JP2005139480A5 - - Google Patents

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Publication number
JP2005139480A5
JP2005139480A5 JP2003374352A JP2003374352A JP2005139480A5 JP 2005139480 A5 JP2005139480 A5 JP 2005139480A5 JP 2003374352 A JP2003374352 A JP 2003374352A JP 2003374352 A JP2003374352 A JP 2003374352A JP 2005139480 A5 JP2005139480 A5 JP 2005139480A5
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JP
Japan
Prior art keywords
polishing
conductive
electrolytic
opening
wiring material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003374352A
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English (en)
Japanese (ja)
Other versions
JP4142554B2 (ja
JP2005139480A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003374352A priority Critical patent/JP4142554B2/ja
Priority claimed from JP2003374352A external-priority patent/JP4142554B2/ja
Publication of JP2005139480A publication Critical patent/JP2005139480A/ja
Priority to US11/145,179 priority patent/US20050274626A1/en
Publication of JP2005139480A5 publication Critical patent/JP2005139480A5/ja
Application granted granted Critical
Publication of JP4142554B2 publication Critical patent/JP4142554B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003374352A 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 Expired - Fee Related JP4142554B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003374352A JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法
US11/145,179 US20050274626A1 (en) 2003-11-04 2005-06-06 Polishing pad and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003374352A JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法

Publications (3)

Publication Number Publication Date
JP2005139480A JP2005139480A (ja) 2005-06-02
JP2005139480A5 true JP2005139480A5 (https=) 2005-08-11
JP4142554B2 JP4142554B2 (ja) 2008-09-03

Family

ID=34686093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003374352A Expired - Fee Related JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法

Country Status (2)

Country Link
US (1) US20050274626A1 (https=)
JP (1) JP4142554B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149949A (ja) * 2005-11-28 2007-06-14 Roki Techno Co Ltd デバイスウエハ用の研磨パッド
JP2007150039A (ja) * 2005-11-29 2007-06-14 Roki Techno Co Ltd 研磨液供給装置、研磨部材及び研磨部材付き研磨液供給装置
JP2007189196A (ja) * 2005-12-14 2007-07-26 Ebara Corp 研磨パッド及び研磨装置
TW200801253A (en) * 2006-04-14 2008-01-01 Roki Techno Co Ltd Polishing pad for device wafer
WO2009090897A1 (ja) * 2008-01-18 2009-07-23 Toyo Tire & Rubber Co., Ltd. 電解研磨パッドの製造方法
DE102009046750B4 (de) * 2008-12-31 2019-02-14 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung
CN104607734B (zh) * 2014-12-11 2017-02-08 南京航空航天大学 辅助阳极掩模微细电解加工阵列微坑的系统及方法
CN104551282B (zh) * 2014-12-11 2017-09-19 南京航空航天大学 采用柔性模板提高阵列微坑电解加工定域性的系统及方法
CN108971674B (zh) * 2018-08-22 2020-04-28 广东工业大学 一种电解加工微沟槽的装置及电解加工方法
CN109378286B (zh) * 2018-11-13 2024-04-23 浙江师范大学 一种电化学机械复合抛光不锈钢衬底的设备及工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809237B2 (ja) * 1996-12-06 2006-08-16 キヤノン株式会社 電解パターンエッチング方法
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6893328B2 (en) * 2003-04-23 2005-05-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Conductive polishing pad with anode and cathode

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