between the internal electrode sheets sandwiching the ceramic dielectric sheet is maintained at a certain level or more. Therefore, it is more effective in suppressing a short circuit between the internal electrodes in the sintered body obtained after firing the laminate.

  Also in this embodiment, the average particle diameter of the co-powder in the internal electrode sheet is in the range of 1/2 or more and 3/2 or less of the thickness of the internal electrode, as in the first embodiment.

  Also in the present embodiment, the content of the co-powder in the internal electrode sheet is the same as that in the first embodiment.

(Embodiment 3)
In this embodiment, a preferred embodiment of the internal electrode sheet-integrated ceramic dielectric sheet of the present invention formed on a carrier film will be described. In the present embodiment, the particles in the internal electrode sheet in the internal electrode sheet-integrated ceramic dielectric sheet of the present invention are primary particles. FIG. 5 shows a top view and FIG. 6 shows a cross-sectional view of an example of the internal electrode sheet-integrated ceramic dielectric sheet of the present invention formed on a carrier film. 25 is a co-powder, 26 is a nickel powder, 27 is a binder, 28 is a sheet for internal electrodes, 29 is a carrier film, and 110 is a ceramic dielectric sheet. In the present embodiment, the internal electrode sheet 28 is directly formed on the ceramic dielectric sheet 110. The co-powder 25 is primary particles. Similar to the first embodiment, the co-powder 25 exists so as to penetrate the cross section of the internal electrode sheet 28 (see FIG. 6).

  Therefore, when producing a laminate of the internal electrode sheet and the ceramic dielectric sheet, the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet at the location where the co-powder 25 is present are pressure-bonded via the co-powder 25. The Thereafter, when the laminate is fired, the main material of the ceramic dielectric layer in the co-powder 25 is sintered together with the main material of the ceramic dielectric layer in the upper and lower ceramic dielectric sheets. As a result, the upper and lower ceramic dielectric layers sandwiching the internal electrode are bonded via the co-powder 25. Therefore, occurrence of structural defects such as delamination and cracks can be suppressed. Further, by adjusting the amount of the co-powder 25, the area of the obtained internal electrode can be adjusted, and a sintered body having a constant capacitance can be obtained.

  Also in this embodiment, the average particle diameter of the co-powder in the internal electrode sheet is in the range of 1/2 or more and 3/2 or less of the thickness of the internal electrode, as in the first embodiment.

  Also in the present embodiment, the content of the co-powder in the internal electrode sheet is the same as that in the first embodiment.

(Embodiment 4)
In the present embodiment, another preferred embodiment of the internal electrode sheet-integrated ceramic dielectric sheet of the present invention formed on a carrier film will be described. In this embodiment, the particles in the internal electrode sheet in the internal electrode sheet-integrated ceramic dielectric sheet of the present invention are secondary particles. FIG. 7 shows a top view and FIG. 8 shows a cross-sectional view of an example of the internal electrode sheet-integrated ceramic dielectric sheet of the present invention formed on a carrier film. 35 is a co-powder, 36 is a nickel powder, 37 is a binder, 38 is a sheet for internal electrodes, 39 is a carrier film, and 210 is a ceramic dielectric sheet. In the present embodiment, as in the third embodiment, the internal electrode sheet 38 is directly formed on the ceramic dielectric sheet 210. The co-powder 35 is a secondary particle in which primary particles are aggregated. Similar to the second embodiment, the co-powder 35 exists so as to penetrate the cross section of the internal electrode sheet 38 (see FIG. 8).

  Therefore, when a laminated body of the internal electrode sheet and the ceramic dielectric sheet is produced, the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet at the location where the co-powder 35 exists are pressure-bonded via the co-powder 35. The Thereafter, when the laminate is fired, the main material of the ceramic dielectric layer in the co-powder 35 is sintered together with the main material of the ceramic dielectric layer in the upper and lower ceramic dielectric sheets. As a result, the upper and lower ceramic dielectric layers sandwiching the internal electrode are joined via the co-powder 35. Therefore, occurrence of structural defects such as delamination and cracks can be suppressed. Further, by adjusting the amount of the co-powder 35, the area of the obtained internal electrode can be adjusted, and a sintered body having a constant capacitance can be obtained.

  Furthermore, also in this embodiment, the assembly of primary particles in the co-powder in the internal electrode sheet can be loosened by pressure bonding when producing a laminate of the internal electrode sheet and the ceramic dielectric sheet. Therefore, the surface smoothness of the internal electrode sheet in the laminate is further improved as compared with the case where primary particles are used, and the distance between the internal electrode sheets sandwiching the ceramic dielectric sheet is maintained at a certain level or more. Therefore, it is more effective in suppressing a short circuit between the internal electrodes in the sintered body obtained after firing the laminate.

  Also in this embodiment, the average particle diameter of the co-powder in the internal electrode sheet is in the range of 1/2 or more and 3/2 or less of the thickness of the internal electrode, as in the first embodiment.

  Also in the present embodiment, the content of the co-powder in the internal electrode sheet is the same as that in the first embodiment.

(Embodiment 5)
In the present embodiment, preferred embodiments of the green chip for a multilayer ceramic capacitor and the sintered body thereof according to the present invention will be described. In the present embodiment, the particles in the internal electrode sheet in the green chip of the present invention are primary particles. FIG. 9 shows an enlarged sectional view of an example of the green chip for a multilayer ceramic capacitor, and FIG. 11 shows an enlarged sectional view of an example of the sintered body after firing. An overall cross-sectional view of an example of the multilayer ceramic capacitor is shown in FIG. 45 is a co-powder, 46 is a nickel powder, 47 is a binder, 48 is a sheet for internal electrodes, and 310 is a ceramic dielectric sheet. The co-powder 45 is a primary particle. The green chip for a multilayer ceramic capacitor of this embodiment can be obtained by alternately laminating the ceramic dielectric sheet and the internal electrode sheet of Embodiment 1. The internal electrode sheet of Embodiment 1 can be transferred from a carrier film and laminated. Alternatively, the green chip for a multilayer ceramic capacitor can be obtained by transferring and laminating a plurality of internal electrode integrated ceramic dielectric sheets of Embodiment 3 from a carrier film.

  The green chip for a multilayer ceramic capacitor is subjected to binder removal processing and firing processing to obtain a sintered body (element body). First, organic components (for example, binder) in the internal electrode sheet 48 and the ceramic dielectric sheet 310 in the multilayer ceramic capacitor green chip disappear, and then the nickel powder is removed. 46 is started, and finally, the ceramic dielectric sheet 310 including the co-powder 45 is started to be sintered. At the start of the sintering of the nickel powder 46, the organic components in the internal electrode sheet 48 have disappeared, and the ceramic dielectric sheet 310 surrounding the nickel powder 46 has not started to be sintered. Therefore, a certain amount of space is spatially present around the nickel powder 46, and the nickel powder 46 is sintered and contracted to form an internal electrode while being rounded. At this time, since the co-powder 45 is present in the internal electrode sheet 48, the continuity of the internal electrode is interrupted at the co-powder 45, and the internal electrode in the sintered body after firing is, for example, as shown in FIG. Shape. In FIG. 11, 11 is a ceramic dielectric layer, and 12 is an internal electrode. An external electrode material is applied to the sintered body and then baked to obtain a multilayer ceramic capacitor as shown in FIG. 12, for example. In FIG. 12, 11 is a ceramic dielectric layer, 12 is an internal electrode, 13 is an element body, and 14 is an external electrode. In FIG. 12, the upper and lower ceramic dielectric layers 11 sandwiching the internal electrode 12 are not cut by the internal electrode 12 and are integrated vertically at several locations within the internal electrode 12, thereby preventing structural defects. .

(Embodiment 6)
In the present embodiment, another preferred embodiment of the green chip for a multilayer ceramic capacitor and the sintered body thereof according to the present invention will be described. In the present embodiment, the particles in the internal electrode sheet in the green chip of the present invention are secondary particles. FIG. 10 is an enlarged cross-sectional view of an example of the green chip for a multilayer ceramic capacitor, and FIG. 11 is an enlarged cross-sectional view of an example of the sintered body after firing. An overall cross-sectional view of an example of the multilayer ceramic capacitor is shown in FIG. 55 is a co-powder, 56 is a nickel powder, 57 is a binder, 58 is a sheet for internal electrodes, and 410 is a ceramic dielectric sheet. The co-powder 55 is a secondary particle in which primary particles are aggregated. The green chip for a multilayer ceramic capacitor of this embodiment can be obtained by alternately laminating the ceramic dielectric sheet and the internal electrode sheet of Embodiment 2. The internal electrode sheet of Embodiment 2 can be transferred from a carrier film and laminated. Alternatively, the green chip for a multilayer ceramic capacitor can be obtained by transferring and laminating a plurality of internal electrode integrated ceramic dielectric sheets of Embodiment 4 from a carrier film.

  The green chip for a multilayer ceramic capacitor is subjected to binder removal processing and firing processing to obtain a sintered body (element body). An external electrode material is applied to the sintered body and then baked to obtain a multilayer ceramic capacitor as shown in FIG. 12, for example. Similarly to the fifth embodiment, in this sintered body, the upper and lower ceramic dielectric layers 11 sandwiching the internal electrode 12 are not cut by the internal electrode 12 in FIG. 11 and FIG. Therefore, structural defects can be prevented.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to the following Example.

(Example 1)
(Manufacture of internal electrode sheets)
1. Barium titanate powder (particles of the main material of the ceramic dielectric layer) (average particle diameter 1.2 μm) (co-powder) and a compound of formula (1) (silane coupling agent) (surface treatment agent) were prepared.
(CH ₃ O) ₃ SiC ₁₀ H ₂₁ (1)
2. The compound (1) was diluted to 1% by weight with isopropyl alcohol to obtain a silane coupling solution. Next, the co-powder was immersed in a silane coupling solution, and ultrasonic vibration (100 W, 45 kHz) was added for 10 minutes.
3. The co-powder immersed in the silane coupling solution was allowed to stand at room temperature and air-dried, and then heat-treated at 150 ° C. for 30 minutes to promote the condensation reaction on the co-powder surface of the silane coupling agent.
4). Nickel powder (metal powder) (average particle size 0.4 μm) and the above silane coupling treatment (surface treatment) co-powder (particles of the main material of the ceramic dielectric layer) (10% by weight with respect to the nickel powder) A butyral resin (non-aqueous binder) (7% by weight based on nickel powder) and butyl acetate (55% by weight based on the total solid content) were sufficiently mixed and dispersed to prepare a paste.
5). A sheet for internal electrodes (average film thickness: 1.2 μm) was prepared on a carrier film by using the gravure printing method of the paste. At this time, when the cross section of the internal electrode sheet was observed, the cross section was as shown in FIG. Since there is no compatibility between the silane coupling agent treated on the surface of the co-powder and the butyral resin, the co-powder is considered to be present in the internal electrode sheet in a state where the butyral resin is repelled.

(Manufacture of ceramic dielectric sheets)
6). Barium titanate powder (main material of ceramic dielectric layer) (average particle size 0.5 μm), butyral resin (non-aqueous binder) (8% by weight based on barium titanate powder) and butyl acetate (based on total solids) 75% by weight) was sufficiently mixed and dispersed to prepare a slurry.
7). A ceramic dielectric sheet (average film thickness: 5 μm) was prepared on the carrier film by using the doctor blade method.

(Manufacture of green chip for multilayer ceramic capacitor and its sintered body)
8). The ceramic dielectric sheet and the internal electrode sheet were alternately laminated and pressure-bonded by 300 layers, and then cut to obtain a green chip. At this time, the ceramic dielectric sheet and the internal electrode sheet were transferred from the carrier sheet and laminated. On the top and bottom of the green chip, only 10 ceramic dielectric sheets were laminated as protective layers.
9. The above-mentioned green chip was heated to 500 ° C. in the atmosphere to perform a debinding process. Thereafter, it was heated to 1250 ° C. in a reducing atmosphere, held for 2 hours, and then cooled to room temperature to obtain a sintered body for multilayer ceramic capacitor (3.2 mm × 1.6 mm × 1.6 mm).

(Example 2)
(Manufacture of internal electrode sheets)
1. Barium titanate powder (main material of ceramic dielectric layer) (average particle size 0.2 μm) (primary particles) and water (solvent) (1000 wt% with respect to barium titanate powder) were prepared.
2. A slurry was prepared by sufficiently mixing and dispersing the barium titanate powder and water.
3. The slurry was granulated using a spray dryer to granulate secondary particles (particles containing the main material of the ceramic dielectric layer) (average particle size 1.2 μm).
4). The secondary particles are heated to 800 ° C. in the air atmosphere, held for 2 hours, then cooled to room temperature, and the contact points between the primary particles constituting the secondary particles are slightly sintered, Formed to obtain co-powder.
5). The co-powder was surface treated in the same manner as in Examples 1-3. In the obtained co-powder, the content of the barium titanate powder was approximately 100% by weight.
6). Nickel powder (metal powder) (average particle size 0.4 μm) and the above surface-treated co-powder (particles containing the main material of the ceramic dielectric layer) (10% by weight with respect to nickel powder) and butyral resin (non An aqueous binder) (7% by weight with respect to the nickel powder) and butyl acetate (55% by weight with respect to the total solid content) were sufficiently mixed and dispersed to prepare a paste.
7). A sheet for internal electrodes (average film thickness: 1.2 μm) was prepared on a carrier film by using the gravure printing method of the paste. At this time, when the cross section of the internal electrode sheet was observed, the cross section was as shown in FIG. In this case, as in Example 1, since there is no compatibility between the silane coupling agent treated on the surface of the co-powder and the butyral resin, the co-powder is repelled in the internal electrode sheet in the state where the butyral resin is repelled. It is considered to exist.

(Manufacture of sintered bodies for multilayer ceramic capacitors)
In place of the internal electrode sheet obtained in 5 of Example 1 except that the internal electrode sheet obtained in 7 above was used, the firing for the multilayer ceramic capacitor was performed in the same manner as in 6 to 9 of Example 1. A ligature was obtained.

(Example 3)
(Manufacture of internal electrode sheets)
1. Barium titanate powder (main material of ceramic dielectric layer) (primary particles) (average particle size 0.2 μm) and polyvinyl alcohol (water-based binder) aqueous solution (solid content of polyvinyl alcohol aqueous solution is relative to barium titanate powder 5% by weight) was prepared.
2. A barium titanate powder and a polyvinyl alcohol aqueous solution were sufficiently mixed and dispersed to prepare a slurry.
3. The slurry is granulated using a spray dryer to produce secondary particles (particles containing the main material of the ceramic dielectric layer) (average particle size 1.2 μm) (the content of the barium titanate powder is 95% by weight). Granulated to obtain co-powder.
4). Nickel powder (metal powder) (average particle size 0.4 μm) and the above powder (particles containing the main material of the ceramic dielectric layer) (10% by weight with respect to nickel powder) and butyral resin (non-aqueous binder) (nickel A paste was prepared by thoroughly mixing and dispersing butyl acetate (55 wt% with respect to the total solid content) and 7 wt% with respect to the powder.
5). A sheet for internal electrodes (average film thickness: 1.2 μm) was prepared on a carrier film by using the gravure printing method of the paste. At this time, when the cross section of the internal electrode sheet was observed, the cross section was as shown in FIG. Since there is no compatibility between the polyvinyl alcohol used for granulation of the co-powder and the butyral resin, it is considered that the co-powder is present in the internal electrode sheet in a state where the butyral resin is repelled.

(Manufacture of sintered bodies for multilayer ceramic capacitors)
In place of the internal electrode sheet obtained in 5 of Example 1 except that the internal electrode sheet obtained in 5 above was used, the firing for the multilayer ceramic capacitor was performed in the same manner as in 6 to 9 of Example 1. A ligature was obtained.

Example 4
(Manufacture of internal electrode sheets)
1. Nickel powder (metal powder) (average particle size 0.4 μm), butyral resin (non-aqueous binder) (7% by weight with respect to nickel powder) and butyl acetate (55% by weight with respect to the total solid content) are thoroughly mixed. A paste was prepared by dispersing.
2. A sheet of nickel powder only (average film thickness 1.2 μm) was prepared on a carrier film by using the gravure printing method of the paste.
3. Barium titanate (particles containing the main material of the ceramic dielectric layer) (average particle size 1.2 μm) (co-powder) was prepared.
4). Co-powder (10% by weight with respect to nickel powder) was sprinkled from above the nickel powder-only sheet and supported on the sheet.
5). By applying a pressure of 500 kgf / cm ² to the sheet carrying the co-powder, the co-powder was pressed into the sheet to produce an internal electrode sheet on the carrier film. At this time, when the cross section of the internal electrode sheet was observed, the cross section was as shown in FIG.

(Manufacture of sintered bodies for multilayer ceramic capacitors)
In place of the internal electrode sheet obtained in 5 of Example 1 except that the internal electrode sheet obtained in 5 above was used, the firing for the multilayer ceramic capacitor was performed in the same manner as in 6 to 9 of Example 1. A ligature was obtained.

(Comparative Example 1)
(Manufacture of internal electrode sheets)
1. Nickel powder (metal powder) (average particle size 0.4 μm), butyral resin (non-aqueous binder) (7% by weight with respect to nickel powder) and butyl acetate (55% by weight with respect to the total solid content) are thoroughly mixed. A paste was prepared by dispersing.
2. Using the gravure printing method, a sheet (average film thickness: 1.2 μm) was prepared on a carrier film, and an internal electrode sheet was obtained.

(Manufacture of sintered bodies for multilayer ceramic capacitors)
In place of the internal electrode sheet obtained in 5 of Example 1, the internal electrode sheet obtained in 2 above was used in the same manner as in 6 to 9 of Example 1 for firing the multilayer ceramic capacitor. A ligature was obtained.

(Comparative Example 2)
(Manufacture of internal electrode sheets)
1. Barium titanate powder (average particle size 0.2 μm) (co-powder) was prepared.
2. Co-powder (particles containing the main material of the ceramic dielectric layer) (10% by weight with respect to nickel powder), nickel powder (metal powder) (average particle size 0.4 μm), butyral resin (non-aqueous binder) A paste was prepared by thoroughly mixing and dispersing (7% by weight with respect to nickel powder) and butyl acetate (55% by weight with respect to the total solid content).
3. Using the gravure printing method, a sheet (average film thickness: 1.2 μm) was prepared on a carrier film, and an internal electrode sheet was obtained.

(Manufacture of sintered bodies for multilayer ceramic capacitors)
In place of the internal electrode sheet obtained in 5 of Example 1, the internal electrode sheet obtained in 3 above was used in the same manner as in 6 to 9 of Example 1, and the firing for the multilayer ceramic capacitor was performed. A ligature was obtained.

(Average thickness of internal electrodes and incidence of structural defects)
Table 1 shows the results of examining the average thickness and the rate of occurrence of structural defects of the internal electrodes n = 100 for each multilayer ceramic capacitor produced in Examples 1, 2, 3, and 4 and Comparative Examples 1 and 2. .

  As can be seen from Table 1, in Comparative Example 1 in which the internal electrode sheet does not contain co-powder (particles containing the main material of the ceramic dielectric layer), the probability of occurrence of structural defects is high. Further, even when the co-powder was added, some structural defects were generated when the average particle diameter was smaller than ½ of the internal electrode thickness (Comparative Example 2). On the other hand, in Examples 1, 2, 3, and 4 in which co-powder having an average particle size of 1/2 or more of the internal electrode thickness is added to the internal electrode sheet, structural defects can be completely prevented. did it. In Examples 1 and 2, since the co-powder is subjected to silane coupling treatment (surface treatment), silicon remains in the sintered body after firing. However, since the silane coupling agent bound to the surface of the co-powder is very small (several nanometers to several tens of nanometers in film thickness), the amount of remaining silicon is negligible, which contributes to the electrical characteristics of the multilayer ceramic capacitor. Confirmed almost no effect.

(Example 5)
(Experiment to investigate the influence of the average particle size of the co-powder contained in the internal electrode sheet on the structural defects and short-circuit occurrence rate of the sintered body)
1. Barium titanate powder (particles of the main material of the ceramic dielectric layer) (co-powder) having an average particle diameter of 0.4 μm, 0.6 μm, 1.2 μm, 1.5 μm, and 2.0 μm was prepared.
2. Sintering for multilayer ceramic capacitors in the same manner as in Examples 1 to 9 except that each barium titanate of 1 above was used instead of barium titanate having an average particle diameter of 1.2 μm in Example 1. Got the body.

  Table 2 shows the results of examining the average thickness, short-circuit occurrence rate, and structural defect occurrence rate of each of the sintered ceramics n = 100 internal electrodes obtained above.

  As can be seen from Table 2, when the average particle size of the co-powder added to the internal electrode sheet was 1/2 (0.5 μm) or more of the internal electrode thickness, the occurrence of structural defects could be suppressed. When the average particle size of the co-powder is ½ or more of the internal electrode thickness, the probability that the upper and lower ceramic dielectric sheets sandwiching the internal electrode sheet are pressed through the co-powder increases. This prevents the upper and lower ceramic dielectric layers sandwiching the internal electrode from being cut off by the internal electrode during firing. As a result, it is considered that the occurrence of structural defects can be suppressed. Moreover, when the average particle size of the co-powder is 3/2 or less, the occurrence rate of short circuit can be suppressed. This is because when the average particle size of the co-powder is an appropriate size compared to the thickness of the internal electrode, the surface smoothness of the internal electrode sheet is good, and when the ceramic dielectric sheet and the internal electrode sheet are laminated and pressure-bonded In addition, the thin portion of the ceramic dielectric sheet can be prevented from being locally formed. Therefore, the distance between the internal electrodes of the sintered body can be kept constant, which is considered to be because the cause of the short circuit can be eliminated.

(Example 6)
(Experiment to investigate the effect of the amount of co-powder contained in the internal electrode sheet on the capacitance and structural defects of the sintered body)
The amount of the co-powder with respect to the nickel powder of Example 1 was changed to 0% by weight, 1% by weight, 10% by weight, 20% by weight, 30% by weight, and 40% by weight. In the same manner as in 1 to 9, a sintered body for a multilayer ceramic capacitor was obtained.

  Table 3 shows the results of examining the capacitance and the rate of occurrence of structural defects for each of the sintered bodies n = 100 sintered green chips for multilayer ceramic capacitors obtained above.

  As can be seen from Table 3, when co-powder is included in the internal electrode sheet, the occurrence of structural defects can be suppressed. Moreover, if the amount of the co-powder relative to the nickel powder is 30% by weight or less, a certain capacitance can be obtained. This is considered to be because the effective area of the internal electrode contributing to the capacitance in the obtained sintered body is almost constant.

  In addition, although the case where the sheet for internal electrodes was formed on the carrier film was described as an example, the case where the green chip and the sintered body for the multilayer ceramic capacitor were formed using the internal electrode sheet-integrated ceramic dielectric sheet Needless to say, the same effect can be obtained.

  The internal electrode sheet of the present invention can be used for the production of a multilayer ceramic capacitor.

The top view of the example of the sheet | seat for internal electrodes in Embodiment 1 of this invention. Sectional drawing of the example of the sheet | seat for internal electrodes in Embodiment 1 of this invention. The top view of the example of the sheet | seat for internal electrodes in Embodiment 2 of this invention. Sectional drawing of the example of the sheet | seat for internal electrodes in Embodiment 2 of this invention. The top view of the example of the sheet | seat integrated ceramic dielectric sheet for internal electrodes in Embodiment 3 of this invention. Sectional drawing of the example of the sheet | seat integral type ceramic dielectric sheet for internal electrodes in Embodiment 3 of this invention. The top view of the example of the sheet | seat integrated ceramic dielectric sheet for internal electrodes in Embodiment 4 of this invention. Sectional drawing of the example of the sheet | seat integrated ceramic dielectric sheet for internal electrodes in Embodiment 4 of this invention. The expanded sectional view of the example of the green chip in Embodiment 5 of the present invention. The expanded sectional view of the example of the green chip in Embodiment 6 of the present invention. Sectional enlarged view of the example of the sintered compact in Embodiment 5 or 6 of this invention. Sectional drawing of the example of the multilayer ceramic capacitor in Embodiment 5 or 6 of this invention. Sectional drawing of the example of a multilayer ceramic capacitor. The figure which shows the manufacturing process example of a multilayer ceramic capacitor.

Explanation of symbols

1, 11 Ceramic dielectric layer 2, 12 Internal electrode 3, 13 Element body 4, 14 External electrode 5, 15, 25, 35, 45, 55 Co-powder 6, 16, 26, 36, 46, 56 Nickel powder 7, 17, 27, 37, 47, 57 Binder 8, 18, 28, 38, 48, 58 Internal electrode sheet 9, 19, 29, 39 Carrier film 110, 210, 310, 410 Ceramic dielectric sheet

Claims (18)

A sheet for internal electrodes for producing a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and an internal electrode by firing a multilayer body with a ceramic dielectric sheet including a main material of the ceramic dielectric layer. And
The internal electrode sheet includes particles including a main material of the ceramic dielectric layer and metal powder,
The sheet for internal electrodes, wherein the average particle diameter of the particles is ½ or more and 3/2 or less of the thickness of the internal electrode.   The internal electrode sheet according to claim 1, wherein the particles are primary particles.   The internal electrode sheet according to claim 1, wherein the particles are secondary particles.   The internal electrode sheet according to any one of claims 1 to 3, wherein a content of the particles is 1 wt% or more and 30 wt% or less with respect to the metal powder.   The internal electrode sheet according to any one of claims 1 to 4, wherein the internal electrode has a thickness of 0.5 µm or more and 2.0 µm or less.   The internal electrode sheet according to any one of claims 1 to 5, wherein the content of the main material of the ceramic dielectric layer in the particles is 80% by weight or more.   The internal electrode sheet according to any one of claims 1 to 6, wherein a main material of the ceramic dielectric layer is barium titanate, aluminum oxide, a lead composite perovskite compound, or strontium titanate.   The internal electrode sheet according to any one of claims 1 to 7, wherein the internal electrode sheet has a thickness of 0.6 µm to 2.5 µm.   The internal electrode sheet according to any one of claims 1 to 8, wherein the metal powder is at least one selected from the group consisting of nickel powder, palladium powder, platinum powder, and silver powder. An internal electrode sheet-integrated ceramic dielectric sheet for producing a sintered body for a multilayer ceramic capacitor including a ceramic dielectric layer and an internal electrode,
The internal electrode sheet-integrated ceramic dielectric sheet includes an internal electrode sheet and a ceramic dielectric sheet,
The internal electrode sheet is the internal electrode sheet according to any one of claims 1 to 9,
The internal electrode sheet-integrated ceramic dielectric sheet, wherein the internal electrode sheet is directly formed on the ceramic dielectric sheet. A multilayer ceramic capacitor including a multilayer ceramic capacitor sintered body including a ceramic dielectric layer and internal electrodes, and a pair of external electrodes,
The multilayer ceramic capacitor sintered body is obtained by firing a multilayer body including a ceramic dielectric sheet and an internal electrode sheet,
The internal electrode sheet is the internal electrode sheet according to any one of claims 1 to 9,
A multilayer ceramic capacitor in which the pair of external electrodes are electrically connected to the internal electrodes. A multilayer ceramic capacitor including a multilayer ceramic capacitor sintered body including a ceramic dielectric layer and internal electrodes, and a pair of external electrodes,
The multilayer ceramic capacitor sintered body is obtained by firing a laminate of the internal electrode sheet-integrated ceramic dielectric sheet according to claim 10,
A multilayer ceramic capacitor in which the pair of external electrodes are electrically connected to the internal electrodes. Ceramic dielectric comprising primary particles including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode, and a metal powder, and including the main material of the ceramic dielectric layer A method for producing an internal electrode sheet for firing a laminate with a body sheet to obtain a sintered body for a multilayer ceramic capacitor including the ceramic dielectric layer and an internal electrode,
Surface treating the primary particles;
A step of forming a paste by mixing and dispersing the surface-treated primary particles and the metal powder in a binder solution;
Forming the paste into a sheet to obtain an internal electrode sheet.   The method for producing an internal electrode sheet according to claim 13, wherein the surface treatment of the primary particles is performed by bringing a coupling agent into contact with the primary particles, drying, and heating. A ceramic containing secondary particles including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode, and a metal powder, and including the main material of the ceramic dielectric layer A method for producing a sheet for an internal electrode for firing a laminate with a dielectric sheet to obtain a sintered body for a multilayer ceramic capacitor including the ceramic dielectric layer and an internal electrode. A step of mixing and dispersing primary particles containing materials in a solvent to form a slurry;
Forming the secondary particles by simultaneously drying and granulating the slurry; and
Heat treating the secondary particles;
Surface treating the heat treated secondary particles;
A step of mixing and dispersing the surface-treated secondary particles and the metal powder in a binder solution to form a paste;
Forming the paste into a sheet to obtain an internal electrode sheet.   The method for producing an internal electrode sheet according to claim 15, wherein the surface treatment of the secondary particles is performed by bringing a coupling agent into contact with the secondary particles, drying and heating. A ceramic containing secondary particles including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode, and a metal powder, and including the main material of the ceramic dielectric layer A method for producing a sheet for an internal electrode for firing a laminate with a dielectric sheet to obtain a sintered body for a multilayer ceramic capacitor including the ceramic dielectric layer and an internal electrode. A step of mixing and dispersing primary particles containing materials in a binder solution to form a slurry;
Forming the secondary particles by simultaneously drying and granulating the slurry; and
A step of mixing and dispersing the secondary particles and the metal powder in a binder solution to form a paste;
Forming the paste into a sheet to obtain an internal electrode sheet. Ceramic dielectric comprising primary particles including a main material of a ceramic dielectric layer having an average particle diameter of ½ or more and 3/2 or less of the thickness of the internal electrode, and a metal powder, and including the main material of the ceramic dielectric layer A method for producing an internal electrode sheet for firing a laminate with a body sheet to obtain a sintered body for a multilayer ceramic capacitor comprising the ceramic dielectric layer and an internal electrode, wherein the metal powder is contained in a binder solution A step of mixing and dispersing to form a paste,
Forming the paste into a sheet,
A method for producing an internal electrode sheet, comprising: pressing the primary particles into the sheet to obtain an internal electrode sheet.

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