JP2005105184A - Epoxy resin composition for encapsulation of media card and media card system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a media card system having excellent fall-proofness resistant to the cracking and chipping by falling. <P>SOLUTION: An organic substrate and a semiconductor device mounted on the organic substrate are integrally encapsulated with an epoxy resin composition containing an epoxy resin, a curing agent, a cure accelerator and an inorganic filler as essential components, containing the inorganic filler in an amount of 20-80 wt.% in the total epoxy resin composition, preferably containing a phenol aralkyl epoxy resin having a biphenylene skeleton as the epoxy resin and more preferably an epoxy resin composition containing a phenol aralkyl resin having a biphenylene skeleton as the curing agent. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an epoxy resin composition for sealing a media card and a media card system used for manufacturing a media card system that is a recording medium for electronic information.

2. Description of the Related Art Conventionally, a media card system serving as a recording medium for electronic information is manufactured by covering an organic substrate on which a semiconductor device is mounted in a hollow state with a pre-molded plastic cap.
However, since the organic substrate is covered with a hollow, the strength is inferior, and problems due to complicated manufacturing processes cannot be solved.
From the viewpoint of protecting the media card from the external environment, a technique for preventing scratches when the media card is inserted into the card folder is disclosed (for example, see Patent Document 1). It was not sufficient in terms of preventing damage to the card itself when the card was dropped.
There is a need for manufacturing methods and materials that can solve these problems.

JP 2002-37982 A (pages 1 to 5)

  The present invention has been made in order to solve the above-described conventional problems. The object of the present invention is to have excellent drop resistance such that cracks and chips do not occur even when the media card system is dropped. An epoxy resin composition and a media card system manufactured using the same are provided.

［３］ 上記硬化剤として一般式（２）で表されるフェノール樹脂硬化剤を含む第［１］又は［２］項記載のメディアカード封止用エポキシ樹脂組成物、

［４］ 第［１］乃至［３］項記載のいずれかに記載のエポキシ樹脂組成物を用いて有機基板及び有機基板に搭載された半導体装置を一体封止してなることを特徴とするメディアカードシステム、
である。 The present invention
[1] An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler as essential components, wherein the inorganic filler is a total epoxy resin composition. An epoxy resin composition for sealing a media card, comprising 20 to 80% by weight in a product, wherein the epoxy resin composition integrally seals an organic substrate and a semiconductor device mounted on the organic substrate,
[2] The epoxy resin composition for sealing a media card according to item [1], including an epoxy resin represented by the general formula (1) as the epoxy resin,

[3] The epoxy resin composition for sealing a media card according to [1] or [2], which contains a phenol resin curing agent represented by the general formula (2) as the curing agent,

[4] A medium characterized by integrally sealing an organic substrate and a semiconductor device mounted on the organic substrate using the epoxy resin composition according to any one of [1] to [3]. Card system,
It is.

  According to the method of the present invention, it is possible to obtain a media card system having excellent drop resistance in which cracks and chips do not occur even when the media card system is dropped, and also in the manufacturing process of the media card system Since it can be simplified, it is suitable as an industrial media card system manufacturing method.

The present invention focuses on the structural defects of the media card system itself and the elastic modulus of the sealing material that varies depending on the amount of inorganic filler, and suppresses locally applied stress when the media card system is dropped. It is made based on the knowledge that it can be made, and includes an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components, and the inorganic filler is contained in the entire epoxy resin composition in an amount of 20 to 80% by weight. The epoxy resin composition preferably includes a phenol aralkyl type epoxy resin having a biphenylene skeleton as an epoxy resin, and more preferably an epoxy resin composition including a phenol aralkyl resin having a biphenylene skeleton as a curing agent. Even if the media card system is dropped by sealing the semiconductor device integrally, cracks and chips It is possible to obtain a media card system having excellent drop resistance that does not occur, and furthermore, by introducing this resin system, it is possible to simultaneously obtain the flame retardancy desired as a molding material, and manufacture of the media card system It has been found that the process can be simplified.
Hereinafter, the present invention will be described in detail.

The epoxy resin used in the present invention refers to monomers, oligomers, and polymers in general having two or more epoxy groups in one molecule, and the molecular weight and molecular structure are not particularly limited. For example, phenylene and / or biphenylene Aralkyl epoxy resin having skeleton, biphenyl epoxy resin, bisphenol epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol epoxy resin, naphthalene epoxy resin, dicyclopentadiene modified phenol epoxy resin, alkyl Examples thereof include modified triphenol methane type epoxy resin, triazine nucleus-containing epoxy resin and the like.
Among them, a phenol aralkyl type epoxy resin having a long phenylene and / or biphenylene skeleton having a long toughness between cross-linking points is very effective for a drop test, and an aralkyl type epoxy resin having a biphenylene skeleton is a More preferred.
Moreover, in order to improve the moisture resistance of the resin composition, it is desirable that impurity ions such as Cl ions and Na ions are as few as possible, and an epoxy equivalent of 150 to 300 g / eq is desirable from the viewpoint of curability. .

  Examples of the curing agent used in the present invention include phenolic, amine-based, polyaminoamide-based, and acid anhydride-based types, and their molecular structures are not particularly limited. For example, phenolic novolak resins and cresols are used for phenol-based curing agents. Novolak resin, dicyclopentadiene modified phenol resin, phenol aralkyl resin having phenylene and / or biphenylene skeleton, triphenol methane resin, terpene modified phenol resin, triphenol methane type phenol resin, etc., amine type aliphatic diamine, polyamine, aromatic Aliphatic, alicyclic, and aromatic types are included in acid anhydrides such as aromatic diamines and polyamines. A phenol aralkyl resin having a biphenylene skeleton is desirable from the viewpoint of the drop strength and flame retardancy.

  The hardening accelerator used for this invention should just accelerate | stimulate reaction of an epoxy resin and a hardening | curing agent, and what is generally used for the sealing material can be utilized. For example, there are diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof, organic phosphines such as triphenylphosphine, imidazole compounds such as 2-methylimidazole, and the like. However, they may be mixed and used.

Examples of the inorganic filler used in the present invention include fused silica, crystalline silica, alumina, silicon nitride, and the like, and spherical fused silica is preferred from the viewpoint of fluidity and low shrinkage.
The present invention is characterized in that an inorganic filler is contained in the entire epoxy resin composition in an amount of 20 to 80% by weight, preferably 40 to 80% by weight, more preferably 45 to 80% by weight. When the amount of the inorganic filler is less than the lower limit, the shrinkage rate of the entire cured product becomes large, and the warp amount of the media card system cannot be suppressed. In addition, if the amount of the inorganic filler exceeds the above upper limit, not only the elastic modulus of the epoxy resin composition becomes high and the drop resistance cannot be secured, but also the viscosity becomes high, causing a shift of the substrate at the time of molding, resulting in poor molding appearance. Become.

The epoxy resin composition of the present invention essentially comprises the components (A) to (D). In addition to these, a silane coupling agent, a flame retardant, a flame retardant aid, a release agent, a silicone-based Various additives such as a synthetic rubber-based low stress agent, a coloring agent, and the like may be appropriately blended.
The epoxy resin composition of the present invention can be produced by, for example, mixing the components (A) to (D) and other additives with a mixer, etc., further melt-kneading with a hot roll or kneader, etc., cooling and pulverizing. Good.

  The present invention is characterized by integrally sealing an organic substrate and a semiconductor device mounted on the organic substrate using the epoxy resin composition described above. In order to manufacture a media card system by integrally sealing an organic substrate and a semiconductor device mounted on the organic substrate using the epoxy resin composition of the present invention, a conventional molding method such as transfer molding, compression molding, injection molding, etc. Then, it may be cured and molded. According to the method of the present invention, since an organic substrate and a semiconductor device mounted on the organic substrate can be integrally sealed with an epoxy resin composition at a time, a semiconductor element, which is a conventional manufacturing method, is sealed with an epoxy resin composition. Such a semiconductor device mounted on an organic substrate is put in a cap and has an advantage that a complicated process such as fixing with an adhesive or the like can be eliminated.

Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited thereto. The blending ratio is parts by weight.
Example 1

Epoxy resin 1: phenol aralkyl type epoxy resin having a biphenylene skeleton represented by the formula (1) (softening point: 58 ° C., epoxy equivalent: 272 g / eq) 100 parts by weight

Phenol resin 1: phenol aralkyl resin having a biphenylene skeleton represented by the formula (2) (softening point 65 ° C., epoxy equivalent 200 g / eq) 70 parts by weight

1,8-diazabicyclo (5,4,0) undecene-7 (hereinafter referred to as DBU)
2 parts by weight Fused silica powder (average particle size 20 μm) 200 parts by weight Carnauba wax 3 parts by weight are mixed at room temperature with a mixer, kneaded at 80 to 110 ° C. with a twin-screw kneader, cooled and pulverized to obtain an epoxy resin composition. Obtained. The evaluation results are shown in Table 1.

Evaluation Method Spiral Flow: Using a mold according to EMMI-1-66, the resin composition was transferred using a transfer molding machine under conditions of a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a holding time of 120 seconds. Molding and measuring the spiral flow. The unit is cm. As an index of fluidity, 120 cm or more was regarded as acceptable.
Drop resistance: Media card (media card system size 20 mm) using the obtained resin composition on a low-pressure transfer molding machine under conditions of a mold temperature of 180 ° C., an injection pressure of 9.8 MPa, and a curing time of 90 seconds. × 31 mm × thickness 1.6 mm) was integrally sealed. The obtained molded product of the media card system was dropped 20 times per sample from a height of 1.8 m, and occurrence of resin cracks, chips, etc. was confirmed with a stereomicroscope. The material of the floor to be dropped was tiled with linoleum. Those with cracks or chips in the appearance inspection were regarded as defective. The test was carried out with n = 20, and the defect 0 was regarded as acceptable.
Warpage: For a molded product of the media card system obtained by integrally sealing and molding the media card in the same manner as the drop resistance test, the amount of warpage between both ends in the long side direction is measured with a contact type surface roughness meter. Measurements were made. The unit is mm. The amount of warpage exceeding 1 mm, which is difficult to correct in the post-correction work, was rejected.
Shift: For a media card system molded product obtained by integrally molding a media card in the same manner as the drop resistance test, cut the cross section and measure how much the board moved with respect to the design value with both ends of the board being measured. It was measured. The unit is μm. As for the pass / fail of the shift amount, an absolute value of 100 μm or less was accepted. Here, the shift amount refers to the moving distance from the design position of the organic substrate.
Flame retardancy: Using a low-pressure transfer molding machine, a test piece having a length of 127 mm, a width of 12.7 mm, and a thickness of 1.6 mm was obtained under the conditions of a mold temperature of 175 ° C., an injection pressure of 9.8 MPa, and a curing time of 120 seconds. After being molded and subjected to a heat treatment at 175 ° C. for 8 hours as a post cure, it was humidified for 48 hours in an environment of 23 ° C. and a relative humidity of 50%, and a flame retardancy test was performed according to UL-94.

Examples 2-6, Comparative Examples 1-6
It compounded according to prescription of Table 1 and Table 2, and obtained the resin composition like Example 1, and evaluated similarly. The evaluation results are shown in Tables 1 and 2.
The components used in other than Example 1 are shown below.
Epoxy resin 2: biphenyl type epoxy resin (manufactured by Japan Epoxy Resin, YX4000, melting point 105 ° C., epoxy equivalent 190 g / eq)
Epoxy resin 3: dicyclopentadiene-modified phenol type epoxy resin (manufactured by Dainippon Ink and Chemicals, HP7200, softening point 60 ° C., epoxy equivalent 263 g / eq)
Phenol resin 2: Phenol aralkyl resin having a phenylene skeleton (Mitsui Chemicals, XL225LL, softening point 75 ° C., hydroxyl group equivalent 175 g / eq)
Phenol resin 3: Phenol novolac resin (Mitsui Chemicals, VR9305, softening point 80 ° C., epoxy equivalent 104 g / eq)
Triphenylphosphine brominated epoxy resin (bromine content 49%, softening point 70 ° C., epoxy equivalent 360 g / eq)
Antimony trioxide carbon black

INDUSTRIAL APPLICATION This invention can be conveniently used as an epoxy resin composition for media card sealing used for manufacture of the media card system used as a recording medium of electronic information, and a media card system. The range of use extends to many industrial and consumer products as recording media for many electronic device products such as digital cameras, mobile phones and personal computers. In addition, the production method does not require a long process of assembling an IC package, mounting it on a base board, and finally stacking the conventional case-shaped molded products, making it easy to package products in a short process. There is an advantage that it can be manufactured.

Claims (4)

An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler as essential components, wherein the inorganic filler is contained in the entire epoxy resin composition. An epoxy resin composition for sealing a media card, comprising 20 to 80% by weight, wherein the epoxy resin composition integrally seals an organic substrate and a semiconductor device mounted on the organic substrate. The epoxy resin composition for media card sealing of Claim 1 containing the epoxy resin represented by General formula (1) as said epoxy resin.

(In the formula, m is an integer of 0 to 4.) The epoxy resin composition for media card sealing of Claim 1 or 2 containing the phenol resin hardening | curing agent represented by General formula (2) as said hardening | curing agent.

(In the formula, m is an integer of 0 to 4.) A media card system comprising an organic substrate and a semiconductor device mounted on the organic substrate integrally sealed using the epoxy resin composition according to any one of claims 1 to 3.