JP2005088038A5 - - Google Patents

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Publication number
JP2005088038A5
JP2005088038A5 JP2003323682A JP2003323682A JP2005088038A5 JP 2005088038 A5 JP2005088038 A5 JP 2005088038A5 JP 2003323682 A JP2003323682 A JP 2003323682A JP 2003323682 A JP2003323682 A JP 2003323682A JP 2005088038 A5 JP2005088038 A5 JP 2005088038A5
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JP
Japan
Prior art keywords
workpiece
laser
laser light
liquid
waveguide means
Prior art date
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Application number
JP2003323682A
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English (en)
Japanese (ja)
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JP4219241B2 (ja
JP2005088038A (ja
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Priority to JP2003323682A priority Critical patent/JP4219241B2/ja
Priority claimed from JP2003323682A external-priority patent/JP4219241B2/ja
Publication of JP2005088038A publication Critical patent/JP2005088038A/ja
Publication of JP2005088038A5 publication Critical patent/JP2005088038A5/ja
Application granted granted Critical
Publication of JP4219241B2 publication Critical patent/JP4219241B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003323682A 2003-09-16 2003-09-16 レーザ加工装置及びレーザ加工方法 Expired - Fee Related JP4219241B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003323682A JP4219241B2 (ja) 2003-09-16 2003-09-16 レーザ加工装置及びレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003323682A JP4219241B2 (ja) 2003-09-16 2003-09-16 レーザ加工装置及びレーザ加工方法

Publications (3)

Publication Number Publication Date
JP2005088038A JP2005088038A (ja) 2005-04-07
JP2005088038A5 true JP2005088038A5 (enExample) 2006-01-12
JP4219241B2 JP4219241B2 (ja) 2009-02-04

Family

ID=34454679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003323682A Expired - Fee Related JP4219241B2 (ja) 2003-09-16 2003-09-16 レーザ加工装置及びレーザ加工方法

Country Status (1)

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JP (1) JP4219241B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270577B2 (ja) 2007-01-26 2009-06-03 日本海洋掘削株式会社 レーザを用いた岩石の加工方法及びその装置
CN108581218B (zh) * 2018-04-10 2020-03-20 上海柏楚电子科技股份有限公司 一种管材激光切割中便于废料分离的切碎方法
JP2025037169A (ja) * 2023-09-05 2025-03-17 旭光通商株式会社 レーザ加工システム、これを用いて加工される被加工物、及びレーザ加工方法

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