JP2005093787A - Device and method for processing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low cost and easily maintained device for processing a substrate, and to provide a method for processing the substrate. <P>SOLUTION: A resist can be discharged from a nozzle 57 to a processing surface Ga of a slanting LCD substrate G from, for instance, below to oblique above, that is, against gravitational force, and the resist is discharged so as to contact the surface Ga of the slanting LCD substrate G. This can provide a coating process by effectively applying a surface tension of the resist discharged from the discharging outlet 57d at a tip of the nozzle 57. Consequently, the amount of the wastefully dripping resin discharged from the discharging outlet 57d of the nozzle 57 can be decreased to realize a low cost. At this time, for instance, a simply structured nozzle 57 can be used to suppress a manufacturing cost of the nozzle 57, which realizes the low cost. Additionally, for instance, the nozzle 57 can be cleaned by inflowing a cleaning fluid to the discharging outlet 57d to simplify a maintenance of the nozzle 57. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a glass substrate used for a liquid crystal display device or the like.

  In the manufacture of LCD (Liquid Crystal Display) and the like, a photolithography technique similar to that used in the manufacture of semiconductor devices to form an ITO (Indium Tin Oxide) thin film or electrode pattern on a glass substrate for LCD Is used. In the photolithography technique, a photoresist is applied to a glass substrate, which is exposed and further developed.

Conventionally, when a glass substrate is increased in size, for example, in a state where the glass substrate is vertically fixed to the plate of the resist coating processing apparatus, the coating nozzle is moved up and down to apply the resist from the surface side of the glass substrate. . As a result, a resist film was formed on the surface of the glass substrate. The application nozzle used at this time was composed of complicated and plural parts. (For example, refer to Patent Document 1).
JP-A-7-112151 (paragraphs [0023], [0024], FIG. 6)

  However, the technique disclosed in Patent Document 1 has a problem that the coating nozzle is complicated and includes a plurality of parts, resulting in high costs and a complicated nozzle structure, which makes maintenance difficult.

  In addition, since the coating process is performed in a state where the processing surface of the substrate is vertical or the processing surface is directed upward, there is a problem that the resist tends to drip and a large amount of resist is wasted.

  In view of the above circumstances, an object of the present invention is to provide a substrate processing apparatus and a substrate processing method that are low in cost and easy to maintain.

  A further object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of preventing waste of processing liquid such as resist.

  In order to solve the above-described problems, a substrate processing apparatus according to the present invention is configured such that a holding mechanism capable of holding a substrate so that the processing surface of the substrate is inclined downward, and the outflowing processing liquid is in contact with the processing surface. A processing liquid supply mechanism having a nozzle disposed in proximity to the processing surface of the substrate held by the holding mechanism, and a drive unit for moving the nozzle along the processing surface of the substrate. It has.

  According to such a configuration, the processing liquid can flow out from the nozzle to the processing surface of the inclined substrate, for example, from the lower side to the upper side, that is, against the gravity. It flows out so that it may contact the process surface of the board | substrate which inclines. Thereby, the coating treatment can be performed by effectively using the surface tension of the treatment liquid flowing out from the tip of the nozzle. Therefore, it is possible to reduce the amount of the processing liquid that flows out from the tip of the nozzle and is wasted. This can also reduce the cost. At this time, for example, a nozzle having a simple structure having a substantially rectangular opening can be used. For this reason, it is possible to reduce the manufacturing cost of the nozzle and reduce the cost, and for example, it is possible to clean the nozzle by flowing a cleaning liquid into the nozzle, so that maintenance of the nozzle becomes easy.

  According to an aspect of the present invention, the nozzle has a discharge port that discharges the processing liquid, and is disposed below the lead-out portion and a lead-out portion that guides the processing liquid obliquely upward toward the discharge port. And a recovery unit for recovering the processing liquid flowing out from the discharge port. As a result, the treatment liquid guided obliquely upward toward the discharge port during the coating process and dripped from the discharge port can be recovered and reused by the recovery unit. Further, for example, by allowing the cleaning liquid to flow into the lead-out part, the inside of the lead-out part and the inside of the recovery part can be easily cleaned, so that maintenance becomes easy.

  According to an aspect of the present invention, the collection unit includes a receiving unit that is provided to protrude from the discharge port toward the substrate held by the holding mechanism and receives the processing liquid that has flowed out of the discharge port. It is characterized by that. Thereby, the processing liquid dripping from the discharge port can be reliably collected.

  According to an aspect of the present invention, the collection unit has a flow path for allowing the processing liquid flowing out from the discharge port to flow obliquely downward. Thereby, the process liquid collect | recovered by the collection | recovery part can be smoothly flowed diagonally downward by gravity.

  According to an aspect of the present invention, the opening surface of the discharge port has an inclination angle with respect to a vertical direction of 10 degrees to 20 degrees. Thereby, for example, when the inclination angle of the opening surface of the discharge port is less than 10 degrees or exceeds 20 degrees, it is possible to prevent the treatment liquid from being easily dripped.

  According to an aspect of the present invention, the holding mechanism holds the substrate with an inclination angle of the substrate with respect to a vertical direction of 10 degrees to 20 degrees. Thereby, for example, when the tilt angle of the substrate is less than 10 degrees or exceeds 20 degrees, it is possible to suppress the treatment liquid from being easily dripped. Further, for example, the inclination angle of the opening surface of the discharge port and the inclination angle of the processing surface of the substrate can be set to be the same. For this reason, for example, the dripping of the processing liquid can be more effectively suppressed by bringing the tip of the nozzle closer to the processing surface of the substrate.

  According to one aspect of the present invention, the holding mechanism includes means for varying an inclination angle of the substrate with respect to a vertical direction in accordance with the type of processing liquid applied on the substrate. As a result, for example, when the treatment liquid has a low viscosity, the dripping of the treatment liquid is suppressed by increasing the inclination angle, and when the treatment liquid has a large viscosity, the inclination angle is reduced, thereby allowing the treatment liquid to flow smoothly and efficiently. The coating process can be performed automatically. In the present invention, for example, the worker may input the angle setting of the holding mechanism in advance to the substrate processing apparatus in accordance with the type of the processing liquid and start the processing.

  According to an aspect of the present invention, the holding mechanism has a heating unit for heating the substrate. As a result, for example, at the time of applying the treatment liquid, the substrate can be heated to promote solidification of the treatment liquid, so that the waste of the treatment liquid can be reduced more effectively.

  According to an aspect of the present invention, the apparatus further includes a casing capable of sealing at least an atmosphere around the substrate held by the holding mechanism, and a nitrogen supply mechanism for making the inside of the casing have a nitrogen atmosphere. It is characterized by that. Thus, for example, when the treatment liquid is applied, the interior of the housing is set to a nitrogen atmosphere, so that the application treatment can be performed in a nitrogen atmosphere and the oxidation of the treatment liquid can be prevented.

  A substrate processing apparatus according to another aspect of the present invention includes a holding mechanism capable of holding the substrate so that the processing surface of the substrate is inclined downward, and a proximity to the processing surface of the substrate held by the holding mechanism. And a processing liquid supply mechanism having a nozzle provided with a discharge port for discharging the processing liquid so as to face the processing surface, and for moving the nozzle along the processing surface of the substrate The drive part is comprised.

  In the present invention, the nozzle discharge port is provided so as to be disposed in the vicinity of the processing surface of the substrate held by the holding mechanism and to face the processing surface. For this reason, for example, the processing liquid can flow out from the nozzle to the processing surface of the inclined substrate from the lower side to the upper side, that is, against gravity, and the processing liquid is inclined to the inclined surface. It can be allowed to flow out in contact with the processing surface. Thereby, the coating treatment can be performed by effectively using the surface tension of the treatment liquid flowing out from the tip of the nozzle. Therefore, it is possible to reduce the amount of the processing liquid that flows out from the tip of the nozzle and is wasted. This can also reduce the cost. At this time, for example, a nozzle having a simple structure having a substantially rectangular opening can be used. For this reason, it is possible to reduce the manufacturing cost of the nozzle and reduce the cost, and for example, it is possible to clean the nozzle by flowing a cleaning liquid into the nozzle, so that maintenance of the nozzle becomes easy.

  A substrate processing method according to the present invention includes a holding mechanism capable of holding a substrate, and a processing liquid supply mechanism having a nozzle disposed in proximity to a processing surface of the substrate held by the holding mechanism. A substrate processing method of a processing apparatus, comprising: (a) a step of holding a substrate by the holding mechanism; and (b) a step of tilting the substrate so that the processing surface faces downward after the step (a). (C) After the step (b), the step of applying the processing liquid to the processing surface by operating the driving unit and moving the nozzle from the upper side to the lower side along the processing surface. .

  Accordingly, since the substrate is tilted after being held by the holding mechanism, the substrate can be tilted so that the processing surface of the substrate faces downward. In addition, for example, the processing liquid can flow out from the nozzle obliquely upward, that is, against gravity, and further, the processing liquid flows out so as to contact the processing surface of the substrate inclined obliquely. . Thereby, the coating treatment can be performed by effectively using the surface tension of the treatment liquid flowing out from the tip of the nozzle. Therefore, it is possible to reduce the cost by reducing the amount of processing liquid that flows out from the tip of the nozzle and is wasted. At this time, for example, a nozzle having a simple structure can be used, so that the cost can be reduced and maintenance such as nozzle cleaning is facilitated. In addition, the nozzle is moved from the upper side to the lower side along the processing surface of the substrate for coating. For this reason, for example, when the nozzle is moved from the lower side to the upper side, the processing liquid being applied again drops on the surface of the processing liquid applied to the substrate, and the film thickness of the processing liquid is prevented from becoming uneven. Can do.

  According to an aspect of the present invention, the nozzle has a discharge port that discharges the processing liquid, and is disposed below the lead-out portion and a lead-out portion that guides the processing liquid obliquely upward toward the discharge port. A recovery unit for recovering the processing liquid flowing out from the discharge port, and a step of recovering a part of the processing liquid flowing out from the discharge port by the recovery unit in the middle of the step (c) Furthermore, it is characterized by comprising. As a result, it is possible to reduce the processing liquid that is wasted and dropped from the discharge port during the coating process. Further, for example, the inside of the recovery unit can be easily cleaned by allowing the cleaning liquid to flow into the lead-out unit.

  According to an aspect of the present invention, the method further includes a step of heating the substrate after the step (a) or the step (b). Thereby, solidification of a processing liquid can be accelerated | stimulated and the dripping of a processing liquid can further be suppressed.

  According to one aspect of the present invention, the step (c) is performed in a nitrogen atmosphere. Thereby, for example, oxidation of the treatment liquid can be prevented.

  According to the present invention, the cost of the substrate processing apparatus can be reduced, and maintenance is facilitated.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view showing a resist coating and developing apparatus for an LCD glass substrate according to an embodiment of the present invention.

  The resist coating and developing apparatus 100 includes a cassette station 1 on which a cassette C that houses a plurality of LCD substrates G is placed, and a plurality of processing units for performing a series of processes including resist coating and development on the LCD substrates G. A processing unit station 2 provided, and an interface station 3 for transferring the LCD substrate G to and from the exposure apparatus 4 are provided. At both ends of the processing unit station 2, a cassette station 1 and an interface station 3 are arranged. In FIG. 1, the longitudinal direction of the resist coating and developing apparatus 100 is defined as the X direction, and the direction orthogonal to the X direction on the plane is defined as the Y direction.

  The cassette station 1 includes a transport device 11 for carrying in and out the LCD substrate G between the cassette C and the processing unit station 2, and the cassette C is carried into and out of the cassette station 1. Further, the transfer device 11 has a transfer arm 11a, and can move on a transfer path 10 provided along the Y direction that is the arrangement direction of the cassette C. The transfer arm 11a allows the cassette C, the processing unit station 2, and the like to move. The LCD substrate G is carried in and out.

  The processing unit station 2 basically has two parallel rows of transfer lines A and B for transferring the LCD substrate G extending in the X direction. A scrub cleaning processing unit (SCR) 21, a first thermal processing unit section 26, a resist processing unit 23, and a second thermal processing unit section 27 from the cassette station 1 side toward the interface station 3 along the transfer line A. Are arranged. In addition, the second thermal processing unit section 27, the development processing unit (DEV) 24, the i-ray UV irradiation unit (i-UV) 25, and the second one from the interface station 3 side toward the cassette station 1 along the transfer line B. Three thermal processing unit sections 28 are arranged. An excimer UV irradiation unit (e-UV) 22 is provided on a part of the scrub cleaning unit (SCR) 21. An excimer UV irradiation unit (e-UV) 22 is provided to remove organic substances on the LCD substrate G prior to scrubber cleaning, and an i-line UV irradiation unit (i-UV) 25 performs a decoloring process for development. Provided.

  The scrub cleaning unit (SCR) 21 performs a cleaning process and a drying process while the LCD substrate G is transported without being rotated as in the prior art. The development processing unit (DEV) 24 also performs the application of the developer, the developer cleaning after the development, and the drying process while being transported without rotating the LCD substrate G therein. In the scrub cleaning processing unit (SCR) 21 and the development processing unit (DEV) 24, the LCD substrate G is transported by, for example, roller transport or belt transport, and the carry-in port and the carry-out port of the LCD substrate G face each other. It is provided on the short side. Further, the conveyance of the LCD substrate G to the i-line UV irradiation unit (i-UV) 25 is continuously performed by a mechanism similar to the conveyance mechanism of the development processing unit (DEV) 24.

  The resist processing unit 23 includes a resist coating processing device (CT) 23a for coating a resist solution on the LCD substrate G, a vacuum drying device (VD) 23b for drying the resist film formed on the LCD substrate G under reduced pressure, and A peripheral resist removing device (ER) 23c for removing excess resist adhering to the peripheral edge of the LCD substrate G by a solvent discharge head capable of scanning four sides of the LCD substrate G placed on a stage not shown is arranged in that order. ing. The resist processing unit 23 is provided with a carry-in port and a carry-out port for the LCD substrate G on opposite short sides, and the LCD substrate G can be delivered by a conveyance roller (not shown).

  The first thermal processing unit section 26 includes two thermal processing unit blocks (TB) 31 and 32 configured by stacking thermal processing units that perform thermal processing on the LCD substrate G. The thermal processing unit block (TB) 31 is provided on the scrub cleaning processing unit (SCR) 21 side, and the thermal processing unit block (TB) 32 is provided on the resist processing unit 23 side. A first transfer device 33 is provided between the two thermal processing unit blocks (TB) 31 and 32. As shown in the side view of FIG. 2, the thermal processing unit block (TB) 31 performs a dehydration baking process on the pass unit (PASS) 61 that transfers the LCD substrate G in order from the bottom and the LCD substrate G 2. The dehydration bake units (DHP) 62 and 63 and the adhesion processing unit (AD) 64 that performs the hydrophobic treatment on the LCD substrate G are stacked in four stages, and the thermal processing unit block (TB) 32 includes , A pass unit (PASS) 65 for transferring the LCD substrate G in order from the bottom, two cooling units (COL) 66 and 67 for cooling the LCD substrate G, and an adhesion processing unit for applying a hydrophobic treatment to the LCD substrate G ( AD) 68 is stacked in four stages. The first transfer device 33 receives the LCD substrate G from the scrub cleaning processing unit (SCR) 21 via the pass unit (PASS) 61, carries in and out the LCD substrate G between the thermal processing units, and passes. The LCD substrate G is transferred to the resist processing unit 23 through the unit (PASS) 65.

  The first transport device 33 includes a guide rail 91 that extends vertically, a lifting member 92 that moves up and down along the guide rail 91, a base member 93 that can pivot on the lifting member 92, and a base member 93. It has a substrate holding arm 94 that is provided so as to be able to move forward and backward and holds the LCD substrate G. The elevating member 92 is moved up and down by the motor 95, the base member 93 is turned by the motor 96, and the substrate holding arm 94 is moved back and forth by the motor 97. Since the first transfer device 33 is provided so as to be able to move up and down, move back and forth, and turn as described above, it can access any of the thermal processing unit blocks (TB) 31 and 32.

  The second thermal processing unit section 27 includes two thermal processing unit blocks (TB) 34 and 35 configured by stacking thermal processing units for performing thermal processing on the LCD substrate G. The thermal processing unit block (TB) 34 is provided on the resist processing unit 23 side, and the thermal processing unit block (TB) 35 is provided on the development processing unit (DEV) 24 side. A second transport device 36 is provided between the two thermal processing unit blocks (TB) 34 and 35. As shown in the side view of FIG. 3, the thermal processing unit block (TB) 34 includes a pass unit (PASS) 69 for transferring the LCD substrate G in order from the bottom, and three units for performing pre-baking processing on the LCD substrate G. The pre-bake units (PREBAKE) 70, 71, 72 are stacked in four stages, and the thermal processing unit block (TB) 35 is a pass unit (PASS) 73 that transfers the LCD substrate G in order from the bottom, LCD The cooling unit (COL) 74 that cools the substrate G and the two pre-baking units (PREBAKE) 75 and 76 that pre-bake the LCD substrate G are stacked in four stages. The second transfer device 36 receives the LCD substrate G from the resist processing unit 23 through the pass unit (PASS) 69, carries in and out the LCD substrate G between the thermal processing units, and passes the pass unit (PASS) 73. The LCD substrate G is transferred to the development processing unit (DEV) 24 via the interface, and the LCD substrate G is transferred to and received from an extension / cooling stage (EXT / COL) 44 which is a substrate transfer portion of the interface station 3 described later. Do. The second transfer device 36 has the same structure as the first transfer device 33 and can access either of the thermal processing unit blocks 34 and 35.

  The third thermal processing unit section 28 includes two thermal processing unit blocks (TB) 37 and 38 configured by stacking thermal processing units for performing thermal processing on the LCD substrate G. The thermal processing unit block (TB) 37 is provided on the development processing unit (DEV) 24 side, and the thermal processing unit block (TB) 38 is provided on the cassette station 1 side. A third transfer device 39 is provided between the two thermal processing unit blocks (TB) 37 and 38. As shown in the side view of FIG. 4, the thermal processing unit block (TB) 37 performs a pass unit (PASS) 77 for transferring the LCD substrate G in order from the bottom, and performs post-baking processing on the LCD substrate G 3 Four post-bake units (POBAKE) 78, 79, and 80 are stacked, and the thermal processing unit block (TB) 38 is transferred from the bottom to the post-bake unit (POBAKE) 81 and the LCD substrate G. In addition, a pass / cooling unit (PASS / COL) 82 for performing cooling and two post-baking units (POBAKE) 83 and 84 for performing post-baking processing on the LCD substrate G are laminated in four stages. The third transport device 39 receives the LCD substrate G from the i-ray UV irradiation unit (i-UV) 25 via the pass unit (PASS) 77, and carries the LCD substrate G in and out of the thermal processing unit. Then, the LCD substrate G is transferred to the cassette station 1 through the pass / cooling unit (PASS / COL) 82. The third transfer device 39 has the same structure as the first transfer device 33 and can access any unit of the thermal processing unit blocks (TB) 37 and 38.

  Note that the LCD substrate G is carried into the scrub cleaning unit (SCR) 21 and the excimer UV irradiation unit (e-UV) 22 by the transport device 11 of the cassette station 1. Further, as described above, the LCD substrate G of the scrub cleaning processing unit (SCR) 21 is carried out to the pass unit (PASS) 61 of the thermal processing unit block (TB) 31 by, for example, roller conveyance, and a pin (not shown) is projected there. Thus, the lifted LCD substrate G is transported by the first transport device 33. In addition, the LCD substrate G is carried into the resist processing unit 23 from the carry-in entrance after the LCD substrate G is transferred to the pass unit (PASS) 65 by the first transfer device 33. In the resist processing unit 23, the LCD substrate G is transferred to the pass unit (PASS) 69 of the thermal processing unit block (TB) 34 through the carry-out port, and the LCD substrate G is placed on pins (not shown) protruding there. Is carried out. When the LCD substrate G is carried into the development processing unit (DEV) 24, a pin (not shown) protrudes in the pass unit (PASS) 73 of the thermal processing unit block (TB) 35 to lower the substrate from the raised state. Thus, for example, the roller transport mechanism extended to the pass unit (PASS) 73 is operated. The LCD substrate G of the i-line UV irradiation unit (i-UV) 25 is, for example, transported to the pass unit (PASS) 77 of the thermal processing unit block (TB) 37 by roller conveyance, and a pin (not shown) is projected there. The lifted LCD substrate G is transported by the third transport device 39. Further, the LCD substrate G after the completion of all the processes is transported to the pass cooling unit (PASS / COL) 82 of the thermal processing unit block (TB) 38 and unloaded by the transport device 11 of the cassette station.

  In the processing unit station 2, the processing units and the transport devices are arranged so as to constitute the two rows of transport lines A and B as described above and basically in the order of processing. , B is provided with a space 40. A shuttle (substrate mounting member) 41 is provided to be able to reciprocate in the space 40. The shuttle 41 is configured to be able to hold the LCD substrate G, and the LCD substrate G can be transferred between the transfer lines A and B.

  The interface station 3 includes a transfer device 42 that loads and unloads the LCD substrate G between the processing unit station 2 and the exposure device 4, a buffer stage (BUF) 43 that places a buffer cassette, and a cooling function. And an extension / cooling stage (EXT / COL) 44, which is a substrate transfer unit, and an external device block 45 in which a titler (TITLER) and a peripheral exposure device (EE) are vertically stacked is provided on the transfer device 42. Adjacent to each other. The transfer device 42 includes a transfer arm 42 a, and the LCD substrate G is carried in and out between the processing unit station 2 and the exposure device 4 by the transfer arm 42 a.

  In the resist coating and developing apparatus 100 configured as described above, first, the LCD substrate G in the cassette C disposed in the cassette station 1 is transferred to the excimer UV irradiation unit (e-UV) of the processing unit station 2 by the transport apparatus 11. ) 22 and is subjected to scrub pretreatment. Next, the LCD device G is carried into the scrub cleaning processing unit (SCR) 21 disposed under the excimer UV irradiation unit (e-UV) 22 and scrubbed by the transfer device 11. In this scrub cleaning, the cleaning process and the drying process are performed while the LCD substrate G is transported without being rotated as in the prior art. As a result, two rotary type scrubber cleaning processing units are conventionally provided. The same processing power that was used can be realized in less space. After the scrub cleaning process, the LCD substrate G is carried out to the pass unit (PASS) 61 of the thermal processing unit block (TB) 31 belonging to the first thermal processing unit section 26 by, for example, roller conveyance.

  The LCD substrate G disposed in the pass unit (PASS) 61 is lifted by protruding a pin (not shown), and is transported to the first thermal processing unit section 26 to be subjected to the following series of processes. That is, first, it is transferred to one of the dehydration bake units (DHP) 62 and 63 of the thermal processing unit block (TB) 31 and subjected to heat treatment, and then the cooling unit of the thermal processing unit block (TB) 32 ( (COL) 66, 67, and after being cooled, an adhesion processing unit (AD) 64 of a thermal processing unit block (TB) 31 and a thermal processing unit block ( TB) is transported to one of 32 adhesion processing units (AD) 68, where it is subjected to adhesion processing (hydrophobization processing) by HMDS, and then transported to one of the cooling units (COL) 66, 67 to be cooled. Furthermore, the pass unit (PA) of the thermal processing unit block (TB) 32 S) is conveyed to the 65. At this time, all the conveyance processing is performed by the first conveyance device 33. In some cases, the adhesion process is not performed. In this case, the LCD substrate G is immediately transferred to the pass unit (PASS) 65 after dehydration baking and cooling.

  Thereafter, the LCD substrate G disposed in the pass unit (PASS) 65 is carried into the resist processing unit 23 by, for example, a conveyance roller. The LCD substrate G is first transported to a resist coating processing device (CT) 23a therein, where a resist solution is applied to the LCD substrate G, and then transported to a vacuum drying device (VD) 23b by a transport roller. It is dried under reduced pressure, and further conveyed to a peripheral resist removing device (ER) 23c by a conveying roller to remove excess resist on the peripheral edge of the LCD substrate G. Then, after the peripheral edge resist removal is completed, the LCD substrate G is unloaded from the resist processing unit 23 by the transport roller. As described above, the decompression drying device (VD) 23b is provided after the resist coating processing device (CT) 23a. If this is not provided, the LCD substrate G coated with the resist is pre-baked or developed. After the post-baking process, the shapes of lift pins, fixing pins, etc. may be transferred to the LCD substrate G. In this way, by drying under reduced pressure without heating by a reduced pressure drying apparatus (VD), It is effective that the solvent is gradually released and the drying of the resist can be promoted without adversely affecting the resist without causing a rapid drying as in the case of drying by heating. This is because it can be prevented.

  The coating process is completed in this way, and the LCD substrate G carried out of the resist processing unit 23 by the transport roller is passed through the pass unit (TB) 34 of the thermal processing unit block (TB) 34 belonging to the second thermal processing unit section 27. PASS) 69. The LCD substrate G placed in the pass unit (PASS) 69 is pre-baked (PREBAKE) 70, 71, 72 of the thermal processing unit block (TB) 34 and the thermal processing unit block ( TB) is transported to one of the pre-baking units (PREBAKE) 75 and 76 of 35 and pre-baked, and then transported to the cooling unit (COL) 74 of the thermal processing unit block (TB) 35 to be cooled to a predetermined temperature. . Then, it is further transported by the second transport device 36 to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35.

  Thereafter, the LCD substrate G is transported to the extension / cooling stage (EXT / COL) 44 of the interface station 3 by the second transport device 36, and the peripheral exposure device (EE) of the external device block 45 is transported by the transport device 42 of the interface station 3. Then, exposure for removing the peripheral resist is performed, and then transported to the exposure device 4 by the transport device 42, where the resist film on the LCD substrate G is exposed to form a predetermined pattern. In some cases, the LCD substrate G is accommodated in a buffer cassette on the buffer stage (BUF) 43 and then conveyed to the exposure device 4.

  After the exposure is finished, the LCD substrate G is carried into the upper titler (TITLER) of the external device block 45 by the transfer device 42 of the interface station 3 and predetermined information is written on the LCD substrate G, and then the extension cooling stage (EXT) -COL) 44, from which it is carried into the processing unit station 2 again. That is, the LCD substrate G is transferred by the second transfer device 36 to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35 belonging to the second thermal processing unit section 27. Then, in the pass unit (PASS) 73, pins are projected to lower the LCD substrate G from the raised state, thereby extending from the development processing unit (DEV) 24 to the pass unit (PASS) 73, for example, roller transport. By operating the mechanism, the LCD substrate G is carried into the development processing unit (DEV) 24 and subjected to development processing. In this development processing, the LCD substrate G is not rotated as in the prior art, and for example, while being conveyed by roller conveyance, the developer application, the developer removal after development, and the drying treatment are performed. Conventionally, the same processing capability as using three rotation type development processing units can be realized in a smaller space.

  After completion of the development processing, the LCD substrate G is roller-transferred to the i-line UV irradiation unit (i-UV) 25 by a transfer mechanism continuous from the development processing unit (DEV) 24, for example, roller transfer, and the LCD substrate G is decolorized. Is given. After that, the LCD substrate G is transferred to a pass unit (TB) 37 of the thermal processing unit block (TB) belonging to the third thermal processing unit section 28 by a transport mechanism in the i-ray UV irradiation unit (i-UV) 25, for example, roller transport. PASS) 77.

  The LCD substrate G disposed in the pass unit (PASS) 77 is transferred to the post processing unit block (POBAKE) 78, 79, 80 of the thermal processing unit block (TB) 37 and the thermal processing unit block ( TB) is transferred to one of post-baking units (POBAKE) 81, 83, 84 of 38 and post-baked, and then transferred to a pass cooling unit (PASS / COL) 82 of thermal processing unit block (TB) 38. After being cooled to a predetermined temperature, it is accommodated in a predetermined cassette C disposed in the cassette station 1 by the transfer device 11 of the cassette station 1.

  FIG. 5 is a cross-sectional view of the resist coating apparatus (CT) 23a. The resist coating processing apparatus (CT) 23a supplies a resist to the processing surface Ga of the LCD substrate G and a holding mechanism 50A that can hold the LCD substrate G so that the processing surface Ga of the LCD substrate G is inclined downward. And a nozzle driving unit 55C having, for example, an air cylinder and a motor 55d for moving the nozzle 57 along the nozzle guide plate 55.

  The holding mechanism 50A is a chuck plate 51 for holding the LCD substrate G, a rotation motor 51c for rotating the chuck plate 51 around the rotation shaft 51a, and for fixing the LCD substrate G from the processing surface Ga side. And a vacuum pump 58 for adsorbing the LCD substrate G to the chuck plate 51.

  The chuck plate 51 is provided with a rotation shaft 51a extending in the X direction, and the chuck plate 51 is configured to be rotatable around the rotation shaft 51a. The chuck plate 51 is rotated around the rotation shaft 51a by, for example, a rotation motor 51c. The chuck plate 51 can be changed so that the inclination angle θ with respect to the vertical direction is not less than 10 degrees and not more than 20 degrees. That is, the processing surface Ga of the LCD substrate G held on the chuck plate 51 has an inclination angle of 10 degrees or more and 20 degrees or less with respect to the vertical direction. The inclination angle θ during the resist coating process is determined in accordance with the type (viscosity), film thickness, and the like of the resist coated on the LCD substrate G.

  A through hole 51 b is formed in the approximate center of the chuck plate 51. The through hole 51b is connected to the vacuum pump 58 via a conducting tube, for example. The LCD substrate G on the chuck plate 51 is attracted to the chuck plate 51 by driving the vacuum pump 58.

  For example, clips 53 for holding four corners on the processing surface Ga side of the LCD substrate G are provided on the chuck plate 51 so as to be position-adjustable. By adjusting the position of the clip 53, the LCD substrate G can be held from the processing surface Ga side.

  A plurality of transport rollers 52 a for transporting the LCD substrate G are rotatably disposed on the chuck plate 51. The LCD substrate G is transported from the upstream process by the transport roller 52 a and placed on the chuck plate 51.

  Therefore, the LCD substrate G is attracted to the chuck plate 51 by the vacuum pump 58 and vacuum chucked. For this reason, the LCD substrate G is held by the chuck plate 51 even when the inclination angle of the LCD substrate G becomes 10 degrees or more and 20 degrees or less at the time of resist application.

  In the chuck plate 51, for example, a heater 54 for heating the adsorbed LCD substrate G is embedded. For example, the control unit T controls the number of rotation pulses of the rotation motor 51c, the rotation speed of the transport roller 52a, the timing, the temperature of the heater 54, the pressure of the vacuum pump 58, and the like.

  The resist supply mechanism 50B has a plate-like nozzle guide plate 55 for guiding the nozzle 57 along the processing surface Ga of the LCD substrate G, and a rotation motor 55c for rotating the nozzle guide plate 55 around the rotation shaft 55a. And a resist supply section 49 for supplying a resist to the nozzle 57.

  The nozzle guide plate 55 is disposed at a position separated from the chuck plate 51 by a predetermined distance, which will be described later, and has, for example, a rotation shaft 55a at the lower end. In the nozzle guide plate 55, for example, a rotation motor 55c for rotating the nozzle guide plate 55 around a rotation shaft 55a is disposed. By driving the rotation motor 55c, the nozzle guide plate 55 can be rotated around the rotation shaft 55a. The inclination angle of the nozzle guide plate 55 with respect to the vertical direction can be changed so as to be substantially parallel to the LCD substrate G during the resist coating process.

  A nozzle 57 is provided on the nozzle guide plate 55 so as to be movable along the processing surface Ga of the LCD substrate G. The nozzle 57 is connected to a resist supply unit 49 described later for supplying a resist to the nozzle 57. The control unit T controls the number of rotation pulses of the rotation motor 55c and the drive timing of the registration supply unit 49, for example, a pump described later.

  The air cylinder and the motor 55d of the nozzle driving unit 55C are provided in the nozzle guide plate 55, for example. The nozzle 57 is configured to be movable obliquely downward from above via, for example, a belt (not shown) by driving the motor 55d. Driving of the air cylinder and the motor 55d is controlled by the control unit T.

  The periphery of the LCD substrate G held on the chuck plate 51 by the housing 50 is sealed. The housing 50 is connected to a nitrogen supply mechanism 47 for making the inside of the housing 50 a nitrogen atmosphere, for example. The nitrogen supply mechanism 47 has, for example, a vacuum pump and a nitrogen cylinder (not shown). For example, the inside of the housing 50 can be evacuated by this vacuum pump, and the inside of the housing 50 can be made a nitrogen atmosphere by a nitrogen cylinder.

  FIG. 6 is an external perspective view of the nozzle 57 of the resist coating apparatus (CT) 23a. As shown in FIG. 6, the nozzle 57 has a discharge port 57d for discharging a resist, a lead-out portion 57a that guides the resist obliquely upward from below toward the discharge port 57d, and a lead-out that is arranged below the lead-out portion 57a. And a recovery part 57b for recovering the resist flowing out from the discharge port 57d of the part 57a. The nozzle 57 has a substantially V-shaped cross section by a lead-out portion 57a and a recovery portion 57b. The width of the nozzle 57 (the length in the X direction) is set to be substantially equal to the coating width of the LCD substrate G, for example.

  FIG. 7 is a side view of the nozzle 57 of the resist coating apparatus (CT) 23a. As shown in FIG. 7, the length of the lead-out portion 57a in the direction of leading out the resist is set so that the resist S flowing out from the discharge port 57d of the lead-out portion 57a is applied in contact with the processing surface Ga of the LCD substrate G. Has been. The distance between the chuck plate 51 and the nozzle guide plate 55 is set to match this length. The opening surface 57c of the discharge port 57d has an inclination angle θ with respect to the vertical direction set to 10 degrees or more and 20 degrees or less. By the rotation motor 51c, the inclination angle θ of the opening surface 57c of the discharge port 57d and the inclination angle of the processing surface Ga of the LCD substrate G can be set to be the same. The inclination angle θ1 of the lead-out portion 57a with respect to the horizontal plane is set to, for example, 10 degrees or more and 20 degrees or less. The collection unit 57b is inclined at an inclination angle θ2 with respect to the horizontal plane (θ1> θ2> 0). The opening surface 57c of the discharge port 57d is inclined so as to face the processing surface Ga of the LCD substrate G. In addition, although the example in which the inclination angle of the LCD substrate G and the inclination angle θ of the opening surface 57c are the same is shown, it is not necessary that the both angles be exactly the same, as long as they are arranged to face each other to some extent. Good.

  The collection unit 57b is provided to protrude from the discharge port 57d toward the LCD substrate G held on the chuck plate 51. Thereby, the resist S flowing out from the discharge port 57d can be reliably recovered. A receiving port 57h for preventing the resist S from overflowing from the recovery part 57b is formed at the tip of the recovery part 57b. Thereby, the resist S flowing out from the discharge port 57d can be reliably received by the receiving port 57h. The recovery part 57b is formed with a flow path 57r for allowing the resist flowing out from the discharge port 57d and received by the receiving port 57h to flow obliquely downward. The movement speed of the nozzle 57, the resist type, the film thickness, the inclination angles θ, θ1, and the like are adjusted so that the resist does not drip during the resist coating process.

  The resist supply unit 49 includes a resist tank 60a for storing resist and a resist collection tank 60b for temporarily storing the resist collected by the collection unit 57b. The resist tank 60a is connected to the lead-out portion 57a through a resist supply tube 59a. The resist collection tank 60b is connected to the collection unit 57b through a resist collection tube 59b. The resist tank 60a and the resist collection tank 60b are connected by a connecting tube. The resist is supplied from the resist tank 60a to the lead-out portion 57a by a pump or the like not shown. In addition, the resist can be supplied from the resist collection tank 60b to the resist tank 60a by a pump (not shown).

  Next, the operation of the resist coating apparatus (CT) 23a will be described with reference to FIG.

  First, as shown in FIG. 8A, the LCD substrate G transported by the transport roller 52 a is received by the chuck plate 51. At this time, the chuck plate 51 is disposed so that the processing surface Ga of the LCD substrate G faces upward, for example. Next, the vacuum pump 58 is operated to attract the LCD substrate G to the chuck plate 51, and the LCD substrate G is fixed to the chuck plate 51 from the clip 53. Next, the heater 54 in the chuck plate 51 is heated.

  Subsequently, as shown in FIG. 8B, the rotation motor 51c is driven to rotate the chuck plate 51 around the rotation shaft 51a, and the inclination angle θ of the chuck plate 51 with respect to the vertical direction is 10 degrees or more. 20 degrees or less. Thereby, the inclination angle θ of the LCD substrate G and the inclination angle of the nozzle guide plate 55 are substantially the same. The LCD substrate G is inclined with the processing surface Ga facing downward, and the processing surface Ga is close to the opening surface 57 c of the nozzle 57. Note that the heater 54 in the chuck plate 51 may be heated after the chuck plate 51 is tilted.

  Next, as shown in FIG. 8C, a pump (not shown) is driven to supply the resist in the resist tank 60a to the lead-out portion 57a of the nozzle 57 through the resist supply tube 59a. Subsequently, the motor 55d is driven to move the nozzle 57 along the chuck plate 51 from above to below (in the direction of the arrow). As a result, the resist is applied on the processing surface Ga of the LCD substrate G with a constant film thickness. At this time, the resist S dripping from the discharge port 57d of the lead-out part 57a is received by the receiving port 57h of the recovery part 57b and recovered into the resist tank 60a via the resist recovery tube 59b and the resist recovery tank 60b.

  When the discharge of the resist is completed, the motor 55d is driven to return the nozzle 57 to the initial setting position shown in FIG. Then, the rotation motor 51a is driven to tilt the chuck plate 51 so that the processing surface Ga of the LCD substrate G faces upward, and the transport roller 52a of the chuck plate 51 is driven to transport the LCD substrate G to the next step.

  As described above, according to the present embodiment, the resist can flow out from the nozzle 57 to the processing surface Ga of the inclined LCD substrate G, for example, from the lower side to the upper side, that is, against the gravity, The resist flows out so as to come into contact with the processing surface Ga of the LCD substrate G inclined obliquely. Thereby, the coating process can be performed by effectively using the surface tension of the resist flowing out from the discharge port 57d at the tip of the nozzle 57. Therefore, it is possible to reduce the cost by reducing the amount of resist that flows out from the discharge port 57d of the nozzle 57 and is wasted. At this time, for example, a nozzle 57 having a simple structure can be used. For this reason, the manufacturing cost of the nozzle 57 can be suppressed and the cost can be reduced. Further, for example, since the nozzle 57 can be cleaned by flowing a cleaning liquid into the discharge port 57d, maintenance of the nozzle 57 is facilitated.

  According to the present embodiment, the nozzle 57 has the lead-out part 57a and the recovery part 57b. Thereby, the resist dripping from the discharge port 57d of the lead-out part 57a during the coating process can be recovered and reused by the recovery part 57b. For example, the inside of the discharge outlet 57d and the inside of the collection | recovery part 57 can be wash | cleaned easily by making a washing | cleaning liquid flow in into the derivation | leading-out part 57a. Accordingly, the maintenance time of the nozzle 57 and the device adjustment time can be shortened, so that the cost can be reduced.

  According to the present embodiment, the opening surface 57c of the lead-out portion 57a has an inclination angle θ with respect to the vertical direction set to 10 degrees or more and 20 degrees or less. Thereby, for example, when the inclination angle θ is less than 10 degrees or exceeds 20 degrees, it is possible to prevent the resist from being easily dripped. For example, as shown in FIG. 9, a force having a magnitude Sg works vertically downward on the resist flowing out from the discharge port 57 d of the nozzle 57. When the force of magnitude Sg is decomposed into a component Sv obliquely downward along the LCD substrate G and a component St in a direction perpendicular to the processing surface Ga, compared to the case where the LCD substrate G is arranged vertically. The size of the component Sv is reduced. That is, by applying the coating process with the LCD substrate G inclined, it is possible to prevent the resist from dripping along the inclined LCD substrate G while utilizing the surface tension of the resist.

  According to the present embodiment, the chuck plate 51 is configured to be able to change the inclination angle θ around the rotation shaft 51a. Thus, for example, when the resist film thickness is large, the tilt angle θ is increased to suppress resist dripping, and when the resist film thickness is small, the tilt angle θ is decreased to smoothly flow the resist and apply efficiently. Processing can be performed.

  According to this embodiment, after the chuck plate 51 is tilted so that the processing surface Ga of the LCD substrate G faces downward, the chuck plate 51 is heated by the heater 54. As a result, the temperature of the LCD substrate G can be raised via the chuck plate 51, and solidification of the resist can be promoted to suppress resist dripping. Accordingly, it is possible to further reduce the amount of resist that is wasted during the coating process and to reduce the cost of the coating process.

  According to this embodiment, a resist is applied to the LCD substrate G in a nitrogen atmosphere. Thereby, for example, oxidation of the resist flowing out from the discharge port 57d of the nozzle 57 can be prevented. Accordingly, a resist-coated LCD substrate G with higher quality can be obtained. Moreover, since the oxidation of the resist recovered by the recovery unit 57b can be prevented, the quality of the resist that is reused can be maintained.

  According to the present embodiment, the resist is applied by moving the nozzle 57 from above to below along the processing surface Ga of the LCD substrate G. For this reason, for example, when the nozzle 57 is moved from the lower side to the upper side, the resist being applied again drops on the surface of the resist applied to the processing surface Ga of the LCD substrate G, and the film thickness of the resist becomes non-uniform. Can be avoided.

  According to the present embodiment, the collection part 57b is inclined at an inclination angle θ2 (θ2> 0) with respect to the horizontal plane. Further, a flow path 57r is formed in the recovery part 57b. For this reason, the resist received at the receiving port 57h can be caused to flow along the flow path 57r using gravity and smoothly guided into the resist collection tank 60b.

  According to the present embodiment, the tilt angle θ of the opening surface 57c of the nozzle 57 and the tilt angle of the processing surface Ga of the LCD substrate G can be set to be the same by the rotation motor 51c. Thereby, for example, by setting the opening surface 57c of the nozzle 57 to be close to the processing surface Ga of the LCD substrate G, resist dripping can be more effectively suppressed.

  According to the present embodiment, the collection unit 57 b is provided so as to protrude from the discharge port 57 d toward the LCD substrate G held by the chuck plate 51. Thereby, the resist dripping vertically downward by gravity can be reliably received by the receiving port 57h.

  The present invention is not limited to the embodiments described above, and various modifications are possible.

  In the present embodiment, an example in which the nozzle 57 having a substantially V-shaped cross section shown in FIG. 7 is used has been described. However, the shape of the nozzle is not limited to this. For example, as shown in FIG. 10, a lead-out portion 57f having the same shape as the lead-out portion 57a shown in FIG. 7 and a collection for collecting the resist flowing out from the lead-out portion 57f You may use the nozzle 57A comprised so that the part 57g might become substantially parallel. By doing in this way, since the structure of a nozzle becomes simpler, the cost reduction of a nozzle can be achieved.

  In the present embodiment, an example in which the resist collection tube 59b is connected to the resist collection tank 60b is shown. However, the resist collection tube 59b may be directly connected to the resist tank 60a without going through the resist collection tank 60b. In this way, the resist collection tank 60b is not necessary, and the cost can be further reduced.

  In this embodiment, the example which fixes the nozzle 57 to the nozzle guide plate 55 was shown so that the longitudinal direction of the nozzle 57 shown in FIG. However, the nozzle 57 may be fixed to the nozzle guide plate 55 so that the longitudinal direction of the nozzle is the vertical direction of the nozzle guide plate 55, and the nozzle 57 may be moved in the X direction (substantially horizontal direction) during resist application. . Even in this case, the resist can be applied to the LCD substrate G using the nozzle 57 having a simple structure.

  In the present embodiment, as shown in FIG. 5, an example in which the conveyance roller 52 a is disposed on the chuck plate 51 is shown. However, the transport roller 52a is not always necessary. For example, the substrate G may be transported by a substrate transport sub-arm in the upstream and downstream processes. Even in this way, the substrate G can be similarly transported.

1 is a plan view showing an overall configuration of a resist coating and developing treatment apparatus according to an embodiment of the present invention. It is a side view showing the 1st thermal processing unit section of the resist application development processing device concerning the embodiment of the present invention. It is a side view which shows the 2nd thermal processing unit section of the resist coating and developing processing apparatus which concerns on embodiment of this invention. It is a side view which shows the 3rd thermal processing unit section of the resist coating and developing processing apparatus which concerns on embodiment of this invention. It is sectional drawing which shows the resist coating processing apparatus (CT) of a resist coating development processing apparatus. It is an external appearance perspective view which shows the nozzle of a resist coating processing apparatus (CT). It is a side view which shows the resist supply mechanism of a resist coating processing apparatus (CT). It is sectional drawing which shows the resist coating process sequence using the resist coating processing apparatus (CT) which concerns on embodiment of this invention. It is a side view which shows the force which acts on the resist which flows out from the front-end | tip of the nozzle of a resist coating processing apparatus (CT). It is sectional drawing which shows the modification of the nozzle of a resist coating processing apparatus (CT).

Explanation of symbols

G ... LCD substrate Ga ... processing surface .theta .... tilt angle CT ... resist coating processing apparatus T ... control unit 47 ... nitrogen supply mechanism 50 ... casing 50A ... holding mechanism 50B ... resist supply mechanism 50C ... nozzle drive unit 51 ... chuck plate 51a Rotating shaft 51c Rotating motor 54 Heater 55C Nozzle drive unit 55d Motor 57, 57A Nozzle 57a Deriving unit 57b Recovery unit 57c Opening surface 57d Ejection port 57h Receiving port 57r Flow channel 100 Resist coating and developing equipment

Claims (14)

A holding mechanism capable of holding the substrate so that the processing surface of the substrate is inclined downward,
A processing liquid supply mechanism having a nozzle disposed in proximity to the processing surface of the substrate held by the holding mechanism so that the outflowing processing liquid is in contact with the processing surface;
And a drive unit for moving the nozzle along the processing surface of the substrate. The substrate processing apparatus according to claim 1,
The nozzle is
A discharge port that discharges the treatment liquid, and a lead-out portion that guides the treatment liquid obliquely upward toward the discharge port;
A substrate processing apparatus comprising: a recovery unit that is disposed below the lead-out unit and recovers the processing liquid that has flowed out of the discharge port. The substrate processing apparatus according to claim 2,
The collection unit
A substrate processing apparatus, comprising: a receiving portion that is provided so as to protrude from the discharge port toward the substrate held by the holding mechanism and that receives a processing liquid flowing out from the discharge port. The substrate processing apparatus according to claim 2,
The substrate processing apparatus, wherein the recovery unit has a flow path for allowing the processing liquid flowing out from the discharge port to flow obliquely downward. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the opening surface of the discharge port has an inclination angle with respect to a vertical direction of 10 degrees to 20 degrees. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the holding mechanism holds the substrate at an inclination angle of 10 to 20 degrees with respect to a vertical direction. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the holding mechanism includes means for varying an inclination angle of the substrate with respect to a vertical direction in accordance with a type of processing liquid applied on the substrate. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the holding mechanism includes a heating unit for heating the substrate. The substrate processing apparatus according to claim 1,
A housing capable of sealing at least the atmosphere around the substrate held by the holding mechanism;
The substrate processing apparatus further comprising: a nitrogen supply mechanism for making the inside of the casing have a nitrogen atmosphere. A holding mechanism capable of holding the substrate so that the processing surface of the substrate is inclined downward,
A treatment liquid supply mechanism having a nozzle disposed near the processing surface of the substrate held by the holding mechanism and provided with a discharge port for discharging the processing liquid so as to face the processing surface;
And a drive unit for moving the nozzle along the processing surface of the substrate. A substrate processing method for a substrate processing apparatus, comprising: a holding mechanism capable of holding a substrate; and a processing liquid supply mechanism having a nozzle disposed in proximity to a processing surface of the substrate held by the holding mechanism. ,
(A) holding the substrate by the holding mechanism;
(B) after the step (a), inclining the substrate so that the processing surface faces downward;
(C) After the step (b), a step of applying the processing liquid to the processing surface by moving the nozzle from above to below along the processing surface. The substrate processing method according to claim 11, comprising:
The nozzle has a discharge port for discharging a processing liquid, and a lead-out portion that guides the processing liquid obliquely upward toward the discharge port, and a processing liquid that is disposed below the lead-out portion and flows out of the discharge port is collected. And a collection unit for
The substrate processing method further comprising a step of recovering a part of the processing liquid flowing out from the discharge port by the recovery unit during the step (c). The substrate processing method according to claim 11, comprising:
After the said process (a) or the process (b), the process for heating the said board | substrate is further comprised, The substrate processing method characterized by the above-mentioned. The substrate processing method according to claim 11, comprising:
The substrate processing method characterized by performing the said process (c) in nitrogen atmosphere.

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