JP2005093956A - Manufacturing method of tape carrier for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a tape carrier which is excellent in insulation performance and migration property between wirings. <P>SOLUTION: The method comprises steps of: laminating a copper foil on the surface of a substrate consisting of polyimide film through an adhesive; forming a TAB tape 3 by effecting etching onto the copper foil so as to have a wiring pattern; removing minute foreign substances attached to the surface of the substrate by performing washing in a washing vessel 7; drying the resultant in a drying oven 8; and screen printing a photosensitive solder resist on the surface of the TAB tape 3 where the wiring pattern has been formed, by means of a screen printer 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention forms a photosensitive solder resist (PSR) or a solder resist (SR) on a tape carrier for a semiconductor device such as a TAB (Tape Automated Bonding) tape, a BGA (Ball Grid Array) tape, or a COF (Chip On Film) tape. In particular, the present invention relates to a method for manufacturing a semiconductor device tape carrier excellent in insulation between wires and migration.

  As a TAB tape having a conventional photosensitive solder resist, for example, there is one disclosed in Patent Document 1. A typical conventional manufacturing method of a TAB tape having such a photosensitive solder resist will be described with reference to FIGS.

  FIG. 5 shows a conventional photosensitive solder resist printing apparatus, and FIG. 6 shows a manufacturing process of a TAB tape having a conventional photosensitive solder resist.

  First, a base material made of polyimide film and a copper foil are laminated through a B-stage adhesive to form a three-layer structure. Next, the adhesive is cured, and further, a wiring pattern of copper foil is formed through a photosensitive resist coating, exposure, development, etching, and stripping process (S1).

  Next, a negative photosensitive solder resist is formed on the TAB tape on which the wiring pattern is formed. That is, as shown in FIG. 5, the TAB tape 3 is sent out from the unwinding machine 9, foreign matter adhering to the surface of the TAB tape 1 is removed by the dust removing roll 11 (S2), and the TAB tape 1 from which the foreign matter has been removed is removed. The photosensitive solder resist is screen printed by the screen printer 6 (S3).

Next, the photosensitive solder resist is dried (S4) and exposed (S5). Subsequently, development is performed to form a photosensitive solder resist pattern (S6). Next, baking (S7) and post-exposure are performed (S8) to improve the heat resistance and chemical resistance of the photosensitive solder resist pattern remaining after development. Finally, plating is formed in the plating process.
JP 9-298219 A

  However, according to the conventional method for producing a TAB tape having a photosensitive solder resist, foreign matter adhering to the surface of the TAB tape 3 is removed using the dust removing roll 11 before screen printing of the photosensitive solder resist. Fine foreign matter that falls between the wirings cannot be removed by the dust removal roll 11. Therefore, the photosensitive solder resist is printed and formed in a state where minute foreign matters are mixed between the wirings. The minute foreign matter mixed between the wirings causes a decrease in insulation and migration between the wirings. In particular, in recent years, the miniaturization of wiring has progressed, and when a minute foreign substance is mixed between the wirings, the insulation between the wirings is lowered and the semiconductor device does not function normally.

  Accordingly, an object of the present invention is to provide a method for manufacturing a tape carrier for a semiconductor device which is excellent in insulation between wires and migration.

  In order to achieve the above object, the present invention forms a wiring pattern on the surface of a substrate, removes foreign matters on the surface of the substrate by washing, and is photosensitive on the surface of the substrate on which the wiring pattern is formed. Provided is a method for manufacturing a tape carrier for a semiconductor device, characterized by forming a solder resist or a solder resist.

  According to this structure, the fine foreign material mixed between wiring is removed by wash | cleaning the surface of the base material in which the wiring pattern was formed.

  According to the present invention, since the foreign matter is removed by cleaning the surface of the base material before forming the photosensitive solder resist or the solder resist, the fine foreign matter mixed between the wiring patterns is exposed to the photosensitive solder resist or the solder resist. Thus, a tape carrier for a semiconductor device having excellent insulation between wires and excellent migration can be manufactured.

  FIG. 1 shows a photosensitive solder resist printing apparatus according to a first embodiment of the present invention. This printing apparatus removes foreign matter adhering to the surface by wet cleaning the unwinding machine 9 for feeding out the TAB tape 3 before printing the photosensitive solder resist and the TAB tape 3 fed from the unwinding machine 9. A washing tank 7 for drying, a drying furnace 8 for drying the wet-cleaned TAB tape 3, a screen printer 6 for screen-printing a photosensitive solder resist on the dried TAB tape 3, and a screen-printed TAB tape 3 A winder 10 for winding.

  Next, a method for manufacturing a TAB tape having a photosensitive solder resist using the printing apparatus shown in FIG. 1 will be described with reference to FIGS.

  FIG. 2 shows a process for forming a photosensitive solder resist pattern, and FIG. 3 shows a manufacturing process according to the present embodiment.

  First, the base material 4 made of a polyimide film and the copper foil 2 are laminated through a B-stage adhesive 5 to form a three-layer structure. Next, the adhesive 5 is cured, and further, a wiring pattern 2 of copper foil is formed through a photosensitive resist coating, exposure, development, etching, and stripping process (S10).

Next, a negative photosensitive solder resist 1 is formed on the TAB tape 3 on which the wiring pattern 2 is formed. That is, as shown in FIG. 1, the TAB tape 3 on which the wiring pattern 2 is formed is sent out by the unwinder 9. Next, the minute foreign matter adhering to the surface of the TAB tape 3 is removed in the washing tank 7 (S11). In the washing tank 7, RO water (reverse osmosis membrane (RO) water) is ejected from the spray nozzle 12. The water pressure ejected from the spray nozzle 12 is preferably about ² to 3 kgf / cm ² . After washing with water, the TAB tape 3 is dried in the drying furnace 8 to remove moisture (S12). After drying, the photosensitive solder resist 1 is printed on the TAB tape 3 by the screen printer 6 (S13). In this way, the TAB tape 3 having the photosensitive solder resist 1 as shown in FIG.

  Next, after printing the photosensitive solder resist 1, the photosensitive solder resist 1 is dried (S14), and exposure is performed by irradiating with ultraviolet rays 14 through an exposure mask 13, as shown in FIG. Then, development is performed as shown in FIG. 2C to form a photosensitive solder resist pattern 10 (S16). At this time, the PSR via 10a and the like are formed. The PSR via 10a becomes a part for forming a solder ball when a chip is mounted. Next, baking (S17) and post-exposure (S18) are performed to improve the heat resistance and chemical resistance of the photosensitive solder resist pattern 10 remaining after development. Finally, plating is formed in the plating process.

  According to the first embodiment, since the foreign matter on the surface of the TAB tape 3 is removed before printing of the photosensitive solder resist 1, the foreign matter remaining between the wirings is not embedded in the photosensitive solder resist. Therefore, it is possible to provide the TAB tape 3 having excellent insulation between wires and excellent migration.

  FIG. 4 shows a photosensitive solder resist printing apparatus according to the second embodiment of the present invention. The printing apparatus according to the second embodiment uses ultrasonic cleaning as the water rinsing tank 7 in the printing apparatus according to the first embodiment shown in FIG. 1, and the others are the first embodiment. It is configured in the same way. The TAB tape 3 delivered from the unwinding machine 9 of the second embodiment passes through a water rinsing tank 7 that is cleaned by ultrasonic cleaning, and after the moisture is removed in a drying furnace 8, a photosensitive solder resist. 1 is screen printed. According to the second embodiment, by performing ultrasonic cleaning in the rinsing tank 7, the rinsing effect is further improved as compared with the first embodiment, and more excellent insulation between wires and migration properties. Is obtained.

  The present invention can be applied to a non-photosensitive type solder resist in addition to the photosensitive solder resist. In addition to the TAB tape, the present invention can also be applied to a tape formed with a photosensitive solder resist or solder resist such as a BGA substrate and a COF tape.

It is a lineblock diagram showing the outline of the printing device of the photosensitive soldering resist concerning a 1st embodiment of the present invention. (A)-(c) is sectional drawing which shows the formation process of the photosensitive soldering resist pattern based on the 1st Embodiment of this invention. It is process drawing which shows the manufacturing method of the TAB tape which has the photosensitive soldering resist pattern which concerns on the 1st Embodiment of this invention. It is a block diagram which shows the outline of the printing apparatus of the photosensitive soldering resist which concerns on the 2nd Embodiment of this invention. It is a block diagram which shows the outline of the printing apparatus of the conventional photosensitive soldering resist. It is process drawing which shows the manufacturing method of the TAB tape which has the conventional photosensitive soldering resist pattern.

Explanation of symbols

1 Photosensitive solder resist (PSR)
DESCRIPTION OF SYMBOLS 1a Photosensitive soldering resist pattern 1b PSR via | veer 2 Wiring pattern 3 TAB tape 4 Base material 5 Adhesive 6 Screen printing machine 7 Washing tub 8 Drying furnace 9 Unwinding machine 10 Winding machine 11a, 11b Dust removal roll 12 Spray nozzle 13 Exposure Mask 14 UV

Claims (4)

Form a wiring pattern on the surface of the substrate,
Removing foreign matter on the surface of the substrate by washing;
A method of manufacturing a tape carrier for a semiconductor device, comprising forming a photosensitive solder resist or a solder resist on a surface of the substrate on which the wiring pattern is formed.   2. The method of manufacturing a tape carrier for a semiconductor device according to claim 1, wherein the cleaning is performed after wet cleaning.   3. The method of manufacturing a tape carrier for a semiconductor device according to claim 2, wherein the wet cleaning is performed by ultrasonic cleaning. 2. The method of manufacturing a tape carrier for a semiconductor device according to claim 1, wherein the substrate on which the wiring pattern is formed is a TAB tape, a BGA tape, or a COF tape.

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