JP2005121709A - Circuit board pressure device to liquid crystal panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make heat applied from a heater head radiate effectively to a terminal part at application so as not to cause degeneration of the polarizing plate and the peripheral seal of a liquid crystal panel. <P>SOLUTION: The circuit board application device to the liquid crystal panel includes a panel-receiving base 110 mounted with the liquid crystal panel 1, a terminal part receiving base 120 juxtaposed on the panel-receiving base, and capable of making a heater head 130 lifted and lowered from/to the terminal-receiving base. The circuit board application device arranges a prescribed circuit board 4 via an anisotropic conductive adhesion material 3 on a terminal part 2 of the liquid crystal panel 1, lowers the heater head 130 to apply the circuit board 4 on the terminal part 2, and is provided with a heat sink 113, brought elastically into contact with the rear face side of the terminal part 2 on the panel-receiving base 110. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a crimping apparatus for thermocompression bonding a circuit board such as a flexible substrate to a terminal portion of a liquid crystal panel via an anisotropic conductive adhesive, and more specifically, a polarizing plate of a liquid crystal panel or the like by heat during thermocompression bonding. The present invention relates to a circuit board crimping apparatus to a liquid crystal panel that does not cause a defect in a peripheral sealing material.

  A liquid crystal panel is composed of a transparent glass (or plastic) substrate on which a transparent electrode is formed, bonded together via a sealing material, and a liquid crystal substance is sealed in the cell gap to form a basic part thereof. .

  When assembling the product, a flexible substrate such as TCP (Tape Carrier Package) or COF (Chip on Film) for driving the liquid crystal is connected to the terminal part of the liquid crystal panel. An optical film such as a retardation film is attached.

  Usually, for example, an anisotropic conductive film (ACF) which is an anisotropic conductive adhesive is used for connection of the flexible substrate to the terminal portion of the liquid crystal panel. An anisotropic conductive film is a film in which conductive particles are mixed into a thermosetting binder resin, and heat conduction is performed between two conductors so that electrical conduction between the conductors is achieved with the conductive particles. Thus, the mechanical connection between the conductors is maintained by the binder resin.

  Connecting a flexible board (circuit board) to the terminal part of the liquid crystal panel via an anisotropic conductive adhesive is performed by a crimping device having a heater bar that is a pressurizing tool. This will be described with reference to FIG.

  This crimping device includes, as a basic configuration, a panel cradle 11 and a terminal portion cradle 12 juxtaposed on the side, and a heater head driven on the terminal cradle 12 by an air cylinder (not shown). 13 is provided so that raising / lowering is possible.

  The liquid crystal panel 1 is placed on the panel cradle 11 such that the terminal portion 2 is on the terminal cradle 12. Then, the flexible substrate 4 is overlaid on the terminal portion 2 via the anisotropic conductive adhesive 3, the heater head 13 is lowered, and the flexible substrate 4 is thermocompression bonded to the terminal portion 2. In this case, the heater head 13 is heated to about 300 ° C., and the heating time is about 20 seconds.

  Recently, along with the trend toward thinner and lighter display devices, the liquid crystal panel itself has also been reduced in size and weight. In order to secure the display area of the liquid crystal panel 1 as much as possible, the frame portion such as the terminal portion 2 is used. Therefore, there is a demand for a so-called narrow frame.

  Along with this, the distance between the pressure-bonded portion by the heater head 13 and the panel display portion becomes shorter and the heating temperature tends to increase as the width of the heater head 13 becomes narrower. There has been a problem that the polarizing plates 5a and 5b attached to the panel 1 and the peripheral sealing material sealing the glass substrates are deteriorated.

  When the semiconductor element 6 such as a bare IC chip for driving a liquid crystal is mounted on the terminal portion 2 of the liquid crystal panel, the mounting state of the semiconductor element 6 becomes unstable due to heat from the crimping portion by the heater head 13. There is also a problem of becoming.

  Therefore, in order to avoid the thermal influence from the heater head on the polarizing plate, it has been proposed that the cooling member made of a good thermal conductor is directly brought into contact with the polarizing plate to absorb the heat generated by the heater head with the cooling member. (See Patent Document 1 below).

  However, in the case of Patent Document 1, although the polarizing plate is thermally protected, heat is still transmitted to the liquid crystal panel, so that even the peripheral sealing material cannot be protected, and is mounted on the terminal portion. Even semiconductor elements cannot be thermally protected. Furthermore, since a pressure adjusting means for absorbing an excessive pressing force of the cooling member to the polarizing plate is required, the apparatus becomes complicated, which is not preferable in terms of cost.

JP 2001-201727 A

  The present invention has been made in order to solve the above-described problems. The object of the present invention is to absorb the heat in the middle of the heat transfer path from the pressure-bonded portion by the heater head to the panel display portion, thereby polarizing the panel display portion. An object of the present invention is to provide a circuit board crimping device to a liquid crystal panel capable of reliably protecting a plate and a peripheral sealing material from heat.

  In order to achieve the above object, the present invention provides a panel cradle on which a liquid crystal panel is placed, a terminal cradle juxtaposed on the panel cradle, and a heater head that can be raised and lowered relative to the terminal cradle. An anisotropic conductive adhesive on the terminal part in a state where the liquid crystal panel is placed on the panel base so that the terminal part straddles the panel base and the terminal part base. In a circuit board crimping apparatus for a liquid crystal panel, in which a predetermined circuit board is arranged and the heater head is lowered to crimp the circuit board to the terminal part, the panel cradle has a back side of the terminal part. The heat sink which contacts elastically is provided.

  According to a preferred aspect of the present invention, in order to further enhance the heat dissipation effect of the heat sink, the panel base is formed with a cylinder chamber in which the heat sink can be moved up and down, and the cylinder chamber includes a pump. A fluid circulation means is connected.

  When the heat sink is elastically brought into contact with the terminal portion, a spring means may be used. However, it is preferable that the heat sink is pushed up by the fluid pressure supplied from the pump and brought into contact with the terminal portion. The material of the heat sink is preferably a metal material having good thermal conductivity and light weight, and particularly preferably an aluminum material.

  According to the present invention, the heat sink is brought into contact with a part of the terminal part in the middle of the heat transfer path from the crimping part by the heater head to the panel display part side, so that the panel display part side of the terminal part is absorbed. It is kept at a low temperature, and the polarizing plate and the peripheral sealing material are more reliably thermally protected. In addition, when a semiconductor element is mounted on the terminal portion, the mounting state of the semiconductor element can be kept good.

  Furthermore, by storing the heat sink in a cylinder chamber connected to a fluid circulation means including a pump, heat can be radiated more effectively from the heat sink. Also, by pushing up the heat sink with the fluid pressure supplied from the pump, it is possible to ensure that the heat sink is in contact with the terminal portion even when the overall thickness of the panel varies due to, for example, the thickness of the polarizing plate. it can.

  Next, the present invention will be described with reference to the embodiment shown in FIG. FIG. 1 is a schematic cross-sectional view of a crimping apparatus according to this embodiment. This crimping apparatus includes a panel cradle 110 and a terminal portion cradle 120 juxtaposed on the side thereof. In this example, the panel cradle 110 is made of steel, and the terminal cradle 120 is made of bakelite.

  The terminal cradle 120 may be the same as that described above with reference to FIG. 2, and a heater head 130 made of, for example, a stainless material is provided so as to be movable up and down. In addition, the terminal unit cradle 120 is provided with a flat terminal unit table 121 on which the terminal unit 2 of the liquid crystal panel 1 is positioned and arranged in a predetermined position.

  The panel base 110 is provided with a flatly formed panel table 111 on which the liquid crystal panel 1 is positioned and placed at a predetermined position. Although not shown, the panel table 111 is, for example, a negative pressure for fixing the liquid crystal panel 1. Adsorption means are provided.

  A panel chamber 110 is formed with a cylinder chamber 112 having a predetermined size. A heat sink 113 is accommodated in the cylinder chamber 112 so as to be movable up and down (up and down). The heat sink 113 is preferably made of an aluminum material that has high thermal conductivity and is lightweight. The cylinder chamber 112 is disposed near the terminal cradle 120 side of the panel cradle 110, and an opening 114 of the cylinder chamber 112 is provided between the panel table 111 and the terminal table 121. In this example, a sealer 119 made of PTFE (polytetrafluoroethylene) is lined on the inner surface of the cylinder chamber 112.

  A fluid circulation means including a pump (not shown) is connected to the cylinder chamber 112. The fluid may be either a gas such as air or a liquid such as water. In this example, air is used, and an air inflow path from the pump (air pump) to the cylinder chamber 112 is provided in the panel cradle 110. 115 and an air outflow path 116 through which the air in the cylinder chamber 112 flows out to the atmosphere. Switching valves 117 and 118 are provided in the air inflow path 115 and the air outflow path 116, respectively.

  In this embodiment, the air inflow passage 115 communicates with the bottom side of the cylinder chamber 112 in order to raise the heat sink 113 by air pressure so as to protrude from the opening 114. The heat sink 113 is provided with a stopper 113b that regulates the upper limit position. Note that the heat sink 113 may be always elastically biased upward using a spring means (not shown).

  Here, when the liquid crystal panel 1 is described further, the liquid crystal panel 1 is bonded to the front glass substrate F on which the transparent electrode is formed and the rear glass substrate R on which the transparent electrode is similarly formed through a sealing material (not shown). Thus, liquid crystal is sealed in the cell gap.

  In this example, the terminal portion 2 is connected to the windshield substrate F side, and the flexible substrate 4 is connected to one electrode forming surface 2 a of the terminal portion 2 via the anisotropic conductive film 3. . Further, polarizing plates 5a and 5b are attached to the front glass substrate F and the rear glass substrate R, respectively.

  In order to connect the flexible substrate 4 to the terminal portion 2 of the liquid crystal panel 1, first, the liquid crystal panel 1 is placed on the panel table 111 so that the terminal portion 2 straddles the terminal portion table 121 and the opening 114 of the cylinder chamber 112. It is positioned and fixed by a negative pressure adsorbing means (not shown).

  Next, the switching valves 117 and 118 are opened so that pressurized air from an air pump (not shown) is circulated in the cylinder chamber 112, and the heat sink 113 is raised by the air pressure so that the other surface of the terminal portion 2 (counter electrode forming surface). ). Note that the air circulation amount and air pressure can be set as appropriate depending on how the switching valves 117 and 118 are opened.

  Thereafter, the flexible substrate 4 is positioned on the terminal portion 2 of the liquid crystal panel 1 via the anisotropic conductive film 3, and the heater head 130 is lowered to heat-press the terminal portion 2 and the flexible substrate 4. At this time, the heat sink 113 is in contact with the terminal portion 2, the heat of the crimping portion is absorbed by the heat sink 113, and the heat is radiated from the heat sink 113 by the air circulating in the cylinder chamber 112.

  Thus, most of the heat transmitted from the heater head 130 to the terminal portion 2 is absorbed and dissipated by the heat sink 113, so that the heat from the heater head 130 is absorbed. It does not reach the polarizing plates 5a and 5b on the panel display unit side and the peripheral sealing material, and can prevent problems such as deterioration.

  Further, when the semiconductor element 6 is mounted on the terminal portion 2 of the liquid crystal panel, it is possible to prevent the heat from the heater head 130 from reaching the semiconductor element 6 and the mounting state becoming unstable.

  Unlike the above-described procedure, the liquid crystal panel 1 may be placed on the panel table 111 and the heat sink 113 may be pushed down in a state where the heat sink 113 is raised in advance by air pressure. In any case, since the heat sink 113 is in elastic contact with the terminal portion 2, for example, even when the thickness of the liquid crystal panel 1 varies, the heat sink 113 can be reliably brought into contact with the terminal portion 2.

  Note that the contact surface (upper surface) 113a of the heat sink 113 is preferably formed in, for example, a planar shape having a contact area with the terminal portion 2 as large as possible in consideration of thermal conductivity, thereby further improving the heat dissipation efficiency. it can.

  Incidentally, when the temperature of the heater head 130 is set to 300 ° C., the heating time is set to 20 seconds, and the heat bonding is performed with the conventional apparatus of FIG. Was 150.degree. C., whereas it was 40.degree. C. when thermocompression bonding was performed using the above-described apparatus having the heat sink 113.

Sectional drawing which shows typically the circuit board crimping | compression-bonding apparatus to the liquid crystal panel by this invention. The side view which shows typically an example of the circuit board crimping | compression-bonding apparatus to the conventional liquid crystal panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Terminal part 2a Electrode formation surface of a terminal part 2b Counter electrode formation surface of a terminal part 3 Anisotropic conductive film 4 Flexible substrate 5a, 5b Polarizing plate 110 Panel base 111 Panel table 112 Cylinder chamber 113 Heat sink 114 Opening part DESCRIPTION OF SYMBOLS 115 Air inflow path 116 Air outflow path 117,118 Switching valve 120 Terminal part receiving stand 121 Terminal part table 130 Heater head

Claims (4)

A panel cradle on which the liquid crystal panel is placed, a terminal part cradle juxtaposed on the panel cradle, and a heater head that can be raised and lowered relative to the terminal part cradle, the liquid crystal panel having the terminal part A predetermined circuit board is disposed on the terminal part via an anisotropic conductive adhesive in a state of being placed on the panel base so as to straddle the panel base and the terminal part base. In the circuit board crimping apparatus to the liquid crystal panel for lowering the heater head and crimping the circuit board to the terminal part,
A circuit board crimping device to a liquid crystal panel, wherein the panel base is provided with a heat sink that elastically contacts the back side of the terminal portion.   2. A circuit to a liquid crystal panel according to claim 1, wherein a cylinder chamber in which the heat sink is housed so as to be movable up and down is formed in the panel base, and fluid circulation means including a pump is connected to the cylinder chamber. Board crimping device.   The circuit board crimping apparatus for a liquid crystal panel according to claim 2, wherein the heat sink is pushed up by a fluid pressure supplied from the pump and contacts the back side of the terminal portion.   The circuit board crimping apparatus for a liquid crystal panel according to any one of claims 1 to 3, wherein the heat sink is made of an aluminum material.

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