JP2005108709A5 - - Google Patents

Download PDF

Info

Publication number
JP2005108709A5
JP2005108709A5 JP2003342196A JP2003342196A JP2005108709A5 JP 2005108709 A5 JP2005108709 A5 JP 2005108709A5 JP 2003342196 A JP2003342196 A JP 2003342196A JP 2003342196 A JP2003342196 A JP 2003342196A JP 2005108709 A5 JP2005108709 A5 JP 2005108709A5
Authority
JP
Japan
Prior art keywords
plasma
electrodes
processed
exposed
processing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003342196A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005108709A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003342196A priority Critical patent/JP2005108709A/ja
Priority claimed from JP2003342196A external-priority patent/JP2005108709A/ja
Publication of JP2005108709A publication Critical patent/JP2005108709A/ja
Publication of JP2005108709A5 publication Critical patent/JP2005108709A5/ja
Pending legal-status Critical Current

Links

JP2003342196A 2003-09-30 2003-09-30 プラズマ処理方法及びプラズマ処理装置 Pending JP2005108709A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003342196A JP2005108709A (ja) 2003-09-30 2003-09-30 プラズマ処理方法及びプラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003342196A JP2005108709A (ja) 2003-09-30 2003-09-30 プラズマ処理方法及びプラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2005108709A JP2005108709A (ja) 2005-04-21
JP2005108709A5 true JP2005108709A5 (cg-RX-API-DMAC7.html) 2005-07-14

Family

ID=34536561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003342196A Pending JP2005108709A (ja) 2003-09-30 2003-09-30 プラズマ処理方法及びプラズマ処理装置

Country Status (1)

Country Link
JP (1) JP2005108709A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5103738B2 (ja) * 2006-01-12 2012-12-19 パナソニック株式会社 大気圧プラズマ処理方法及び装置
JP5143498B2 (ja) * 2006-10-06 2013-02-13 東京エレクトロン株式会社 基板処理方法、基板処理装置、プログラムならびに記録媒体
JP4733615B2 (ja) * 2006-10-31 2011-07-27 積水化学工業株式会社 プラズマ処理方法および処理装置
JP5870794B2 (ja) * 2012-03-21 2016-03-01 セイコーエプソン株式会社 画像記録装置、画像記録方法

Similar Documents

Publication Publication Date Title
JP2002289583A5 (cg-RX-API-DMAC7.html)
JP2002280378A5 (cg-RX-API-DMAC7.html)
DE60215171D1 (de) Vorrichtung zum massieren von produkten
JP2012138500A5 (cg-RX-API-DMAC7.html)
WO2008123288A1 (ja) トラップ装置、排気系及びこれを用いた処理システム
EA200701008A1 (ru) Плазменная система
TW200636847A (en) Substrate processing method, substrate processing apparatus and controlling program
TWI315389B (en) Dehydration drying method and apparatus, and substrate processing apparatus
ATE334235T1 (de) Verfahren zum plasmareinigen von mit einer organischen substanz beschichteten materialoberflächen und vorrichtung dafür
TW368699B (en) Manufacturing method for semiconductor device and manufacturing device for semiconductor
JP2005108709A5 (cg-RX-API-DMAC7.html)
WO2004021409A3 (en) A method and system to enhance the removal of high-k-dielectric materials
WO2005033376A3 (en) Plating method and apparatus
JP2010531043A5 (cg-RX-API-DMAC7.html)
JP2006147654A5 (cg-RX-API-DMAC7.html)
JP2003347284A5 (cg-RX-API-DMAC7.html)
JP2005243988A5 (cg-RX-API-DMAC7.html)
JP2003124198A5 (cg-RX-API-DMAC7.html)
JP2002231608A5 (cg-RX-API-DMAC7.html)
JP2005085586A5 (cg-RX-API-DMAC7.html)
JP5940215B2 (ja) 粉末プラズマ処理装置
JPH044008B2 (cg-RX-API-DMAC7.html)
JPH0467776B2 (cg-RX-API-DMAC7.html)
TWI670382B (zh) 基板處理裝置及基板處理方法
JP2006231150A5 (cg-RX-API-DMAC7.html)