JP4142554B2 - 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 - Google Patents
導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 Download PDFInfo
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- JP4142554B2 JP4142554B2 JP2003374352A JP2003374352A JP4142554B2 JP 4142554 B2 JP4142554 B2 JP 4142554B2 JP 2003374352 A JP2003374352 A JP 2003374352A JP 2003374352 A JP2003374352 A JP 2003374352A JP 4142554 B2 JP4142554 B2 JP 4142554B2
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- conductive
- polishing
- polishing pad
- platen
- wiring material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
接触電極を接触させた前記導電性表層を被研磨面である前記デバイスウェーハの配線材と接触させることによって、前記接触電極と前記配線材とを前記導電性表層を介して電気的に導通させ、
前記研磨パッドの研磨面に電解液を供給することによって、前記研磨パッドの電解液収容部に電解液を満たして、その電解液の液面と前記配線材とを接触させ、
前記接触電極と前記プラテンとに直流電圧を印加することによって、前記配線材をアノードとし、前記プラテンと前記導電性粘着テープを介して電気的に接続した前記導電性シートをカソードとし、該アノードとカソードと前記複数の電解液収容部の電解液とで複数の電解セルを形成し、
前記研磨面に電解液を供給し前記プラテンを回転させながら、前記デバイスウェーハを前記研磨ヘッドで回転させることにより、前記配線材を電解研磨することを特徴とする(請求項7)。
直径5mmの貫通孔を10mmピッチで設置した研磨パッドを使用し、図1に示した電解研磨方法により定電圧Cu電解研磨特性を測定した。結果を図7に示す。尚、電解液には市販試薬リン酸を50倍希釈して使用し、プラテン、研磨ヘッドの回転数はともに45rpmとし、研磨圧力は18.7g/cm2とした。
図1に示した電解研磨方法により定電圧によるCu電解研磨の電解電圧依存測定をした。結果を図8に示す。電解液には市販試薬リン酸を50倍希釈して使用し、プラテン、研磨ヘッドの回転数はともに45rpmとし、研磨圧力は18.7g/cm2とした。
2………導電性研磨パッド
3………導電性表層
4………接触電極
5………ウェーハ
6………研磨ヘッド
7………ノズル
8………絶縁層
9………導電性表層
10………導電性シート
11………貫通孔(開口)
12………貫通孔(開口)
13………電解液
14………層間絶縁膜(シリコン基板)
15………配線材
16………バリアメタル
Claims (7)
- カソードとなる導電性シート上に、開口を有する絶縁体と該開口と連結する開口を有する導電性表層とを順次積層し、該導電性表層上に研磨ヘッドに装着したデバイスウェーハを載置し、該導電性表層に直流電源のプラス電極を接続して該導電性表層と電気的に接触する前記デバイスウェーハの配線材をアノードし、該アノードとその対極の前記カソードと前記両開口が連結して形成された電解液収容部と電解液とで、ウェーハ径より小さい複数の電解セルを形成することを特徴とするデバイスウェーハの配線材を電解研磨するプラテン上に載置する導電性研磨パッド。
- 前記導電性シート裏面に、プラテンに貼付する導電性粘着テープを積層する請求項1記載の導電性研磨パッド。
- 前記導電性表層は、導電性繊維に熱硬化性樹脂若しくはエラストマーが含浸された材料で形成されている請求項1又は2に記載の研磨パッド。
- 前記熱硬化性樹脂若しくはエラストマーには、研磨砥粒が分散して含有されている請求項3に記載の研磨パッド。
- 前記絶縁体は、電気絶縁性を有する合成樹脂である請求項1〜4のいずれかに記載の導電性研磨パッド。
- 前記導電性研磨パッドの絶縁体の厚さは、0.5mm〜5mmである請求項1〜5のいずれかに記載の導電性研磨パッド。
- 請求項2に記載の研磨パッドをプラテンに載置し、研磨ヘッドに装着したデバイスウェーハの配線材を電解研磨する研磨方法において、
接触電極を接触させた前記導電性表層を被研磨面である前記デバイスウェーハの配線材と接触させることによって、前記接触電極と前記配線材とを前記導電性表層を介して電気的に導通させ、
前記研磨パッドの研磨面に電解液を供給することによって、前記研磨パッドの電解液収容部に電解液を満たして、その電解液の液面と前記配線材とを接触させ、
前記接触電極と前記プラテンとに直流電圧を印加することによって、前記配線材をアノードとし、前記プラテンと前記導電性粘着テープを介して電気的に接続した前記導電性シートをカソードとし、該アノードとカソードと前記複数の電解液収容部の電解液とで複数の電解セルを形成し、
前記研磨面に電解液を供給し前記プラテンを回転させながら、前記デバイスウェーハを前記研磨ヘッドで回転させることにより、前記配線材を電解研磨することを特徴とする研磨方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003374352A JP4142554B2 (ja) | 2003-11-04 | 2003-11-04 | 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 |
US11/145,179 US20050274626A1 (en) | 2003-11-04 | 2005-06-06 | Polishing pad and polishing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2003374352A JP4142554B2 (ja) | 2003-11-04 | 2003-11-04 | 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005139480A JP2005139480A (ja) | 2005-06-02 |
JP2005139480A5 JP2005139480A5 (ja) | 2005-08-11 |
JP4142554B2 true JP4142554B2 (ja) | 2008-09-03 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2003374352A Expired - Fee Related JP4142554B2 (ja) | 2003-11-04 | 2003-11-04 | 導電性研磨パッド及び該研磨パッドを使用する電解研磨方法 |
Country Status (2)
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US (1) | US20050274626A1 (ja) |
JP (1) | JP4142554B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007149949A (ja) * | 2005-11-28 | 2007-06-14 | Roki Techno Co Ltd | デバイスウエハ用の研磨パッド |
JP2007150039A (ja) * | 2005-11-29 | 2007-06-14 | Roki Techno Co Ltd | 研磨液供給装置、研磨部材及び研磨部材付き研磨液供給装置 |
JP2007189196A (ja) * | 2005-12-14 | 2007-07-26 | Ebara Corp | 研磨パッド及び研磨装置 |
TW200801253A (en) * | 2006-04-14 | 2008-01-01 | Roki Techno Co Ltd | Polishing pad for device wafer |
US20110048963A1 (en) * | 2008-01-18 | 2011-03-03 | Toyo Trie & Rubber Co., Ltd. | Method of manufacturing electropolishing pad |
DE102009046750B4 (de) * | 2008-12-31 | 2019-02-14 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung |
CN104551282B (zh) * | 2014-12-11 | 2017-09-19 | 南京航空航天大学 | 采用柔性模板提高阵列微坑电解加工定域性的系统及方法 |
CN104607734B (zh) * | 2014-12-11 | 2017-02-08 | 南京航空航天大学 | 辅助阳极掩模微细电解加工阵列微坑的系统及方法 |
CN108971674B (zh) * | 2018-08-22 | 2020-04-28 | 广东工业大学 | 一种电解加工微沟槽的装置及电解加工方法 |
CN109378286B (zh) * | 2018-11-13 | 2024-04-23 | 浙江师范大学 | 一种电化学机械复合抛光不锈钢衬底的设备及工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3809237B2 (ja) * | 1996-12-06 | 2006-08-16 | キヤノン株式会社 | 電解パターンエッチング方法 |
US7066800B2 (en) * | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
US6893328B2 (en) * | 2003-04-23 | 2005-05-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Conductive polishing pad with anode and cathode |
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2003
- 2003-11-04 JP JP2003374352A patent/JP4142554B2/ja not_active Expired - Fee Related
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2005
- 2005-06-06 US US11/145,179 patent/US20050274626A1/en not_active Abandoned
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Publication number | Publication date |
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US20050274626A1 (en) | 2005-12-15 |
JP2005139480A (ja) | 2005-06-02 |
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