JP2010002799A - Ic circuit element mounting device of display panel, and display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To protect a polarizing film pasted to a panel substrate, in such a manner that the deterioration and damages due to heat are not generated, when an IC circuit element is thermocompression-bonded to the panel substrate. <P>SOLUTION: The device, although pressurizes the panel substrate 1 under heating by a compression bonding head 15 thereby thermocompression bonds the IC circuit element 5, and here, a shielding means 21 is provided in order to protect a polarizing film 4a disposed on the panel substrate 1 so as not to exceed the heat resistant temperature. The shielding means 21 is bent into a V shape and consists of a shielding plate 22, having a folded part 22a and a cold air supply pipe 23; the folded part 22a abuts on a position between the sticking part of the folded part 22a and the polarizing film 4a and ACF 8; and the cooling wind spouting from a jet port 23 of the cold air supply pipe 23 is made inverse, in a direction of going toward the folded part 22a from an inner surface on a side facing the compression bonding head 15, and to thereafter, flow out from apertures on both sides of the shielding plate 22 toward thereto. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a display panel IC circuit element mounting device and an IC circuit element for mounting an IC circuit element constituting a driver circuit on a transparent panel substrate in a flat display device such as a liquid crystal display, a plasma display, and an organic EL display. It is related with the display panel which carries.

  As a flat display device, for example, a liquid crystal display device has a panel substrate in which liquid crystal is sealed between two transparent substrates made of a TFT substrate and a color filter, and a driver circuit is mounted on the panel substrate. It is manufactured by. The driver circuit is composed of IC circuit elements and is generally mounted on at least one side of the panel substrate.

  Typical methods for mounting an IC circuit element on a panel substrate include a COG (Chip On Glass) method in which an IC circuit element is directly mounted on a panel substrate, and a COF (Chip On Film) in which an IC chip is mounted on a flexible substrate. TAB (Tape Automated Bonding). In any case, a fine wiring pattern is formed on the panel substrate, and an anisotropic conductive sheet, that is, an ACF (Anisotropic Conductive Film) is attached to the portion where the wiring pattern is formed. A driver circuit composed of an IC circuit element is mounted by a COG method or a TAB method, and a large number of electrodes provided in the IC circuit element and a wiring pattern are electrically connected. ACF is obtained by dispersing minute conductive particles in a binder resin made of a thermosetting resin.

  For example, in the TAB mounting method, a flexible substrate on which an IC circuit element is mounted is temporarily pressure-bonded by performing alignment so that electrodes provided on the flexible substrate coincide with the wiring pattern of the panel substrate. At this stage, the binder resin is uncured, and the binder resin is cured by a subsequent press bonding.

  The main pressure bonding is performed by placing the panel substrate on a receiving table and pressurizing the bonding portion of the COF to the panel substrate with a pressure blade heated from above. In this main pressure bonding, the electrode of the IC circuit element and the wiring of the panel substrate are electrically connected via the conductive particles of ACF, and the binder resin is thermally cured. As a result, the COF is fixedly bonded to the panel substrate.

  By the way, whether it is the COG method or the TAB method, the mounting area of the IC circuit element is a narrow place and is in a position closest to the effective area where the image is displayed. A polarizing film is attached to the effective area of the panel substrate. This polarizing film consists of a film with low heat resistance, and its heat-resistant temperature is about 60 degreeC. On the other hand, the curing temperature of the ACF binder resin is 120 ° C. or higher. In order to perform the main pressure bonding at a high speed, the temperature of the pressure bonding blade tends to be increased. Therefore, there is a possibility that heat is transferred to the polarizing film at the time of press-bonding with the pressing blade, and there is a possibility of damaging the polarizing film. As a result, the quality of the display device, such as display unevenness, is degraded.

  From the above, for example, Patent Document 1 proposes a configuration in which the heat is not transmitted to the polarizing film while the main pressure bonding is performed by the pressure bonding blade. In this Patent Document 1, the heat shield is brought into contact with the end of the polarizing film with respect to the side of the substrate on which the IC chip is mounted, and the heat transmitted from the crimping blade to the substrate is brought into contact with the polarizing film. It is constructed so as to be absorbed by the heat shield plate and to prevent the temperature of the polarizing film from rising. Further, since the polarizing film is covered with the heat shield plate, it is possible to prevent radiant heat from acting on the polarizing film.

As a result, it is possible to prevent the polarizing film from reaching a high temperature and to prevent damage due to heat. Further, in order to remove heat from the heat shield plate, a refrigerant supply device for circulating cooling water is provided, and the heat shield plate is connected to the refrigerant supply device. Further, there is a description that instead of the heat shield plate, an air cooling method in which cool air is blown between the pressure bonding region where the pressure bonding blade is located and the polarizing film can be adopted.
JP 2001-230577 A

  By the way, in recent years, flat display devices tend to have a large screen. Therefore, the length of the area where the IC circuit elements are mounted on each side of the panel substrate is increased, and the IC circuit elements mounted on each side are increased. The number also increases. In Patent Document 1, the heat shield plate is configured to have a length extending over the entire length of the side on which the IC circuit element is mounted on the panel substrate, and the crimping blade is thermocompression bonded to each IC circuit element. I am doing so. Therefore, the heat shield plate that is in contact with the polarizing film must be in contact with the entire length of the polarizing film. Even if it is very small, the heat shielding effect due to heat absorption cannot be sufficiently exhibited.

  In particular, when a large panel substrate is heated with a crimping blade, the panel substrate cannot be prevented from being thermally deformed. Since the heat shielding plate of Patent Document 1 absorbs heat from the polarizing film, it is necessary to bring the heat shielding plate into contact with the polarizing film. Resulting in. Therefore, if the panel substrate is wavy or warped, even if it is slight, a part of the heat shield plate is separated from the polarizing film, and the cooling function is remarkably lowered.

  The present invention has been made in view of the above points. The object of the present invention is that when an IC circuit element is thermocompression bonded to a panel substrate, the polarizing film adhered to the panel substrate is heated. The object is to enable effective protection without causing deterioration or damage.

  In order to achieve the above-described object, the present invention is configured such that a plurality of IC circuit elements are connected to at least one side of a panel substrate having a polarizing film attached to the surface, and the pressure is applied under heat by a crimping head. A shielding plate is disposed on the panel substrate so as to contact a position between the pressure-bonding head and the polarizing film, and the width of the shielding plate is the pressure-bonding head. It is provided so as to face the pressure-bonding head as being equal to or longer than the length of the plate, and the shielding plate is brought into contact with the panel substrate on the arrangement side of the polarizing film defined by the shielding plate. It is characterized in that a cooling means for injecting cold air toward the part is arranged.

  The shielding plate functions to shield heat from the pressure-bonding head from being transmitted to the polarizing film, and does not absorb the heat transmitted to the polarizing film. The shielding plate isolates the polarizing film from the pressure-bonding head and cools it by supplying cold air. The cold air is supplied from a cooling means, for example, a pipe through which cold air is circulated, with injection holes formed at predetermined pitch intervals. Although cold air can be blown directly onto the polarizing film, it is sufficient that a flow of cooling air is formed between the pressure-bonding head and the end of the polarizing film along the shielding plate. However, when the cold air from the cooling means comes into contact with the crimping head, the temperature of the crimping head becomes non-uniform. Therefore, the function of preventing the cold air from being blown toward the pressure-bonding head is also exerted on the shielding plate.

  Some panel substrates have a predetermined number of IC circuit elements connected to at least one side, and IC circuit elements connected to a maximum of four sides. It can be configured to be crimped simultaneously to all the IC circuit elements connected to one side, or each IC circuit element can be individually crimped.

  Here, when mounting the IC circuit element on the panel substrate, an anisotropic conductive sheet, that is, an ACF is used, and the binder resin constituting the ACF is thermally cured by heating the pressure-bonding head. . The pressure-bonding head is at a temperature higher than the curing temperature of the binder resin and is usually at a high temperature around 200 ° C. Since the heat-resistant temperature of the polarizing film is about 60 ° C., it is sufficient that the polarizing film is kept at 60 ° C. or less by the shielding by the shielding plate and the cool air supplied from the cooling means, and it is not necessary to extremely reduce the temperature. . The IC circuit element mounting method can be applied to the TAB method or the COG method. In short, the shielding plate is brought into contact with the region heated by the pressure-bonding head and the region where the polarizing film is attached.

  The shielding plate can be composed of a metal plate, a plastic panel, a ceramic plate, or the like, but a metal plate, particularly a copper plate or an aluminum plate, has a high thermal conductivity, and therefore can be suitably used as a shielding plate. Since the shielding plate shields the cooling head from coming into contact with the cooling air, the width of the shielding plate is made larger than the length of the crimping head. However, it is not necessary to increase the dimensional difference between them. Rather, since the shielding plate needs to be in close contact with the surface of the panel substrate over its entire length, it is desirable that the width of the shielding plate be longer than the entire length of the crimping head, but not larger than necessary.

  The panel substrate is composed of two upper and lower transparent substrates, for example, glass substrates, the IC circuit element is mounted on the lower substrate, and the polarizing films are formed on both front and back surfaces of the panel substrate composed of two transparent substrates. The pressure-bonding head is disposed on the surface side of the panel substrate, that is, the side on which the IC circuit element is mounted. The pressure-bonding head is placed on a receiving base that receives the pressure applied by the pressure-bonding head on the opposite side of the panel substrate. Accordingly, at least the side on which the crimping head is disposed needs to be shielded, and a shield plate can be provided on the opposite surface.

  The shielding plate is brought into contact with the surface of the panel substrate, and cool air from the cooling means is supplied. This cold air flow is efficiently directed to a position in the vicinity of the IC circuit element mounting portion on the surface of the panel substrate. For this purpose, the shielding plate is brought into contact with the panel substrate in an inclined state. And if there is an edge at the tip of the shielding plate in contact with the panel substrate, the panel substrate may be damaged. Therefore, when the shielding plate is formed in a V-shaped shape and the folded portion of the shielding plate is configured to contact the panel substrate, the edge does not contact the panel substrate, so even if the pressing force is increased, There is no risk of damaging the panel substrate. In this case, in the cooling means, the cold air is jetted so as to form a flow from the wall surface of the shielding plate facing the crimping head toward the folded portion.

  As described above, when the IC circuit element is thermocompression bonded to the panel substrate by the crimping head by the shielding plate and the cooling means, the heat transfer from the crimping head to the polarizing film attached to the panel substrate is transmitted. The polarizing film is effectively protected without being deteriorated or damaged by heat.

    Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2, reference numeral 1 denotes a panel substrate. The panel substrate 1 includes a lower substrate 2 and an upper substrate 3 which are upper and lower transparent glass substrates. Liquid crystal is sealed between the lower substrate 2 and the upper substrate 3 to form a cell gap. Polarizing films 4 a and 4 b are formed on the front and back surfaces of the panel substrate 1. The surface-side polarizing film 4 a is provided on the upper substrate 3 of the panel substrate 1, and the polarizing film 4 a is disposed up to the edge of the upper substrate 3 or a position in the vicinity thereof.

  A part of the lower substrate 2 in the panel substrate 1 protrudes from the upper substrate 3, and the protruding portion is a mounting region M, and the IC circuit element 5 is mounted in the mounting region M. For this purpose, the wiring portion 6 is formed in the mounting region M, and the wiring portion 6 is provided with a predetermined number of wires as a group. The IC circuit element 5 is made of COF in which an IC chip 5a is mounted on a flexible substrate 5b. When the IC circuit element 5 is mounted on the panel substrate 1, the wiring portion 7 formed on the flexible substrate 5b is replaced with the panel substrate 1. It is electrically connected to the wiring part 6 on the side.

  Here, in the present embodiment, the mounting method of the IC circuit element 5 is a TAB mounting method performed via the ACF 8. The ACF 8 is individually attached to each wiring part 6 in the mounting area M of the lower substrate 2. Alignment marks A 1 and A 1 are provided on both sides of the wiring portion 6, and similar alignment marks A 2 and A 2 are provided on the flexible substrate 5 b of the IC circuit element 5. Therefore, the IC circuit element 5 is placed on the lower substrate 2 in a state of alignment so that the alignment marks A1 and A2 coincide with each other, and is temporarily bonded.

  The panel substrate 1 to which the IC circuit element 5 has been temporarily bonded is conveyed to a main pressure bonding stage, and the ACF 8 is pressed under heating by the main pressure bonding stage, whereby each wiring constituting the wiring parts 6 and 7 is passed through conductive particles. And the IC circuit element 5 is fixed to the panel substrate 1 by curing the binder resin. Therefore, FIG. 3 and FIG. In the present embodiment, the main pressure bonding is configured to individually pressure bond a plurality of IC circuit elements 5 connected to one side of the panel substrate 1, but all the ICs connected to one side are arranged. You may comprise so that the circuit element 5 may be finally crimped | bonded simultaneously.

  The main pressure bonding stage is provided with a conveying means 10 for conveying the panel substrate 1, and a pressure bonding unit 11 is provided at a position where the mounting area M (FIG. 1) of the panel substrate 1 faces in a conveying path by the conveying means 10. It has been. The crimping unit 11 includes a cradle 14 that moves up and down along a slide guide 13 provided in the unit body 12 and a crimping head 15. The cradle 14 can be moved up and down by a predetermined stroke by a lift drive means 16 composed of a cylinder or the like. Therefore, the cradle 14 is displaced up and down to an operating position (FIG. 4) that contacts the lower surface of the panel substrate 1 held by the transport means 10 and a retracted position (FIG. 3) that is lowered below. It has become.

  The pressure-bonding head 15 is a pressure-bonding blade 17 that pressurizes from above and thermocompression-bonds at a portion where the wiring portion 6 of the panel substrate 1 held by the conveying means 10 and the wiring portion 7 of the IC circuit element 5 are joined. The heater 18 is heated to a predetermined temperature, for example, 200 ° C. A crimping head 15 having a crimping blade 17 is mounted on an elevating member 19 that is guided by a slide guide 13 so as to be movable in the vertical direction together with a cradle 14, and operates a pressure application means 20 provided on the unit main body 12. Thus, a predetermined pressure is applied to the pressure-bonding head 15. That is, by driving the pressure application means 20, the pressure-bonding blade 17 is brought into contact with the panel board 1 in a non-operating position (FIG. 3) higher than the panel board 1 held by the transport means 10, and predetermined. It is displaced between the operating position (FIG. 4) where the applied pressure is applied.

  Further, a shielding means 21 is attached to the unit body 12. As shown in FIG. 5, the shielding means 21 includes a shielding plate 22 and a cold air supply pipe 23 constituting the cooling means, and the cold air supply pipe 23 is formed with injection holes 23a with a predetermined pitch interval. . The shielding plate 22 and the cold air supply pipe 23 are attached to an attachment member 24, and rotating arms 25 and 25 are connected to both ends of the attachment member 24. And the crimping | compression-bonding unit 11 is arrange | positioned between these movable arms 25 and 25, and the other end part of the rotation arms 25 and 25 is connected with the unit main body 12 so that rotation is possible toward the up-down direction, By a rotation drive means (not shown), the shielding plate 22 is rotated between an operating position (FIG. 3) where the panel board 1 is in contact with the surface of the lower substrate 2 and an open position (FIG. 4) rotated upward from this position. Displaceable.

  Here, the shielding plate 22 is bent in a substantially V shape, and the folded portion 22a has a rounded non-edge structure. When the shielding plate 22 is set to the operating position, the folded portion 22a is the panel substrate 1. Can be contacted. Moreover, in the operating position, the front and back surfaces from the folded portion 22a to the connecting portion of the shielding plate 22 that expands in a V shape to the attachment member 24 are inclined with respect to the panel substrate 1.

  In FIG. 1, the length L of the portion where the ACF 8 is attached is substantially equal to the total length of the IC circuit element 5, and the total length of the crimping blade 17 is equal to or slightly longer than this dimension. When the pressure is applied by the crimping blade 17, a pressure can be applied to the entire ACF 8, and the entire ACF 8 is heated. On the other hand, the shielding plate 22 is in contact with the panel substrate 1 at a position between the polarizing film 4a provided on the upper substrate 3 and the attachment portion of the ACF 8, and the width of this contact portion. B (portion indicated by hatching in FIG. 1) is longer than the entire length of the crimping blade 17, and the shielding plate 22 is configured to project from the both ends of the crimping blade 17 to the left and right. Therefore, as indicated by the arrows in FIG. 5, the cooling air blown from the injection port 23 a of the cold air supply pipe 23 passes from the inner surface of the shielding plate 22 facing the crimping head 15 to the folded portion 22 a that contacts the panel substrate 1. The direction is changed so as to face, and then flows out toward the openings on both sides of the shielding plate 22. For this reason, the cooling air is not directly blown to the pressure-bonding head 15 under heating.

  The present embodiment is configured as described above, and the IC circuit element 5 is preliminarily pressure-bonded to the panel substrate 1 via the ACF 6 and is carried into the main pressure-bonding stage by the transport means 10. . At this time, as shown in FIG. 4, the cradle 14 constituting the crimping unit 11 is lowered, the crimping head 15 provided with the crimping blade 17 is held in the raised position, and the rotating arm 25 is further operated upward. Thus, the shielding plate 22 is held in a state of being rotated upward. Further, at least the crimping blade 15 is heated to a set temperature by the heater 19 in advance.

  When the panel substrate 1 is carried into the main pressure bonding stage by the conveying means 10, it stops at a predetermined position. In this state, firstly, the raising / lowering driving means 16 is operated to bring the cradle 14 into contact with the panel substrate 11. Next, the rotating arm 25 is operated, and the shielding plate 22 comes into contact with the panel substrate 1. The contact position of the shielding plate 22 with the panel substrate 1 is outside the polarizing film 4 a provided on the upper substrate 3. Here, when the polarizing film 4 a extends to the end portion of the upper substrate 3, the polarizing film 4 a is brought into contact with a position from the end corner portion of the upper substrate 3 to the lower substrate 2, and polarized on the end portion of the upper substrate 3. When there is a blank portion where the film 4a is not formed, the blank portion can be brought into contact with the blank portion. And cold air is injected from the injection port 23a of the cold air supply pipe | tube 23 arrange | positioned inside this shielding board 22. FIG. Here, the cool air is for preventing the polarizing film 4a from exceeding its heat-resistant temperature of 60 ° C., and the supplied cool air does not need to be extremely low, and is a normal temperature or a low temperature close to normal temperature. It may be.

  In this state, the heated crimping head 15 is lowered, the crimping blade 17 is brought into contact with the panel substrate 1, and the pressing force is applied to the crimping blade 17 by the pressurizing action means 20 to compress the ACF 8. At the same time, the binder resin is softened or melted. Since the crimping blade 17 is in a heated state and is in contact with the panel substrate 1, this heat is transmitted to the panel substrate 1. However, in this panel substrate 1, the shielding plate 22 is in contact between the contact position of the crimping blade 17 and the portion where the polarizing film 4 a is adhered. Supplyed and cooled. Therefore, the heat transmitted from the crimping blade 17 to the panel substrate 1 is blocked by the contact portion of the shielding plate 22 and is not transmitted to the polarizing film 4a or even if transmitted, a slight temperature rise occurs. It only occurs.

  Here, the shielding plate 22 prevents the polarizing film 4a from being heated from the crimping blade 17 through the panel substrate 1, but since cold air is sprayed, the cold air contacts the crimping blade 17. Then, the crimping blade 17 is partially cooled, and the temperature uniformity of the crimping blade 17 cannot be achieved. However, since the shielding plate 22 is interposed between the cold air supply pipe 23 and the crimping blade 17, the crimping blade 17 does not come into direct contact with the cold air from the cold air supply pipe 23. From the inside of the shield plate 22 formed in a V-shape, a flow of cool air jetted from the cool air supply pipe 23 is generated, but this cool air flows downward along the shield plate 22 to the panel substrate 1. The panel substrate 1 is cooled by being guided to the folded portion 22a which is a contact portion. Thereafter, it is discharged outward from both sides of the shielding plate 22. Since the end portions on both sides of the shielding plate 22 protrude from both sides of the crimping blade 17, the cold air does not flow toward the crimping blade 17. Therefore, the temperature uniformity of the crimping blade 17 is not impaired, the accuracy of the main crimping operation is not lowered, and the entire ACF 8 is cured uniformly.

  When one IC circuit element 5 is crimped in this way, the next IC circuit element 5 is crimped. At this time, the panel substrate 1 or the crimping unit 11 is moved. Here, if the main pressure bonding is continued while moving the pressure bonding unit 11 by one pitch, the final pressure bonding stage can be made compact. Therefore, if the unit main body 12 is provided in the traveling drive means, the crimping unit 11 can be finally crimped while being pitch-fed by the traveling drive means.

  By the way, a plurality of IC circuit elements 5 are mounted on the panel substrate 1, and the IC circuit elements 5 can be individually crimped on the final crimping stage, but the main crimping process is performed at a high speed. In addition, a plurality of IC circuit elements 5 mounted on a single side of the panel substrate 1 at the same time, preferably all at the same time, can be thermocompression bonded simultaneously. For this purpose, it is conceivable to lengthen the pressure-bonding head 15 constituting the pressure-bonding unit 11, but in order to perform the main pressure bonding with high accuracy, the pressure-bonding unit 30 is attached to the panel substrate 1 as shown in FIG. The number of the IC circuit elements 5 to be crimped to is arranged side by side. On the other hand, one cradle 31 is provided over the entire length of the panel substrate 1.

  As shown in FIG. 7, the crimping unit 30 has a crimping head 33 provided with a crimping blade 32 at the tip, and this crimping head 33 is attached to an elevating guide 35 provided on a post 34 erected on the unit base 30a. It can move up and down along. A swing bar 36 is pivotally supported by a swing shaft 36a at the upper end portion of the post 34, and a lifting shaft 33a is connected to the pressure-bonding head 33. A roller receiver 37 is provided. The roller receiver 37 is in contact with a roller 39 provided on the swing bar 36 by a tension spring 38 provided between the crimping head 33 and the swing bar 36. An extending portion of the swing bar 36 opposite to the swing shaft 36a is connected to a cylinder 40 as a pressure application means, and the cylinder 40 is attached to the unit base 30a.

  Therefore, when the cylinder 40 is reduced, the pressure-bonding head 33 rises and is disposed above the panel substrate 1. Then, when the cylinder 40 is extended, the swing bar 36 swings and displaces so that the side on which the roller 39 is provided is lowered around the swing shaft 36a. As a result, it is pushed by the roller 39 and the pressure-bonding head 33 is lowered, and the pressure-bonding blade 32 presses the IC circuit element 5. Here, the crimping blade 32 is heated by a heater (not shown), whereby the IC circuit element 5 is thermocompression bonded to the panel substrate 1.

  As described above, since the crimping blade 32 is heated, the shielding means 21 similar to that described above is provided so that heat is not transmitted to the portion of the panel substrate 1 where the polarizing film 4a is adhered. Accordingly, the folded portion 22a of the shielding plate 22 constituting the shielding means 21 is in contact with the position between the crimping blade 32 and the polarizing film 4a, and cold air is supplied to the shielding plate 22 from the cold air supply pipe 23. Yes. Therefore, the heat transmitted from the crimping blade 17 to the panel substrate 1 is blocked by the contact portion of the shielding plate 22.

  Here, in order to prevent the heat transfer of the crimping blade 32 to the polarizing film 4 a in the panel substrate 1, the shielding means 21 is provided for each crimping unit 30, but the shielding means covers all the crimping units 30. It can also be configured as a length. In the shielding means 41 shown in FIG. 8, slits 43 are provided at intervals corresponding to the respective crimping units 30 in the shielding plate 42 in order to ensure contact with the panel substrate 1 over the entire length thereof. Yes. In addition, cold air is supplied from the cold air supply pipe 44 toward the shielding plate 42, but in order to prevent the cold air from flowing out from the slit 43 toward the crimping unit 30, the width of the slit 43 is reduced and the shielding plate 42. Rather than connecting the both ends to the mounting member 45, the side where the polarizing film 4a is located can be opened to extend to the position past the folded portion 42a. Thereby, the cold air flowing along the inner surface of the shielding plate 42 is surely directed to the side where the polarizing film 4a is located, and does not flow toward the crimping unit 30 side.

It is a top view which shows a panel board | substrate and an IC circuit element. It is a side view of FIG. It is a structure explanatory view in the operation state of the mounting device of the IC circuit element to the panel board | substrate which shows the 1st Embodiment of this invention. FIG. 4 is a configuration explanatory view in a non-operating state in the same configuration as FIG. 3. It is a principal part enlarged view of FIG. It is composition explanatory drawing of the crimping | compression-bonding unit which shows the 2nd Embodiment of this invention. FIG. 7 is a side view of FIG. 6. It is an external view which shows the modification of a shielding means.

Explanation of symbols

1 Panel substrate 2 Lower substrate 3 Upper substrate 4a, 4b Polarizing film 5 IC circuit element 8 ACF
DESCRIPTION OF SYMBOLS 10 Conveyance means 11,30 Crimp unit 14,31 Receptacle 15,33 Crimp head 17,32 Crimp blade 18 Heater 21,41 Shield means 22,42 Shield plates 22a, 42a Folding part 23,44 Cold air supply pipe 23a Injection port

Claims (5)

In what is mounted by connecting a plurality of IC circuit elements to at least one side of a panel substrate having a polarizing film attached to the surface, and applying pressure by heating with a crimping head,
With respect to the panel substrate, a shielding plate is disposed so as to contact the position between the pressure-bonding head and the polarizing film,
The shield plate is provided so that its width dimension is equal to or longer than the length of the pressure-bonding head so as to face the pressure-bonding head.
A display having a configuration in which cooling means for injecting cold air toward a contact portion of the shielding plate with respect to the panel substrate is arranged on the side of the polarizing film partitioned by the shielding plate. Panel IC circuit device mounting device. 2. The IC circuit element mounting device for a display panel according to claim 1, wherein the IC circuit element is mounted on the panel substrate through an anisotropic conductive sheet. 3. The device for mounting an IC circuit element on a display panel according to claim 1, wherein the shielding plate is made of a thin metal plate. The shielding plate is shaped to be folded in a V shape, the folded portion of the shielding plate is brought into contact with the panel substrate, and the cool air from the cooling means is from the wall surface of the shielding plate facing the crimping head. 4. An apparatus for mounting an IC circuit element on a display panel according to claim 3, wherein the apparatus is configured to spray toward the folded portion. A display panel manufactured from a panel substrate on which an IC circuit element is mounted by the mounting device according to claim 1.

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