JP2005093905A - Electronic substrate unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic substrate unit which can require a less number of parts, facilitate its assembling work, have a low cost, and naturally compatible with dimensional change of an electronic substrate. <P>SOLUTION: The unit comprises a circuit board 4 having electronic components 3 mounted thereon, a heat sink plate 5 made of a metallic material laminated on the lower surface of the circuit board 4, and a polymer thermoplastic resin 6 filled in outer peripheral sides of the circuit board 4 and the heat sink plate 5 to cover the outer peripheries of the circuit board 4 and the heat sink plate 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a waterproof electronic board unit.

  Conventionally, various electronic board units having waterproof properties have been proposed. Japanese Patent Application Laid-Open No. 9-246748 discloses an electronic board unit as an example.

  As shown in FIG. 9, the electronic board unit 50 of the above publication includes a circuit board 52 on which a connector 51 a and each electronic component 51 b are mounted, and an exterior member 53 that covers the outer periphery of the circuit board 52. The exterior member 53 includes a case 53a made of a metal and formed in a cylindrical shape, and a cover 53b having one end fixed to the opening of the case 53a and the other end disposed along the outer peripheral surface of the connector 51a by bending. , And a sealing resin 53c for bringing the other end of the cover 53b into close contact with the outer peripheral surface of the connector 51a.

According to the above configuration, even when the water or the like is installed at a position where it directly hits, the exterior member 53 prevents water or the like from entering the position where the circuit board 52 is located. Can prevent malfunction due to the adverse effect of water.
Japanese Patent Laid-Open No. 9-246748

  However, in the conventional electronic substrate unit 50, since the exterior member 53 is composed of three parts of the case 53a, the cover 53b, and the sealing resin 53c, the number of parts is large and the assembly thereof is complicated. There was a problem of being.

  Further, in order to make the electronic board unit 50 compact when the external dimensions of the circuit board 52 are changed to be small, the electronic board unit 50 can be assembled to the outer periphery of the circuit board 52 when the external dimensions of the circuit board 52 are changed greatly. The dimensions of the exterior member 53 are also forced to change. Specifically, for example, the electronic board unit 50 installed in the engine room of a car may have a different size for each car model, and therefore the circuit board 52 is changed for each model. Usually, the exterior member 53 also needs to be changed. For this reason, it has been complicated to cope with the dimensional change of the circuit board 52.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is that the number of parts is small, the assembling work is easy, the cost is low, and the size change of the electronic board can be naturally handled. It is to provide an electronic board unit.

  In order to achieve the above object, the invention described in claim 1 is characterized in that it is covered with a polymer thermoplastic resin portion filled on the outer peripheral side of the circuit board.

  Further, the invention described in claim 2 is that the circuit board is disposed in a state where a gap is interposed in the frame portion of the metal frame, and is covered with a polymer thermoplastic resin portion filling the outer peripheral side thereof. To do.

  Furthermore, the invention described in claim 3 is a polymer thermoplastic resin in which a circuit board and a resin sheet laminated thereon are arranged in a state where a gap is interposed in a frame part of a metal substrate, and these outer peripheral sides are filled. The intent is to have suffered in the department.

  According to the first aspect of the present invention, water or the like is prevented from entering the inside of the circuit board by the polymer thermoplastic resin portion, so that the electronic components are prevented from malfunctioning due to the adverse effect of water. it can. And as a waterproof structure, since the polymeric thermoplastic resin part should just be filled in the outer peripheral side of a circuit board, there are few parts, an assembly operation | work is easy and it is low-cost. In addition, it can naturally cope with a change in dimensions of the circuit board.

  According to the invention of claim 2, the adhesion between the metal frame and the polymer thermoplastic resin portion is very weak, and there is a possibility that water may enter inside from the boundary surface. Since a gap is formed between the two and the polymer thermoplastic resin portion is filled in the gap, water does not enter the position of the circuit board. Therefore, it is possible to prevent the electronic component or the like from malfunctioning due to the adverse effect of water. As the waterproof structure, it is only necessary to fill the polymer thermoplastic resin portion on the outer peripheral side of the circuit board and the like. In addition, it can naturally cope with a change in dimensions of the circuit board.

  Furthermore, the electronic board unit can be attached to a desired installation location via the attachment part of the metal frame. Therefore, it is possible to provide an electronic board unit that includes a strong metal mounting portion and that does not cause malfunction due to the adverse effect of water on electronic components.

  According to invention of Claim 3, since the contact | adhesion power of the boundary surface of a resin sheet and a polymer thermoplastic resin part is very strong, there is no possibility that water will permeate into this inside from this boundary. In addition, the adhesion between the metal frame and the polymer thermoplastic resin part is very weak, and water may enter the inside from the boundary surface, but there is a gap between the metal frame and the circuit board. Since the gap is formed and filled with the polymer thermoplastic resin portion, water does not enter the position of the circuit board. Therefore, it is possible to prevent the electronic component or the like from malfunctioning due to the adverse effect of water. As the waterproof structure, it is only necessary to fill the polymer thermoplastic resin portion on the outer peripheral side of the circuit board and the like. Furthermore, it can naturally cope with a change in the dimensions of the circuit board.

  For the above-mentioned reason, the resin sheet and the polymer thermoplastic resin portion are integrated to form a water intrusion prevention structure. Therefore, since it is not necessary to form the polymer thermoplastic resin portion at the place where the resin sheet of the circuit board is disposed, the polymer thermoplastic resin is filled as compared with the case where the polymer thermoplastic resin is filled over the entire outer periphery of the circuit board. The filling process of the thermoplastic resin is simplified. In addition, the adhesion between the metal frame and the polymer thermoplastic resin part is very weak, and water may enter inside from the boundary surface, but there is a gap between the metal frame and the circuit board. Since the gap is formed and filled with the polymer thermoplastic resin portion, water does not enter the position of the circuit board.

  Furthermore, the electronic board unit can be attached to a desired installation location via the attachment portion of the metal frame. Therefore, it is possible to provide an electronic board unit that includes a strong metal mounting portion and in which an electronic component or the like does not malfunction due to an adverse effect of water.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments embodying the invention will be described with reference to the drawings.

(First embodiment)
1 and 2 show a first embodiment, FIG. 1 is a perspective view of an electronic board unit, FIG. 2A is a cross-sectional view taken along line A1-A1 in FIG. 1, and FIG. 2B is FIG. It is sectional drawing which follows the A2-A2 line.

  1 and 2, an electronic board unit 1A includes a circuit board 4 on which a connector 2 and each electronic component 3 are mounted, a metal heat sink plate 5 laminated on the lower surface of the circuit board 4, and these circuit boards. 4 and the sheet sink 5 are formed on the outer peripheral side of the plate and are composed of a polymer thermoplastic resin portion 6 that covers the outer periphery of the circuit board 4 and the like.

  The connector 2 has a resin connector case 2a and a metal terminal portion 2b disposed in the opening 2c. The resin material of the connector case 2a is the resin of the polymer thermoplastic resin portion 6. Those having good adhesion at the interface are used.

  The polymer thermoplastic resin portion 6 is filled throughout the entire area on the outer peripheral side of the circuit board 4 and the heat sink plate 5 as long as the opening 2c of the connector 2 is not blocked. A hot melt adhesive (hot melt resin) is used as the polymer thermoplastic resin.

  In the above configuration, when the electronic board unit 1A is installed at a position where water or the like directly hits, the polymer thermoplastic resin portion 6 can prevent water or the like from entering the inside of the circuit board 4. Therefore, it is possible to prevent the electronic component 3 or the like from malfunctioning due to the adverse effect of water. And since the polymeric thermoplastic resin part 6 should just be filled in the outer peripheral side of the circuit board 4, there are few parts, an assembly | attachment operation | work is easy and it is low-cost. Further, it is possible to naturally cope with a change in dimensions of the circuit board 4.

  Furthermore, in the first embodiment, since the heat sink plate 5 is laminated on the lower surface of the circuit board 4, the heat generated in the circuit board 4 is radiated to the heat sink plate 5, and the temperature rise of the circuit board 4 can be reliably suppressed. .

(Second Embodiment)
3 to 5 show a second embodiment, FIG. 3 is an exploded perspective view of the electronic board unit, FIG. 4 is a perspective view of the electronic board unit, and FIG. 5A is a cross section taken along line B1-B1 in FIG. FIG. 5 and FIG. 5B are cross-sectional views taken along line B2-B2 in FIG.

  3 to 5, an electronic board unit 1B includes a circuit board 4 on which a connector 2 and each electronic component 3 are mounted, a metal heat sink plate 5 stacked on the lower surface of the circuit board 4, and a circuit board 4 In addition, the metal frame 7 in which the sheet sink plate 5 is disposed in the opening 8 inside, and the polymer heat that fills the outer peripheral side of the circuit board 4, the heat sink plate 5, and the metal frame 7 and covers the outer periphery of the circuit board 4 It is comprised from the plastic resin part 6. FIG.

  As in the first embodiment, the connector 2 includes a resin connector case 2a and a metal terminal portion 2b disposed in the opening 2c. The resin material of the connector case 2a is a polymer. A material having good adhesion at the interface with the resin of the thermoplastic resin portion 6 is used.

  The metal frame 7 is formed of, for example, an aluminum material, and has a rectangular frame portion 7a having an opening 8 that is slightly larger in size than the circuit board 4, and a protruding position on the outer side at a position facing the frame portion 7a. And a pair of mounting portions 7b, 7b. And the circuit board 4 is arrange | positioned in the position which has a clearance gap between the inner peripheral surfaces of the opening part 8 over the whole outer peripheral surface. Bolt insertion holes 9 are formed in each mounting portion 7b.

  The polymer thermoplastic resin portion 6 is filled on the outer peripheral side of the circuit board 4, the heat sink plate 5 and the frame portion 7 a of the metal frame 7 as long as the opening 2 c of the connector 2 is not blocked. 5 and the outer periphery of the frame portion 7a of the metal frame 7, and the gap d between the circuit board 4 and the heat sink plate 5 and the metal frame 7 is also filled, and the circuit board 4, the heat sink plate 5 and the metal frame 7 are bonded. ing. As the polymer thermoplastic resin, a hot melt adhesive is used as in the first embodiment.

  In the above configuration, when the electronic board unit 1B is installed at a position where water or the like directly hits, the adhesion between the metal frame 7 and the polymer thermoplastic resin portion 6 is very weak, and from the boundary surface thereof Although water may enter inside, a gap d is formed between the metal frame 7 and the circuit board 4 and the gap d is filled with the polymer thermoplastic resin portion 6. Water does not enter the position of the circuit board 4. Therefore, it is possible to prevent the electronic component 3 or the like from malfunctioning due to the adverse effect of water. And as a waterproof structure, since the polymeric thermoplastic resin part 6 should just be filled in the outer peripheral side etc. of the circuit board 4, there are few parts, an assembly operation | work is easy and it is low-cost. Further, it is possible to naturally cope with a change in dimensions of the circuit board 4.

  Further, the electronic board unit 1 </ b> B can be attached to a desired installation location via the attachment portion 7 b of the metal frame 7. Therefore, it is possible to provide the electronic board unit 1B that includes the strong metal mounting portion 7b and in which the electronic component 3 or the like does not malfunction due to the adverse effect of water.

  Furthermore, since the heat sink plate 5 is laminated also in the second embodiment, the temperature rise of the circuit board 4 can be suppressed as in the first embodiment.

(Third embodiment)
6 to 8 show the third embodiment, FIG. 6 is an exploded perspective view of the electronic board unit, FIG. 7 is a perspective view of the electronic board unit, and FIG. FIG. 8 and FIG. 8B are cross-sectional views taken along line C2-C2 in FIG.

  6 to 8, an electronic board unit 1C includes a circuit board 4 on which a connector 2 and each electronic component 3 are mounted, a metal heat sink plate 5 laminated on the lower surface of the circuit board 4, and the heat sink board. 5, a resin sheet 10 laminated on the lower surface of the circuit board 5, a metal frame 7 in which the circuit board 4, the sheet sink plate 5, and the resin sheet 10 are arranged in the opening 8 inside, It is composed of a polymer thermoplastic resin portion 6 filled on the side and covering the outer periphery of the circuit board 4 and the like.

  Similarly to the first and second embodiments, the connector 2 has a resin connector case 2a and a metal terminal portion 2b disposed in the opening 2c. The resin material of the connector case 2a is as follows. A material having good adhesion at the interface with the resin of the polymer thermoplastic resin portion 6 is used.

  The resin sheet 10 is formed of a material having good adhesion with the interface of the resin of the polymer thermoplastic resin portion 6 (in this embodiment, a hot melt adhesive). In this embodiment, the resin sheet 10 is made of polybutylene terephthalate (PBT). Is formed.

  The metal frame 7 is formed of, for example, an aluminum material, and has a rectangular frame portion 7a having an opening 8 that is slightly larger in size than the circuit board 4, and a protruding position on the outer side at a position facing the frame portion 7a. And a pair of mounting portions 7b, 7b. And the circuit board 4 is arrange | positioned in the position which has the clearance gap d between the inner peripheral surfaces of the opening part 8 over the whole outer peripheral surface. Bolt insertion holes 9 are formed in each mounting portion 7b.

  The polymer thermoplastic resin portion 6 does not block the opening 2c of the connector 2 and is filled on the outer peripheral side of the circuit board 4 and the frame portion 7a of the metal frame 7 in a range excluding the lower surface of the resin sheet 10. The outer periphery of the circuit board 4 and the frame portion 7a of the metal frame 7 is covered, and the gap d between the circuit board 4 and the heat sink plate 5 and the metal frame 7 is also filled. The metal frame 7 is bonded. That is, since the resin sheet 10 is arrange | positioned at the lower surface side of the circuit board 4 compared with 2nd Embodiment, the point by which the polymer thermoplastic resin part 6 is not arrange | positioned differs. As the polymer thermoplastic resin, a hot melt adhesive is used as in the first and second embodiments.

  In the above configuration, when the electronic board unit 1C is installed at a position where water or the like directly hits, the adhesion between the resin sheet 10 and the polymer thermoplastic resin portion 6 is very strong. There is no possibility of water entering inside. Further, the adhesion between the metal frame 7 and the polymer thermoplastic resin portion 6 is very weak, and water may enter inside from the boundary surface. In this case, a gap is formed, and since the polymer thermoplastic resin portion 6 is filled in the gap, water does not enter the position of the circuit board 4. Therefore, it is possible to prevent the electronic component 3 or the like from malfunctioning due to the adverse effect of water. And as a waterproof structure, since the polymeric thermoplastic resin part 6 should just be filled in the outer peripheral side etc. of the circuit board 4, there are few parts, an assembly operation | work is easy and it is low-cost. Furthermore, it is possible to naturally cope with a change in dimensions of the circuit board 4.

  For the above-mentioned reason, the resin sheet 10 and the polymer thermoplastic resin portion 6 are integrated to form a water intrusion prevention structure. Therefore, since it is not necessary to form the polymer thermoplastic resin portion 6 at the place where the resin sheet 10 of the circuit board 4 is disposed, when the polymer thermoplastic resin is filled over the entire outer periphery of the circuit board 4. In comparison, the filling process of the polymer thermoplastic resin is simplified. Further, the adhesion between the metal frame 7 and the polymer thermoplastic resin portion 6 is very weak, and there is a possibility that water may enter inside from the boundary surface. In this case, a gap d is formed, and since the polymer thermoplastic resin portion 6 is filled in the gap d, water does not enter the position of the circuit board 4.

  Furthermore, the electronic board unit 1 </ b> C can be attached to a desired installation location via the attachment portion 7 b of the metal frame 7. Therefore, it is possible to provide the electronic board unit 1C that includes the strong metal mounting portion 7b and that does not cause the electronic component 3 or the like to malfunction due to the adverse effect of water.

  Moreover, since the heat sink plate 5 is laminated also in the third embodiment, the same as in the first embodiment. The temperature rise of the circuit board 4 can be suppressed.

  The present invention can be embodied in another embodiment as follows. In the following other embodiments, the same operations and effects as those of the above embodiment can be obtained.

  (1) In the first to third embodiments, the circuit board 4 has the connector 2 mounted thereon. On the other hand, you may make it the structure which does not mount the connector 2. FIG.

  (2) In the first to third embodiments, the heat sink plate 5 made of metal is laminated on the lower surface of the circuit board 4. On the other hand, the heat sink plate 5 may not be stacked.

  Further, technical ideas other than the claims that can be grasped from the above embodiment will be described together with the effects thereof.

  (A) The electronic substrate unit according to any one of claims 1 to 3, wherein the polymer thermoplastic resin portion is a hot melt adhesive.

  According to this configuration, the same functions and effects as those of the first to third aspects of the invention can be obtained.

  (B) The electronic board unit according to any one of claims 1 to 3 and (a), wherein a heat sink plate is laminated on one surface of the circuit board.

  According to this configuration, the heat generated in the circuit board is radiated to the heat sink plate, and the temperature rise of the circuit board can be suppressed.

  (C) The electronic board unit according to (3) and (b) above, wherein a heat sink plate is laminated on one surface of the circuit board, and a resin sheet is laminated on the lower surface of the heat sink plate. apparatus.

  According to this configuration, the heat generated in the circuit board is radiated to the heat sink plate, and the temperature rise of the circuit board can be suppressed, and it is not necessary to form the polymer thermoplastic resin portion at the place where the resin sheet is disposed. Therefore, the filling process of the polymer thermoplastic resin is simplified.

1 is a perspective view of an electronic board unit according to a first embodiment of the present invention. 1 shows a first embodiment of the present invention, in which (a) is a cross-sectional view taken along line A1-A1 in FIG. 1, and (b) is a cross-sectional view taken along line A2-A2 in FIG. It is a disassembled perspective view of an electronic board unit which shows 2nd Embodiment of this invention. It is a perspective view of an electronic substrate unit, showing a second embodiment of the present invention. FIG. 5 shows a second embodiment of the present invention, where (a) is a cross-sectional view taken along line B1-B1 in FIG. 4, and (b) is a cross-sectional view taken along line B2-B2 in FIG. It is a disassembled perspective view of an electronic substrate unit, showing a third embodiment of the present invention. It is a perspective view of an electronic substrate unit, showing a third embodiment of the present invention. 3A and 3B show a third embodiment of the present invention, in which FIG. 7A is a cross-sectional view taken along line C1-C1 in FIG. 7, and FIG. 7B is a cross-sectional view taken along line C2-C2 in FIG. It is a perspective view of the electronic substrate unit of a prior art example.

Explanation of symbols

1A, 1B, 1C Electronic board unit 3 Electronic component 4 Circuit board 5 Heat sink plate 6 Polymer thermoplastic resin part 7 Metal frame 7a Frame part 8 Opening part 10 Resin sheet d Gap between circuit board and frame part

Claims (3)

  An electronic board unit comprising: a circuit board on which an electronic component is mounted; and a polymer thermoplastic resin portion that fills the outer periphery of the circuit board and covers the outer periphery of the circuit board.   A circuit board on which electronic components are mounted; and a frame part in which the circuit board is disposed in an internal opening, and the circuit board is located at a position having a gap with the inner peripheral surface of the opening. A metal frame having a mounting portion projecting outside the frame portion and filled on the outer peripheral side of the circuit board, covering the outer periphery of the circuit board, and filling a gap between the circuit board and the metal frame And an electronic substrate unit comprising a polymer thermoplastic resin portion for bonding the circuit board and the metal frame. A circuit board on which electronic components are mounted and a resin sheet laminated on one surface of the circuit board and having good adhesion with the interface of the polymer thermoplastic resin, and the resin sheet and the circuit board are disposed inside. A frame portion that is disposed in the opening and is located at a position where the resin sheet and the circuit board have a gap with the inner peripheral surface of the opening, and a mounting portion that protrudes outside the frame A metal frame having the outer periphery of the circuit board, covering the outer periphery of the circuit board, and filling the gap between the resin sheet and the circuit board and the frame portion. An electronic substrate unit comprising: a polymer thermoplastic resin portion that bonds the metal frame and the metal frame.

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