KR100917721B1 - 발광 다이오드용 패키지의 제조 방법 - Google Patents
발광 다이오드용 패키지의 제조 방법 Download PDFInfo
- Publication number
- KR100917721B1 KR100917721B1 KR1020070038417A KR20070038417A KR100917721B1 KR 100917721 B1 KR100917721 B1 KR 100917721B1 KR 1020070038417 A KR1020070038417 A KR 1020070038417A KR 20070038417 A KR20070038417 A KR 20070038417A KR 100917721 B1 KR100917721 B1 KR 100917721B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- package
- wiring pattern
- base
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (12)
- 삭제
- 삭제
- 발광 다이오드 소자를 실장하기 위한 배선 패턴을 형성한 베이스판에, 상기 발광 다이오드 소자를 수용하기 위한 개구를 형성한 커버판을 첩착한 발광 다이오드용 패키지의 제조 방법에 있어서,복수개의 개구를 형성한 커버판에 배선 패턴을 형성한 복수장의 베이스판을 첩착하는 것을 특징으로 하는발광 다이오드용 패키지의 제조 방법.
- 발광 다이오드 소자를 실장하기 위한 배선 패턴을 형성한 세라믹스제 베이스판에, 상기 발광 다이오드 소자를 수용하기 위한 개구를 형성한 세라믹스제 커버판을 첩착한 발광 다이오드용 패키지의 제조 방법에 있어서,제 1 그린시트에 복수개의 개구를 형성한 후에 소성하여 커버판을 형성하고, 또한 제 2 그린시트를 소성한 후에 배선 패턴을 인쇄하고, 상기 배선 패턴을 소결한 후에 분단하여 복수장의 베이스판을 형성하며, 상기 베이스판에 복수장의 커버판을 첩착하는 것을 특징으로 하는발광 다이오드용 패키지의 제조 방법.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
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- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2006-00321505 | 2006-11-29 | ||
JP2006321505A JP4340283B2 (ja) | 2006-11-29 | 2006-11-29 | 発光ダイオード用パッケージ及びその製造方法並びに発光ダイオード用パッケージを用いた発光ダイオード |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080048903A KR20080048903A (ko) | 2008-06-03 |
KR100917721B1 true KR100917721B1 (ko) | 2009-09-15 |
Family
ID=39560257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070038417A KR100917721B1 (ko) | 2006-11-29 | 2007-04-19 | 발광 다이오드용 패키지의 제조 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4340283B2 (ko) |
KR (1) | KR100917721B1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010087331A (ja) * | 2008-10-01 | 2010-04-15 | Nippon Korumo Kk | Led実装済基板 |
CN104218139A (zh) * | 2014-08-20 | 2014-12-17 | 深圳市晶台股份有限公司 | 一种全新的led封装结构 |
CN104218141A (zh) * | 2014-09-17 | 2014-12-17 | 深圳市晶台股份有限公司 | 一种倒装led芯片的封装结构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207678A (ja) * | 2002-10-30 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
KR20050090918A (ko) * | 2004-03-10 | 2005-09-14 | (주)나노팩 | 발광소자와 그 패키지 구조체 및 제조방법 |
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2006
- 2006-11-29 JP JP2006321505A patent/JP4340283B2/ja active Active
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2007
- 2007-04-19 KR KR1020070038417A patent/KR100917721B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004207678A (ja) * | 2002-10-30 | 2004-07-22 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
KR20050090918A (ko) * | 2004-03-10 | 2005-09-14 | (주)나노팩 | 발광소자와 그 패키지 구조체 및 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2008135624A (ja) | 2008-06-12 |
KR20080048903A (ko) | 2008-06-03 |
JP4340283B2 (ja) | 2009-10-07 |
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