JP2005116990A5 - - Google Patents

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Publication number
JP2005116990A5
JP2005116990A5 JP2003353007A JP2003353007A JP2005116990A5 JP 2005116990 A5 JP2005116990 A5 JP 2005116990A5 JP 2003353007 A JP2003353007 A JP 2003353007A JP 2003353007 A JP2003353007 A JP 2003353007A JP 2005116990 A5 JP2005116990 A5 JP 2005116990A5
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JP
Japan
Prior art keywords
light emitting
emitting element
metal base
base portion
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003353007A
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Japanese (ja)
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JP4254470B2 (en
JP2005116990A (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2003353007A external-priority patent/JP4254470B2/en
Priority to JP2003353007A priority Critical patent/JP4254470B2/en
Priority to US10/891,422 priority patent/US7391153B2/en
Priority to DE102004034166.4A priority patent/DE102004034166B4/en
Priority to DE102004063978.7A priority patent/DE102004063978B4/en
Priority to CN2009100096747A priority patent/CN101476710B/en
Priority to CNB2004100712619A priority patent/CN100472820C/en
Publication of JP2005116990A publication Critical patent/JP2005116990A/en
Publication of JP2005116990A5 publication Critical patent/JP2005116990A5/ja
Publication of JP4254470B2 publication Critical patent/JP4254470B2/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (6)

発光素子と、
一方の端部が前記発光素子に電気接続されると共に、前記発光素子に電源を供給するための端子として機能するリードと、
前記発光素子が搭載されると共に、前記発光素子の熱を放熱する金属ベース部と、
前記発光素子を覆う透光性の樹脂又はガラスによる封止部材とを備え、
前記リードは、金属板材からなり、前記金属ベース部にガラス材からなる耐熱性絶縁性部材によって保持されていることを特徴とする発光装置。 A light emitting element;
One end is electrically connected to the light emitting element, and the lead functions as a terminal for supplying power to the light emitting element.
The light emitting element is mounted, and a metal base portion that dissipates heat of the light emitting element;
A sealing member made of translucent resin or glass covering the light emitting element,
The lead is made of a metal plate material, and is held by the heat-resistant insulating member made of a glass material on the metal base portion. 発光素子と、
一方の端部が前記発光素子に電気接続されると共に、前記発光素子に電源を供給するための端子として機能するリードと、
前記発光素子が搭載されると共に、前記発光素子の熱を放熱する金属ベース部と、
前記発光素子を覆う透光性の樹脂又はガラスによる封止部材とを備え、
前記リードは、前記金属ベース部にセラミックス材からなる耐熱性絶縁性部材によって保持され、前記セラミックス材に形成された金属パターンであることを特徴とする発光装置。 A light emitting element;
One end is electrically connected to the light emitting element, and the lead functions as a terminal for supplying power to the light emitting element.
The light emitting element is mounted, and a metal base portion that dissipates heat of the light emitting element;
A sealing member made of translucent resin or glass covering the light emitting element,
2. The light emitting device according to claim 1, wherein the lead is a metal pattern formed on the ceramic material and held by the heat resistant insulating member made of a ceramic material on the metal base portion. 前記発光素子と前記リードとの接続を電極又は配線層を介して行うサブマウントを有し、
前記発光素子は、前記サブマウントを介して、前記金属ベース部に搭載されていることを特徴とする請求項１又は２に記載の発光装置。 A submount for connecting the light emitting element and the lead via an electrode or a wiring layer;
The light emitting device, through the sub-mount, light-emitting device according to claim 1 or 2, characterized in that it is mounted on the metal base portion. 前記金属ベース部に重なるように接合され又は前記金属ベース部に一体加工された金属製の反射鏡部を有することを特徴とする請求項１から３のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 3, characterized in that it has the metal base section are joined so as to overlap or the metal base portion integrally machined metallic reflector portion. 前記金属ベース部あるいは前記反射鏡部の少なくとも一方に、放熱フィンが形成されていることを特徴とする請求項１から４のいずれかに記載の発光装置。 The light emitting device according to any one of claims 1 to 4 , wherein a heat radiating fin is formed on at least one of the metal base portion or the reflecting mirror portion. 前記金属ベース部は、シート状のヒートシンクが装着されていることを特徴とする請求項１から４のいずれかに記載の発光装置。 The metal base portion, the light emitting device according to claim 1, sheet-like heat sink is characterized in that it is mounted 4.
JP2003353007A 2003-07-17 2003-10-10 Light emitting device Expired - Fee Related JP4254470B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003353007A JP4254470B2 (en) 2003-10-10 2003-10-10 Light emitting device
US10/891,422 US7391153B2 (en) 2003-07-17 2004-07-15 Light emitting device provided with a submount assembly for improved thermal dissipation
DE102004034166.4A DE102004034166B4 (en) 2003-07-17 2004-07-15 Light-emitting device
DE102004063978.7A DE102004063978B4 (en) 2003-07-17 2004-07-15 Light-emitting device
CN2009100096747A CN101476710B (en) 2003-07-17 2004-07-16 Illuminating device and its manufacture method
CNB2004100712619A CN100472820C (en) 2003-07-17 2004-07-16 Illuminating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003353007A JP4254470B2 (en) 2003-10-10 2003-10-10 Light emitting device

Publications (3)

Publication Number Publication Date
JP2005116990A JP2005116990A (en) 2005-04-28
JP2005116990A5 true JP2005116990A5 (en) 2007-09-13
JP4254470B2 JP4254470B2 (en) 2009-04-15

Family

ID=34543709

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003353007A Expired - Fee Related JP4254470B2 (en) 2003-07-17 2003-10-10 Light emitting device

Country Status (1)

Country Link
JP (1) JP4254470B2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4124129B2 (en) * 2004-01-23 2008-07-23 セイコーエプソン株式会社 Light source device and projector
KR100688626B1 (en) * 2005-05-07 2007-03-02 아로 주식회사 Light emitting diode package and back light unit using it
KR100601891B1 (en) * 2005-08-04 2006-07-19 삼성전자주식회사 Led package structure and manufacturing method
WO2007088584A1 (en) 2006-01-31 2007-08-09 Fujitsu Limited Optical module and method for manufacturing same
JP2007227489A (en) * 2006-02-22 2007-09-06 Matsushita Electric Ind Co Ltd Heat dissipation substrate, its production method and light emitting module employing it
KR101210090B1 (en) * 2006-03-03 2012-12-07 엘지이노텍 주식회사 Metal core printed circuit board and light-emitting diode packaging method thereof
TWI314366B (en) * 2006-04-28 2009-09-01 Delta Electronics Inc Light emitting apparatus
US20080049445A1 (en) * 2006-08-25 2008-02-28 Philips Lumileds Lighting Company, Llc Backlight Using High-Powered Corner LED
EP2077420A1 (en) * 2006-10-10 2009-07-08 NeoBulb Technologies, Inc. A semiconductor light-emitting module
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
JP5188120B2 (en) 2007-08-10 2013-04-24 新光電気工業株式会社 Semiconductor device
DE102008021435A1 (en) * 2008-04-29 2009-11-19 Schott Ag Housing for LEDs with high performance
KR101018119B1 (en) * 2008-09-04 2011-02-25 삼성엘이디 주식회사 LED package
JP5645392B2 (en) * 2009-11-30 2014-12-24 京セラ株式会社 Parts for photoelectric conversion device and photoelectric conversion device
KR101157530B1 (en) * 2009-12-16 2012-06-22 인탑스엘이디 주식회사 LED Package And the Method for producing The same
JP6205894B2 (en) * 2012-07-04 2017-10-04 日亜化学工業株式会社 Package molded body for light emitting device and light emitting device using the same
KR102157065B1 (en) * 2014-03-25 2020-09-17 엘지이노텍 주식회사 Light emitting device package
JP6477734B2 (en) * 2016-06-30 2019-03-06 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

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