JP4142554B2 - 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 - Google Patents

導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 Download PDF

Info

Publication number
JP4142554B2
JP4142554B2 JP2003374352A JP2003374352A JP4142554B2 JP 4142554 B2 JP4142554 B2 JP 4142554B2 JP 2003374352 A JP2003374352 A JP 2003374352A JP 2003374352 A JP2003374352 A JP 2003374352A JP 4142554 B2 JP4142554 B2 JP 4142554B2
Authority
JP
Japan
Prior art keywords
conductive
polishing
polishing pad
platen
wiring material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003374352A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005139480A (ja
JP2005139480A5 (https=
Inventor
茂 富永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Roki Techno Co Ltd
Original Assignee
Roki Techno Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roki Techno Co Ltd filed Critical Roki Techno Co Ltd
Priority to JP2003374352A priority Critical patent/JP4142554B2/ja
Publication of JP2005139480A publication Critical patent/JP2005139480A/ja
Priority to US11/145,179 priority patent/US20050274626A1/en
Publication of JP2005139480A5 publication Critical patent/JP2005139480A5/ja
Application granted granted Critical
Publication of JP4142554B2 publication Critical patent/JP4142554B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2003374352A 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 Expired - Fee Related JP4142554B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003374352A JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法
US11/145,179 US20050274626A1 (en) 2003-11-04 2005-06-06 Polishing pad and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003374352A JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法

Publications (3)

Publication Number Publication Date
JP2005139480A JP2005139480A (ja) 2005-06-02
JP2005139480A5 JP2005139480A5 (https=) 2005-08-11
JP4142554B2 true JP4142554B2 (ja) 2008-09-03

Family

ID=34686093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003374352A Expired - Fee Related JP4142554B2 (ja) 2003-11-04 2003-11-04 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法

Country Status (2)

Country Link
US (1) US20050274626A1 (https=)
JP (1) JP4142554B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007149949A (ja) * 2005-11-28 2007-06-14 Roki Techno Co Ltd デバイスウエハ用の研磨パッド
JP2007150039A (ja) * 2005-11-29 2007-06-14 Roki Techno Co Ltd 研磨液供給装置、研磨部材及び研磨部材付き研磨液供給装置
JP2007189196A (ja) * 2005-12-14 2007-07-26 Ebara Corp 研磨パッド及び研磨装置
TW200801253A (en) * 2006-04-14 2008-01-01 Roki Techno Co Ltd Polishing pad for device wafer
WO2009090897A1 (ja) * 2008-01-18 2009-07-23 Toyo Tire & Rubber Co., Ltd. 電解研磨パッドの製造方法
DE102009046750B4 (de) * 2008-12-31 2019-02-14 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung
CN104607734B (zh) * 2014-12-11 2017-02-08 南京航空航天大学 辅助阳极掩模微细电解加工阵列微坑的系统及方法
CN104551282B (zh) * 2014-12-11 2017-09-19 南京航空航天大学 采用柔性模板提高阵列微坑电解加工定域性的系统及方法
CN108971674B (zh) * 2018-08-22 2020-04-28 广东工业大学 一种电解加工微沟槽的装置及电解加工方法
CN109378286B (zh) * 2018-11-13 2024-04-23 浙江师范大学 一种电化学机械复合抛光不锈钢衬底的设备及工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809237B2 (ja) * 1996-12-06 2006-08-16 キヤノン株式会社 電解パターンエッチング方法
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US7066800B2 (en) * 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6893328B2 (en) * 2003-04-23 2005-05-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Conductive polishing pad with anode and cathode

Also Published As

Publication number Publication date
US20050274626A1 (en) 2005-12-15
JP2005139480A (ja) 2005-06-02

Similar Documents

Publication Publication Date Title
CN100413032C (zh) 用于电化学机械抛光的导电抛光用品
US6988942B2 (en) Conductive polishing article for electrochemical mechanical polishing
US7207878B2 (en) Conductive polishing article for electrochemical mechanical polishing
KR101011095B1 (ko) 전기화학적 기계적 연마에서의 공정 제어
US7374644B2 (en) Conductive polishing article for electrochemical mechanical polishing
US6315883B1 (en) Electroplanarization of large and small damascene features using diffusion barriers and electropolishing
US6962524B2 (en) Conductive polishing article for electrochemical mechanical polishing
TWI314496B (en) System, method and polishing pad for electrochemical mechanical polishing
TW536450B (en) Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) Conductive polishing article for electrochemical mechanical polishing
JP4142554B2 (ja) 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法
JP2004134734A (ja) 基板を研磨する方法および装置
WO2004094107A1 (en) Conductive polishing pad with anode and cathode
US20080017521A1 (en) Process control in electro-chemical mechanical polishing
US20080156657A1 (en) Conductive polishing article for electrochemical mechanical polishing
JP2005139480A5 (https=)
US7311592B2 (en) Conductive polishing article for electrochemical mechanical polishing
WO2007119845A1 (ja) デバイスウエハ用の研磨パッド
CN100466188C (zh) 用于电化学机械抛光的导电抛光部件
TWI285576B (en) Conductive polishing article for electrochemical mechanical polishing
US20050224368A1 (en) Polishing system and polishing method
WO2007061064A1 (ja) デバイスウエハ用の研磨パッド
US6264536B1 (en) Reducing polish platen corrosion during integrated circuit fabrication
EP1640113B1 (en) Conductive polishing article for electrochemical mechanical polishing
JP2007150039A (ja) 研磨液供給装置、研磨部材及び研磨部材付き研磨液供給装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050315

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060209

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070625

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071211

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080208

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20080208

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080509

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080509

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080603

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080612

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110620

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4142554

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120620

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130620

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees