JP2005093842A - Heat dissipation sheet and heat dissipation member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide heat dissipation structure capable of suppressing deterioration in a heat dissipation effect even at a change of temperature while improving the efficiency of heat conduction. <P>SOLUTION: A plurality of projections 1 comprising a heat conductive material are formed in an area which is a part of a plate surface of a metallic plate 4 (or a heat receiving surface of a radiator) and the remaining area of the plate surface is filled with filling resin 2 having an adhesive property and ≤100ppm linear expansion coefficient up to substantially the same height as the height of the projections 1. An adhering projection part 3 having substantially the same height as the height of the projections 1 and an upper surface consisting of adhesive resin is formed on a part or all of the periphery of the area. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat-dissipating sheet, a heat-dissipating member, and a semiconductor device in which these are attached to a semiconductor element to dissipate heat generated in the electronic part such as a semiconductor element.

2. Description of the Related Art In recent years, heat dissipation technology for quickly removing heat generated from electronic components has become important due to high-density mounting accompanying increased functionality and downsizing of electronic devices and increased integration of various semiconductor elements.
As a conventional heat dissipation structure applied to a heat generating electronic component, the electronic component and a radiator (such as a heat sink or a housing) are combined with a heat conductive material such as a heat conductive silicone gel or a heat conductive silicone grease. In this structure, heat is transferred to the radiator and diffused (see, for example, Patent Document 1).

The heat conductive material interposed between the electronic component and the heatsink has low thermal resistance, good connectivity, and heat resistance in order to reliably conduct the heat generated from the electronic component to the heatsink. It is necessary.
Therefore, as a heat conductive material, a large amount of heat conductive filler (metal oxide, boron nitride, etc.) with high heat conductivity is mixed in a base material such as heat conductive silicone gel or heat conductive silicone grease. Those with improved thermal conductivity are mainly used.
In addition, instead of the heat conductive material interposed between the electronic component and the heatsink, heat conductive particles and metal wires are placed in a sheet made of polymer material to improve heat conductivity. Sheets have also been developed (see, for example, Patent Documents 2 and 3).
JP 2001-156227 A JP 2000-150742 A JP 2002-246413 A

  However, the amount of heat generated from each electronic component is increasing more rapidly, for example, as the processing speed of the MPU of the computer is further increased and the elements are further densely packed. It has become impossible to obtain a sufficient heat dissipation effect with a heat dissipation structure via gel or thermally conductive silicone grease.

  In addition, when the present inventors examined the conventional heat dissipation sheet in detail, for example, when performing a thermal cycle test between −55 ° C. and 125 ° C., the heat dissipation sheet is detached from the element due to a difference in linear expansion, etc. It was found that the heat dissipation effect deteriorated due to temperature change, which hindered the reliability of the heat dissipation structure.

  An object of the present invention is to provide a heat dissipation structure in which the deterioration of the heat dissipation effect is suppressed even with respect to a temperature change while improving the heat conduction efficiency.

The present invention has the following features.
(1) A plurality of protrusions made of a heat conductive material are formed in a partial region of at least one plate surface of the metal plate,
In the rest of the region, a filling resin having adhesiveness and a linear expansion coefficient of 100 ppm or less is filled to a height substantially equal to the height of the protrusions,
A part of or all of the periphery of the region is provided with an adhesive convex portion having a height substantially the same as the height of the protrusion and having at least an upper surface made of an adhesive resin. Sheet.
(2) The heat dissipation sheet according to (1), wherein the metal plate has a thickness of 15 μm to 2 mm.
(3) The heat radiation sheet according to (1), wherein the protrusion is formed in each of the regions on both plate surfaces of the metal plate.
(4) The heat-dissipating sheet according to (3), wherein the filling resin is filled in each of the regions of both plate surfaces to substantially the same height as the protrusions.
(5) The heat radiation sheet according to the above (3) or (4), wherein the adhesive convex portion is provided on a part or all of the periphery of each of the regions on both plate surfaces.
(6) The heat dissipating sheet according to (1) above, wherein the heat conductive filler is dispersed in the filling resin.
(7) The heat dissipation sheet according to (1), wherein the mounting target of the heat dissipation sheet is a semiconductor element, and the outer peripheral shape of the metal plate is substantially the same as the outer peripheral shape of the semiconductor element.
(8) The heat radiation sheet according to the above (1), wherein the filling resin and the adhesive resin used for the bonding convex portion are different from each other.
(9) The heat radiation sheet according to (1), wherein the entire bonding convex portion is made of an adhesive resin, and the elastic modulus of the adhesive resin is 2 MPa to 2 GPa.
(10) A plurality of protrusions made of a heat conductive material are formed in a partial region of the heat receiving surface of the radiator, and the remainder in the region has adhesiveness and has a linear expansion coefficient of 100 ppm or less. Filling resin is filled to substantially the same height as the protrusions,
A part of or all of the periphery of the region is provided with an adhesive convex portion having a height substantially the same as the height of the protrusion and having at least an upper surface made of an adhesive resin. Element.
(11) The heat radiating member according to (10), wherein a heat conductive filler is dispersed in the filling resin.
(12) The heat radiating member according to (10), wherein the filling resin and the adhesive resin used for the bonding convex portion are different from each other.
(13) The heat radiating member according to (10), wherein the entire bonding convex portion is made of an adhesive resin, and the elastic modulus of the adhesive resin is 2 MPa to 2 GPa.
(14) A semiconductor having a configuration in which the heat dissipation sheet according to any one of (1) to (9) or the heat dissipation member according to any of (10) to (13) is mounted on a semiconductor element. apparatus.

In the present invention, first, heat is favorably conducted from an object such as an element by adopting a structure in which a heat conductive projection is provided on the metal plate surface and the heat receiving surface of the radiator.
In addition, an adhesive filling resin having an adhesive property is filled between the projections, and an adhesive convex portion is provided around the region where the projections are provided to enhance the adhesion to the mounting object. Further, the linear expansion coefficient of the filling resin is limited to 100 ppm or less, and the difference in linear expansion coefficient between the metal plate, the protrusion, the filling resin, and the element is reduced, thereby reducing the linear expansion coefficient difference. The generation | occurrence | production of the distortion (stress) resulting from this is suppressed, and the trouble that the said heat conductive sheet (member) peels from the target object is suppressed.

First, the heat dissipation sheet according to the present invention will be described in detail.
FIG. 1 is a diagram illustrating an example of the heat dissipation sheet. As shown in the figure, the heat dissipation sheet has a configuration in which a plurality of protrusions 1 made of a heat conductive material are formed in a region e in at least one plate surface of the metal plate 4. In the configuration example of FIG. 1B, the protrusion 1 is provided only on one plate surface of the metal plate 4, and in the examples of FIGS. 1C and 1D, not only one plate surface of the metal plate 4 is provided. The other plate surface is also provided with a protrusion 1b.
The rest of the region e is filled with the filling resin 2 up to substantially the same height as the protrusion 1, and the upper surface of the protrusion is exposed. As the filling resin, one having adhesiveness and having a linear expansion coefficient of 100 ppm or less is used.

Adhesive convex portions 3 are provided in part or all of the periphery of the region e. In the example of FIG. 1A, the bonding convex portion 3 is provided as a convex strip that is continuously surrounded like a frame around the entire periphery of the region e.
The bonding convex portion has substantially the same height as the protrusion 1 and at least the upper surface is made of an adhesive resin. Thereby, it can contact an object with a protrusion and can show adhesive force.

  By setting it as the said structure, a protrusion receives heat | fever favorably from target objects, such as an element, and transfers it to a thermal radiation member. In addition, by providing a filling resin and an adhesive convex portion, and further limiting the linear expansion coefficient of the filling resin to 100 ppm or less, the heat conductive sheet can be used even when a heat cycle of room temperature to high temperature is applied. The trouble of peeling from the object is suppressed, and the state of adhesion to the object is maintained.

  The material of the metal plate used as the substrate of the heat radiating sheet is not particularly limited as long as it has a high thermal conductivity suitable for the use as the heat radiating sheet. Examples of preferable materials include gold, silver, copper, and aluminum. What kind of material is used for the metal plate may be appropriately determined depending on the use of the heat dissipation sheet, and may be a multilayer structure made of any material. From the viewpoint of low cost, copper and aluminum are preferable materials.

The thickness of the substrate and the size and shape of the plate surface are not limited, and may be appropriately determined according to the area scale of the electronic component to be mounted, the amount of heat generation, and the like.
In actual use, the thickness is about 0.3 mm to 2 mm. In particular, when a bare chip is to be mounted, a thickness of about 0.3 mm to 0.5 mm is preferable.
When the outer peripheral shape of the board surface of the substrate is a square, the size is exemplified by a range from a general bare chip size (5 mm × 5 mm) to a relatively large heat sink size (50 mm × 50 mm). However, it is not limited to these ranges.

  In the heat dissipation sheet, the protrusion 1, the filling resin 2, and the adhesive protrusion 3 are provided on at least one of the two main surfaces of the metal plate. The provided surface is connected to an electronic component or heat dissipation. Whether to connect to the member may be appropriately selected according to the conditions during use. It is preferable to connect the surface to the potential component from the viewpoint of utilizing the preferable thermal conductivity and highly reliable adhesion of the heat dissipation sheet for the electronic component.

  As shown in FIG. 1B, the projection 1, the filling resin 2, and the bonding projection 3 are provided only on one surface of the metal plate 4, and in the case where the other surface is flat, the other surface of the metal plate Conventionally known heat conductive silicone gel, heat conductive silicone grease, or the like may be interposed in the connection between and the other party.

  Since the heat-dissipating sheet is interposed between the electronic component and the heat-dissipating member, as shown in FIG. An embodiment in which 1b is provided is preferable. Moreover, in order to ensure favorable adhesion | attachment with both, you may provide the resin for filling or the convex part for adhesion | attachment also on the other surface. In FIG. 1 (d), the filling resin and the bonding convex portion are simultaneously provided, but the illustration of only one of them being omitted. By such an aspect, even if it is a connection object which consists of material which cannot be metal-bonded, sufficient adhesion | attachment and the heat conduction by it are securable.

In the embodiment shown in FIG. 1 (c), the protrusion on the side to be joined to a metal radiator (heat spreader, heat sink, etc.) is formed of a low melting point metal such as solder, so that the metal can be directly joined to the radiator. Also good.
As shown in FIG. 1D, both the electronic component and the heat radiating member are provided by providing the protrusions 1 and 1b, the filling resins 2 and 2b, and the bonding protrusions 3 and 3b on both surfaces of the metal plate. On the other hand, good adhesion and heat conduction can be secured.

The height of the protrusion formed on the substrate surface depends on the scale of the heat-dissipating sheet and the target object. However, if the target is a bare chip, the height is preferably 30 μm to 100 μm, more preferably 30 μm to 50 μm.
The shape of each protrusion may be, for example, a columnar shape (cylindrical shape, square injection shape, etc.), a circular (cornered) frustum shape, a hemispherical shape, a substantially spherical shape, a spindle shape, or an arbitrary shape having a deformed cross section.
The outer diameter of the protrusion is about 200 μm to 1000 μm when the diameter changes in the height direction or when the shape of the cross section (cross section perpendicular to the height direction) is not circular, it is measured at the thickest part. In particular, a preferred outer diameter range is 300 μm to 500 μm.

The arrangement pattern of the protrusions in the region may be a square matrix, a fine shape as shown in FIG. 1A, an irregular set, or the like.
The collective density of the protrusions varies depending on the outer diameter of the protrusions. For example, in the case of a cylindrical protrusion having a diameter of 470 μm, 30% to 60% of the whole is good as defined by the total protrusion area per unit area. This is a preferable range in which good adhesion and thermal conductivity can be obtained.

The material of the protrusions may be a material having good thermal conductivity, and may be the same material as the metal plate or a different material.
From the viewpoint of the method of forming the protrusion, it may be an additive method in which the protrusion is joined to the metal plate from the outside, or a subtractive method in which the protrusion is left by etching the metal plate. In addition, a layer made of a material different from the metal plate is formed in a subtractive manner by previously laminating a layer made of a material to be a projection on the metal plate and etching the layer to leave the projection. can do.
Select each substrate / projection material in consideration of the mechanical strength and thermal conductivity as the substrate required for the metal plate, the connectivity and thermal conductivity with the object necessary for the projection, the material cost of each, What is necessary is just to select the formation method of protrusion.

As a material / form of the protrusion, for example, a low melting point metal material such as solder or a bump formed of a heat conductive paste or the like is preferable. A bump made of a metal material having a low melting point is melted at the time of mounting, thereby reducing the contact resistance between the electronic component and the radiator and improving the heat radiation efficiency.
As a procedure for forming bumps with a heat conductive paste, for example, a filling resin layer is first formed on a metal plate, and projection holes are patterned on the resin layer, and heat conduction is performed in the holes. By filling the conductive paste, a paste-like bump is obtained.
When the protrusion is added to the metal plate as a bump from the outside, the shape is preferably a cylindrical shape or a hemispherical shape.

  When the protrusions are formed on both surfaces of the metal plate, specifications such as the shape, material, and position of the protrusions on both surfaces may be independently selected for each surface according to the objects to be joined. From the point of conducting heat well in the thickness direction of the heat conductive sheet, the protrusions on both sides of the metal plate are formed with the same outer diameter at the same position corresponding to each other on the front and back, and the inside of the metal plate It is also possible to simply conduct heat conduction in the plate thickness direction.

As the filling resin, one having adhesiveness and a linear expansion coefficient of 100 ppm or less is used.
The adhesiveness referred to in the present invention is not only the property that the filling resin itself can be bonded to the other party, but also the property that can be bonded by heating and / or pressurization, although it does not exhibit adhesiveness as it is. It may be. For example, a thermoplastic resin that is fused and / or pressure-bonded by heating and / or pressurization, and a thermosetting resin that is thermoset by heating are exemplified.
The adhesive force (that is, the peeling force) required for the filling resin when the adhesiveness is developed may be 5 MPa or more, and particularly preferably 10 MPa or more. As a method for measuring the adhesive force, a filling resin is attached to a semiconductor chip, and it is bonded to a measurement plate made of a metal plate material of the heat dissipation sheet by flip chip bonding, cured at 175 ° C. for 5 hours, and then pushed. -Pull gauge is used to apply a force to the semiconductor chip in the direction along the plate surface for measurement, measure the force (shearing adhesive force) when it is peeled off, and measure it as the adhesive force .

  The linear expansion coefficient of the filling resin is 100 ppm or less, and 50 ppm to 30 ppm is particularly preferable. Materials for forming such a filling resin exhibiting adhesiveness include thermoplastic polyimide resin, epoxy resin, polyetherimide resin, polyamide resin, silicone resin, phenoxy resin, acrylic resin, polycarbodiimide resin, and fluorine resin. , Polyester resin, polyurethane resin and the like. These resins may be used, and the components may be appropriately adjusted, polymerized, and mixed to form a resin having a linear expansion coefficient in the above range.

  If there is a difference between the coefficient of linear expansion of the metal plate and the coefficient of linear expansion of the protrusion, which is a heat dissipation path, a large stress is generated between them due to temperature changes. At this time, if the elastic modulus of the filling resin filling between the protrusions is high, the stress is further increased. From the viewpoint of reducing this, it is preferable to make the elastic modulus of the filling resin as low as possible.

A thermal conductive filler may be dispersed in the filling resin to further increase the thermal conductivity. Examples of the material for the thermally conductive filler include silver, copper, aluminum, alumina, solder, zinc oxide, and tin. Examples of the shape of the heat conductive filler include a spherical shape, a scaly shape, a needle shape, and a fiber shape.
What kind of material and shape of the heat conductive filler is used may be appropriately determined depending on the use of the heat dissipation sheet.

  It is preferable that the filling resin is filled to a height substantially the same as the height of the protrusion, and the protrusion can directly contact the object. Since the filling resin has a slight degree of freedom in shape, the protrusion may protrude slightly.

Examples of the method of filling the filling resin between the protrusions include the following.
(I) After forming protrusions on the metal plate, cover the protrusions with a sheet made of a filling resin, heat and press from above to infiltrate the resin between the protrusions, and then polish from the top surface Method to expose the protrusions and align the height of both.
(Ii) A method in which a protrusion is formed on a metal plate, a flat plate is disposed on the protrusion, and a resin is poured into a gap between the flat plate and the metal plate.

The bonding convex portion is positioned so as to surround the entire area e as shown in FIG. 1 (a), or as provided in a part of the periphery of the area e as shown in FIG. And In FIG. 2, the convex portions for adhesion are provided at the four corners of the rectangular metal plate as a form that exhibits a triangle when the plate surface is viewed, but the pattern is not limited, and the adhesion to the object is improved. Any pattern can be used as long as it can be enhanced and achieve the object of the present invention.
It is preferable that the height of the protrusions for bonding is substantially the same as the height of the protrusions so as not to interfere with the contact of the protrusions and that the protrusions do not interfere with the adhesion of the protrusions for bonding.

Even if the adhesive convex part is entirely made of an adhesive resin, only the part exposed on the upper surface is a multilayer structure made of an adhesive resin (for example, the lower layer is a layer with a protruding metal plate, It may be a layer made of a material.
The height of the bonding convex portion is preferably substantially the same as that of the protrusion within the allowable range of manufacturing error, but may be as low as about 1 μm.
The cross-sectional shape (the cross-sectional shape when cut perpendicularly to the continuous direction) when the bonding convex portion is formed in a strip shape may be an arbitrary shape such as a square, a rectangle, or a semicircle. Considering the point of securing the adhesion to the object and the possibility of useless accumulation of heat, a cylindrical shape and a hemispherical shape are preferable cross-sectional shapes.

The adhesiveness of the adhesive convex portion has the same meaning as the adhesiveness of the filling resin.
The adhesive force (peeling force) required for the adhesive convex portion may be 10 MPa or more, and particularly preferably 20 MPa or more.
Examples of the adhesive resin used for the adhesive projection include thermoplastic polyimide resin, polycarbodiimide resin, and epoxy resin.

  It is preferable that the filling resin and the adhesive resin used for the convex portions for bonding are different from each other. This is because the filling resin has a low adhesive force for the purpose of stress relaxation, and an adhesive resin is provided to compensate for this.

  Outer frame and reinforcement for improving the mechanical strength (for example, bending rigidity, etc.) of the heat-dissipating sheet for the adhesive projection by setting the elastic modulus of the adhesive resin to 2 MPa to 3 Gpa, preferably 100 MPa to 2 GPa. It can also be used as a member. Examples of such a resin include thermoplastic polyimide, polycarbodiimide, and epoxy.

  Examples of the method for forming the bonding convex portion include a method in which an adhesive resin is directly applied to a metal plate so as to obtain a target pattern, or an adhesive resin sheet having a target pattern is prepared separately. The method of sticking by heating and pressurizing to a metal plate is mentioned.

Next, the heat radiating member of this invention is demonstrated.
The said heat radiating member replaces the metal plate of the heat radiating sheet of this invention with the heat radiator. More specifically, as shown in FIG. 3, heat conduction is performed in a part of the heat receiving surface 5a (FIG. 3B) of the radiator 5 in the same manner as the one-side structure essential to the heat dissipation sheet. A plurality of protrusions 1 made of a conductive material are formed, filled with a filling resin, and an adhesive projection is provided around the protrusion.
However, in the said heat radiating member, since the protrusion is directly provided in the heat acceptance surface of a heat radiator, the aspect at the back surface side of a heat radiator is not specifically limited. Depending on what kind of member the radiator is connected to, the mode on the back side may be appropriately determined.
The detailed description of the protrusions, the filling resin, the material of the bonding convexes, the shape, the positional relationship, and the like are all the same as the description of the heat dissipation sheet.
By forming the protrusion and the bonding function directly on a heat radiator such as a heat spreader, it is possible to reduce heat transfer loss due to contact resistance.

  Any heat dissipating member having a heat receiving surface, such as a heat spreader, a heat sink, and a housing of the apparatus, may be used as the heat radiator.

  The electronic component to be connected to the heat radiation sheet / heat radiation member of the present invention is not particularly limited, and examples thereof include a motor-driven device, etc.In particular, since the bare chip can directly discharge the heat accumulated in the device, The utility is particularly remarkable.

The semiconductor device according to the present invention is obtained by joining the heat-dissipating sheet / heat-dissipating member of the present invention to an electronic component, particularly a semiconductor element.
Examples of the semiconductor element include various integrated circuits such as a silicon chip. FIG. 4 is a schematic view of the heat dissipation sheet A illustrated in FIG. It is an example of a device configuration in which a conductive adhesive layer B is interposed.
4A, the protrusion side of the heat dissipation sheet A illustrated in FIG. 1B is joined to the semiconductor element C, and the other surface of the heat dissipation sheet A is interposed with the heat conductive adhesive layer B interposed therebetween. It is a device configuration example joined to a radiator H.
FIG. 4C shows an apparatus configuration example in which the heat dissipating member exemplified in FIG.

In this example, as shown in FIG. 1 (b), a heat radiating sheet having protrusions only on one side of a metal plate was actually manufactured and its performance was evaluated.
A 250 μm thick, 25 mm × 25 mm copper plate is used as the metal plate, and solder bumps (substantially spherical, outer diameter 470 μm, height from the plate surface 150 μm) are shown in FIG. They are arranged in a fine array pattern having an equilateral triangle as a minimum unit as in a). The pitch between the centers of adjacent bumps is 600 μm.

Next, as a filling resin, a polycarbodiimide film having a thickness of 120 μm, a shape of 20 mm × 20 mm, and a linear expansion coefficient of 80 ppm, using a hot roll laminator, a temperature of 100 ° C., a linear pressure of 3.5 [kg / cm ² ], Bonding was performed so as to cover the convex forming surface under the condition of a speed of 1000 rpm, and precuring was performed at 150 ° C. for 30 minutes, and the bumps were infiltrated and filled.
In this example, a polycarbodiimide film that protruded from the area of 18 mm × 18 mm to the entire periphery was used as a bonding convex portion.
Then, it grind | polished until the protrusion (solder bump) surface was exposed using water-resistant abrasive paper (No. 800), and obtained the thermal radiation sheet | seat of this invention. The height of the projections after polishing at this time (= the thickness of the filling resin is about 100 μm).
The evaluation of the heat dissipation sheet will be described later together with other examples and comparative examples.

In this example, in the aspect of Example 1, the adhesive convex portion was formed of a resin different from the filling resin.
As in Example 1, a 250 μm thick, 25 mm × 25 mm copper plate was used as the metal plate, and solder bumps were arranged in a fine array pattern in an 18 mm × 18 mm region on the main surface.

Next, as a filling resin, a polycarbodiimide film having a thickness of 120 μm and a shape of 18 mm × 18 mm, using a hot roll laminator, at a temperature of 100 ° C., a linear pressure of 3.5 kg / cm ² , and a speed of 1000 rpm. The layers were overlapped and bonded so as to coincide with the convex portion formation region, precured at 150 ° C. for 30 minutes, and permeated and filled between the bumps.

Next, a polycardiimide resin having a cross section of 1 mm in width and 120 μm in height is bonded to the entire periphery of the protrusion formation region using a hot roll laminator, and then further cured at 150 ° C. for 15 minutes, did.
Then, it grind | polished until the protrusion (solder bump) surface was exposed using water-resistant abrasive paper (No. 800), and obtained the thermal radiation sheet | seat of this invention. The height of the projections after polishing at this time (= the thickness of the filling resin is about 100 μm).
The evaluation of the heat dissipation sheet will be described later together with other examples and comparative examples.
Comparative Example 1

Comparative Example 1
In this comparative example, a heat radiating sheet was produced in the same manner as in Example 1 except that the outer peripheral adhesive projection was not provided. That is, a polycarbodiimide film having a shape of 18 mm × 18 mm is overlaid so as to coincide with the protruding region.

[Evaluation]
Using a thermal resistance measuring device, the thermal resistivity of each heat radiation sheet obtained in Examples 1 and 2 and the comparative example was measured. The thermal resistance measuring device is a device that measures the thermal resistivity of each heat radiating sheet by sandwiching the heat radiating sheet from both sides with a heater and a cooler and measuring the temperature gradient at that time.
Also, each heat-dissipating sheet is bonded to a silicon wafer using a flip chip bonder (the material of the bonding surface is silicon), and a high temperature side 125 ° C. to a low temperature side −55 ° C., one cycle 30 minutes, 1000 cycles heat cycle Then, the floating of the heat dissipation sheet from the edge of the IC bare chip was observed. For observation of floating of the heat dissipation sheet, an interface between the silicon wafer and the heat dissipation sheet was observed using an ultrasonic deep scratch device (SAT).
Table 1 shows the thermal resistivity [cm ² K / W] and the lift from the edge of each of the examples and comparative examples.

  As is apparent from Table 1 above, it was found that the example had a better adhesion effect on the end face of the silicon wafer than the comparative example.

  As described above, the heat-dissipating sheet / heat-dissipating structure of the present invention improves the heat conduction efficiency and, at the same time, has little deterioration in the adhesion state with respect to temperature changes. Therefore, it is possible to provide a heat dissipation structure that is more effective and highly reliable for electronic components.

It is sectional drawing which showed one structural example of the thermal radiation sheet | seat by this invention. Fig.1 (a) is the figure (top view) which looked at the main surface of the said heat-radiation sheet, FIG.1 (b) is XX sectional drawing of Fig.1 (a). FIGS. 1C and 1D are cross-sectional views showing various variations as an alternative configuration to FIG. It is the figure which showed the other structural example of the thermal radiation sheet | seat by this invention, Comprising: The shape of the adhesive convex part at the time of seeing the main surface of the said thermal radiation sheet is illustrated. It is sectional drawing which showed one structural example of the heat radiating member by this invention. It is sectional drawing which shows the structural example of the semiconductor device by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Protrusion 2 Filling resin 3 Adhesive convex part 4 Metal plate 5 Radiator

Claims (14)

A plurality of protrusions made of a heat conductive material are formed in a partial area of at least one plate surface of the metal plate,
In the rest of the region, a filling resin having adhesiveness and a linear expansion coefficient of 100 ppm or less is filled to a height substantially equal to the height of the protrusions,
A part of or all of the periphery of the region is provided with an adhesive convex portion having a height substantially the same as the height of the protrusion and having at least an upper surface made of an adhesive resin. Sheet.   The heat dissipation sheet according to claim 1, wherein the metal plate has a thickness of 15 μm to 2 mm.   The heat-radiation sheet according to claim 1, wherein the protrusion is formed in each of the regions on both plate surfaces of the metal plate.   The heat-dissipating sheet according to claim 3, wherein the filling resin is filled in each of the regions of both plate surfaces to a height substantially equal to the height of the protrusion.   The heat-radiation sheet according to claim 3 or 4, wherein the bonding convex portion is provided on a part or all of the periphery of each of the regions on both plate surfaces.   The heat-radiating sheet according to claim 1, wherein the thermally conductive filler is dispersed in the filling resin.   The heat dissipation sheet according to claim 1, wherein the mounting target of the heat dissipation sheet is a semiconductor element, and the outer peripheral shape of the metal plate is substantially the same as the outer peripheral shape of the semiconductor element.   The heat-radiating sheet according to claim 1, wherein the filling resin and the adhesive resin used for the bonding convex portion are different from each other.   The heat dissipation sheet according to claim 1, wherein the entire bonding convex portion is made of an adhesive resin, and the elastic modulus of the adhesive resin is 2 MPa to 2 GPa. A plurality of protrusions made of a heat conductive material are formed in a part of the heat receiving surface of the radiator,
In the rest of the region, a filling resin having adhesiveness and a linear expansion coefficient of 100 ppm or less is filled to a height substantially equal to the height of the protrusions,
A part of or all of the periphery of the region is provided with an adhesive convex portion having a height substantially the same as the height of the protrusion and having at least an upper surface made of an adhesive resin. Element.   The heat radiating member according to claim 10, wherein a thermally conductive filler is dispersed in the filling resin.   The heat radiating member according to claim 10, wherein the filling resin and the adhesive resin used for the bonding convex portion are different from each other.   The heat radiating member according to claim 10, wherein the entire bonding convex portion is made of an adhesive resin, and the elastic modulus of the adhesive resin is 2 MPa to 2 GPa.   The semiconductor device which has the structure by which the thermal radiation sheet in any one of the said Claims 1-9 or the thermal radiation member in any one of the said Claims 10-13 was mounted | worn with the semiconductor element.

Images