CN217767713U - Display module assembly and display device - Google Patents
Display module assembly and display device Download PDFInfo
- Publication number
- CN217767713U CN217767713U CN202220202020.7U CN202220202020U CN217767713U CN 217767713 U CN217767713 U CN 217767713U CN 202220202020 U CN202220202020 U CN 202220202020U CN 217767713 U CN217767713 U CN 217767713U
- Authority
- CN
- China
- Prior art keywords
- substrate
- heat dissipation
- dissipation layer
- display module
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model provides a display module assembly and display device, include: the display panel comprises a first substrate and a second substrate, wherein the second substrate comprises a first surface and a second surface, and the first surface is partially provided with a flexible circuit board; the driving IC chip is arranged on the first surface of the second substrate; the heat dissipation layer, the heat dissipation layer with drive IC chip position corresponds, the heat dissipation layer is located and is close to the second surface of second base plate divides the region, perhaps drive IC chip with flexible circuit board divides the region, keeps away from a side surface of second base plate all covers the heat conduction paper tinsel, heat conduction paper tinsel surface covering the heat dissipation layer, the utility model discloses a close on the regional attached graphite fin of IC chip, not only can be rapidly with the temperature diffusion of drive IC chip to reduce IC department temperature, fine protection electronic components and extension electronic product's life-span moreover.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a display module assembly and display device.
Background
With the increasing requirement of the screen size of the mobile phone, the power consumption of an IC (Integrated Circuit) chip which needs to drive a display is increasing, so that the heat generation of the IC chip is more and more obvious, and the heat dissipation problem of the IC chip draws wide attention; if the heat is not emitted in time, the service life of the IC, the service life of the product and the functional integrity of the product can be influenced, and the experience of the user can also be influenced.
SUMMERY OF THE UTILITY MODEL
For solving the problem that exists among the prior art, the utility model provides a display module assembly and display device avoids IC region through the polaroid under, and the graphite flake is pasted on the shading in a poor light glue that this region corresponds improves integrated touch module assembly IC heat dissipation problem.
The utility model provides a following technical scheme:
a display module, comprising:
the display panel comprises a first substrate and a second substrate, the second substrate comprises a first surface and a second surface, and the first surface part is provided with a flexible circuit board;
the driving IC chip is arranged on the first surface of the second substrate;
the heat dissipation layer corresponds to the position of the drive IC chip, the heat dissipation layer is arranged on a part of the surface of the second surface close to the second substrate, or one side of the second substrate is far away from the second substrate, the parts of the surface of the drive IC chip and the flexible circuit board are covered with the heat conduction foil, and the surface of the heat conduction foil is covered with the heat dissipation layer.
The flexible circuit board is in electrical contact with the heat dissipation layer.
As a preferred technical scheme, the heat dissipation layer is a graphite heat dissipation sheet.
Preferably, the first substrate size is smaller than the second substrate size.
The preferable technical proposal comprises a first polarizer and a second polarizer,
the first polaroid is attached to the surface of one side, away from the second substrate, of the first substrate;
the second polaroid is arranged on the second surface partial area of the second substrate.
As a preferable technical scheme, the second polaroid is in no electrical contact with the heat dissipation layer.
The backlight module comprises a bright enhancement film, a diffusion film, a light guide plate, a reflecting film and an iron frame which are sequentially stacked; and light shading glue is arranged between the light enhancement film and the second surface of the second substrate.
Preferably, the heat dissipation layer is attached to a portion of the second surface of the second substrate, or the heat dissipation layer is attached to a portion of the surface of the backlight assembly facing the second substrate.
As a preferable technical scheme, light shielding glue is arranged between the heat dissipation layer and the second surface part region of the second substrate; and a shading glue is arranged between the heat dissipation layer and the backlight assembly.
Preferably, the heat conductive foil is a copper foil.
The application also provides a display device, which comprises the display module.
The utility model discloses a technical scheme beneficial effect that can reach:
1. a graphite radiating fin is attached to the lower end of the polaroid, so that the temperature of the drive IC chip can be rapidly diffused, and the temperature of the IC is reduced;
2. in order to avoid the problem of radio frequency interference of products, a copper foil is pasted on the IC chip and the flexible circuit board, a graphite sheet can be added above the copper foil, and heat generated by the IC can be transmitted to the graphite sheet through the copper foil at the upper end in time for heat dissipation.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below to form a part of the present invention, and the exemplary embodiments and the description thereof of the present invention explain the present invention and do not form an improper limitation to the present invention. In the drawings:
fig. 1 is a schematic structural view of a display module disclosed in embodiment 1 of the present invention;
fig. 2 is a schematic structural view of a display module disclosed in embodiment 1 of the present invention;
description of reference numerals:
a first substrate 10; a first polarizing plate 101; a second substrate 20; a second polarizer 201; a driver IC chip 102; a flexible circuit board 103; a backlight assembly 40; a thermally conductive foil 1021; graphite fins 1022.
Detailed Description
To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. In the description of the present invention, it is noted that the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
This embodiment 1 provides a display module assembly, includes:
a display panel including a first substrate 10 and a second substrate 20, the second substrate 20 including a first surface and a second surface, the first surface being partially provided with a flexible circuit board 103;
a driving IC chip 102, the driving IC chip 102 being disposed on the first surface of the second substrate 20;
and a heat dissipation layer corresponding to the driver IC chip 102, the heat dissipation layer being disposed in a second partial surface region adjacent to the second substrate 20.
The flexible circuit board 103 is in electrical contact with the heat dissipation layer.
A Flexible Printed Circuit board 103 (FPC), which is a highly reliable and excellent Flexible Printed Circuit board made of a polyimide or polyester film as a base material.
In this embodiment, the second substrate 20 has a heat dissipation layer attached to the second surface portion, so that the heat generated by the driving IC chip 102 during operation can be conducted to the heat dissipation layer well, and the heat dissipation layer uniformly distributes the heat, thereby rapidly dispersing the heat in the binding region of the driving IC chip 102, avoiding the concentration of the heat in the binding region and bringing about the damage of the display panel.
Preferably, the heat dissipation layer is a graphite heat dissipation fin 1022.
Preferably, the first substrate 10 is smaller in size than the second substrate 20.
Preferably, the polarizer comprises a first polarizer 101 and a second polarizer 201, wherein the first polarizer 101 is attached to a surface of the first substrate 10, which is far away from the second substrate 20; the second polarizer is disposed on a second partial surface region of the second substrate 20.
Preferably, the heat dissipation layer is attached to the second substrate 20 at the second surface portion region.
Preferably, the second polarizer is in electrical contact with the heat dissipation layer.
Preferably, the backlight assembly 40 is included, and the backlight assembly 40 includes a brightness enhancement film, a diffusion film, a light guide plate, a reflection film and an iron frame which are stacked in sequence; a light-shielding glue is disposed between the bright enhancement film and the second surface of the second substrate 20.
Preferably, the heat dissipation layer is attached to a portion of the second surface of the second substrate 20, or the heat dissipation layer is attached to a portion of the surface of the backlight assembly 40 facing the second substrate 20.
Preferably, a light shielding glue is arranged between the heat dissipation layer and the second surface partial region of the second substrate 20; a light-shielding adhesive is disposed between the heat dissipation layer and the backlight assembly 40.
Graphite fin 1022 covers on the heat conduction copper foil table, graphite fin 1022 is the dark colour, can play the effect of shading, the inner structure of protection drive IC chip 102 is not by natural light shines, avoid receiving the damage that leads to because of drive IC chip 102 receives natural light shines, simultaneously because graphite fin 1022 has better heat-sinking capability, it is too big when the inside electric current that passes through of drive IC chip 102, when the consumption is too high, a large amount of heats that drive IC chip 102 self produced can be through graphite fin 1022 effluvium, can reduce drive IC chip 102 regional temperature, improve the display module's display reliability.
Example 2
This embodiment 2 provides a display module assembly, and it is the attached position of heat dissipation layer that is different from embodiment 1, can be fine with the heat that drives IC chip 102 during operation and distribute in the heat dissipation layer to reduce electronic product's temperature, reach the purpose of protection electronic components and extension electronic product's life-span.
Preferably, the surfaces of the driving IC chip 102 and the flexible circuit board 103 are covered with the thermal conductive foil 1021 on the side away from the second substrate 20. According to fig. 2, the heat conducting foil 1021 is covered on the surfaces of the driving IC chip 102 and the flexible circuit board 103, and heat generated by the driving IC chip 102 can be timely transferred to the graphite sheet through the heat conducting foil 1021 at the upper end for heat dissipation, so that the problem of radio frequency interference can be well solved.
Preferably, the thermal conductive foil 1021 is a copper foil. The heat conductive copper foil can quickly convert a point heat source emitted by the driving IC chip 102 into a surface heat source, thereby reducing the temperature of the electronic product, protecting the electronic components and prolonging the service life of the electronic product.
Example 3
The application also provides a display device comprising the display module of embodiment 1-2.
The display module and the display device according to the embodiment of the present application are described in detail, and the principle and the implementation of the present application are explained by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display module, comprising:
the display panel comprises a first substrate and a second substrate, wherein the second substrate comprises a first surface and a second surface, and the first surface is partially provided with a flexible circuit board;
the driving IC chip is arranged on the first surface of the second substrate;
the heat dissipation layer corresponds to the position of the drive IC chip, the heat dissipation layer is arranged in a part of the area of a second surface close to the second substrate or on one side far away from the second substrate, the surfaces of the part of the area of the drive IC chip and the flexible circuit board are covered with heat conduction foils, and the surfaces of the heat conduction foils cover the heat dissipation layer; the flexible circuit board is in electrical contact with the heat dissipation layer.
2. The display module of claim 1 wherein the heat sink layer is a graphite heat sink.
3. The display module of claim 1, wherein the first substrate size is smaller than the second substrate size.
4. The display module of claim 1, comprising a first polarizer and a second polarizer,
the first polarizer is attached to the surface of one side, away from the second substrate, of the first substrate;
the second polaroid is arranged on the second surface part area of the second substrate.
5. The display module of claim 4, wherein the second polarizer is in electrical contact with the heat dissipation layer.
6. The display module according to any one of claims 1 to 5, comprising a backlight assembly, wherein the backlight assembly comprises a brightness enhancement film, a diffusion film, a light guide plate, a reflective film and an iron frame, which are sequentially stacked; and a shading glue is arranged between the bright enhancement film and the second surface of the second substrate.
7. The display module according to claim 6, wherein the heat dissipation layer is attached to a portion of the second surface of the second substrate, or a portion of the surface of the backlight assembly facing the second substrate.
8. The display module of claim 6, wherein a light blocking glue is disposed between the heat dissipation layer and the second surface portion region of the second substrate; and a shading glue is arranged between the heat dissipation layer and the backlight assembly.
9. The display module of claim 1, wherein the thermally conductive foil is a copper foil.
10. A display device comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220202020.7U CN217767713U (en) | 2022-01-25 | 2022-01-25 | Display module assembly and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220202020.7U CN217767713U (en) | 2022-01-25 | 2022-01-25 | Display module assembly and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217767713U true CN217767713U (en) | 2022-11-08 |
Family
ID=83868926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220202020.7U Active CN217767713U (en) | 2022-01-25 | 2022-01-25 | Display module assembly and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217767713U (en) |
-
2022
- 2022-01-25 CN CN202220202020.7U patent/CN217767713U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101546741B1 (en) | Light emitting module and display apparatus having the same | |
| KR101301317B1 (en) | Backlight unit and liquid crystal display using the same | |
| CN101500373B (en) | Printed circuit board, backlight unit and liquid crystal display device | |
| CN102346332A (en) | Liquid crystal display device including backlight unit | |
| KR100900376B1 (en) | Illuminating device, electro-optic device, and electronic apparatus | |
| CN103149720A (en) | Liquid crystal display device | |
| CN217767713U (en) | Display module assembly and display device | |
| JP4587720B2 (en) | Light source device and liquid crystal display device having the same | |
| KR101154790B1 (en) | The radiant heat circuit board unified blanket and the chassis structure having the same | |
| JP2000214441A (en) | Liquid crystal display device | |
| CN210470094U (en) | Heat dissipation device for display | |
| KR101283068B1 (en) | The radiant heat circuit board unified blanket and the backlight unit having the same | |
| JPH10232385A (en) | Heat radiating structure for liquid crystal display module | |
| CN217116726U (en) | Display module and electronic equipment | |
| JPH08146396A (en) | Liquid crystal display device | |
| US10353139B2 (en) | Backlight module and display device | |
| CN106163230B (en) | Display screen module and mobile terminal | |
| CN210401951U (en) | PCB protective layer, backlight module and liquid crystal display device | |
| CN215340605U (en) | Liquid crystal display module with self-heat dissipation function | |
| CN218917852U (en) | Point-bonded-ground display module | |
| CN212544174U (en) | Double-layer PCB optical module | |
| CN210777632U (en) | LED display module | |
| CN214474903U (en) | Heat-conducting, light-shading and electric-conducting backlight module of keyboard | |
| CN219957907U (en) | Light guide plate and backlight module | |
| CN219065942U (en) | Backlight module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |