JP2005136203A5 - - Google Patents
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- Publication number
- JP2005136203A5 JP2005136203A5 JP2003370817A JP2003370817A JP2005136203A5 JP 2005136203 A5 JP2005136203 A5 JP 2005136203A5 JP 2003370817 A JP2003370817 A JP 2003370817A JP 2003370817 A JP2003370817 A JP 2003370817A JP 2005136203 A5 JP2005136203 A5 JP 2005136203A5
- Authority
- JP
- Japan
- Prior art keywords
- led chip
- jig
- lower jig
- air exhaust
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 9
- 239000004020 conductor Substances 0.000 claims 8
- 238000002347 injection Methods 0.000 claims 7
- 239000007924 injection Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003370817A JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003370817A JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005136203A JP2005136203A (ja) | 2005-05-26 |
JP2005136203A5 true JP2005136203A5 (enrdf_load_stackoverflow) | 2006-11-16 |
JP4431363B2 JP4431363B2 (ja) | 2010-03-10 |
Family
ID=34647714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003370817A Expired - Fee Related JP4431363B2 (ja) | 2003-10-30 | 2003-10-30 | 発光ダイオードの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4431363B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7906794B2 (en) * | 2006-07-05 | 2011-03-15 | Koninklijke Philips Electronics N.V. | Light emitting device package with frame and optically transmissive element |
TWI528469B (zh) * | 2014-01-15 | 2016-04-01 | 矽品精密工業股份有限公司 | 半導體封裝件及其製法 |
CN107546221B (zh) * | 2017-08-10 | 2023-07-25 | 中国科学院福建物质结构研究所 | 一种远程荧光led器件及其制备方法 |
CN107611118A (zh) * | 2017-08-10 | 2018-01-19 | 中国科学院福建物质结构研究所 | 一种远程荧光led器件及其制备方法 |
CN108063172B (zh) * | 2017-12-20 | 2024-01-23 | 杭州华扬电子有限公司 | 打线治具 |
DE102021118490A1 (de) * | 2021-07-16 | 2023-01-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung einer vielzahl von licht emittierenden bauelementen und bauteil |
-
2003
- 2003-10-30 JP JP2003370817A patent/JP4431363B2/ja not_active Expired - Fee Related
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