JP4431363B2 - 発光ダイオードの製造方法 - Google Patents

発光ダイオードの製造方法 Download PDF

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Publication number
JP4431363B2
JP4431363B2 JP2003370817A JP2003370817A JP4431363B2 JP 4431363 B2 JP4431363 B2 JP 4431363B2 JP 2003370817 A JP2003370817 A JP 2003370817A JP 2003370817 A JP2003370817 A JP 2003370817A JP 4431363 B2 JP4431363 B2 JP 4431363B2
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JP
Japan
Prior art keywords
led chip
jig
resin
lower jig
air exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003370817A
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English (en)
Japanese (ja)
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JP2005136203A (ja
JP2005136203A5 (enrdf_load_stackoverflow
Inventor
かおり 波岡
巖 東海林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2003370817A priority Critical patent/JP4431363B2/ja
Publication of JP2005136203A publication Critical patent/JP2005136203A/ja
Publication of JP2005136203A5 publication Critical patent/JP2005136203A5/ja
Application granted granted Critical
Publication of JP4431363B2 publication Critical patent/JP4431363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
JP2003370817A 2003-10-30 2003-10-30 発光ダイオードの製造方法 Expired - Fee Related JP4431363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003370817A JP4431363B2 (ja) 2003-10-30 2003-10-30 発光ダイオードの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003370817A JP4431363B2 (ja) 2003-10-30 2003-10-30 発光ダイオードの製造方法

Publications (3)

Publication Number Publication Date
JP2005136203A JP2005136203A (ja) 2005-05-26
JP2005136203A5 JP2005136203A5 (enrdf_load_stackoverflow) 2006-11-16
JP4431363B2 true JP4431363B2 (ja) 2010-03-10

Family

ID=34647714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003370817A Expired - Fee Related JP4431363B2 (ja) 2003-10-30 2003-10-30 発光ダイオードの製造方法

Country Status (1)

Country Link
JP (1) JP4431363B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906794B2 (en) * 2006-07-05 2011-03-15 Koninklijke Philips Electronics N.V. Light emitting device package with frame and optically transmissive element
TWI528469B (zh) * 2014-01-15 2016-04-01 矽品精密工業股份有限公司 半導體封裝件及其製法
CN107546221B (zh) * 2017-08-10 2023-07-25 中国科学院福建物质结构研究所 一种远程荧光led器件及其制备方法
CN107611118A (zh) * 2017-08-10 2018-01-19 中国科学院福建物质结构研究所 一种远程荧光led器件及其制备方法
CN108063172B (zh) * 2017-12-20 2024-01-23 杭州华扬电子有限公司 打线治具
DE102021118490A1 (de) * 2021-07-16 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer vielzahl von licht emittierenden bauelementen und bauteil

Also Published As

Publication number Publication date
JP2005136203A (ja) 2005-05-26

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