JP2005088038A5 - - Google Patents

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Publication number
JP2005088038A5
JP2005088038A5 JP2003323682A JP2003323682A JP2005088038A5 JP 2005088038 A5 JP2005088038 A5 JP 2005088038A5 JP 2003323682 A JP2003323682 A JP 2003323682A JP 2003323682 A JP2003323682 A JP 2003323682A JP 2005088038 A5 JP2005088038 A5 JP 2005088038A5
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JP
Japan
Prior art keywords
workpiece
laser
laser light
liquid
waveguide means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003323682A
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Japanese (ja)
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JP2005088038A (en
JP4219241B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2003323682A priority Critical patent/JP4219241B2/en
Priority claimed from JP2003323682A external-priority patent/JP4219241B2/en
Publication of JP2005088038A publication Critical patent/JP2005088038A/en
Publication of JP2005088038A5 publication Critical patent/JP2005088038A5/ja
Application granted granted Critical
Publication of JP4219241B2 publication Critical patent/JP4219241B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Claims (2)

レーザ光を発生させるレーザ光源と、
被加工物を保持する保持部と、
前記被加工物と前記保持部とを液中に浸漬させる容器と、
レーザ光を前記レーザ光源から前記被加工物まで導くレーザ導波手段と、
前記レーザ導波手段のレーザ光出射部と前記被加工物との間に配置された保護部材とを備え、
前記保護部材はレーザ光を透過させる材料から構成されることを特徴とするレーザ加工装置。 A laser light source for generating laser light;
A holding part for holding a workpiece;
A container for immersing the workpiece and the holding part in a liquid;
Laser waveguide means for guiding laser light from the laser light source to the workpiece;
A protective member disposed between the laser beam emitting portion of the laser waveguide means and the workpiece,
The laser processing apparatus, wherein the protective member is made of a material that transmits laser light. 被加工物を保持部により保持して前記被加工物を液中に浸漬させ、
レーザ導波手段のレーザ光出射部を前記被加工物に対向するように液中に配置し、
レーザ光を透過させる材料から構成された保護部材を前記レーザ光出射部と前記被加工物との間に配置し、
レーザ光源で発生させたレーザ光を前記レーザ導波手段を介して前記レーザ光出射部から液中の前記被加工物に照射することを特徴とするレーザ加工方法。 Hold the workpiece by the holding part and immerse the workpiece in the liquid,
The laser light emitting part of the laser waveguide means is disposed in the liquid so as to face the workpiece,
A protective member made of a material that transmits laser light is disposed between the laser light emitting portion and the workpiece,
A laser processing method, wherein a laser beam generated by a laser light source is applied to the workpiece in liquid from the laser beam emitting portion through the laser waveguide means.
JP2003323682A 2003-09-16 2003-09-16 Laser processing apparatus and laser processing method Expired - Fee Related JP4219241B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003323682A JP4219241B2 (en) 2003-09-16 2003-09-16 Laser processing apparatus and laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003323682A JP4219241B2 (en) 2003-09-16 2003-09-16 Laser processing apparatus and laser processing method

Publications (3)

Publication Number Publication Date
JP2005088038A JP2005088038A (en) 2005-04-07
JP2005088038A5 true JP2005088038A5 (en) 2006-01-12
JP4219241B2 JP4219241B2 (en) 2009-02-04

Family

ID=34454679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003323682A Expired - Fee Related JP4219241B2 (en) 2003-09-16 2003-09-16 Laser processing apparatus and laser processing method

Country Status (1)

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JP (1) JP4219241B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270577B2 (en) * 2007-01-26 2009-06-03 日本海洋掘削株式会社 Rock processing method and apparatus using laser
CN108581218B (en) * 2018-04-10 2020-03-20 上海柏楚电子科技股份有限公司 Shredding method facilitating waste separation in pipe laser cutting

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