JP2005136203A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005136203A5 JP2005136203A5 JP2003370817A JP2003370817A JP2005136203A5 JP 2005136203 A5 JP2005136203 A5 JP 2005136203A5 JP 2003370817 A JP2003370817 A JP 2003370817A JP 2003370817 A JP2003370817 A JP 2003370817A JP 2005136203 A5 JP2005136203 A5 JP 2005136203A5
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- jig
- lower jig
- air exhaust
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003370817A JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003370817A JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005136203A JP2005136203A (ja) | 2005-05-26 |
JP2005136203A5 true JP2005136203A5 (fi) | 2006-11-16 |
JP4431363B2 JP4431363B2 (ja) | 2010-03-10 |
Family
ID=34647714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003370817A Expired - Fee Related JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4431363B2 (fi) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906794B2 (en) * | 2006-07-05 | 2011-03-15 | Koninklijke Philips Electronics N.V. | Light emitting device package with frame and optically transmissive element |
TWI528469B (zh) * | 2014-01-15 | 2016-04-01 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
CN107611118A (zh) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | 一种远程荧光led器件及其制备方法 |
CN107546221B (zh) * | 2017-08-10 | 2023-07-25 | 中国科学院福建物质结构研究所 | 一种远程荧光led器件及其制备方法 |
CN108063172B (zh) * | 2017-12-20 | 2024-01-23 | 杭州华扬电子有限公司 | 打线治具 |
-
2003
- 2003-10-30 JP JP2003370817A patent/JP4431363B2/ja not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI467737B (zh) | 發光二極體封裝結構、照明裝置及發光二極體封裝用基板 | |
JP5522462B2 (ja) | 発光装置及び照明装置 | |
JP2009076576A5 (fi) | ||
KR101249230B1 (ko) | 플렉시블 led 어레이 | |
JP5226498B2 (ja) | 発光装置 | |
JP2008535233A5 (fi) | ||
EP2170024A3 (en) | Backlight unit equipped with light emitting diodes | |
JP2012004391A (ja) | 発光装置及び照明装置 | |
US20090218586A1 (en) | Led lamp | |
KR200291282Y1 (ko) | 반도체패키지용 인쇄회로기판 | |
US9048392B2 (en) | Light emitting device array assemblies and related methods | |
JP2005136203A5 (fi) | ||
TWI268616B (en) | Active matrix substrate and method of manufacturing the same | |
JP5721797B2 (ja) | 発光ダイオードパッケージ及びその製造方法 | |
KR100405453B1 (en) | Chip light emitting diode(led) and manufacturing method thereof | |
TW200627667A (en) | LED package structure and mass production method of making the same | |
JP5769129B2 (ja) | 発光装置及び照明装置 | |
KR100917721B1 (ko) | 발광 다이오드용 패키지의 제조 방법 | |
KR20110077247A (ko) | 전원연결이 간편한 led 조명장치 | |
JP4431363B2 (ja) | 発光ダイオードの製造方法 | |
JPH0639466Y2 (ja) | 表面実装型半導体装置 | |
KR101802638B1 (ko) | 발광 효율이 개선된 발광 다이오드 칩 어레이 | |
CN212062469U (zh) | 一种cob封装结构 | |
KR101078833B1 (ko) | 발광 다이오드 유닛 | |
KR20090001169A (ko) | Led 패키지 및 그것의 어레이 |