JP2005101660A - 発光ダイオードランプ - Google Patents
発光ダイオードランプ Download PDFInfo
- Publication number
- JP2005101660A JP2005101660A JP2004373133A JP2004373133A JP2005101660A JP 2005101660 A JP2005101660 A JP 2005101660A JP 2004373133 A JP2004373133 A JP 2004373133A JP 2004373133 A JP2004373133 A JP 2004373133A JP 2005101660 A JP2005101660 A JP 2005101660A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- blue light
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】 複数の色を混色して白色光を得るようにした発光ダイオードランプにおいて、青色発光ダイオードと黄色発光ダイオードが発する青色光と黄色光を混色して白色光を得るようにするとともに、前記青色発光ダイオードは、一方の面に陽極と陰極の両方の電極を有し、前記両電極が前記青色発光ダイオードの下側に位置する導電パターンと対面するように前記両電極を下に向けて配置したことを特徴とする。
【選択図】 図3
Description
5、34、59 絶縁台
6、7、35、36 導電パターン
11、40、59 青色発光ダイオード
18、48 黄色発光ダイオード
32 透光性樹脂
Claims (3)
- 青色発光ダイオードと黄色発光ダイオードを透光性樹脂で覆い、前記各発光ダイオードが発する青色光と黄色光を混色して白色光を得ることを特徴とする発光ダイオードランプ。
- 青色発光ダイオードと黄色発光ダイオードは、共通の絶縁台上に配置したことを特徴とする請求項1記載の発光ダイオードランプ。
- 前記青色発光ダイオードは、一方の面に陽極と陰極の両方の電極を有し、前記両電極が前記絶縁台の表面に位置する導電パターンと対面するように前記両電極を下に向けて配置したことを特徴とする請求項2記載の発光ダイオードランプ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373133A JP2005101660A (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004373133A JP2005101660A (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP06188393A Division JP3649748B2 (ja) | 1993-03-22 | 1993-03-22 | 発光ダイオードランプ |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2005101660A true JP2005101660A (ja) | 2005-04-14 |
Family
ID=34464577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004373133A Pending JP2005101660A (ja) | 2004-12-24 | 2004-12-24 | 発光ダイオードランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2005101660A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7868332B2 (en) | 2005-11-10 | 2011-01-11 | Samsung Electronics Co., Ltd. | High luminance light emitting diode and liquid crystal display device using the same |
US9155157B2 (en) | 2006-08-14 | 2015-10-06 | Koninklijke Philips N.V. | Electroluminescent device having a variable color point |
US9991237B2 (en) | 2014-09-19 | 2018-06-05 | Nichia Corporation | Light emitting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62178551U (ja) * | 1986-04-30 | 1987-11-12 | ||
JPH01137655A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 光デバイス |
JPH01268074A (ja) * | 1988-04-20 | 1989-10-25 | Hitachi Ltd | 光電子装置 |
JPH02118959U (ja) * | 1989-03-10 | 1990-09-25 |
-
2004
- 2004-12-24 JP JP2004373133A patent/JP2005101660A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62178551U (ja) * | 1986-04-30 | 1987-11-12 | ||
JPH01137655A (ja) * | 1987-11-25 | 1989-05-30 | Hitachi Ltd | 光デバイス |
JPH01268074A (ja) * | 1988-04-20 | 1989-10-25 | Hitachi Ltd | 光電子装置 |
JPH02118959U (ja) * | 1989-03-10 | 1990-09-25 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7868332B2 (en) | 2005-11-10 | 2011-01-11 | Samsung Electronics Co., Ltd. | High luminance light emitting diode and liquid crystal display device using the same |
US9155157B2 (en) | 2006-08-14 | 2015-10-06 | Koninklijke Philips N.V. | Electroluminescent device having a variable color point |
US9991237B2 (en) | 2014-09-19 | 2018-06-05 | Nichia Corporation | Light emitting device |
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