JPH06166286A - Thermocompression bonding method for memory card and contact bonder - Google Patents

Abstract

PURPOSE:To thermocompression-bond a panel effectively with a frame at a low heating temperature and low pressing force. CONSTITUTION:When a panel 7 is thermocompression-bonded with a frame 5 through a thermocompression bonding means by using thermal adhesives, pressure-sensitive adhesives, etc., only a bonding clearance W to the frame 5 of the outer circumference, etc., of the panel 7 is thermocompression-bonded concentrically by projecting sections 12b, 13b formed to thermocompression bonding plates 12, 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for heating and pressure-bonding a panel to a frame of a memory card used as an external storage device of various electronic devices such as a personal computer, an electronic notebook, a fax, a still camera, an industrial machine and the like. The present invention relates to a crimping machine used for thermocompression bonding.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 11 and 12, a plug-in type memory card 1 has a semiconductor chip such as an IC (hereinafter referred to as an IC) on a circuit board 2 which is a printed board for single-sided or double-sided use. ) 3 and the connector 4 etc. are mounted, and the outer peripheries of the circuit board 2 and the connector 4 are adhered to the frame 5 by the double-sided adhesive tape 6 etc.
The upper and lower surfaces of a pair of upper and lower panels 7 and the like are adhered and sealed by a thermocompression bonding method with a double-sided adhesive tape 8 or the like.

The frame 5 is composed of PBT, PC, AB
The panel 7 is injection-molded with a synthetic resin such as S or modified PPE into a substantially rectangular frame, and the panel 7 is pressed with a metal thin plate such as a stainless thin plate into a substantially rectangular shape. The double-sided adhesive tapes 6 and 8 are formed by impregnating a nonwoven fabric with a heat-sensitive adhesive or a pressure-sensitive adhesive to form a film. And frame 5
Outer peripheral ribs 5a are integrally formed on the upper and lower surfaces of the above, and the pair of upper and lower panels 7 are adhered to the inside of these outer peripheral ribs 5a by thermocompression bonding. A power supply battery 9 is incorporated in the memory card capable of storing data.

Conventionally, this type of memory card 1 has been used.
When a pair of upper and lower panels 7 is thermocompression bonded to both upper and lower surfaces of the frame 5, a crimping machine 11 shown in FIGS. 13 and 11B is used.

This crimping machine 11 has a fixed lower heating crimping plate 12
An air cylinder 14 for vertically moving the upper heating and pressure bonding plate 13 up and down, a heater controller 15 for the upper and lower heating and pressure bonding plates 12 and 13, a pressure bonding timer 16, and a pressure bonding command button 1.
It has 7 etc.

After a pair of upper and lower double-sided adhesive tapes 8 are lightly pressure-bonded to the upper and lower opposed surfaces of the upper and lower panels 7 in advance,
The memory card 1 assembled in a state in which the pair of upper and lower panels 7 are stacked on the upper and lower sides of the frame 5 is placed on the lower heating and pressure bonding plate 12, and the upper heating and pressure bonding plate 13 is lowered by the air cylinder 14 to store the memory. The card 1 is heat-pressed from above and below between the upper and lower thermocompression-bonding plates 12 and 13 (a method of simultaneously heating and pressing) to bond the frame 5 and the pair of upper and lower panels 7.

At this time, not only in the heat-sensitive adhesive but also in the pressure-sensitive adhesive, in order to obtain the fluidity of the adhesive constituent portion and the stable adhesive strength, the heating and pressurization by the upper and lower heating and pressure bonding plates 12 and 13 are simultaneously performed. There is a need to do. Then, the conditions at the time of heating and pressure bonding vary depending on the adhesive, but for example, when a low temperature type epoxy adhesive is used, the heating temperature is 100 ° C.
10 to 6 at ~ 200 ° C and applied pressure of 1 to 5 kg / cm ² .
Thermocompression bonding is performed under the condition of 00 sec.

In the conventional crimping machine 11, the thermocompression-bonding surfaces 12a and 13a of the upper and lower heating and pressure-bonding plates 12 and 13 are entirely formed flat, and the upper and lower heating and pressure-bonding plates 12 and 13 form the entire surface of the pair of upper and lower panels 7. Was heated and pressure bonded.

[0009]

However, as in the conventional method of thermocompression-bonding the entire surfaces of the pair of upper and lower panels 7 with the upper and lower thermocompression-bonding plates 12 and 13, as shown in FIG. 5 requires a step H _{1 for} slightly lowering the outer peripheral ribs 5a on both upper and lower sides than the pair of upper and lower panels 7, and the panel 7 also needs to have sufficient flatness. Strength cannot be obtained. In addition, since the upper and lower thermocompression-bonding plates 12 and 13 come into contact with the outer peripheral ribs 5a during heating and pressure bonding, and the frame 5 is easily heated and deformed, it is necessary to increase the heat resistance of the material of the frame 5. If the frame 5 is filled with glass fiber or the like in order to improve heat resistance, the impact resistance and moldability of the frame 5 are sacrificed.

For example, 30% glass fiber in modified PPE
Table 1 below shows the experimental values comparing the heat resistance and the impact resistance of the filled one and the glass fiber of 0%.

Therefore, conventionally, a low-temperature (100 ° C. to 200 ° C.) type adhesive has been used which can heat and press-bond the panel 7 to the frame 5 at a heating temperature at which the frame 5 is not deformed. Considering the reliability of heat resistance and the like, the frame 5 made of synthetic resin is insufficient, and a frame 5 having higher heat resistance is desired. A frame made of aluminum die-cast is also considered by some, but there is a problem in terms of cost.

Further, in the method of thermocompression bonding the entire surfaces of the pair of upper and lower panels 7, since the heating temperature is dispersed over the entire surface of the panel 7, the heating temperature of the upper and lower thermocompression bonding plates 12 and 13 is set to the heating temperature of the adhesive. 20% to 3 than 100 ° C to 200 ° C
It must be increased by 0%, the frame 5 is likely to be deformed, and the inside of the memory card 1 is heated to a high temperature. Therefore, a secondary battery for backup having low heat resistance is easily broken. There was a problem to say.

If the entire surfaces of the pair of upper and lower panels 7 are heated, it takes a long time for the heat-sensitive adhesive and the pressure-sensitive adhesive to cool and solidify after heating and melting, resulting in low productivity. There was a problem.

Further, in the method of thermocompression bonding the entire surfaces of the pair of upper and lower panels 7, the pressing force is dispersed over the entire surface of the panel 7, so that a high pressing force is required. By the way, the outer diameter of the panel 7 of the memory card 1 is 85.6 × 54.0.
Since it is mm, 8.56 × 5.4 × 5 kg / cm ² ≈2
A high pressing force as high as 30 kg / cm ² was required.

The present invention has been made in order to solve the above-mentioned problems, and is a method for thermocompression-bonding a memory card in which a panel can be effectively thermocompression-bonded to a frame at low heating temperature and pressure. The purpose is to provide a crimping machine.

[0016]

In order to achieve the above-mentioned object, a method for thermocompression bonding a memory card according to the present invention is a method for thermocompression bonding a panel to a frame of a memory card by using a heat-sensitive adhesive or a pressure-sensitive adhesive. In the thermocompression bonding method for a memory card, which is thermocompression bonded by means of the above-mentioned method, only the bonding margin of the panel to the frame is intensively thermocompressed by the thermocompression bonding means. In addition, the memory card crimping machine of the present invention heat-presses the panel to the frame with a thermocompression-bonding plate with a heat-sensitive adhesive or pressure-sensitive adhesive interposed between the frame and the panel of the memory card. In the crimping machine for a memory card described above, a convex portion is formed on the thermocompression-bonding plate so as to intensively heat-compress only the bonding margin of the panel to the frame.

[0017]

The thermocompression bonding method and crimping machine for the memory card of the present invention configured as described above, when the panel is heat-pressed by the thermocompression bonding means using a heat-sensitive adhesive or pressure-sensitive adhesive, By using the thermocompression bonding means such as the protrusions formed on the crimping plate, only the bonding margin to the frame such as the outer periphery of the panel is intensively thermocompression bonded, so that the heating temperature and pressure are not dispersed over the entire panel during thermocompression bonding. The heating temperature and pressure can be concentratedly applied only to the bonding margin of the panel.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method and apparatus for heat-pressing a memory card according to the present invention will be described below with reference to FIGS. It should be noted that the same reference numerals are given to the same structural portions as those in FIGS.

First, the memory card 1 will be described with reference to FIGS. The circuit board 2 has ICs 3 and the like mounted on both upper and lower surfaces, and a connector mounted on one end. Then, two large and small cutouts 21 and 22 are formed in a corner portion of the circuit board 2 opposite to the connector 4, and a secondary battery 23 for backup is mounted in the small cutout 22. .

A connector accommodating portion 24 is formed on one end side of the frame 5, and a primary battery accommodating portion 25 for a power source is formed at a corner portion on the opposite side. A bottom terminal plate 26 and a side terminal plate 27, which are plates, are provided. Then, the battery cartridge 29 accommodating the primary battery 28 is detachably inserted into the primary battery accommodating portion 25 so that the primary battery 28 is brought into contact with both the terminal plates 26, 27. .

Then, when the circuit board 2 is inserted into the frame 5, the connector 4 is fitted in the connector accommodating portion 24, and the important notch 21 is fitted in the outer periphery of the primary battery accommodating portion 25 so that both ends thereof are fitted. The leads of the child plates 26 and 27 are soldered to the circuit board 2. Then, the outer periphery of the circuit board 2 and the like are adhered to the step portion 5b for adhering to the circuit board formed on the inner periphery of the frame 5 with the double-sided adhesive tape 6.

Then, panel bonding steps 5c are formed inside the outer peripheral ribs 5a integrally formed on the upper and lower surfaces of the frame 5, around the primary battery accommodating portion 25 and on the upper and lower surfaces of the connector 4, and the pair of upper and lower panels 7 is formed. A double-sided adhesive tape 8 formed in a film shape by impregnating a non-woven fabric with a heat-sensitive adhesive or a pressure-sensitive adhesive around the outer periphery of the panel bonding step portion 5c.
It is glued by.

Next, the pressurizer 11 will be described with reference to FIGS. As shown in FIGS. 1 to 3, the upper and lower thermocompression bonding plates 1
A pair of upper and lower panel bonding step portions 5 corresponding to a bonding margin W of the panel 7 to the frame 5 are provided on the upper and lower facing surfaces of the panels 2 and 13.
A pair of upper and lower convex portions 1 having substantially the same width as c and the same shape.
2b and 13b are integrally formed, and these protrusions 1
The upper and lower opposing surfaces, which are the tip surfaces of 2b and 13b, are thermocompression bonding surfaces 1.
2a and 13a.

Therefore, after a pair of upper and lower double-sided adhesive tapes 8 are lightly pressure-bonded to the upper and lower opposite surfaces of the upper and lower panels 7 in advance,
The memory card 1 assembled in a state where the pair of upper and lower panels 7 are stacked on the upper and lower sides of the frame 5 is thermocompression-bonded from above and below between the upper and lower thermocompression-bonding plates 12 and 13 to form the panel-bonding step 5c of the frame 5. When adhering the outer periphery of the panel 7 and the like to each other, the convex portions 12b and 13b of the upper and lower heating and pressure bonding plates 12 and 13 intensively heat only the adhesive margin W of the pair of upper and lower panels 7 inside the outer peripheral rib 5a of the frame 5. Can be crimped.

At this time, as shown in FIG. 3, while the frame 5 is positioned by the positioning member 31, the frame 5 is heat-pressed with high precision. The positioning member 31 is preferably made of, for example, thermosetting resin or silicone resin.

Therefore, according to the crimping machine 11, since the upper and lower heating and crimping machines 12, 13 intensively heat and press only the bonding margin W necessary for the thermocompression bonding of the panel 7, the pressing force is about 230 kg / Bonding can be performed with a pressure force lower than about 1/10 of cm ² .

Further, the convex portion 1 of the upper and lower heating and pressure bonding plates 12 and 13
2b and 13b heat and pressure-bond a pair of upper and lower panels 7 inside the outer peripheral rib 5a of the frame 5, so that the height H ₂ of the outer peripheral rib 5a is set slightly higher than the upper and lower surfaces of the panel 7 so that the height H If it is within ₂ , even if the flatness of the panel 7 is slightly poor, the quality is little affected and the panel 7 can be stably bonded to the frame 5, so that the high quality memory card 1 can be obtained.

Further, since the outer peripheral ribs 5a of the frame 5 are not directly subjected to the temperature at the time of thermocompression bonding, the deformation of the frame 5 is small, the material of the frame 5 is inexpensive, and the one having high impact resistance can be freely selected. Therefore, the cost can be reduced.

Further, the upper and lower heating and pressure bonding plates 12 and 13 are provided with the convex portion 1.
Since only the bonding margin W is intensively thermocompression-bonded by 2b and 13b, sufficient thermocompression bonding is possible even at a low heating temperature and a low pressurizing force (low crimping thrust), and the air cylinder 14 crimps the upper thermocompression bonding plate 13. Since the thrust force can be reduced, the crimping machine 11 can be manufactured at a low price.

Further, since the heat-sensitive adhesive and the pressure-sensitive adhesive of the double-sided adhesive tape 8 are cooled and solidified after being heated and melted, only the bonding margin W of the panel 7 is intensively heated by the convex portions 12b and 13b. Therefore, the heating temperature is not applied to the entire panel 7, and the cooling time after heating the panel 7 is very short. Therefore, the time until the heat-sensitive adhesive or the pressure-sensitive adhesive is sufficiently cooled and solidified after heating and melting can be greatly shortened,
Productivity can be improved.

Next, a modified example will be described. First, the convex portion 12
The thermocompression bonding surfaces 12a and 13a of b and 13b are shown in FIG.
Although it may be a flat surface as shown in FIG. 4, thermal efficiency can be improved by forming a groove 31 in the center as shown in FIG.

Next, as shown in (A) and (B) of FIG.
Between the heating plate 33 having the heater 32 of the upper and lower heating pressure bonding plates 12 and 13 and the pressure bonding plate 34 having the convex portions 12b and 13b, an elastic body such as a spring 35 and a silicone rubber 36 is interposed, As shown in C), the heating plate 33
By using an elastic body such as a rubber heater 37 for the heating method of (1), it is possible to average the pressure bonding of the upper and lower panels 7 to the frame 5 (improve the followability), so that the panel 7 can be stably bonded to the frame 5. Therefore, the quality of the memory card 1 can be improved.

Next, as shown in (A) and (B) of FIG.
By attaching a Teflon coating 38 or a Teflon sheet 39 to the thermocompression bonding surfaces 12a, 13a which are the tip surfaces of the convex portions 12b, 13b of the upper and lower thermocompression bonding plates 12, 13a, these thermocompression bonding surfaces 12a, 13a have low friction. If it is formed of a member, the printing surface 7a of the panel 7 shown in FIG.
Can be prevented and the quality of the memory card 1 can be improved. In addition, the life of the protrusions 12b and 13b can be improved. At this time, the entire convex portions 12b and 13b may be formed of a low friction member such as Teflon material.

Next, as shown in FIG. 6C, the lower heat-bonding plate 12 (or the upper heat-bonding plate 13) is pivoted to the pivot receiver 40.
If it is supported so that it can be swung, the panel 7 can be stably bonded to the frame 5.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made based on the technical idea of the present invention.

[0036]

EFFECTS OF THE INVENTION The heat-pressing method and pressure-bonding machine for a memory card of the present invention configured as described above have the following effects.

According to the first and second aspects, when the panel is thermocompression-bonded to the frame by using the thermocompression bonding agent or the pressure-sensitive adhesive, the panel is bonded by the thermocompression bonding means such as the convex portion formed on the thermocompression bonding plate. The heating temperature and pressure are not dispersed over the entire surface of the panel during thermocompression bonding, but the heating temperature and pressure are concentrated only on the panel's bonding margin. Since the panel can be added to the frame, the panel can be heated and pressure-bonded to the frame at a low heating temperature and a low pressure (low pressure force), and the productivity of the memory card can be improved.

According to the first and second aspects, the panel can be thermocompression-bonded to the frame at a low heating temperature, so that the frame is less likely to be deformed by heating and the selection range of the frame material can be expanded.

According to the second aspect of the present invention, since the panel can be heated and pressure-bonded to the frame with a low pressure, the pressure-bonding thrust of the heat-pressure bonding plate can be reduced, and the pressure-bonding machine can be manufactured at a low cost.

According to the second aspect of the present invention, since only the margin for adhesion to the frame such as the outer periphery of the panel can be intensively thermocompression-bonded by the convex portion of the thermocompression-bonding plate, sufficient adhesion strength can be obtained even if the flatness of the panel varies slightly. Therefore, a high quality memory card can be manufactured.

According to the third aspect, since the elastic body is interposed between the heating plate and the pressure bonding plate of the heating pressure bonding plate, the panel can be stably bonded to the frame, and the quality of the memory card can be improved.

According to the fourth aspect of the present invention, since at least the tip surface of the thermocompression bonding plate is formed of a low friction member, it is possible to prevent the printed surface of the panel from being scratched during the thermocompression bonding of the panel to the frame, and to provide a high quality memory card. Can be manufactured.

According to the fifth aspect of the present invention, at least one of the pair of upper and lower thermocompression bonding plates is supported so that it can be swung, so that the panel can be stably bonded to the frame and the quality of the memory card can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional side view of essential parts for explaining a method and a pressure bonding machine for a memory card according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a convex portion of a thermocompression bonding plate of the pressure bonding machine.

FIG. 3 is a sectional side view showing a thermocompression bonding process of the pressure bonding machine.

FIG. 4 is a schematic side view showing a modified example of the convex portion of the thermocompression bonding plate.

FIG. 5 is a side view showing a modified example of the thermocompression bonding plate.

FIG. 6 is a side view showing a modified example of the thermocompression bonding plate.

FIG. 7 is a perspective view showing a memory card manufactured according to the present invention.

FIG. 8 is an exploded perspective view showing a circuit board and a frame of the above memory card.

FIG. 9 is an exploded perspective view showing a frame and a panel of the above memory card.

10 (A) is a sectional side view taken along the line AA of FIG. 7, and FIG. 10 (B) is a sectional side view taken along the line BB of FIG.

11 (A) is a perspective view of a memory card manufactured by a conventional method, and FIG. 11 (B) is a cross-sectional view for explaining thermocompression bonding of a panel to a frame by a conventional thermocompression bonding plate. It is a side view.

FIG. 12 is an exploded perspective view of a memory card manufactured by a conventional method.

FIG. 13 is a front view showing the entire crimping machine.

[Explanation of symbols]

 1 Memory Card 5 Frame 5a Outer Rib 5c Panel Adhesive Step 7 Panel 8 Double Sided Adhesive Tape (Heat Sensitive Adhesive or Pressure Sensitive Adhesive) 11 Crimping Machine 12, 13 Heat Crimping Plate (Heat Crimping Means) 12a, 13a Heat Crimping Surface 12b, 13b Convex portion 33 Heating plate 34 Crimping plate 36 Silicon rubber (elastic body) 37 Rubber heater (elastic body) 38 Teflon coating (low friction member) 39 Teflon sheet (low friction member) 40 Pivot receiver (support for swinging movement) Material) W Adhesion allowance

Claims (5)

[Claims] 1. A thermocompression bonding method for a memory card, wherein a panel is bonded to a frame of a memory card by a thermocompression bonding means using a heat-sensitive adhesive or a pressure-sensitive adhesive. A thermocompression bonding method for a memory card, which is characterized by intensively thermobonding only the bonding margin. 2. A memory card crimping machine for thermocompression-bonding the panel to the frame with a thermocompression-bonding plate, with a heat-sensitive adhesive, a pressure-sensitive adhesive or the like interposed between the frame and the panel of the memory card. A crimping machine for a memory card, characterized in that the thermocompression-bonding plate is provided with a convex portion for intensively thermocompression-bonding only the bonding margin of the panel to the frame. 3. A crimping machine for a memory card according to claim 2, wherein an elastic body is interposed between the heating plate and the crimping plate of the thermocompression-bonding plate. 4. A crimping machine for a memory card according to claim 2, wherein at least a tip end surface of the convex portion of the thermocompression-bonding plate is formed of a low friction member. 5. The pressure bonding machine for a memory card according to claim 1, wherein at least one of the pair of upper and lower heating and pressure bonding plates is supported so as to be able to swing.