JP2005093783A - Multilayer printed circuit board having recess for embedding electronic component, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a recess for embedding an electronic component and capable of forming high density wiring and performing high density packaging causing no insulation failure nor problem in packaging, and to provide a method for manufacturing it. <P>SOLUTION: The method for manufacturing the multilayer printed wiring board comprises steps of forming the recess for embedding the electronic component by laser machining, and exposing a circuit pattern for packaging the electronic component at the bottom of the recess. An insulating material hard to be laser-machined is filled in a gap of the circuit pattern for packaging the electronic component, and the insulating material easy to be laser-machined is used for a second insulating layer with its part removed when the recess is formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a multilayer printed wiring board having a recess for embedding an electronic component and a method for manufacturing the same.

  As electronic devices become lighter, thinner, and more multifunctional, there is an increasing demand for higher speed and thinner multilayer printed wiring boards used in electronic devices. In addition, the use of multilayer printed wiring boards is increasing for rewiring of electronic components used in electronic devices. In that case, higher density and thinner boards are required.

  Therefore, there is a need for a multilayer printed wiring board that can suppress the layer thickness or reduce the area by mounting or sandwiching relatively thick electronic components and semiconductor bare chips, etc. in the depression of the multilayer printed wiring board. However, it is increasing year by year.

  For example, Japanese Patent Application Laid-Open No. 5-343856 discloses a multilayer printed wiring board in which a hybrid module having functions of electronic components or electronic circuits is sandwiched.

  Conventionally, when manufacturing a multilayer printed wiring board provided with a recess for embedding an electronic component, a method of cutting out an inner layer circuit pattern after lamination has been used. When cutting out the circuit pattern of the inner layer with a blade, the inner layer copper thickness of 70 to 100 μm is required to absorb the vertical position accuracy of the cutting device and the thickness variation of the multilayer printed wiring board. With this thickness, it is difficult to form a circuit pattern with a pitch of, for example, 120 μm or less corresponding to flip chip mounting that has been increasing in recent years.

As a countermeasure for this, there is a method in which machining is performed with a laser processing machine, but the multilayer printed wiring board is provided with an insulator for each circuit pattern, and the insulator resin on the circuit pattern can be sufficiently removed. If processing is performed under the conditions, the processing proceeds to the insulator in the gap portion of the circuit pattern, and further reaches the vicinity of the lower conductor, leading to poor insulation, and the circuit pattern support strength becomes insufficient, There was a problem that caused the bug.
JP-A-5-343856

  An object of the present invention is to provide a multilayer printed wiring board having a recess for embedding electronic components that does not cause insulation failure, has no defects during mounting, and enables high-density wiring and high-density mounting, and a method for manufacturing the same. It is in.

  The present invention relates to a method of manufacturing a multilayer printed wiring board comprising a plurality of insulator layers having a circuit pattern and an insulator substrate, and having a recess for embedding an electronic component. An insulator that is difficult to be laser-processed is used for the first insulator layer formed on the inner side of the circuit pattern for mounting, and laser processing is easily performed on the second insulator layer that is on the outer side of the circuit pattern for mounting electronic components. After forming a multilayer printed wiring board using an insulator, a hole is formed in the second insulator layer by laser processing to form a recess for embedding an electronic component, and a circuit pattern for mounting an electronic component at the bottom of the recess It is characterized by exposing.

  Instead of using an insulator that is difficult to laser process for the first insulator layer, an insulator that is difficult to laser process is filled in the gap between the circuit patterns for mounting electronic components formed on the surface of the first insulator layer. May be.

  In another aspect, a multilayer printed wiring board is formed by bonding an upper printed wiring board having holes for embedding electronic components and a lower printed wiring board having a circuit pattern for mounting electronic components via an adhesive layer. When filling, the gap between the circuit patterns for mounting the electronic component is filled with an insulator that is difficult to be laser processed, and then the portion corresponding to the hole of the adhesive layer is removed by laser processing, A recess is formed with the adhesive layer, and the circuit pattern for mounting the electronic component is exposed at the bottom of the recess.

  In the above aspect, a hole for embedding an electronic component is formed in the upper printed wiring board and then joined to the lower printed wiring board to form a multilayer printed wiring board. However, a hole is formed in the upper printed wiring board. The upper printed circuit board is made so that a multi-layer printed wiring board is manufactured without cutting, and a hole is formed in a part of the upper printed wiring board by cutting to form a part of the recess, and then a recess is formed by laser processing. The remaining part of the wiring board and the adhesive layer may be removed so that the circuit pattern for mounting the electronic component is exposed at the bottom of the recess.

  The multilayer printed wiring board provided with the recess for embedding the electronic component produced by the above manufacturing method can prevent the deterioration of the insulation performance due to the damage of the insulator in the circuit pattern gap for mounting the electronic component, and the electronic component mounting. By protecting the circuit pattern for use, reliable electronic component mounting can be achieved.

  The present invention eliminates the problems in the prior art that the underlying insulator in the circuit pattern gap is significantly damaged, the mechanical strength is inferior, and the insulation reliability is poor, and high-density wiring and high-density mounting are possible. A multilayer printed wiring board having a recess for embedding an electronic component and a method for manufacturing the same can be provided.

  In the method of manufacturing a multilayer printed wiring board having a recess for embedding an electronic component according to the first aspect of the present invention, first, a plurality of insulator layers having circuit patterns are laminated on an insulator substrate having an inner wiring layer. A multilayer printed wiring board is formed.

  In the case of the present invention, the first insulator layer formed inside the circuit pattern for mounting the electronic component is made of an insulator that is difficult to be laser processed, and the second layer located outside the circuit pattern for mounting the electronic component. An insulator that is easily laser processed is used for the insulator layer.

  For example, the first insulator layer is a copper foil coated on both sides of an insulating substrate having an inner wiring layer with an adhesive sheet, a prepreg (a glass fiber cloth impregnated with an insulating resin and semi-cured), etc. After that, by etching, forming an opening, removing the adhesive sheet and prepreg of the opening, forming a micro via connection by plating in the opening, and selectively etching A circuit pattern for mounting electronic components is formed.

  For the adhesive sheet constituting the first insulator layer, an adhesive film having a high content of inorganic fillers, short fibers and the like and inferior in laser processability, for example, an adhesive film with high elasticity copper foil manufactured by Hitachi Chemical is used.

  Next, similarly to the first insulator layer, a second insulator layer is formed to be multilayered, but the adhesive sheet constituting the second insulator layer contains an inorganic filler, a short fiber, etc. The one with a low rate and excellent laser processability, for example, a copper foil with resin made by Mitsui Mining & Mining is used.

  After forming the multilayer printed wiring board in this way, a recess for embedding an electronic component was formed in the second insulator layer by laser processing, and the first insulator layer was formed at the bottom of the recess. Expose the circuit pattern for mounting electronic components.

  At this time, since the first insulator layer is made of an insulator that is difficult to be laser processed, it is difficult to be damaged during processing. Thereby, the mechanical strength of the 1st insulator layer provided with the circuit pattern in which an electronic component is mounted and the fall of insulation reliability are prevented.

  In the second aspect of the present invention, the configuration of the multilayer printed wiring board is the same as that of the first aspect, but instead of using an insulator that is difficult to be laser processed for the first insulator layer, An insulator that is difficult to be laser-processed is filled in the gap between the circuit patterns for mounting electronic components formed on the surface. For the insulator, a material having a high content of inorganic fillers, short fibers and the like and inferior in laser processability, for example, an undercoat agent manufactured by Yamaei Chemical is used. In this case, any insulator can be used for the first insulator layer itself.

  In the third aspect of the present invention, an upper printed wiring board having a hole for embedding an electronic component and a lower printed wiring board provided with a circuit pattern for mounting the electronic component are joined via an adhesive layer to form a multilayer printed wiring. Form a plate. In this case, the gap between the circuit patterns for mounting electronic components formed on the surface of the lower printed wiring board is filled with an insulator that is difficult to be laser processed. Then, the part corresponding to the said hole of an adhesive bond layer is removed by laser processing, and the said circuit pattern for electronic component mounting is exposed in the bottom part of the said hollow. For the adhesive layer, an adhesive sheet having a low content of inorganic fillers, short fibers and the like and excellent in laser processability, for example, an epoxy adhesive film manufactured by Hitachi Chemical or Yodogawa Paper Mill is used.

  In the third aspect of the present invention, a hole for embedding an electronic component is formed in the upper printed wiring board and then joined to the lower printed wiring board to form a multilayer printed wiring board. In 4th aspect, after producing a multilayer printed wiring board without forming a hole in an upper side printed wiring board, a hole is made in a part of upper side printed wiring board by cutting, and it is made into a part of hollow after that, by laser processing The remainder of the upper printed wiring board and the adhesive layer are removed so as to form a recess, and the circuit pattern for mounting the electronic component is exposed at the bottom of the recess.

(Example 1)
FIG. 1 is a series of cross-sectional views showing a method of manufacturing a multilayer printed wiring board (18) according to Embodiment 1 of the present invention.

(I):
(A) A copper foil (2) is provided on both the front and back surfaces or one surface (both surfaces in the drawing) of the insulating substrate (1) to obtain a laminated board.

(B) An opening (3) is provided in a desired portion of the laminate,
(C) Plating (4) is performed on the side wall of the opening to obtain a through hole.

  (D) By selectively etching the copper foil of the laminate, the inner wiring layer (5) is formed from the copper foil (2), and the inner wiring layer (5) is formed on both the front and back surfaces. Forming an inner layer wiring board.

  As the insulator substrate (1), a substrate using various functional fibers as a core material, an organic film substrate combining long and short organic molecules, and the like can be used. For example, glass substrate-epoxy resin laminate (glass epoxy laminate), glass substrate-polyimide resin laminate, glass substrate-Teflon (registered trademark) laminate, aramid substrate-epoxy resin laminate, ethylene Fluorine substrate-epoxy resin laminate, polyphenylene ether resin laminate, polyester ester / polyetherimide copolymer substrate (sheet), acrylic copolymer substrate (sheet), polyimide sheet, and the like can be used.

(II):
(E) A copper foil through an adhesive sheet (6), a prepreg (a glass fiber cloth is impregnated with an insulating resin and semi-cured, and has a function of an adhesive sheet), etc. (2) Heat and pressure adhesion is performed on both sides.

  As the adhesive sheet (6), laser processability is poor and a glass fiber prepreg, an organic nonwoven fabric prepreg, a resin sheet containing a large amount of inorganic filler, etc., for example, a glass substrate epoxy resin prepreg made by Hitachi Chemical is used. The adhesive sheet (6) may be non-porous.

(F) Etching and opening a desired portion of the copper foil (2), removing the adhesive sheet and prepreg exposed in the opening (7),
(G) The opening (7) is plated to form a micro via connection, and the copper foil (2) is selectively etched to form a circuit pattern (5).

(III):
When the circuit pattern (5) is formed in the step (G), a circuit pattern (9) for mounting an electronic component is provided in a place where a recess for embedding the electronic component (see step K) is formed.

  The first multilayer printed wiring board intermediate (14-1) is formed by the steps (I) to (III).

(IV):
(H) Copper foil through the first multilayer printed wiring board intermediate (14-1) via an adhesive sheet (11), a prepreg (a glass fiber cloth impregnated with an insulating resin and semi-cured), etc. (2) Heat and pressure adhesion is performed on both sides.

  As the adhesive sheet (11), a filler, a resin sheet with a low reinforcing fiber content, and good laser processability, such as a copper foil with resin manufactured by Mitsui Mining & Mining, is used. The adhesive sheet (11) may be non-porous.

(I) Etching and opening a desired portion of the copper foil (2), removing the adhesive sheet and prepreg exposed in the opening,
(J) Plating the opening (7) to form a microvia connection, and then selectively etching the copper foil (2) on the surface of the first multilayer printed wiring board intermediate (14-1) Thus, a circuit pattern (8) is formed. Thus, the second multilayer printed wiring board intermediate (14-2) is formed.

  The adhesive sheet (11) can be used alone, but after chemically treating the surface of the conductor layer, a plurality of insulator substrates and copper foil are combined via the adhesive sheet, It can also be converted.

(V):
(K) The part (13) where the recess for embedding the electronic component is formed is spotted by laser processing to expose the circuit pattern (9) for mounting the electronic component. In this case, although the adhesive sheet (11) has good laser processability, the adhesive sheet (6) has poor laser processability, and thus, in the laser processing, processing reaches a layer below the adhesive sheet (6). It is prevented. By the above, a multilayer printed wiring board (18) provided with the hollow which embeds an electronic component is manufactured.

The loss of the insulator between the electronic component mounting circuits of the multilayer printed wiring board thus obtained could be suppressed to ½ or less of the insulating layer thickness. In addition, for 10 multilayer printed wiring boards, a voltage of DC 10 V was applied for 1000 hours between the mounting circuit with a pitch of 100 μm at the bottom of the recess and between the circuit and the lower layer circuit in an environment of 85 ° C. and 85% relative humidity. As a result, the insulation resistance of 1 × 10 ¹¹ Ω or more was maintained.

(Example 2)
FIG. 2 is a series of cross-sectional views showing a method of manufacturing a multilayer printed wiring board (18) according to Embodiment 2 of the present invention.

(I):
(A) Similarly to Example 1, a copper foil (2) is provided on both the front and back sides or one side (both sides in the drawing) of the insulating substrate (1) to obtain a laminated board.

(B) An opening (3) is provided in a desired portion of the laminate,
(C) Plating (4) is performed on the side wall of the opening to obtain a through hole.

  (D) Next, by selectively etching the copper foil of the laminated board, a first inner wiring board having inner wiring layers formed on both front and back surfaces is formed.

(II):
(E) The copper foil (2) is heated on both sides of the first inner wiring board through an adhesive sheet (6), a prepreg (a glass fiber cloth impregnated with an insulating resin and semi-cured), etc. Apply pressure bonding. Any adhesive sheet (6) can be used. The adhesive sheet (6) may be non-porous.

(F) Then, the desired portion of the copper foil (2) is etched and opened, and the adhesive sheet and prepreg exposed in the opening (7) are removed,
(G) The opening (7) is plated to form a micro via connection, and the copper foil (2) is selectively etched to form a circuit pattern (5).

(III):
When forming a circuit pattern in the step (G), a circuit pattern (9) for mounting an electronic component is prepared in a place where a recess for embedding an electronic component (see step (L)) is formed.

  Through the steps (I) to (III), the first multilayer printed wiring board intermediate (14-1) is formed.

(IV):
(H) The insulator (10) is filled in the space around the circuit pattern (9) for mounting the electronic components on the first multilayer printed wiring board intermediate (14-1) or in the gap between the circuit patterns on the entire surface. As the insulator (10), the laser processability is poor, and an inorganic filler, a resin containing a large amount of short glass fiber, etc., for example, an undercoat agent made by Yamaei Chemical is used. Thus, the second multilayer printed wiring board intermediate (14-2) is formed.

(V):
(I) Copper foil through the second multilayer printed wiring board intermediate (14-2) via an adhesive sheet (11), a prepreg (a glass fiber cloth impregnated with an insulating resin and semi-cured), etc. (2) Heat and pressure adhesion is performed on both sides. As the adhesive sheet (11), a filler or a resin sheet having a low reinforcing fiber content and good laser processability is used.

(J) Then, a desired portion of the copper foil (2) is etched and opened, and the adhesive sheet and prepreg exposed in the opening (7) are removed,
(K) The opening (7) is plated to form a micro via connection, and then the copper foil (2) on the surface of the second multilayer printed wiring board intermediate (14-2) is selectively etched. Thus, a circuit pattern (8) is formed. Thus, the third multilayer printed wiring board intermediate (17) is formed.

(VI):
(L) Next, the part (13) where the recess for embedding the electronic component is formed is spotted by laser processing to expose the circuit pattern (9) for mounting the electronic component. In this case, the adhesive sheet (11) has good laser processability, but the insulator (10) filled around the circuit pattern (9) or in the gap between the circuit patterns on the entire surface has poor laser processability. In the place covered with the body (10), the laser processing prevents the processing from reaching the adhesive sheet (6). By the above, a multilayer printed wiring board (18) provided with the hollow which embeds an electronic component is manufactured.

The loss of the insulator between the electronic component mounting circuits of the multilayer printed wiring board thus obtained could be suppressed to 1/10 or less of the insulating layer thickness. In addition, for 10 multilayer printed wiring boards, a voltage of DC 10V was applied for 1000 hours between the mounting circuit of 100 μm pitch at the bottom of the recess and between the circuit and the lower layer circuit in an environment of 85 ° C. and 85% relative humidity. As a result, the insulation resistance of 1 × 10 ¹¹ Ω or more was maintained.

(Example 3)
3 to 5 show a lower printed wiring board (15) having a circuit for an electronic component and an upper printed wiring board (16) provided with a hole for embedding the electronic component, according to a third embodiment of the present invention. It is a series of sectional views showing a method of manufacturing a multilayer printed wiring board (18) by bonding.

(I):
(A) FIG. 3 shows a method of manufacturing the lower printed wiring board (15). A copper foil (2) is provided on both the front and back surfaces or one surface (both surfaces in the drawing) of the insulator substrate (1) to obtain a laminate.

(B) An opening (3) is provided in a desired portion of the laminate,
(C) Plating (4) is performed on the side wall of the opening to obtain a through hole.

  (D) Next, the internal wiring layer (5) is formed by selectively etching the copper foil of the laminated board, and the first inner layer wiring board having the inner layer wiring layer (5) formed on both the front and back surfaces is formed. Form.

(II):
(E) The copper foil (2) is heated on both sides of the first inner wiring board through an adhesive sheet (6), a prepreg (a glass fiber cloth impregnated with an insulating resin and semi-cured), etc. Apply pressure bonding. Any adhesive sheet (6) can be used.

(F) Then, the desired portion of the copper foil (2) is etched and opened, the adhesive sheet and prepreg exposed at the opening (7) are removed, and the opening (7) is plated to connect to micro vias. Form the
(G) Next, the copper foil (2) to be bonded to the upper printed wiring board (16) is selectively etched to form a circuit pattern (5).

(III):
When forming the circuit pattern (5) in the step G, a circuit pattern (9) for mounting an electronic component is provided at a location corresponding to the recess (13) for embedding the electronic component in the upper printed wiring board. .

  By the steps (I) to (III), the lower printed wiring board intermediate body (14) is formed.

(IV):
(H) The insulator (10) is filled in the gap between the circuit patterns (9) around the entire printed circuit board (9) for mounting the electronic component on the lower printed wiring board intermediate (14). As the insulator (10), as in Example 2, laser processability is poor and a resin containing a large amount of inorganic filler, short glass fiber, or the like is used. Thus, the lower printed wiring board (15) is formed.

  The lower printed wiring board (15) can be used alone, but after chemically treating the surface of the conductor layer, a plurality of insulator substrates and copper foil are combined through an adhesive sheet, and the same procedure as described above is performed. Thus, it can be multi-layered.

(V):
FIG. 4 shows a method for manufacturing the upper printed wiring board.

  (I) An upper printed wiring board is formed in the same manner as the lower printed wiring board (15).

  (J) In the upper printed wiring board (16), a hole (12) having a desired size is provided at a portion where the electronic component is embedded by punching, router processing, drilling processing, or the like. The upper printed wiring board (16) can also be subjected to chemical treatment on the surface of the conductor layer in order to improve adhesion with the adhesive sheet.

(VI):
FIG. 5 shows a method of manufacturing a multilayer printed wiring board (18) having a recess for embedding an electronic component by joining the lower printed wiring board (15) and the upper printed wiring board (16).

  (K) That is, the lower printed wiring board (15) and the upper printed wiring board (16) were overlapped with the position of the electrode, the position of the window, and the like through the adhesive sheet (11). Then, a third multilayer printed wiring board intermediate (17-1) having a recess for embedding an electronic component is formed by thermocompression bonding.

(VII):
(L) As it is, since the lower printed wiring board (15) and the upper printed wiring board (16) are not electrically connected, the through hole (3) is opened.
(M) Further, in order to electrically connect both printed wiring boards, the inner surface of the through hole (3) is plated to form a through hole (4).

(VIII):
(N) Further, the copper foil on the upper and lower surfaces of the third multilayer printed wiring board intermediate (17-1) is selectively etched to form the outer layer wiring (8), and the fourth multilayer printed wiring board Intermediate (17-2) is obtained.

(IX):
(O) Next, a portion corresponding to the recess (13) for embedding the electronic component in the adhesive sheet (11) is spotted by laser processing to expose the circuit pattern (9) for mounting the electronic component. In this case, the laser processability of the adhesive sheet (11) is good, but the insulator (10) filled around the circuit pattern (9) or in the gap between the circuit patterns on the entire surface is poor in laser processability. Where the body (10) is located, the laser processing prevents the processing from reaching the adhesive sheet (6) of the lower printed wiring board (15). By the above, a multilayer printed wiring board (18) provided with the hollow which embeds an electronic component is manufactured.

The loss of the insulator between the electronic component mounting circuits of the multilayer printed wiring board thus obtained could be suppressed to 1/10 or less of the insulating layer thickness. In addition, for 10 multilayer printed wiring boards, a voltage of DC 10 V was applied for 1000 hours between the mounting circuit with a pitch of 100 μm at the bottom of the recess and between the circuit and the lower layer circuit in an environment of 85 ° C. and 85% relative humidity. As a result, the insulation resistance of 1 × 10 ¹¹ Ω or more was maintained.

Example 4
FIGS. 6 to 8 show a lower printed wiring board (15) having a circuit for electronic components and an upper printed wiring board (16) provided with holes for embedding external power supply components according to the fourth embodiment of the present invention. It is a series of sectional views showing a manufacturing method example of a multilayer printed wiring layer (18) by bonding.

  FIG. 6 shows a method of manufacturing the lower printed wiring board (15). The steps until the lower printed wiring board (15) is formed in this embodiment are the same as those in the third embodiment. Therefore, an insulator (10) having poor laser processability is filled in the gap between the circuit patterns (9) around the entire printed circuit board (9) for mounting the electronic component on the lower printed wiring board (15).

  FIG. 7 shows a method of manufacturing the upper printed wiring board (16).

  (I) The upper printed wiring board (16) is formed in the same manner as the lower printed wiring board (15). In the present embodiment, at this stage, the process of providing a hole at a position where the electronic component is embedded is not performed. The upper printed wiring board (16) can also be subjected to chemical treatment on the surface of the conductor layer in order to improve adhesion with the adhesive sheet.

  FIG. 8 shows a method of manufacturing a multilayer printed wiring board (18) having a recess for embedding an electronic component by joining the lower printed wiring board (15) and the upper printed wiring board (16).

  (J) Via the adhesive sheet (11), the lower printed wiring board (15) and the upper printed wiring board (16) are overlaid while aligning the positions of the electrodes, and then thermocompression bonded. Then, a third multilayer printed wiring board intermediate (17-1) is formed.

  In this state, the lower printed wiring board (15) and the upper printed wiring board (16) are not electrically connected.

Therefore,
(K) Open the through hole (3).

  (L) Furthermore, in order to electrically connect both printed wiring boards, the inner surface of the through hole (3) is plated to form a through hole (4).

  (M) Further, the outer multilayer circuit (8) is formed by selectively etching the upper and lower copper foils of the third multilayer printed wiring board intermediate (17-1), and the fourth multilayer printed wiring board. Intermediate (17-2) is obtained.

  (N) Next, with a blade such as an end mill, the recessed portion in which the electronic component is embedded penetrates the upper printed wiring board (16) to the middle of the adhesive sheet (11).

  (O) Subsequently, laser processing is performed on the hollow portion of the adhesive sheet (11) to expose the circuit pattern (9) for mounting the electronic component. In this case, although the laser processability of the adhesive sheet (11) is good, the laser processability of the insulator (10) filled around the circuit pattern (9) or in the gap between the circuit patterns on the entire surface is poor. In the laser processing, the processing is prevented from reaching the adhesive sheet (6) of the lower printed wiring board. By the above, a multilayer printed wiring board (18) provided with the hollow which embeds an electronic component is manufactured.

The loss of the insulator between the electronic component mounting circuits of the multilayer printed wiring board thus obtained could be suppressed to 1/10 or less of the insulating layer thickness. In addition, for 10 multilayer printed wiring boards, a voltage of DC 10V was applied for 1000 hours between the mounting circuit of 100 μm pitch at the bottom of the recess and between the circuit and the lower layer circuit in an environment of 85 ° C. and 85% relative humidity. As a result, the insulation resistance of 1 × 10 ¹¹ Ω or more was maintained.

It is a series of sectional views showing a manufacturing method of a multilayer printed wiring board concerning Example 1 of the present invention. It is a series of sectional views showing a method for manufacturing a multilayer printed wiring board according to Example 2 of the present invention. It is a series of sectional views showing a method for manufacturing a lower printed wiring board according to Example 3 of the present invention. It is a series of sectional views showing a manufacturing method of the upper side printed wiring board according to Example 3 of the present invention. It is a series of sectional views showing a method for manufacturing a multilayer printed wiring board according to Example 3 of the present invention. It is a series of sectional views showing a manufacturing method of a lower printed wiring board according to Example 4 of the present invention. It is sectional drawing which shows the manufacturing method of the upper side printed wiring board which concerns on Example 4 of this invention. It is sectional drawing which shows the manufacturing method of the multilayer printed wiring board which concerns on Example 4 of this invention. It is sectional drawing which shows the multilayer printed wiring board produced by the manufacturing method of Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulator board | substrate 2 Copper foil 3 Through-hole 4 Through-hole 5 Inner layer wiring 6 Adhesive sheet 7 Micro via 8 Outer layer wiring 9 Circuit for electronic component mounting 10 Insulator 11 Adhesive sheet 12 Hole 13 Indentation 14-1 for embedding electronic components First multilayer printed wiring board intermediate 14-2 Second multilayer printed wiring board intermediate 15 Lower printed wiring board 16 Upper printed wiring board 17-1 Third multilayer printed wiring board intermediate 17-2 Fourth Multilayer printed wiring board intermediate 18 Multilayer printed wiring board

Claims (7)

  Sandwiching a circuit pattern for mounting an electronic component, and having an inner first insulator layer and an outer second insulator layer, forming a recess for embedding an electronic component in the second insulator layer; In the manufacturing method of the multilayer printed wiring board in which the circuit pattern for mounting the electronic component is exposed at the bottom of the recess, the insulator that is difficult to be laser-processed on the first insulator layer inside the circuit pattern for mounting the electronic component And using the insulator that is easily laser-processed for the second insulator layer outside the circuit pattern for mounting the electronic component, and removing the part of the second insulator layer by laser processing to form the depression A method of manufacturing a multilayer printed wiring board having a recess for embedding an electronic component, characterized in that:   Multilayer printed wiring having an insulator layer outside a circuit pattern for mounting an electronic component, forming a recess for embedding the electronic component in the insulator layer, and exposing the circuit pattern for mounting the electronic component at the bottom of the recess In the board manufacturing method, an insulator that is difficult to be laser-processed is filled in a gap between the circuit patterns for mounting electronic components, and an insulator that is easily laser-processed is formed on an insulator layer outside the circuit pattern for mounting electronic components. A method of manufacturing a multilayer printed wiring board having a recess for embedding an electronic component, wherein the recess is formed by removing a part of the insulator layer by laser processing.   A multilayer printed wiring board is formed by bonding an upper printed wiring board having holes for embedding electronic components and a lower printed wiring board having a circuit pattern for mounting electronic components via an adhesive layer, and forming a laser. In the method for manufacturing a multilayer printed wiring board, by removing a portion corresponding to the hole of the adhesive layer by processing and exposing the circuit pattern for mounting the electronic component at the bottom of the recess, the circuit for mounting the electronic component is provided. A method of manufacturing a multilayer printed wiring board having a recess for embedding an electronic component, wherein an insulator that is difficult to be laser processed is filled in a gap between patterns.   A multilayer printed wiring board is formed by bonding an upper printed wiring board to be provided with a recess for embedding electronic components and a lower printed wiring board having a circuit pattern for mounting electronic components via an adhesive layer. Fill the gap between the circuit patterns for mounting the electronic components on the lower printed wiring board with an insulator that is difficult to laser process, and perform cutting and subsequent laser processing on the portion of the upper printed wiring board where the hole should be formed. A multilayer print provided with a recess for embedding an electronic component, wherein the recess is formed and the adhesive layer is removed to expose the circuit pattern for mounting the electronic component at the bottom of the recess A method for manufacturing a wiring board.   It has an inner first insulator layer and an outer second insulator layer across a circuit pattern for mounting an electronic component, and a recess for embedding an electronic component is formed in the second insulator layer. A multilayer printed wiring board in which a circuit pattern for mounting an electronic component is exposed at the bottom of the substrate, wherein a first insulator layer is formed by an insulator that is difficult to be laser processed, and a second insulator is formed by an insulator that is easily laser processed. A multilayer printed wiring board comprising a recess for embedding an electronic component, wherein an insulator layer is formed, and the recess is provided in the second insulator layer.   A multilayer printed wiring board having a recess for embedding an electronic component by laser processing and having a circuit pattern for mounting an electronic component exposed at the bottom of the recess, wherein a laser is inserted in the gap between the circuit patterns for mounting the electronic component. A multilayer printed wiring board provided with a recess for embedding an electronic component, which is filled with an insulator that is difficult to process.   In a multilayer printed wiring board in which an upper printed wiring board having a hole for embedding an electronic component and a lower printed wiring board having a circuit pattern for mounting the electronic component are joined via an adhesive layer, the electronic The gap between the circuit patterns for component mounting is filled with an insulator that is difficult to be laser-processed, and a recess for embedding the electronic component is formed by the hole and the adhesive layer of the upper printed wiring board. A multilayer printed wiring board comprising a recess for embedding an electronic component, wherein the circuit pattern for mounting the electronic component is exposed at a bottom of the recess.

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